CN106250891A - Fingerprint sensor package method and encapsulation module - Google Patents
Fingerprint sensor package method and encapsulation module Download PDFInfo
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- CN106250891A CN106250891A CN201610846978.9A CN201610846978A CN106250891A CN 106250891 A CN106250891 A CN 106250891A CN 201610846978 A CN201610846978 A CN 201610846978A CN 106250891 A CN106250891 A CN 106250891A
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- fingerprint sensor
- cover plate
- dielectric cover
- sensitive face
- encapsulation
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The present invention relates to a kind of fingerprint sensor package module, including: dielectric cover plate, it has the first surface and second surface being oppositely arranged；Supporting construction, the supporting surface with the bonding of the first surface with described dielectric cover plate and the bottom surface being oppositely arranged with supporting surface；Fingerprint sensor, has the sensitive face being oppositely arranged and non-sensitive face, and described sensitive face bonds with the first surface of dielectric cover plate；Hinge structure of the present invention reduces the complexity of packaging technology and improves the yields of fingerprint sensor package module.
Description
Technical field
The present invention relates to fingerprint sensor package method and the fingerprint sensor package module encapsulated according to this method for packing
, particularly to the sensor packaging method using the binding agent bonding chip parts such as some glue in encapsulation process.
Background technology
Fingerprint sensor is mostly important convenient biological identification module, prior art fingerprint sensing in mobile electronic device
Device needs the most structural encapsulation and electricity welding procedure alternately complex manufacturing, and yields is low.
Fingerprint sensor includes becket, plays two effect first and is enclosed in around sensor and plays effect attractive in appearance,
It two is that the circuit with electronic equipment internal is connected antistatic, and it three is that becket is simultaneously connected with signal in some technical schemes
Drive and drive signal as fingerprint when measuring.
Fingerprint sensor also includes dielectric cover plate, and the effect first of dielectric cover plate is as the protection of fingerprint sensor chip
Layer, outside when preventing from pressing, fingerprint sensor prevents fingerprint sensor to be directly exposed to because of stress fragmentation simultaneously；Dielectric cover plate
Effect its two be as the insulating functional layers forming electric capacity between finger print and fingerprint sensor.
Therefore, fingerprint sensor module needs mechanical structure and electricity technique to complete in the fabrication process.
The priority step of a kind of typical above-mentioned fingerprint sensor module packaging is: 1. mechanical structure step: by dielectric cap
Sheet is combined with fingerprint sensor, uses glue-line bonding dielectric cover plate and fingerprint sensor；2. it is electrically connected with step: by fingerprint
Sensing chip is electrically connected with circuit layer；3. mechanical structure step: becket is bonded by glue-line with dielectric cover plate,；4 electricity
Configuration steps: described becket is electrically connected with circuit layer.
Another kind of electrical fingerprint sensor module packaging successively step is: 1 is electrically connected with step: fingerprint sensor with
Circuit layer is electrically connected with；2 mechanical structure steps: dielectric cover plate and fingerprint sensor are by glue-line adhesive bond；3 mechanical structure steps
Rapid: becket is combined with dielectric cover plate and is bonded by glue-line；4 are electrically connected with step: becket is electrically connected with circuit layer；
According to the basic encapsulation step of above-mentioned step fingerprint sensor be mechanical structure encapsulation step-electric connection step-
Mechanical structure encapsulation step-electric connection step or electric connection step-mechanical structure encapsulation step-mechanical structure encapsulation step
Suddenly-it is electrically connected with step.
Electric connection realizes described becket electricity or fingerprint sensor welds with circuit layer, and welding is suitable for backflow welder
Skill, air or nitrogen are heated to sufficiently high temperature after-blow to having posted the wiring board of element by element two by reflow soldering process
The solder of side bonds with mainboard after melting.Existing fingerprint sensor module manufacture process needs through, mechanical structure-electricity
The connection procedure of structure-mechanical structure-electricity structure, needs twice reflow soldering process to complete electricity structure and connects, mechanical structure
Connect and need twice glue.Therefore during prior art encapsulation chip, structure connection mixes mutually with being electrically connected with, this manufacture process side
Method is complicated.
Therefore there are two shortcoming first mechanical structure packaging technologies and electricity structure welding for above-mentioned prior art
Technique alternately complex process, it two is that becket, dielectric cover plate, fingerprint sensor cannot function as independent module and exist
Thus once complete electricity structure and connect, it is necessary to new fingerprint sensor package method and fingerprint sensor package mould are proposed
Group.
Summary of the invention
For solving the problems referred to above present invention, one fingerprint sensor package module is proposed, including:
Dielectric cover plate, it has the first surface and second surface being oppositely arranged；
Supporting construction, the supporting surface with the bonding of the first surface with described dielectric cover plate and the end being oppositely arranged with supporting surface
Face；
Fingerprint sensor, has the first table of the sensitive face being oppositely arranged and non-sensitive face, described sensitive face and dielectric cover plate
Face bonds；
Preferably, the second surface of dielectric cover plate constitutes the upper surface of encapsulation module, the bottom surface of described supporting construction and described finger
The non-sensitive face of stricture of vagina sensing chip constitutes the lower surface of encapsulation module.
Preferably, also include: surround component that there is the Guan Bi knot of the edge formation around dielectric cover plate and supporting construction
Structure.
Preferably, the component upper end decorative outer frame as encapsulation module is surrounded.
Preferably, described encirclement component has an end face, the bottom surface of described supporting construction, the non-sensitive face of fingerprint sensor and
End face constitutes the lower surface of encapsulation module.
Preferably, supporting construction and encirclement component are integrated part.
Preferably, the lower surface of described encapsulation module is arranged at least one for the pad being electrically connected with.
A kind of concrete fingerprint sensor package method is also provided for, including following for solving the above-mentioned technical problem present invention
Encapsulation step:
S1 provides dielectric cover plate, and it has the first surface and second surface being oppositely arranged；
S2 provides the structural support, and it has the first table of the supporting surface and bottom surface being oppositely arranged, supporting surface and described dielectric cover plate
Face bonds；
S3 provides fingerprint sensor, and it has the sensitive face being oppositely arranged and non-sensitive face；
S4 is by the first surface bonding of the sensitive face of described fingerprint sensor with described dielectric cover plate；
The most also include following encapsulation step:
S1 provides dielectric cover plate, and it has the first surface and second surface being oppositely arranged；
S2 provides fingerprint sensor, has the sensitive face being oppositely arranged and non-sensitive face；
S3 is by the first surface bonding of the sensitive face of described fingerprint sensor with described dielectric cover plate；
S4 provides the structural support, and has the first surface of the supporting surface and bottom surface being oppositely arranged, supporting surface and described dielectric cover plate
Bonding.
Preferably, also include:
Step S5 provides the encirclement component of the component that can form Guan Bi at the edge of dielectric cover plate and supporting construction, will surround structure
Part is arranged on outside described dielectric cover plate and supporting construction.
Hinge structure of the present invention has the advantage of two aspects, first first carries out during fingerprint sensor package
Fingerprint sensor, supporting construction, dielectric cover plate mechanical structure connect the encapsulation module that formation is independent, it is simple to encapsulation module conduct
Module carries out electricity structure with circuit layer and is connected, and i.e. packaging technology is by " mechanical structure encapsulation step-electric connection step-mechanics
Connection Step-electricity Connection Step " it is converted into " mechanical structure encapsulation step-electric connection step "；Secondly fingerprint is only comprised
Sensing chip, supporting construction, the independent fingerprint sensor package module of dielectric cover plate, can sell as independent module or with electricity
Circuit layer on subset connects, and present invention reduces process complexity and improves fingerprint sensor package yield.
Accompanying drawing explanation
Fig. 1 is fingerprint three-dimensional sensor decomposing schematic representation.
In Fig. 2, a is M-M directional profile fingerprint sensor package module packaging sequential schematic user in Fig. 1 to figure c
To arrow logo encapsulation order, supporting construction is preferentially combined with dielectric cover plate.
In Fig. 3, a is M-M directional profile fingerprint sensor package module packaging sequential schematic user in Fig. 1 to figure c
To arrow logo encapsulation order, fingerprint sensor changes the original sentence to preferential combination with borrowing point.
Fig. 4 fingerprint sensor package schematic flow sheet.
In Fig. 5, a to figure c is embodiment two fingerprint fingerprint encapsulation module encapsulation sequential schematic and uses direction arrow logo
Encapsulation order.
Detailed description of the invention
Below in conjunction with accompanying drawing, technical solution of the present invention is further described in detail, be it should be noted that accompanying drawing is only
It is for the technical thought of the short and sweet displaying present invention, simultaneously in order to help skilled in the art to understand the technical program
Accompanying drawing uses direction arrows encapsulation order；The structure shown in accompanying drawing is a kind of preferred embodiment as the present invention
It is not intended that limit a kind of restriction to protection scope of the present invention, protection scope of the present invention with the content of claim is
Standard, the most any change done according to spirit order of the present invention or constitute substantially identical or be equal to technical solution of the present invention
Technical scheme the most within the scope of the present invention.
Embodiment one:
Including being positioned at whole encapsulating structure with reference to Fig. 1 fingerprint sensor package module package structure outermost, becket 20 is
By well known to a person skilled in the art that mode processes acquirement, the microstructure of becket 20 includes metal ring wall 23, at gold
The upper end belonging to ring wall 23 forms chamfering 21, and chamfering 21 structure is for guiding user that finger is pressed against described fingerprint sensor sense
Answer the position that district is corresponding；In some technical schemes, becket 20 is also as the electrode being electrically connected with fingerprint epidermis, becket
20 connections drive high-frequency driving signal to form measure loop with described fingerprint induction chip 3, and becket is near chamfering 21 simultaneously
Upper end as decoration fingerprint sensor package module decorative outer frame.Becket 20 also includes supporting with described metal ring wall 23
Structure 22, as the supporting construction 22 of dielectric cover plate, the upper surface of supporting construction is that it is directly viscous with dielectric cover plate for supporting surface 221
Its effect of the face closed is that dielectric cover plate 1 provides mechanical support effect, supporting construction 22 also include set relative with supporting surface phase 221
The bottom surface 222 put, supporting construction 22 extends internally its opening shape size side essentially identical with fingerprint sensor 3 formed
Shape opening 25.It is to be noted becket 20 be the optional structure of the art its be as around dielectric cover plate 1 and
The encirclement component of the Guan Bi that the edge of support structure 22 is formed, only uses in fingerprint sensing encapsulation module in some techniques and supports knot
Structure 22 does not include becket 20, it is possible to use plastic package process replaces becket to be formed around dielectric cover plate and the encirclement of supporting construction
Component.
Central authorities at described becket 20 arrange dielectric cover plate 1, and dielectric cover plate 1 is that anisotropic material is the most blue
Gem, dielectric cover plate 1 can also be isotropic material typical such as pottery or glass dielectric cover plate, and dielectric cover plate 1 has
The first surface 11 being oppositely arranged and second surface 12, second surface 12 is exposed to outside and constitutes fingerprint sensor package module
Upper surface, for providing the surface for contacting with finger, the first surface 11 of dielectric cover plate 1 passes through glue bond in described support
In structure 22, described glue includes but not limited to: epoxide-resin glue, polyurethane (PU) glue, amino resin adhesive, phenolic resin glue, third
Olefin(e) acid resin glue, furane resins glue, resorcinol-formaldehyde resin glue, xylene formal dehyde resin glue, unsaturated polyester ester gum, compound
Type resin glue, polyimides glue, urea-formaldehyde resin adhesive.
First surface 11 at described dielectric cover plate bonds fingerprint sensor 3, bonding mode and first surface 11 and props up
The bonding mode of support structure 22 is identical, and described fingerprint sensor 3 includes that sensitive face 31 (seesFig. 3)And it is relative with sensitive face 31
The non-sensitive face 32 arranged, non-sensitive face 32 constitutes fingerprint sensing with the lower surface of becket and the bottom surface 222 of supporting construction
The lower surface of device encapsulation module, the first surface 11 of above-mentioned dielectric cover plate bonds with the sensitive face 31 of fingerprint sensor.Described
Sensor element (not shown) and the circuit coordinated with sensor element of fingerprint sensor 3 are integrated in described fingerprint biography
The sensitive face 31 of sense chip 3, in order to strengthen the thickness range of dielectric cover plate 1 described in the signal penetration capacity of fingerprint sensor 3
In the range of 20um-800um, the thickness of the glue-line of described bonding fingerprint sensor 3 and dielectric cover plate 1 is in 2um-20um scope
In.
Encapsulation module
With reference to the decomposition texture schematic diagram of the fingerprint sensor module shown in Fig. 2, (referring concurrently to Fig. 4 a) described fingerprint sensor
Encapsulation module 123 encapsulation is carried out according to the steps；
S1 provides dielectric cover plate 1, and it has the first surface 11 and second surface 12 being oppositely arranged；
S2 provides the structural support 22, and it has the supporting surface 221 and bottom surface 222 being oppositely arranged, supporting surface 221 and described dielectric cap
The first surface 11 of sheet bonds；
S3 provides fingerprint sensor, and it has the sensitive face 31 and non-sensitive face 32 being oppositely arranged；
The first surface 11 of the sensitive face 31 of described fingerprint sensor with described dielectric cover plate is bonded by S4；
It is described in further detail each step:
Thering is provided dielectric cover plate in a certain plane with reference to Fig. 2 a step S1, this plane is not limited to horizontal plane, can be in space times
The plane of one angle, described dielectric cover plate 1 (is not shown in figure by typical being achieved in that as on the erecting bed of chip package
Go out), the described erecting bed i.e. plane at dielectric cover plate 1 place；The first surface 11 of dielectric cover plate is placed on top direction, the
Two surfaces 12 be directly exposed in air for finger-surface contacts, the first surface 11 of dielectric cover plate is arranged on the lower
Direction is close with the sensitive face of fingerprint sensor, the thickness i.e. finger surface between first surface 11 and second surface 12 and finger
Distance between stricture of vagina sensing chip 3, finger forms detection electric capacity, electric capacity with fingerprint sensor by the effect of dielectric cover plate 1
The thickness equal conditions being sized depending on described dielectric cover plate 1 under the electric capacity of the least formation of its thickness the biggest.
Step S2 described dielectric cover plate 1 first surface 11 glue 10, in actual manufacture glue process be by point
The independent glue point that glue is formed put one by one by glue machine, and glue point forms the glue-line 10 of connected support structure 22 in encapsulation process, in order to
Convenient expression only represents with the final form glue-line 10 of glue, and described glue-line 10 covers the first surface 11 of dielectric cover plate 1.Described glue
Layer 10 can be divided into the branch region at described dielectric cover plate first surface 11 edge according to function, it is simple to bonding supporting construction
With dielectric cover plate 1 first surface；It is distributed in described dielectric cover plate 1 surface zone line, for bonding the biography of fingerprint sensor 3
Sense face.
Integrally formed with reference to Fig. 2 a and 2b becket 20 and supporting construction 22, those skilled in the art are readily apparent all right
Becket 20 and the supporting construction 22 of Split type structure are set.Supporting construction and becket 20, with dielectric cover plate 1 place in space
Plane parallel, and by symmetrical centre O of supporting construction 2 in described plane ' align with the center O of dielectric cover plate 1 so that
Symmetrical centre O of supporting construction ' with the center O line X of dielectric cover plate and described supporting construction 22 place plane and dielectric cover plate
First surface 11 is vertical.According to the understanding of those skilled in the art, when the shape of dielectric cover plate 1 is circle, described center O is i.e.
The center of circle of dielectric cover plate 1；Such as round rectangle or ellipse etc. when described dielectric cover plate 1 is non-circular, described center is i.e.
The geometric center of respective shapes, moves described supporting construction 22 or dielectric cover plate 1 along axis X so that both distances are not
The disconnected supporting surface 221 having reduced supporting construction 22 and the process of first surface 11 bonding of dielectric cover plate.
Being structure as a whole with supporting construction 22 due to becket with reference to Fig. 2 b, therefore becket is equally along above-mentioned axial line
The mobile edge lateral surface to described dielectric cover plate, glue-line 10 spreads under the extruding of supporting construction 22 and dielectric cover plate 1, diffusion
Process by exist and dielectric cover plate 1 and becket 20, supporting construction 22 between air extrusion.
Forming gap 5 between described metal ring wall 23 and dielectric cap 1 through assembling, this gap 5 optionally uses glue to fill out
Fill, time when filling described gap 5 at glue, increase the amount of glue, when supporting construction 22 and dielectric cover plate 1 bond, glue warp
Cross to extrude to overflow and be diffused into metal ring wall 23 and formation filling in the gap 5 of dielectric cover plate side 12 formation.Need not on the contrary
When described gap 5 is filled, glue step reduce glue amount then described in the spilling glue that is extruded be not enough to fill gap.
See Fig. 2 c and be described in further detail step S3, it is provided that fingerprint sensor,
Described fingerprint sensor 3 is along being perpendicular to the first surface 11 of described dielectric cover plate 1 and through dielectric cover plate center O's
Axis X moves, and axis X passes the center O of fingerprint sensor simultaneously " mobile to dielectric cover plate 1 surface first surface glue-line 10
Position, fingerprint sensor 3 is divided into sensitive face 31 and non-sensitive face 31, sensitive face 31 integrated fingerprint sensing capacitance array and with
The circuit of cooperation.Described non-sensitive face includes the signal outlet for exporting sensitive face image or signal alternatively, for
The circuit 4 that fingerprint encapsulation module coordinates is electrically connected with.
The step S4 sensitive face 31 glue-line 10 on described dielectric cover plate first surface 11, non-sensitive face 31 is away from described
Glue-line.The air layer formed between fingerprint sensor 3 and dielectric cover plate is extruded because of the diffusion of described glue-line.Described dielectric cover plate
The sensitive face 31 that 1 contacts with fingerprint sensor forms continuous print and connects glue-line.Simultaneously in order to improve described fingerprint recognition sensing
Dielectric cover plate described in the speed of device and the thickness with glue-line are less than 2um-20um.
Circuit layer, circuit layer 4 is it is also required to provide when fingerprint sensing encapsulation module is applied in electronic equipment with reference to Fig. 2 c
Could be for transmitting the flexible PCB of signal, often use flexible circuit to pass as transmission fingerprint in the electronic equipments such as mobile phone
The signalling channel of sensor transmission figure, the non-sensitive face 31 of described fingerprint sensor arranges multiple pad (not shown) soft
Property circuit be connected by pad and fingerprint sensor 3 are typical.Similarly, becket 20 bottom can also be provided for electrically connecting
The pad connect, circuit layer 4 is electrically connected with by pad with fingerprint sensor 3 or becket 20, and circuit layer electrically connects with becket
Connect and optionally form electrostatic discharge protective circuit.Circuit layer 4 can also is that the pcb circuit board in the electronic equipments such as mobile phone, fingerprint sensing
Use to weld etc. between device with pcb plate and well known to a person skilled in the art that technical method is electrically connected with, such as at becket
Solder joint is formed by reflow soldering process, by confidence in tsv technique inside fingerprint sensor between 20 and circuit senses layer
Number line, is sent to described circuit layer 4 by holding wire by the sensing signal of fingerprint sensor 3.
If being non-integral structure with reference to supporting construction 22 above-mentioned for Fig. 4 b and becket 20, then can increase step S5 i.e. provides
The encirclement component of the component of Guan Bi can be formed at the edge of dielectric cover plate and supporting construction, encirclement component is arranged on described dielectric
Outside cover plate and supporting construction.Surround component its work played in fingerprint encapsulation sensor of alternative structure as becket 20
With the effect similar to becket, surrounding component can be structure its cross-section structure Cheng Jing after removing supporting construction 22 in Fig. 2 a
" L " type of picture.
Formed solely after encapsulation through step S1 to fingerprint sensor described in step S4 3, dielectric cover plate 1 becket 20
Vertical module, when not being connected with described circuit layer 4 as independent module, the advantage of its hinge structure be, dielectric
Use glue between cover plate 1, metal 20 ring, 3, fingerprint sensing core connects combination, is tied by mechanics during fingerprint sensor package
Structure encapsulation concentration completes, and does not the most replace the electric connection of fingerprint sensor, and the standalone module that formed selectable with
Flexible circuit or pcb plate etc. are electrically connected with, and can be connected by the electricity structure of fingerprint sensor and disposably complete to connect, will be existing
There are the mechanical structure repeatedly replaced encapsulation and the electricity structure connection procedure (structure-electricity-structure-electricity) of technology, are reduced to single
Electric connection process (structure-electricity) structure connected concentration complete.
Embodiment two
Comprise the following steps that with reference to Fig. 3 a to Fig. 3 c encapsulation step variation
S1 provides dielectric cover plate, and it has the first surface 11 and second surface 12 being oppositely arranged；
S2 provides fingerprint sensor, has the sensitive face being oppositely arranged and non-sensitive face；
S3 is by the first surface bonding of the sensitive face of described fingerprint sensor with described dielectric cover plate；
S4 provides the structural support, and has the first surface of the supporting surface and bottom surface being oppositely arranged, supporting surface and described dielectric cover plate
Bonding.
The present embodiment is a kind of variation of embodiment one, and both differ only in: fingerprint sensor 3 is prior to propping up
Support structure 22 bonds with the first surface of dielectric cover plate 1, and the adjustment of this installation steps order is final to fingerprint sensing encapsulation module
Finished product does not has materially affect.It is embodied as that details is identical with embodiment one not to be repeated them here in corresponding steps.
If above-mentioned supporting construction 22 and becket 20 are non-integral structure, then can increase that step S5 i.e. provides can be in dielectric
The edge of cover plate and supporting construction forms the encirclement component of the component of Guan Bi, encirclement component is arranged on described dielectric cover plate and props up
Outside support structure.Surround component alternative structure its effect played in fingerprint encapsulation sensor and metal as becket 20
The effect that ring is similar, surrounds " L " that component can be its cross-section structure journey mirror image of structure after removing supporting construction 22 in Fig. 2 a
Type.
Embodiment three
In described encapsulation process, liner 5 is increased as the another kind of variation present invention with reference to Fig. 5 a to Fig. 5 c；With liner
The fingerprint sensor module encapsulation order of 5 is as follows:
Wherein step S1 is identical with embodiment one or embodiment two to step S4, in step s 5 in surface or the support of liner 5
Structural plane glue 101, and described axis X moves；Glue 10 described in S get rid of under the extruding of liner liner 5 and supporting construction space it
Between air；Step S6 provides circuit layer 4, and circuit layer 4 could be for transmitting the flexible PCB 4 of signal, at electronic equipment
In often use flexible circuit as the signalling channel of transmission fingerprint sensor transmission figure, above-mentioned flexible circuit generally with preposition finger
Stricture of vagina sensor 3 coordinates.Circuit layer 4 is electrically connected with fingerprint sensor 3 or becket, and circuit layer 4 is electrically connected with becket 20
Optionally form electrostatic discharge protective circuit.Circuit layer 4 can also is that the pcb circuit board in the electronic equipments such as mobile phone, puts in cell phone back
During fingerprint sensor, use to weld etc. between fingerprint sensor with pcb plate and well known to a person skilled in the art that technical method is carried out
It is electrically connected with.Described liner 5 can be made of a variety of materials and such as use plastic plate or metallic plate, arranges many in the inside of liner
The individual through hole 51 running through liner two ends, the diameter of through hole 51 is determined by the holding wire 52 extended in hole, and described holding wire is for leading
Electric metal.Holding wire 52 extends to the signal outlet 34 of fingerprint sensor from described through hole, and the other end of holding wire connects
Pad surfaces electrode 53, the signal outlet simultaneously also serving as fingerprint sensing encapsulation module uses.
Hinge structure of the present invention has the advantage of two aspects, first carries out fingerprint during fingerprint sensor package
Sensing chip, becket, dielectric cover plate mechanical structure connect and form independent encapsulation module, then using independent encapsulation module as
Module carries out electricity structure with circuit layer 4 and is connected, and i.e. packaging technology is by " mechanical structure encapsulation step-electric connection step-mechanics
Connection Step-electricity Connection Step " it is converted into " mechanical structure encapsulation step-electric connection step ", secondly only comprise fingerprint
Sensing chip, becket, the independent fingerprint sensor package of dielectric cover plate, can sell or and electronic equipment as independent module
On circuit layer 4 connect, present invention reduces process complexity improve fingerprint sensor package yield, fingerprint sensing encapsulation module
Also including liner, and have on liner and run through through hole, in through hole, holding wire is had higher anti-by the protection of described liner
Impact.
Claims (10)
1. fingerprint sensor package module, it is characterised in that including:
Dielectric cover plate, it has the first surface and second surface being oppositely arranged；
Supporting construction, the supporting surface with the bonding of the first surface with described dielectric cover plate and the end being oppositely arranged with supporting surface
Face；
Fingerprint sensor, has the first table of the sensitive face being oppositely arranged and non-sensitive face, described sensitive face and dielectric cover plate
Face bonds.
2. fingerprint sensor package module as claimed in claim 1, it is characterised in that the second surface structure of described dielectric cover plate
The upper surface of encapsulation module, the bottom surface of described supporting construction is become to constitute encapsulation module with the non-sensitive face of described fingerprint sensor
Lower surface.
3. fingerprint sensor package module as claimed in claim 1, it is characterised in that also include: surround component, have around
The closing structure that the edge of dielectric cover plate and supporting construction is formed.
4. fingerprint sensor package module as claimed in claim 3, it is characterised in that described encirclement component upper end is as encapsulation
The decorative outer frame of module.
5. fingerprint sensor package module as claimed in claim 3, it is characterised in that described encirclement component has end face, described
The bottom surface of supporting construction, the non-sensitive face of fingerprint sensor and end face constitute the lower surface of encapsulation module.
6. fingerprint sensor package module as claimed in claim 3, it is characterised in that described supporting construction and encirclement component are
Body part.
7. fingerprint sensor package module as described in claim 2 or claim 5, it is characterised in that described encapsulation module
At least one is set on lower surface for the pad being electrically connected with.
8. the method for packing of fingerprint sensor, it is characterised in that include following encapsulation step:
S1 provides dielectric cover plate, and it has the first surface and second surface being oppositely arranged；
S2 provides the structural support, and it has the first table of the supporting surface and bottom surface being oppositely arranged, supporting surface and described dielectric cover plate
Face bonds；
S3 provides fingerprint sensor, and it has the sensitive face being oppositely arranged and non-sensitive face；
S4 is by the first surface bonding of the sensitive face of described fingerprint sensor with described dielectric cover plate.
9. the method for packing of fingerprint sensor, it is characterised in that include following encapsulation step:
S1 provides dielectric cover plate, and it has the first surface and second surface being oppositely arranged；
S2 provides fingerprint sensor, has the sensitive face being oppositely arranged and non-sensitive face；
S3 is by the first surface bonding of the sensitive face of described fingerprint sensor with described dielectric cover plate；
S4 provides the structural support, and has the first surface of the supporting surface and bottom surface being oppositely arranged, supporting surface and described dielectric cover plate
Bonding.
10. fingerprint sensor package method as claimed in claim 8 or 9, it is characterised in that also include:
Step S5 provides the encirclement component of the component that can form Guan Bi at the edge of dielectric cover plate and supporting construction, will surround structure
Part is arranged on outside described dielectric cover plate and supporting construction.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610846978.9A CN106250891B (en) | 2016-09-23 | 2016-09-23 | Fingerprint sensor packaging method and packaging module |
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| CN201610846978.9A CN106250891B (en) | 2016-09-23 | 2016-09-23 | Fingerprint sensor packaging method and packaging module |
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| CN106250891A true CN106250891A (en) | 2016-12-21 |
| CN106250891B CN106250891B (en) | 2024-03-19 |
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| CN201610846978.9A Active CN106250891B (en) | 2016-09-23 | 2016-09-23 | Fingerprint sensor packaging method and packaging module |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106599791A (en) * | 2016-11-16 | 2017-04-26 | 江西合力泰科技有限公司 | Biological recognition module set installation structure and installation method thereof |
| CN106650627A (en) * | 2016-11-16 | 2017-05-10 | 江西合力泰科技有限公司 | Biological recognition module installation structure and installation method thereof |
| WO2021000311A1 (en) * | 2019-07-04 | 2021-01-07 | 深圳市汇顶科技股份有限公司 | Fingerprint sensor, fingerprint recognition module and fingerprint recognition system |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103699881A (en) * | 2013-12-13 | 2014-04-02 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and mobile terminal |
| CN105428339A (en) * | 2015-12-01 | 2016-03-23 | 华天科技（西安）有限公司 | Antistatic fingerprint sensor chip packaging structure and manufacturing method |
-
2016
- 2016-09-23 CN CN201610846978.9A patent/CN106250891B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103699881A (en) * | 2013-12-13 | 2014-04-02 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and mobile terminal |
| CN105428339A (en) * | 2015-12-01 | 2016-03-23 | 华天科技（西安）有限公司 | Antistatic fingerprint sensor chip packaging structure and manufacturing method |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106599791A (en) * | 2016-11-16 | 2017-04-26 | 江西合力泰科技有限公司 | Biological recognition module set installation structure and installation method thereof |
| CN106650627A (en) * | 2016-11-16 | 2017-05-10 | 江西合力泰科技有限公司 | Biological recognition module installation structure and installation method thereof |
| CN106599791B (en) * | 2016-11-16 | 2023-06-23 | 江西合力泰科技有限公司 | Biological identification module mounting structure and mounting method thereof |
| WO2021000311A1 (en) * | 2019-07-04 | 2021-01-07 | 深圳市汇顶科技股份有限公司 | Fingerprint sensor, fingerprint recognition module and fingerprint recognition system |
| US11288481B2 (en) | 2019-07-04 | 2022-03-29 | Shenzhen GOODIX Technology Co., Ltd. | Fingerprint sensor, fingerprint recognition module and fingerprint recognition system |
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| Publication number | Publication date |
|---|---|
| CN106250891B (en) | 2024-03-19 |
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