CN106255345B - 一种双层电路板结构的制作方法 - Google Patents
一种双层电路板结构的制作方法 Download PDFInfo
- Publication number
- CN106255345B CN106255345B CN201610690922.9A CN201610690922A CN106255345B CN 106255345 B CN106255345 B CN 106255345B CN 201610690922 A CN201610690922 A CN 201610690922A CN 106255345 B CN106255345 B CN 106255345B
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- layer
- circuit board
- double
- mounting plate
- board structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/047—Box-like arrangements of PCBs
Abstract
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Priority Applications (1)
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CN201610690922.9A CN106255345B (zh) | 2016-08-20 | 2016-08-20 | 一种双层电路板结构的制作方法 |
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CN201610690922.9A CN106255345B (zh) | 2016-08-20 | 2016-08-20 | 一种双层电路板结构的制作方法 |
Publications (2)
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CN106255345A CN106255345A (zh) | 2016-12-21 |
CN106255345B true CN106255345B (zh) | 2020-07-24 |
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CN201610690922.9A Active CN106255345B (zh) | 2016-08-20 | 2016-08-20 | 一种双层电路板结构的制作方法 |
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CN (1) | CN106255345B (zh) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1853451A (zh) * | 2003-09-18 | 2006-10-25 | 伊姆贝拉电子有限公司 | 用于制造电子模块的方法 |
CN101789383A (zh) * | 2009-01-23 | 2010-07-28 | 欣兴电子股份有限公司 | 具有凹穴结构的封装基板的制作方法 |
CN101901791A (zh) * | 2009-12-17 | 2010-12-01 | 香港应用科技研究院有限公司 | 一个可用于多封装组件的模组以及一种制作该模组和多封装组件的方法 |
CN103137613A (zh) * | 2011-11-29 | 2013-06-05 | 中国科学院微电子研究所 | 有源芯片封装基板及制备该基板的方法 |
CN103582301A (zh) * | 2012-07-26 | 2014-02-12 | 先丰通讯股份有限公司 | 具有内埋元件的电路板 |
CN105228341A (zh) * | 2014-06-30 | 2016-01-06 | Lg伊诺特有限公司 | 印刷电路板、封装基板及其制造方法 |
-
2016
- 2016-08-20 CN CN201610690922.9A patent/CN106255345B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1853451A (zh) * | 2003-09-18 | 2006-10-25 | 伊姆贝拉电子有限公司 | 用于制造电子模块的方法 |
CN101789383A (zh) * | 2009-01-23 | 2010-07-28 | 欣兴电子股份有限公司 | 具有凹穴结构的封装基板的制作方法 |
CN101901791A (zh) * | 2009-12-17 | 2010-12-01 | 香港应用科技研究院有限公司 | 一个可用于多封装组件的模组以及一种制作该模组和多封装组件的方法 |
CN103137613A (zh) * | 2011-11-29 | 2013-06-05 | 中国科学院微电子研究所 | 有源芯片封装基板及制备该基板的方法 |
CN103582301A (zh) * | 2012-07-26 | 2014-02-12 | 先丰通讯股份有限公司 | 具有内埋元件的电路板 |
CN105228341A (zh) * | 2014-06-30 | 2016-01-06 | Lg伊诺特有限公司 | 印刷电路板、封装基板及其制造方法 |
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CN106255345A (zh) | 2016-12-21 |
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Effective date of registration: 20200305 Address after: 1, No. 610000, 12 floor, No. 69, Tianfu Third Street, Chengdu hi tech Zone, Sichuan, 1201 Applicant after: Chengdu's science and Technology Co Ltd Address before: 610000 Sichuan Province, Chengdu Tianfu Avenue, No. 69, No. 1421 building 14 layer 1 Applicant before: Chengdu Shida cloud Technology Co. Ltd. |
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Effective date of registration: 20200630 Address after: 341000 electronic information industry technology city, Longnan economic and Technological Development Zone, Longnan County, Ganzhou City, Jiangxi Province Applicant after: Longnan Junya Precision Circuit Co.,Ltd. Address before: 1, No. 610000, 12 floor, No. 69, Tianfu Third Street, Chengdu hi tech Zone, Sichuan, 1201 Applicant before: CHENGDU LIWEISI TECHNOLOGY Co.,Ltd. |
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