CN106250891B - Fingerprint sensor packaging method and packaging module - Google Patents
Fingerprint sensor packaging method and packaging module Download PDFInfo
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- CN106250891B CN106250891B CN201610846978.9A CN201610846978A CN106250891B CN 106250891 B CN106250891 B CN 106250891B CN 201610846978 A CN201610846978 A CN 201610846978A CN 106250891 B CN106250891 B CN 106250891B
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- cover plate
- fingerprint sensor
- packaging
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
Abstract
The invention relates to a fingerprint sensor packaging module, comprising: a dielectric cover sheet having oppositely disposed first and second surfaces; a support structure having a support surface bonded to the first surface of the dielectric cover sheet and a bottom surface disposed opposite the support surface; the fingerprint sensing chip is provided with a sensing surface and a non-sensing surface which are oppositely arranged, and the sensing surface is adhered to the first surface of the dielectric cover plate; compared with the prior art, the invention reduces the complexity of the packaging process and improves the yield of the fingerprint sensor packaging module.
Description
Technical Field
The present invention relates to a fingerprint sensor packaging method and a fingerprint sensor packaging module packaged according to the packaging method, and more particularly, to a sensor packaging method in which a chip component is bonded by using an adhesive such as dispensing during packaging.
Background
The fingerprint sensor is the most important and convenient biological authentication module in mobile electronic equipment, the fingerprint sensor in the prior art needs multiple times of structural packaging and electrical welding processes to alternately perform the production process, and the yield is low.
The fingerprint sensor comprises a metal ring, one of the two functions is that the metal ring is enclosed around the sensor to achieve attractive effect, the other one is that the metal ring is connected with a circuit inside the electronic equipment to prevent static electricity, and the third one is that the metal ring is connected with a signal drive at the same time to serve as a fingerprint drive signal during measurement in some technical schemes.
The fingerprint sensor also comprises a dielectric cover plate, wherein one of the dielectric cover plate is used as a protective layer of the fingerprint sensor chip, so that the fingerprint sensor chip is prevented from being broken due to stress when pressed, and the fingerprint sensor chip is prevented from being directly exposed outside; the dielectric cover plate is used as an insulating functional layer for forming a capacitor between the finger print and the fingerprint sensing chip.
Therefore, the fingerprint sensor module needs to be completed by mechanical structure and electrical technology in the manufacturing process.
A typical sequence of the above fingerprint sensor module package is: 1. the mechanical structure steps are as follows: combining the dielectric cover plate with the fingerprint sensing chip, and adhering the dielectric cover plate and the fingerprint sensing chip by using an adhesive layer; 2. an electrical connection step: electrically connecting the fingerprint sensing chip with the circuit layer; 3. the mechanical structure steps are as follows: bonding the metal ring and the dielectric cover plate through an adhesive layer; 4 electrical structure steps: the metal ring is electrically connected with the circuit layer.
Another electrical fingerprint sensor module package sequence comprises: 1, an electrical connection step: the fingerprint sensing chip is electrically connected with the circuit layer; 2, mechanical structure steps: the dielectric cover plate and the fingerprint sensor are bonded by an adhesive layer; 3, mechanical structure steps: the metal ring is combined with the dielectric cover plate and is bonded through an adhesive layer; 4, an electrical connection step: the metal ring is electrically connected with the circuit layer;
the basic packaging steps of the fingerprint sensing chip are mechanical structure packaging step-electrical connection step-mechanical structure packaging step-electrical connection step or electrical connection step-mechanical structure packaging step-electrical connection step.
And the metal ring electricity or fingerprint sensing chip is electrically connected with the circuit layer in a welding way, and the welding is suitable for a reflow soldering process, wherein the reflow soldering process heats air or nitrogen to a high enough temperature and then blows the air or nitrogen to a circuit board on which the element is stuck to enable the solder on two sides of the element to be melted and then be adhered to the main board. In the existing fingerprint sensor module manufacturing process, the connection process of mechanical structure-electrical structure-mechanical structure-electrical structure is needed, the electrical structure connection is needed to be completed through two reflow soldering processes, and the mechanical structure connection needs to be performed through two dispensing processes. Therefore, the prior art packages the chip by mixing the structural connection and the electrical connection, and the manufacturing process is complicated.
Therefore, in view of the above-mentioned prior art, there are two disadvantages, namely, the mechanical structure packaging process and the electrical structure welding process are alternately performed to make the process complex, and the metal ring, the dielectric cover plate and the fingerprint sensing chip cannot exist as independent modules to complete the electrical structure connection at one time, so that it is necessary to propose a new fingerprint sensor packaging method and a new fingerprint sensor packaging module.
Disclosure of Invention
In order to solve the above-mentioned problems, the present invention provides a fingerprint sensor package module, comprising:
a dielectric cover sheet having oppositely disposed first and second surfaces;
a support structure having a support surface bonded to the first surface of the dielectric cover sheet and a bottom surface disposed opposite the support surface;
the fingerprint sensing chip is provided with a sensing surface and a non-sensing surface which are oppositely arranged, and the sensing surface is adhered to the first surface of the dielectric cover plate;
preferably, the second surface of the dielectric cover plate forms an upper surface of the packaging module, and the bottom surface of the supporting structure and the non-sensing surface of the fingerprint sensing chip form a lower surface of the packaging module.
Preferably, the method further comprises: an enclosing member having a closed structure formed around edges of the dielectric cover sheet and the support structure.
Preferably, the upper end of the surrounding member serves as a decorative outer frame of the packaging module.
Preferably, the surrounding member has an end face, and the bottom face of the support structure, the non-sensing face of the fingerprint sensor and the end face constitute a lower surface of the package module.
Preferably, the support structure and the enclosing member are one piece.
Preferably, at least one bonding pad for electrical connection is disposed on the lower surface of the packaging module.
In order to solve the technical problems, the invention also provides a specific fingerprint sensor packaging method, which comprises the following packaging steps:
s1, providing a dielectric cover plate, wherein the dielectric cover plate is provided with a first surface and a second surface which are oppositely arranged;
s2 provides a support structure having oppositely disposed support and bottom surfaces, the support surface being bonded to the first surface of the dielectric cover sheet.
S3, providing a fingerprint sensing chip which is provided with a sensing surface and a non-sensing surface which are oppositely arranged;
s4, bonding the sensing surface of the fingerprint sensing chip and the first surface of the dielectric cover plate;
in another embodiment, the method further comprises the following packaging steps:
s1, providing a dielectric cover plate, wherein the dielectric cover plate is provided with a first surface and a second surface which are oppositely arranged;
s2, providing a fingerprint sensing chip, wherein the fingerprint sensing chip is provided with a sensing surface and a non-sensing surface which are oppositely arranged;
s3, bonding a sensing surface of the fingerprint sensing chip and the first surface of the dielectric cover plate;
s4, providing a supporting structure with a supporting surface and a bottom surface which are oppositely arranged, wherein the supporting surface is adhered with the first surface of the dielectric cover plate.
Preferably, the method further comprises:
step S5 provides an enclosure member that can form a closed member at the edges of the dielectric cover sheet and support structure, the enclosure member being mounted outside the dielectric cover sheet and support structure.
Compared with the prior art, the invention has the advantages that firstly, in the packaging process of the fingerprint sensor, the fingerprint sensing chip, the supporting structure and the dielectric cover plate are connected to form an independent packaging module, so that the packaging module can be used as a module to be electrically connected with the circuit layer, namely, the packaging process is converted from a mechanical structure packaging step, an electric connection step, a mechanical connection step, an electric connection step into a mechanical structure packaging step, an electric connection step; and the independent fingerprint sensor packaging module only comprises a fingerprint sensing chip, a supporting structure and a dielectric cover plate, and can be sold as an independent module or connected with a circuit layer on electronic equipment.
Drawings
Fig. 1 is an exploded perspective view of a fingerprint sensor.
Fig. 2a to 2c are schematic views of a packaging sequence of the fingerprint sensor module in the M-M direction section of fig. 1, and the packaging sequence is marked by using directional arrows, and the support structure is preferentially combined with the dielectric cover plate.
Fig. 3a to 3c are schematic views of a packaging sequence of the fingerprint sensor module in the M-M direction section of fig. 1, and the packaging sequence is marked by using a directional arrow, and the fingerprint sensor chip is combined with the borrowing point improvement priority.
Fig. 4a and 4b are schematic flow diagrams of fingerprint sensor packages.
Fig. 5a to 5c are schematic views of a fingerprint package module according to an embodiment, and the package sequence is identified by using directional arrows.
Detailed Description
The following is a detailed description of the technical solution of the present invention with reference to the accompanying drawings, where the accompanying drawings are only for the sake of brevity and clarity, and in order to help a person skilled in the art understand the technical solution, the accompanying drawings use directional arrows to indicate the packaging sequence; the construction shown in the drawings is intended as a preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention, which is defined by the appended claims, and any modifications made in accordance with the spirit of the present invention or technical solutions substantially identical or equivalent to the technical solutions of the present invention are within the scope of the present invention.
Embodiment one:
referring to fig. 1, the fingerprint sensor package module package structure includes a metal ring 20 located at the outermost side of the entire package structure, and is manufactured by a manner known to those skilled in the art, the microstructure of the metal ring 20 includes a metal ring wall 23, a chamfer 21 is formed at the upper end of the metal ring wall 23, and the chamfer 21 is configured to guide a user to press a finger at a position corresponding to the sensing area of the fingerprint sensor; in some embodiments, the metal ring 20 is further used as an electrode electrically connected to the fingerprint surface, the metal ring 20 is connected to drive the high-frequency driving signal to form a detection loop with the fingerprint sensor chip 3, and the upper end of the metal ring, which is close to the chamfer 21, is used as a decorative outer frame for decorating the fingerprint sensor packaging module. The metal ring 20 further comprises a supporting structure 22 with the metal ring wall 23, the supporting structure 22 is used as a dielectric cover plate, the upper surface of the supporting structure is a supporting surface 221, the surface directly adhered with the dielectric cover plate is used for providing mechanical supporting function for the dielectric cover plate 1, the supporting structure 22 further comprises a bottom surface 222 opposite to the supporting surface 221, and the supporting structure 22 extends inwards to form a square opening 25 with the shape and the size of the opening being basically the same as that of the fingerprint sensing chip 3. It should be noted that the metal ring 20 is an alternative structure in the art that is a closed enclosing member formed around the edges of the dielectric cover plate 1 and the support structure 22, and that in some processes the support structure 22 alone is not included in the finger sensing packaging module, and that instead of the metal ring a plastic packaging process may be used to form an enclosing member around the dielectric cover plate and the support structure.
In the center of the metal ring 20, a dielectric cover sheet 1 is provided, the dielectric cover sheet 1 is typically made of an anisotropic material such as sapphire, the dielectric cover sheet 1 may also be typically made of an isotropic material such as ceramic or glass, the dielectric cover sheet 1 has a first surface 11 and a second surface 12 which are oppositely disposed, the second surface 12 being exposed to the outside to form an upper surface of the fingerprint sensor package module for providing a surface for contact with a finger, the first surface 11 of the dielectric cover sheet 1 is adhered to the support structure 22 by an adhesive, the adhesive including but not limited to: epoxy resin adhesive, polyurethane (PU) adhesive, amino resin adhesive, phenolic resin adhesive, acrylic resin adhesive, furan resin adhesive, resorcinol-formaldehyde resin adhesive, xylene-formaldehyde resin adhesive, unsaturated polyester adhesive, composite resin adhesive, polyimide adhesive, urea resin adhesive.
The fingerprint sensing chip 3 is bonded to the first surface 11 of the dielectric cover sheet in the same way as the first surface 11 and the support structure 22, the fingerprint sensing chip 3 comprising a sensing surface 31 (seeFIGS. 3a and 3bAnd a non-sensing surface 32 opposite to the sensing surface 31, wherein the non-sensing surface 32, the lower end surface of the metal ring and the bottom surface 222 of the supporting structure form the lower surface of the fingerprint sensor package module, and the first surface 11 of the dielectric cover plate is adhered to the sensing surface 31 of the fingerprint sensor chip. The sensor element (not shown) of the fingerprint sensing chip 3 and the circuit matched with the sensor element are integrated on the sensing surface 31 of the fingerprint sensing chip 3, the thickness of the dielectric cover plate 1 ranges from 20um to 800um for enhancing the signal transmission capability of the fingerprint sensing chip 3, and the thickness of the adhesive layer bonding the fingerprint sensing chip 3 and the dielectric cover plate 1 ranges from 2um to 20um.
Packaging module
Referring to the exploded schematic views of the fingerprint sensor module shown in fig. 2a to 2c, the encapsulation of the fingerprint sensor package module 123 (referring to fig. 4 a) is performed as follows;
s1 provides a dielectric cover sheet 1 having oppositely disposed first and second surfaces 11, 12;
s2 provides a support structure 22 having oppositely disposed support surfaces 221 and a bottom surface 222, the support surfaces 221 being bonded to the first surface 11 of the dielectric cover sheet.
S3, providing a fingerprint sensing chip, wherein the fingerprint sensing chip is provided with a sensing surface 31 and a non-sensing surface 32 which are oppositely arranged;
s4, bonding the sensing surface 31 of the fingerprint sensing chip and the first surface 11 of the dielectric cover plate;
further detailing the steps:
referring to fig. 2a, step S1 provides the dielectric cover plate in a plane, which is not limited to a horizontal plane, but may be a plane at any angle in space, and typically, the dielectric cover plate 1 is placed on a mounting table (not shown) of the chip package, where the mounting table is the plane of the dielectric cover plate 1; the first surface 11 of the dielectric cover is placed in an upper direction, the second surface 12 is directly exposed in the air for contacting with the surface of the finger, the first surface 11 of the dielectric cover is arranged in a lower direction and is close to the sensing surface of the fingerprint sensing chip, the thickness between the first surface 11 and the second surface 12, namely the distance between the surface of the finger and the fingerprint sensing chip 3, the finger and the fingerprint sensing chip form a detection capacitance through the action of the dielectric cover 1, and the smaller the thickness of the capacitance is, the larger the capacitance is formed under the same condition that the size of the capacitance depends on the thickness of the dielectric cover 1.
In step S2, the first surface 11 of the dielectric cover sheet 1 is glued, in the actual manufacturing process, the gluing process is to form independent glue points by dispensing one by a dispenser, the glue points form a glue layer 10 connected with the supporting structure 22 in the packaging process, and for convenience of representation, the glue layer 10 covers the first surface 11 of the dielectric cover sheet 1 only by the glue layer 10 in the final form of glue. The glue layer 10 can be divided into areas which are distributed at the edge of the first surface 11 of the dielectric cover plate according to functions, so that the support structure and the first surface of the dielectric cover plate 1 can be conveniently bonded; is distributed in the middle area of the surface of the dielectric cover plate 1 and is used for adhering the sensing surface of the fingerprint sensing chip 3.
Referring to fig. 2a and 2b, the metal ring 20 and the support structure 22 are integrally formed, and those skilled in the art will readily recognize that a separate structure of the metal ring 20 and the support structure 22 may be provided. The support structure and the metal ring 20 are spatially parallel to the plane of the dielectric cover plate 1 and align the center of symmetry O 'of the support structure 2 with the center O of the dielectric cover plate 1 in said plane such that the line X of symmetry O' of the support structure with the center O of the dielectric cover plate is perpendicular to the plane of said support structure 22 and to the dielectric cover plate first surface 11. As understood by the skilled artisan, when the shape of the dielectric cover sheet 1 is circular, the center O is the center of the circle of the dielectric cover sheet 1; when the dielectric cover 1 is non-circular, such as a rounded rectangle or oval, the center is the geometric center of the corresponding shape, and the support structure 22 or the dielectric cover 1 is moved along the axis X, so that the distance between the support surface 221 of the support structure 22 and the first surface 11 of the dielectric cover is continuously reduced to complete the adhesion process.
Referring to fig. 2b, since the metal ring is integrally formed with the support structure 22, the metal ring is also moved along the axis to the outer side of the edge of the dielectric cover sheet, and the adhesive layer 10 is spread under the extrusion of the support structure 22 and the dielectric cover sheet 1, and the air between the dielectric cover sheet 1 and the metal ring 20 and the support structure 22 is extruded during the spreading process.
By assembling the metal annular wall 23 and the dielectric cover plate 1 a gap is formed, which is optionally filled with glue, and when filling the gap, i.e. increasing the amount of glue during gluing, the glue spreads via extrusion overflow into the gap formed by the metal annular wall 23 and the dielectric cover plate side 12 when the support structure 22 is glued to the dielectric cover plate 1. Conversely, when the gap is not required to be filled, the extruded overflow glue is insufficient to fill the gap when the glue amount is reduced in the gluing step.
Referring to fig. 2c in further detail to step S3, a fingerprint sensing chip is provided,
the fingerprint sensing chip 3 moves along an axis X perpendicular to the first surface 11 of the dielectric cover plate 1 and passing through the center O of the dielectric cover plate, and meanwhile, the axis X passes through the center O "of the fingerprint sensing chip and moves to the position of the first surface adhesive layer 10 on the surface of the dielectric cover plate 1, the fingerprint sensing chip 3 is divided into a sensing surface 31 and a non-sensing surface 32, and the sensing surface 31 integrates a fingerprint sensing capacitor array and a circuit matched with the fingerprint sensing capacitor array. The non-sensing surface optionally comprises a signal outlet for outputting an image or signal of the sensing surface, and is electrically connected with the circuit layer 4 matched with the fingerprint packaging module.
Step S4, the sensing surface 31 is adjacent to the glue layer 10 on the first surface 11 of the dielectric cover sheet, and the non-sensing surface 32 is distant from the glue layer. The air layer formed between the fingerprint sensing chip 3 and the dielectric cover sheet is squeezed out by the spreading of the glue layer. The sensing surface 31 of the dielectric cover plate 1, which is in contact with the fingerprint sensing chip, forms a continuous adhesive layer. And the thicknesses of the dielectric cover plate and the adhesive layer are not more than 2um-20um for improving the speed of the fingerprint identification sensor.
Referring to fig. 2c, when the fingerprint sensing package module is applied to an electronic device, a circuit layer needs to be provided, the circuit layer 4 may be a flexible circuit board for transmitting signals, a flexible circuit is often used as a signal channel for transmitting a transmission pattern of a fingerprint sensor in an electronic device such as a mobile phone, and a plurality of bonding pads (not shown in the drawing) are disposed on a non-sensing surface 32 of the fingerprint sensor, and the flexible circuit is typically connected with the fingerprint sensing chip 3 through the bonding pads. Similarly, a pad for electrical connection may be disposed on the bottom end of the metal ring 20, where the circuit layer 4 is electrically connected to the fingerprint sensor chip 3 or the metal ring 20 through the pad, and the circuit layer is electrically connected to the metal ring to optionally form an electrostatic protection circuit. The circuit layer 4 may also be a pcb circuit board in an electronic device such as a mobile phone, and the fingerprint sensor and the pcb board are electrically connected by using a technical method known to those skilled in the art, such as soldering, for example, a solder joint is formed between the metal ring 20 and the circuit sensing layer through a reflow soldering process, a signal wire is built in the fingerprint sensing chip through a tsv process, and a sensing signal of the fingerprint sensing chip 3 is transmitted to the circuit layer 4 through the signal wire.
Referring to fig. 4b, if the support structure 22 and the metal ring 20 are not integrally formed, step S5 may be added to provide a surrounding member capable of forming a closed member at the edges of the dielectric cover sheet and the support structure, and the surrounding member is mounted outside the dielectric cover sheet and the support structure. The surrounding member, which may be an "L" shaped cross-sectional structure of the structure of fig. 2a with support structure 22 removed, serves a similar function as the metal ring in the fingerprint sensor package as an alternative to the metal ring 20.
The fingerprint sensing chip 3 and the metal ring 20 of the dielectric cover plate 1 are packaged to form an independent module, and are used as independent modules when not connected with the circuit layer 4, compared with the prior art, the fingerprint sensing chip has the advantages that the dielectric cover plate 1, the metal ring 20 and the fingerprint sensing chip 3 are combined by using glue connection, mechanical structure packaging is completed in a concentrated manner in the fingerprint sensor packaging process, electrical connection of alternative fingerprint sensors is not performed in the process, the formed independent modules are selectively electrically connected with a flexible circuit or a pcb board and the like, the electrical structure connection of the fingerprint sensing chip can be completed at one time, and the structure connection is completed in a concentrated manner in a single electrical connection process (structure-electrical) in the prior art.
Example two
Referring to fig. 3a to 3c, a packaging step variant comprises the following steps:
s1 provides a dielectric cover sheet having oppositely disposed first and second surfaces 11, 12;
s2, providing a fingerprint sensing chip, wherein the fingerprint sensing chip is provided with a sensing surface and a non-sensing surface which are oppositely arranged;
s3, bonding a sensing surface of the fingerprint sensing chip and the first surface of the dielectric cover plate;
s4, providing a supporting structure with a supporting surface and a bottom surface which are oppositely arranged, wherein the supporting surface is adhered with the first surface of the dielectric cover plate.
The present embodiment is a modification of the first embodiment, and the difference between them is only that: the fingerprint sensing chip 3 is adhered to the first surface of the dielectric cover 1 prior to the supporting structure 22, and the adjustment of the sequence of the mounting steps has no substantial effect on the final product of the fingerprint sensing package module. Details of the corresponding steps are the same as those of the first embodiment, and will not be described again.
If the support structure 22 and the metal ring 20 are not integrally formed, a step S5 of providing a surrounding member capable of forming a closed member at the edges of the dielectric cover sheet and the support structure and mounting the surrounding member outside the dielectric cover sheet and the support structure may be added. The surrounding member, which may be an "L" shaped cross-sectional structure of the structure of fig. 2a with support structure 22 removed, serves a similar function as the metal ring in the fingerprint sensor package as an alternative to the metal ring 20.
Example III
Referring to fig. 5a to 5c as a further variant, the invention adds a spacer 5 during said encapsulation; the fingerprint sensor module with gasket 5 is packaged in the following order:
wherein steps S1 to S4 are the same as those of the first or second embodiment, and the surface of the pad 5 or the supporting structure is coated with glue in step S5, and the axis X is moved; the glue layer 10 removes air between the cushion 5 and the supporting structure gap under the compression of the cushion; step S6 provides a circuit layer 4, which may be a flexible circuit board for transmitting signals, a flexible circuit is often used in electronic devices as a signal channel for transmitting a fingerprint sensor transmission pattern, and the flexible circuit is usually matched with the front fingerprint sensing chip 3. The circuit layer 4 is electrically connected with the fingerprint sensing chip 3 or the metal ring, and the circuit layer 4 is electrically connected with the metal ring 20 to form an electrostatic protection circuit optionally. The circuit layer 4 may also be a pcb circuit board in an electronic device such as a mobile phone, and when the fingerprint sensor is placed on the back of the mobile phone, the fingerprint sensor and the pcb board are electrically connected by using a technical method known to those skilled in the art, such as welding. The pad 5 may be made of various materials, for example, a plastic plate or a metal plate, and a plurality of through holes 51 penetrating both ends of the pad are provided in the interior of the pad, and the diameter of the through holes 51 is determined by signal lines 52 extending in the holes, the signal lines being conductive metals. The signal line 52 extends from the through hole to the signal outlet 34 of the fingerprint sensing chip, and the other end of the signal line is connected with the pad surface electrode 53 and is also used as the signal outlet of the fingerprint sensing package module.
Compared with the prior art, the invention has the advantages that in the process of packaging the fingerprint sensor, the mechanical structures of the fingerprint sensing chip, the metal ring and the dielectric cover plate are connected to form an independent packaging module, the independent packaging module is used as a module to be electrically connected with the circuit layer 4, namely the packaging process is converted from a mechanical structure packaging step, an electric connection step, a mechanical connection step and an electric connection step into a mechanical structure packaging step, an electric connection step, and the independent fingerprint sensor package only comprising the fingerprint sensing chip, the metal ring and the dielectric cover plate can be sold as an independent module or connected with the circuit layer 4 on the electronic equipment.
Claims (6)
1. Fingerprint sensor encapsulation module, its characterized in that includes:
a dielectric cover sheet having oppositely disposed first and second surfaces;
a support structure having a support surface bonded to the first surface of the dielectric cover sheet and a bottom surface disposed opposite the support surface;
the fingerprint sensing chip is provided with a sensing surface and a non-sensing surface which are oppositely arranged, and the sensing surface is adhered to the first surface of the dielectric cover plate;
a surrounding member having a closed structure formed around edges of the dielectric cover sheet and the support structure;
the second surface of the dielectric cover plate forms the upper surface of the packaging module, the bottom surface of the supporting structure and the non-sensing surface of the fingerprint sensing chip form the lower surface of the packaging module, and at least one bonding pad for electrical connection is arranged on the lower surface of the packaging module;
the thickness of the dielectric cover plate is set to be 20-800 um, and the thickness of the adhesive layer for bonding the fingerprint sensing chip and the dielectric cover plate is set to be 2-20 um.
2. The fingerprint sensor package module of claim 1, wherein the upper end of the surrounding member serves as a decorative frame for the package module.
3. The fingerprint sensor package module of claim 1, wherein the surrounding member has an end surface, and wherein the bottom surface of the support structure, the non-sensing surface of the fingerprint sensor, and the end surface form a lower surface of the package module.
4. The fingerprint sensor package module of claim 1, wherein the support structure and surrounding member are one-piece.
5. The packaging method of the fingerprint sensor is characterized in that the packaging method is applied to the fingerprint sensor packaging module set according to any one of claims 1-4, and comprises the following packaging steps:
providing a dielectric cover sheet having oppositely disposed first and second surfaces;
providing a support structure having oppositely disposed support surfaces and a bottom surface, the support surfaces being bonded to the first surface of the dielectric coversheet;
providing a fingerprint sensing chip which is provided with a sensing surface and a non-sensing surface which are oppositely arranged;
bonding a sensing surface of the fingerprint sensing chip with a first surface of the dielectric cover plate;
the thickness of the dielectric cover plate is set to be 20-800 um, and the thickness of the adhesive layer for bonding the fingerprint sensing chip and the dielectric cover plate is set to be 2-20 um.
6. The fingerprint sensor packaging method of claim 5, further comprising:
an enclosure member is provided that is capable of forming a closed member at the edges of the dielectric coversheet and support structure, the enclosure member being mounted outside the dielectric coversheet and support structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610846978.9A CN106250891B (en) | 2016-09-23 | 2016-09-23 | Fingerprint sensor packaging method and packaging module |
Applications Claiming Priority (1)
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| WO2021000311A1 (en) * | 2019-07-04 | 2021-01-07 | 深圳市汇顶科技股份有限公司 | Fingerprint sensor, fingerprint recognition module and fingerprint recognition system |
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| CN103699881A (en) * | 2013-12-13 | 2014-04-02 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and mobile terminal |
| CN105428339A (en) * | 2015-12-01 | 2016-03-23 | 华天科技（西安）有限公司 | Antistatic fingerprint sensor chip packaging structure and manufacturing method |
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| CN103699881A (en) * | 2013-12-13 | 2014-04-02 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and mobile terminal |
| CN105428339A (en) * | 2015-12-01 | 2016-03-23 | 华天科技（西安）有限公司 | Antistatic fingerprint sensor chip packaging structure and manufacturing method |
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