CN106252459A - 一种适用于多晶硅片的倒片机卸片装置 - Google Patents

一种适用于多晶硅片的倒片机卸片装置 Download PDF

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CN106252459A
CN106252459A CN201610656332.4A CN201610656332A CN106252459A CN 106252459 A CN106252459 A CN 106252459A CN 201610656332 A CN201610656332 A CN 201610656332A CN 106252459 A CN106252459 A CN 106252459A
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张冠纶
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Tongwei Solar Hefei Co Ltd
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Tongwei Solar Hefei Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
    • HELECTRICITY
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    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781Batch transfer of wafers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876Particular processes or apparatus for batch treatment of the devices
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract

本发明提供一种适用于多晶硅片的倒片机卸片装置,所述的支座本体设置于操作台的底部,所述的操作台的上表面设置有凹槽,并在凹槽上卡接有装片盒,所述的凹槽底部设置有伸缩杆,所述伸缩杆的顶部设置有吸盘,并在伸缩杆的内部贯穿设置有通气管道,所述的伸缩杆的底部与水平设置在操作台上的硅片输送装置相互连接,所述的硅片输送装置为两个相互平行设置的滑槽结构组成。通过装置在进行装片盒卸片时,控制伸缩杆的升降,使得吸盘与多晶硅片原件接触,再通过通气管道的抽气操作,使得吸盘接触的空气抽空,然后使得伸缩杆在滑槽上移动,达到安全卸片,整个装置设计合理,操作便捷,可被进一步推广应用。

Description

一种适用于多晶硅片的倒片机卸片装置
技术领域
本发明涉及多晶硅片的加工设备领域,具体涉及一种适用于多晶硅片的倒片机卸片装置。
背景技术
随着现在社会经济的不断发展,人们的生活水平也在不断提升,人们对于自身的生活品质追求也越来越高。特别是城市化进程的发展,对于能源的消耗也越来越大,于是人们也越来越追求对于清洁能源的使用,光伏太阳能也是现在研究的重要目标和方向。
光伏太阳能在发展和生产加工过程中,会有大量的多晶硅片的生产和加工,中国多晶硅工业起步于20世纪50年代,60年代中期实现了产业化,到70年代,生产厂家曾经发展到20多家。多晶硅片的加工质量直接影响着光伏产品的生产效益。
在多晶硅片的加工同时,由于硅片的生产较为精细,成本较高,会对硅片进行清洗操作,操作不慎会导致硅片的损坏,一般的将硅片装配后,需要再进行卸装操作,但人工操作的失误率也较高,极易造成硅片的边角磕碰损坏,不便于在工业化的生产中大规模的采用。
发明内容
针对现有技术的不足,本发明提供了一种适用于多晶硅片的倒片机卸片装置,能够有效实现对于装配好的多晶硅片进行有效的卸片操作。
为实现以上目的,本发明通过以下技术方案予以实现:
一种适用于多晶硅片的倒片机卸片装置,包括支座本体、操作台、硅片输送装置、装片盒,所述的支座本体设置于操作台的底部,所述的操作台的上表面设置有凹槽,并在凹槽上卡接有装片盒,所述的凹槽底部设置有伸缩杆,所述伸缩杆的顶部设置有吸盘,并在伸缩杆的内部贯穿设置有通气管道,所述的伸缩杆的底部与水平设置在操作台上的硅片输送装置相互连接,所述的硅片输送装置为两个相互平行设置的滑槽结构组成。
优选地,所述的支座本体的底部设置有调升底脚。
优选地,所述的支座本体与操作台螺栓连接。
优选地,所述的吸盘的接口部位设置有密封垫圈。
优选地,所述的伸缩杆与滑槽可拆卸连接。
优选地,所述的支座本体上设置有控制开关。
本发明提供了一种适用于多晶硅片的倒片机卸片装置,通过装置上设计的吸盘与伸缩杆结构的相互配合使用,在进行装片盒卸片时,控制伸缩杆的升降,使得吸盘与多晶硅片原件接触,再通过通气管道的抽气操作,使得吸盘接触的空气抽空,实现与多晶硅片原件的紧密固定,然后使得伸缩杆在在滑槽上移动,达到有效、安全卸片,整个装置设计合理,操作便捷,可被进一步推广应用。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1本发明的侧面结构示意图;
图2本发明的俯视结构示意图;
图3本使用新型伸缩杆部分结构示意图;
其中:1、支座本体;2、操作台;3、装片盒;4、伸缩杆;5、吸盘;6、滑槽;11、调升底座;12、控制开关;21、凹槽;31、多晶硅片原件;41、通气管道;51、密封圈。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚,下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
如图1、图2、图3所示,本实施例提供一种适用于多晶硅片的倒片机卸片装置,包括支座本体1、操作台2、硅片输送装置、装片盒3,支座本体1设置于操作台2的底部,操作台2的上表面设置有凹槽21,并在凹槽21上卡接有装片盒3,装片盒3内横向盛放有多晶硅片原件31,凹槽31底部设置有伸缩杆4,伸缩杆4的顶部设置有吸盘5,并在伸缩杆4的内部贯穿设置有通气管道41,通气管道41在吸气状态下,使得吸盘5与多晶硅片原件31充分接触,防止脱落,同时避免的较硬的夹具在搬运时对多晶硅片原件31的损害,伸缩杆4的底部与水平设置在操作台2上的硅片输送装置相互连接,硅片输送装置为两个相互平行设置的滑槽6结构组成,使得伸缩杆4能在滑槽6上自由移动。使得装置操作便捷,可被进一步推广应用。
支座本体1的底部设置有调升底脚11。
支座本体1与操作台2螺栓连接,方便安装拆卸。
吸盘5的接口部位设置有密封垫圈51。
伸缩杆4与滑槽6可拆卸连接。
支座本体1上设置有控制开关12,方便对装置的有效控制。
以上实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。

Claims (6)

1.一种适用于多晶硅片的倒片机卸片装置,包括支座本体、操作台、硅片输送装置、装片盒,其特征在于,所述的支座本体设置于操作台的底部,所述的操作台的上表面设置有凹槽,并在凹槽上卡接有装片盒,所述的凹槽底部设置有伸缩杆,所述伸缩杆的顶部设置有吸盘,并在伸缩杆的内部贯穿设置有通气管道,所述的伸缩杆的底部与水平设置在操作台上的硅片输送装置相互连接,所述的硅片输送装置为两个相互平行设置的滑槽结构组成。
2.如权利要求1所述的适用于多晶硅片的倒片机卸片装置,其特征在于,所述的支座本体的底部设置有调升底脚。
3.如权利要求1所述的适用于多晶硅片的倒片机卸片装置,其特征在于,所述的支座本体与操作台螺栓连接。
4.如权利要求1所述的适用于多晶硅片的倒片机卸片装置,其特征在于,所述的吸盘的接口部位设置有密封垫圈。
5.如权利要求1所述的适用于多晶硅片的倒片机卸片装置,其特征在于,所述的伸缩杆与滑槽可拆卸连接。
6.如权利要求1所述的适用于多晶硅片的倒片机卸片装置,其特征在于,所述的支座本体上设置有控制开关。
CN201610656332.4A 2016-08-11 2016-08-11 一种适用于多晶硅片的倒片机卸片装置 Pending CN106252459A (zh)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110313565A1 (en) * 2010-06-17 2011-12-22 Semes Co., Ltd. Substrate Processing Apparatus And Method For Loading And Unloading Substrates
CN102509744A (zh) * 2011-10-14 2012-06-20 苏州日和科技有限公司 一种输送机构
CN202651082U (zh) * 2012-06-21 2013-01-02 华中科技大学 一种光伏太阳能硅片输送设备

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110313565A1 (en) * 2010-06-17 2011-12-22 Semes Co., Ltd. Substrate Processing Apparatus And Method For Loading And Unloading Substrates
CN102509744A (zh) * 2011-10-14 2012-06-20 苏州日和科技有限公司 一种输送机构
CN202651082U (zh) * 2012-06-21 2013-01-02 华中科技大学 一种光伏太阳能硅片输送设备

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