CN106232863A - Load lock chamber and vacuum flush system for vacuum flush system - Google Patents
Load lock chamber and vacuum flush system for vacuum flush system Download PDFInfo
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- CN106232863A CN106232863A CN201480078013.9A CN201480078013A CN106232863A CN 106232863 A CN106232863 A CN 106232863A CN 201480078013 A CN201480078013 A CN 201480078013A CN 106232863 A CN106232863 A CN 106232863A
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- load lock
- lock chamber
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
- C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32743—Means for moving the material to be treated for introducing the material into processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
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- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
A kind of load lock chamber (122 for vacuum flush system is described；422；522).Described load lock chamber includes forming the load-lock wall of load lock chamber volume and for the device for vacuum generation (425) described load lock chamber evacuated.Described load lock chamber still further comprises grain catcher (127；427；527), described grain catcher is located at least in a wall (430 of described load lock chamber；528；529；530；531) place.Additionally, describe a kind of processing system including load lock chamber and processing chamber.
Description
Technical field
Embodiments of the present invention relate to load lock chamber and vacuum flush system.Embodiments of the present invention specifically relate to
And for the load lock chamber of vacuum flush system with for processing the vacuum flush system of substrate.
Background technology
Substrate the most such as in vacuum coating apparatus, in high vacuum conditions, at 5*10-4The scope of hPa to 0.5hPa
It is coated with under interior pressure.In order to increase equipment yield and avoid the demand that must be evacuated by whole equipment for each substrate
(and especially fine vacuum section), is used for substrate by load-lock and unloading locking.
In order to improve material throughput, and increase modern coaxial coating apparatus yield, be currently in use the load-lock of separation
With unloading locking cavity.The most so-called 3 chamber coater units are made up of, at load-lock load-lock and unloading locking
In, substrate is pumped to the suitable transitional pressure of order vacuum coated section (process chamber) (such as at p=1* from atmospheric pressure
10-3Pressure between hPa to p=1.0hPa), in unloading locking, by ventilating, described substrate is again adjusted to atmospheric pressure
Force level.
The task of load lock chamber is to be evacuated to enough and of a sufficiently low transitional pressure as quickly as possible to reach work
Skill scope.The task of unloading locking cavity is to ventilate as quickly as possible to reaching atmospheric pressure.Then, at substrate from unloading locking
After chamber unloading, load lock chamber evacuates again.
Meanwhile, in the past few years in increasingly for the relatively of low pollution being expected to during vacuum technology.For example, production is worked as
During display, the acceptance of particle contamination is the most reduced, and the desired quality of quality standard and consumer has increased.Example
As, if if the chamber of processing system is the most suitably evacuated to the parts in vacuum transmission system or process system in the technique phase
Produce the pending substrate of granule between if to introduce the particles into process system through evacuating etc., pollute and be possible to occur.
Therefore, there is multiple possible pollution sources of particles during operation in depositing system, this have impact on product quality.At process system
Middle cleaning and replacement part and continuous vacuum pumping are a kind of methods reducing contamination of products risk.But, as it has been described above, institute
Stating technique must be may the fastest and most efficient method perform.Cleaning and exchange process maintenance are got up the cost time, thus not
Can use within the production time.
In view of foregoing, it is an object of the invention to provide at the vacuum of a kind of at least some problem overcoming this area
Reason system and the load lock chamber for application of vacuum chamber.
Summary of the invention
In view of foregoing, it is provided that according to a kind of load lock chamber for vacuum flush system of independent claims
With a kind of vacuum flush system.Additional aspects of the present invention, advantage and feature from independent claims, specification and drawings aobvious and
It is clear to.
According to an embodiment, it is provided that a kind of load lock chamber for vacuum flush system.Described load-lock
Chamber includes forming the load-lock wall of load lock chamber volume, producing dress for vacuum load lock chamber evacuated
Put and be located at least in the grain catcher at a wall of load lock chamber.
According to another embodiment, it is provided that a kind of vacuum flush system for processing substrate.Described vacuum flush system
Including: application of vacuum chamber, described application of vacuum chamber is adapted to process substrate；And according to embodiment described herein
Load lock chamber, described load lock chamber is configured to be transferred to application of vacuum chamber substrate from atmospheric condition.
According to another embodiment, it is provided that for processing the vacuum flush system of substrate.Described vacuum flush system includes:
Vacuum loading locking chamber, described vacuum loading locking chamber has load lock chambers locular wall, and includes that the first vacuum can be close
Envelope valve and the salable valve of the second vacuum, the described first salable valve of vacuum enters vacuum loading locking chamber for providing substrate
Entrance, the outlet that the second salable valve of vacuum leaves load lock chamber for providing substrate.Described load lock chamber enters one
Step includes substrate transport system, for transmission base plate.Vacuum flush system still further comprises application of vacuum chamber, described vacuum
Process chamber and include one or more process components for substrate being performed technique, wherein said load lock chamber and process chamber
Room utilizes the second salable valve of vacuum to be coupled to each other so that pending substrate can be by substrate transport system from load lock chamber
It is sent to process chamber through the second salable valve of vacuum.Additionally, described vacuum flush system includes grain catcher, described
Grain catcher is located at least at a wall of described load lock chamber.
Embodiment has further related to the device for performing disclosed method, and includes performing each described
The device part of method step.These method steps can be performed by hardware component, the computer that be programmed by appropriate software, by
The combination in any of both performs or performs in any other manner.Additionally, also relates to institute according to the embodiment of the present invention
The method of the operation of the device described.Described method includes the method step performing each function of device.
Accompanying drawing explanation
Therefore, in order to the features described above of the present invention used by mode is understood in detail, can be obtained by reference implementation mode
Obtain the more specifically description of the present invention summarized above.Accompanying drawing relates to embodiments of the present invention and is described as follows:
Fig. 1 illustrates the load lock chamber being connected to process chamber according to embodiment described herein；
Fig. 2 illustrates the example desorbing/degassing of the particulate trapping material in the vacuum chamber according to embodiment described herein
The schematic diagram of speed；
Fig. 3 illustrates the pumped down in load lock chamber (pump down) period according to embodiment described herein
The schematic diagram of pressure in time；
Fig. 4 illustrates the load lock chamber being connected to process chamber according to embodiment described herein；And
Fig. 5 illustrates the processing system with load lock chamber according to embodiment described herein.
Detailed description of the invention
With detailed reference to the various embodiments of the present invention, one or more example of embodiment shown in the drawings.
In the following description to accompanying drawing, similar elements symbol refers to same parts.Generally, the difference about each embodiment is only described
Different.Each example is provided by explanation of the invention, and is not intended as the restriction of the present invention.In addition it is shown that or describe
It is that the feature of a part for an embodiment may be used for other embodiments or is used in combination with other embodiments, in order to
Produce further embodiments.This specification is intended to include such modifications and variations.
Additionally, in the following description, load lock chamber is interpreted as the chamber for vacuum flush system.According to herein
Described embodiment, load lock chamber can provide the transition chamber thereof from atmospheric condition to low pressure or vacuum.For example, according to
The load lock chamber of embodiment described herein can have substrate entrance and substrate outlet, and substrate entrance is for receiving at air
Under the conditions of the substrate that transmitted, substrate outlet is adapted for being connected to vacuum chamber, such as processes chamber.According to herein
The load lock chamber of described embodiment can be evacuated to vacuum, and can include relevant device, such as vacuum pump.It addition,
Load lock chamber according to embodiment described herein can have substrate transport system for by board transport to loadlock
In determining chamber and/or to vacuum (such as processing) chamber.Load lock chamber can have very at substrate entrance and substrate exit
Empty salable valve.According to the different embodiments that can combine from other embodiments described herein, the salable valve of vacuum can be from
The group being made up of grid valve, slit valve and groove valve provides.
Term " grain catcher (particle trap) " is interpreted as to catch in vacuum chamber as used herein
Catch the device of granule, such as dust granules, the granule produced by the abrasion of the mobile parts from chamber part, at depositing operation
The granule that period produces, substrate and/or the carrier granule introducing vacuum chamber and the granule being similar to.Specifically, such as this
The grain catcher that literary composition is mentioned can be passive particulate catcher, and this means especially that grain catcher need not be by power supply or the like
Activate or power supply.Passive particulate catcher can be to catch the grain catcher of granule at granule through grain catcher.
Fig. 1 illustrates the load lock chamber 522 being connected to process chamber 524.According to embodiments more described herein, that
This load lock chamber being connected and vacuum chamber (such as processing chamber) can be described as vacuum flush system.Load lock chambers
Room 522 can have entrance 523, and entrance 523 is for guiding substrate 510 to load lock chamber.Load lock chamber
Entrance 523 is adaptable to pending respective material, the one-tenth in such as substrate size or load lock chamber to be loaded into 522
Criticize the size of substrate.Individually substrate or the pending substrate in a collection of substrate can be by corresponding transmission system in atmospheric condition
Under be sent to load lock chambers chamber inlet 523.For example, substrate or batch of substrates can be by for the transporting rail of substrate, biographies
Defeated belt conveyor, the mechanical hand of bearing substrate, include the carrier of the single carrier support member for single substrate or batch of substrates
System and analog transmission.In order to by pending substrate-guided to load lock chamber 522, entrance 523 be opened, and make
Load lock chamber stands atmospheric condition.According to embodiments more described herein, when opening entrance and substrate is directed to
During load lock chamber, load lock chamber 522 can be described as ventilating.
When pending substrate 510 is placed in load lock chamber 522, load lock chamber 522 can be negative by closing
Carry locking cavity entrance 523 and close.In some embodiments, substrate is placed in load lock chamber can include by will
Substrate, to the indoor substrate support of load lock chambers or the mechanical hand of rail system, is sent to load lock chambers by board carrying
In room.Or, substrate can be transferred in load lock chamber by conveyer belt or rail system, as will be described in detail.
When substrate is in load lock chamber, load lock chamber can be evacuated, such as, be used for making load lock chamber enter to low
Pressure, coarse vacuum or medium vacuum.For example, load lock chamber can enter the typical pressure of about 1 millibar (mbar).According to
Some embodiments, can make load lock chamber be correspondingly equipped with such as vacuum pump and vacuum seal, in order to guarantee negative
Carry the reliable of the vacuum in locking cavity to install.
According to some embodiments, substrate can be maintained in load lock chamber by substrate support and reach between limiting time
Every, or can continuous moving is with the outlet close to load lock chamber 522 further, described outlet can with vacuum chamber (such as
Process chamber 524) connect.For example, substrate is to keep reaching limiting time in load lock chamber to be spaced or further
Ground continuous moving can be depending on system, and this load lock chamber is a part for this system.In an example, substrate is negative
Keep in carrying locking cavity or move the connecting gear being depending on load lock chamber and processing between chamber.According to some
Embodiment, load lock chamber as described herein can provide the part in substrate transmission path in the processing system.
In some embodiments, rarefied load lock chamber 522 can be by opening lock or valve 525 or the like court
Open to processing chamber 524.Can be via lock according to embodiment as herein described, load lock chamber 522 and process chamber 524
Or valve 525 connects or keeps being connected to each other.According to embodiment as herein described, processing chamber is application of vacuum chamber.One
In individual example, process chamber and can have ratio load lock chamber (the most relatively low pressure) higher vacuum, such as by having about
10-8Millibar and about 10-5End vacuum (base pressure) between Hao Ba.Due to the pressure strip being present in load lock chamber
Part, substrate can be sent to process chamber from load lock chamber, and not substantial interference to the vacuum condition processed in chamber.
In the processing chamber, substrate can stand expectation technique, as will be mentioned in detail below.
In general, the particle size of product (substrate) the most constantly becomes the strictest.Expect dirt in the processing system
Dye reduces the most in a better way.Load lock chamber according to embodiment described herein provides grain catcher, this
At that grain catcher is located at least in the wall of load lock chamber.In FIG, wall 528,529,530 and 531 is provided with
Grain catcher 527 in load lock chamber 522.In some embodiments, grain catcher can include for catching negative
The binding agent of the granule in load locking cavity.
According to embodiment described herein, it is provided that for the load lock chamber of vacuum flush system.Load lock chamber
Including forming the load-lock wall of load lock chamber volume and for vacuum generation dress load lock chamber evacuated
Put.Load lock chamber according to embodiment described herein farther includes grain catcher, this grain catcher at least position
At a wall of load lock chamber, or the position of any other possible carrier collisionless (collision free).One
For as, grain catcher can be located at any free position in chamber, this might mean that only transmission region should not be restricted by
Stop.
Load lock chamber according to embodiment described herein allows to come into process chamber and/or pollution at granule
Before the risk of substrate and/or carrier occurs, catch the granule in load lock chamber.Especially, due to load-lock
Chamber vent or the high gas velocity/flow during these times of pumped down and pellet transportation acceleration, be positioned at load-lock
Grain catcher at one or more in wall in chamber can catch the granule being present in load lock chamber.More such as
Granule can not be removed by the vacuum pump of load lock chamber.For example, according to the load lock chambers of embodiment described herein
Room can have the geometry including one or more so-called " dead band ".Load lock chamber according to embodiment described herein
Dead band be understood to be load lock chamber wherein particulate accumulation occur regardless of being executed for such as passing through vacuum pump
By district or the region of the evacuation technique of load lock chamber band to low pressure or vacuum condition.For example, load lock chamber
Dead band can be depending on ventilation technics, ventilation installation, ventilation intake position, pumped down delivery pipe link position and chamber design.
In some embodiments, direction is depended in dead band, and load lock chamber is vented from the direction and/or substrate is from direction quilt
Load to load lock chamber.According to some embodiments, dead band can be depending on device for vacuum generation in load lock chamber
In position, and device for vacuum generation gather region.
According to some embodiments, load lock chamber can include the region with high gas velocity, such as to load
Locking cavity ventilates and during pumped down.In some embodiments, grain catcher as described herein is positioned at these districts
One of in one of territory or these regions close, in these regions, the probability catching (process) granule is higher.
The inventor of the load lock chamber according to embodiment described herein finds that particulate accumulation is such as at chamber wall
Occur.For example (geometry of load lock chamber, the position of device for vacuum generation, substrate entrance, base are again depended on
Plate exit and similarity), the bottom of load lock chamber can be dead band, thereby increases and it is possible to tend to particulate accumulation.In FIG, example
Property two dead bands 540 and 541 are shown.
In some embodiments, when substrate is transferred into process chamber, accumulation granule on chamber wall can be carried
To substrate and/or carrier.According to some embodiments, at substrate during load lock chamber is sent to vacuum chamber, substrate
And/or carrier can be such as by vibration or rock and discharge the granule rested at substrate and/or carrier.According to as herein described
Embodiment, the granule that the pump not being supported in locking cavity catches can be caught by grain catcher, described granule capturing
Device is positioned at the load lock chambers locular wall according to embodiment described herein.Specifically, grain catcher can include bonding material
Material.
In some embodiments, be positioned in chamber wall one or more at grain catcher can include magnetic material,
Electrostatic equipment, jointing material and analog.For example, the grain catcher in load lock chamber can include catching
And keep the material polluting granule.In some instances, grain catcher can include depending on granule to be captured (this again may be used
Depend on being present in the character of the outdoor granule of load lock chambers), pending substrate, load lock chambers chamber size, chamber material
Material, substrate carrier material and the material of analog.
According to some embodiments, it is positioned at the grain catcher at one or more wall of load lock chamber and can include gluing
Close paper tinsel, bonding sheet, adhesive plate, for jointing material carrier, there is the carrier of viscose glue, the roller of jointing material (such as adhesive foil)
And analog.
In some embodiments, gluing according to the grain catcher in the load lock chamber of embodiment described herein
Mixture can include without silicon materials, polyolefine material, acryloid cement, acrylic acid foamed adhesive, polyethylene film, PET,
OPP, PES, moral Sha's film (Tesa-Film), aluminum or common metal forming and its combination in any.In some embodiments, according to
The grain catcher of embodiment described herein may be included in the foamed adhesive on polypropylene film.
According to some embodiments, the material for grain catcher described herein can be such as by having low outgassing rate
There is provided in oligosaprobic risk, the especially vacuum condition in being such as present in load lock chamber as described herein.One
In a little embodiments, the material for the granule capturing in load lock chamber can have low degassing value/every 1 hour by uop
(a1h).A1h value describes material at one hour interior amount of gas evolved.According to embodiments more described herein, for load lock chambers
Material in the material of the grain catcher in room or the grain catcher in load lock chamber has typically about
1.0E-8mbar*l/(s*cm2) and about 1.5E-6mbar*l/ (s*cm2A1h degassing value between), more typically at about 1.0E-
8mbar*l/(s*cm2) and about 1.0E-6mbar*l/ (s*cm2A1h degassing value between), and the most typically about
2.5E-8mbar*l/(s*cm2) and about 1.0E-6mbar*l/ (s*cm2A1h degassing value between).In some embodiments,
Degassing value a1h of one hour is less than 1.5E-6mbar*l/ (s*cm2)。
It is used as the low degassing speed of the material according to the grain catcher in the load lock chamber of embodiment described herein
Rate can be conducive to the low stain of the load lock chambers indoor carried out by grain catcher.Bearing according to embodiment described herein
Carry in locking cavity have the grain catcher of low outgassing rate as above allow with low-level maintain process cycles time
Between energy, or the most do not increase process cycles, process cycles such as by the evacuation technique of load lock chamber and its lasting time
Between affect.The grain catcher that corresponding material is used in the load lock chamber according to embodiment described herein avoid by
Additional degassing in the load lock chamber that grain catcher introduces is polluted, it is to avoid evacuate the prolongation of technique and process cycles, and
Client's acceptance level to the load lock chamber according to embodiment described herein can be increased.
Fig. 2 shows and (especially includes the grain catcher in the load lock chamber according to embodiment described herein
The grain catcher of jointing material as described herein) desorbing measure signal Figure 200.The abscissa of Fig. 2 shows in minutes
Time, and the vertical coordinate of Figure 200 display curve 210 in per time and the flow (Q '/A [mbarl/s+cm of every area2])。
Flow shown in Figure 200 increases over time and reduces, and result produces about 1.35E-06 [mbar*l/s*cm2]
A1h degassing value.Fig. 3 shows schematic diagram 300, this schematic diagram 300 show the pressure in terms of millibar to the time in seconds, thus
The pumped down time of instruction load lock chamber.This two curves show the load lock chamber without grain catcher
The pumped down time (curve 320), and there is the pumped down time (curve of the load lock chamber of grain catcher
310).In this example, the jointing material including foamed adhesive as above and polypropylene film is used as according to herein
Grain catcher in the load lock chamber of described embodiment.It can be seen that drop to the pressure of about 2E-01 millibar,
Grain catcher is insignificant on the impact of pump time, because these two curves substantially overlap each other.Drop to lower
Pressure and increasing over time, the load lock chamber with grain catcher compares the load-lock without grain catcher
Chamber, has slightly, the insignificant longer pumped down time.
Returning Fig. 1, load lock chamber is illustratively shown as the shape substantially with cuboid, and this shape has 6
Individual wall (such as 4 sidewalls, roof and diapire).Grain catcher may be provided in load lock chamber (the embodiment institute such as Fig. 1
Show) each wall at, or may be provided at the only a part of these walls, be such as provided in one of load lock chamber,
At two, three, four or five walls.In an example, what grain catcher was only provided in as load lock chamber is dead
At the diapire in one of district.In another embodiment, grain catcher is only provided at a part for wall, or is provided in some walls
Some at, such as the dead band during this depends on load lock chamber.In some embodiments, grain catcher is permissible
It is positioned at any possible collisionless position of carrier.
According to some embodiments, and specifically include the situation of bonding sheet, adhesive foil or adhesive plate at grain catcher
Under, can have scope for typically at about 0.5m according to the grain catcher of embodiment described herein2With 5m2Between chi
Very little, size the most between about 2 a and about 10, and the most typically at about 0.2m2With 10m2Between size.
According to some embodiments, grain catcher (granule capturing sheet, granule capturing paper tinsel, granule capturing plate specifically
Or the like), especially include that the grain catcher of jointing material can be attached to or be fixed at least the one of load lock chamber
Individual wall.In some embodiments, grain catcher is attached or is fixed at least one wall of load lock chamber removedly.
For example, load lock chamber can provide grain catcher fixing device, such as framework, clamping device, is used for clinging
The region of grain catcher, for fixing the boring of grain catcher, grain catcher support member or the like., for example
Grain catcher fixing device can be by metal or have another material of low outgassing rate and make.According to some embodiments,
Grain catcher fixing device is made up of the material identical with load lock chambers locular wall.In embodiments more described herein,
Grain catcher fixing device can allow to be positioned at the wall of load lock chamber grain catcher.For example, granule is caught
Storage fixing device may be provided on the wall of load lock chamber, especially makes grain catcher be positioned near this wall, covers and be somebody's turn to do
Wall maybe can be attached or be fixed to this wall.
According to some embodiments, when grain catcher contacts or when grain catcher and load lock chambers with chamber wall
When the distance of locular wall is typically less than 3cm, more typically less than 2cm and is even more typically less than 1cm, grain catcher
Can be located at chamber wall.This is equally applicable to the position of the grain catcher at dead band or near dead band.Some embodiment party
In formula, it is positioned at the grain catcher at the chamber wall of load lock chamber as described herein and can represent or include granule capturing
Any possible collisionless position of carrier that device is positioned in load lock chamber, such as, does not hinder base at grain catcher
The machinery of system followed the tracks of by onboard body, the mechanical hand of substrate carrier, the substrate tracking system being present in load lock chamber, substrate
Any position of the operation of hands or the like.In an example, the collisionless position of carrier does not include carrier itself.?
In some embodiments, being positioned at the grain catcher at the wall of the load lock chamber according to embodiment described herein can manage
Solving is the grain catcher on wall, the most such as, fixed by fixing device or be attached on wall.According to some embodiments,
Fixing device is directly provided on wall, but grain catcher might not contact load latch well locular wall.Other embodiment party
In formula, at least some of of grain catcher contacts with load lock chambers locular wall.According to some embodiments, granule capturing utensil
There is the catch surface for catching granule towards load lock chamber volume.
Or, in granule capturing sheet, the grain catcher of granule capturing paper tinsel or the like form can be twined by granule capturing
It is provided at the wall of load lock chamber around/withdrawal system.In an example, grain catcher withdrawal roller and granule
It is outdoor that catcher winding roller is positioned at load lock chambers.Grain catcher can guide to load lock chamber from withdrawal roller, and this can
It is transferred to load lock chamber by making grain catcher pass lock (such as, inflatable easamatic power brake), grid valve, slit valve or groove valve
In perform.The grain catcher of load lock chambers indoor is positioned at the wall of load lock chamber, and is directed to loadlock
Determine the grain catcher winding roller outside chamber, such as, again pass through lock, slit valve or the like.According to enforcements more described herein
Mode, grain catcher can continuously move to from granule capturing withdrawal roller or can step-by-step movement move to grain catcher winding
Roller or recoil roller.In the embodiment that can combine with other embodiments as herein described, can be by grain catcher
It is indoor that withdrawal roller and grain catcher winding roller are provided in load lock chambers.In this case, for withdrawal roller and winding roller
Roller support member can be by metal or there is certain material of low outgassing rate make.
As stated above with respect to Fig. 1, it is connectable to vacuum according to the load lock chamber of embodiment described herein
Chamber.Load lock chamber can be provided with corresponding attachment means, receive device and sealing device, in order to allow vacuum chamber
Connect.For example, load lock chamber can include flange, boring, bolt, screw etc., in order to by load lock chamber
It is connected to vacuum chamber.Load lock chamber can farther include substrate and export, such as gap lock, negative valve or the like, from
And allow from load lock chamber, substrate is sent to vacuum chamber.In exemplified here the accompanying drawing described, load-lock
Chamber is illustrated as being connected to process chamber.It will be appreciated, however, that load lock chamber also can be connected to other vacuum chambers.
For example, the vacuum chamber that load lock chamber is connectable to can be selected from by buffer chamber, heating chamber, transfer chamber,
Circulation time adjusts chamber, the deposition chambers with sedimentary origin and the group of analog composition.Specifically, according to reality described herein
The load lock chamber executing mode is connectable to one or more vacuum chamber.According to some embodiments, load lock chamber can
It is connected directly to the vacuum chamber of non-process chamber, but (load lock chamber is vacuum flush system to vacuum flush system
A part) application of vacuum chamber can be included.
As it has been described above, the combination of load lock chamber and process chamber can refer to processing system herein.According to this paper institute
State embodiment, it is provided that for processing the vacuum flush system of substrate.Application of vacuum chamber includes application of vacuum chamber and load
Locking cavity, described application of vacuum chamber is adapted for processing substrate, and described load lock chamber is used for substrate from greatly
Gas condition is sent in application of vacuum chamber, and described load lock chamber has the wall surrounding load lock chamber volume.Described
Application of vacuum chamber still further comprises grain catcher, and described grain catcher is located at least in a wall of load lock chamber
Place.Can be as it has been described above, example according to the grain catcher in some embodiments, load lock chamber and load lock chamber
As for geometry, material and characteristic aspect described in detail above.For example, grain catcher can comprise viscous
Condensation material, such as bonding sheet, adhesive foil, adhesive plate or the like.
According to embodiment described herein, it is provided that for processing the vacuum flush system of substrate.Described vacuum flush system
Locking chamber including vacuum loading, described vacuum loading locking chamber has load lock chambers locular wall, and includes the first vacuum
Salable valve and the salable valve of the second vacuum, the described first salable valve of vacuum is used for providing substrate to enter vacuum loading locking chamber
Entrance in room, the described second salable valve of vacuum is for the outlet providing substrate to leave load lock chamber.Load lock chambers
Room farther includes the substrate transport system for transmission base plate, transmits system the most as described in detail below.Application of vacuum
System farther includes application of vacuum chamber, and described application of vacuum chamber includes one or more work for substrate performs technique
Skill parts.The second vacuum salable valve coupling each other is utilized according to embodiment described herein, load lock chamber and process chamber
Connect so that pending substrate can pass the salable valve transmission of the second vacuum by substrate transport system from load lock chamber
To processing chamber.Vacuum flush system farther includes grain catcher, and described grain catcher is located at least in load lock chambers
At one wall of room.According to embodiments more described herein, grain catcher can be granule capturing as described in detail above
Device, such as its mode are for including above mentioned material, having above mentioned shape, have above mentioned material
Value and analog.
According to some embodiments, process chamber as mentioned in this article and may be adapted to substrate is performed technique, such as heater
Skill, cooling technique, cleaning procedure, pretreating process, positioning process, depositing operation and similar technique.
According to some embodiments that can combine with other embodiments described herein, process chamber can be adapted to for
Sputtering technology, such as by including sputtering target (such as rotatable sputter target).According to the exemplary embodiment of the present invention, can be by DC
Sputtering, pulsed sputter, RF sputtering or MF sputtering are provided in application of vacuum chamber described herein.According to can with described herein other
The further embodiments that embodiment combines, can be by frequency in the range of 5kHz to 100kHz (such as, 30kHz to 50kHz)
Mid frequency sputtering be provided in process in chamber as described herein.In some embodiments, application of vacuum chamber is applicable to
PVD, CVD technique, pecvd process, evaporation technology, microwave treatment and similar technique.
Processing chamber 524 shown in Fig. 1 and include substrate support 512, substrate can be shelved on substrate support during processing
On 512.According to some embodiments, the process chamber 524 of Fig. 1 farther includes sedimentary origin 513, for material is deposited on base
On plate 110.In the embodiment shown in fig. 1, pending substrate 110 keeps in a substantially horizontal direction, and deposits
Technique can be carried out on substantially vertical direction.
Fig. 2 illustrates the embodiment being connected to process the load lock chamber 422 of chamber 424.Grain catcher 427
At the diapire 430 of load lock chamber 422.Grain catcher 427 shown in Fig. 4 can be grain catcher described above.Load
Locking cavity 422 can include device for vacuum generation 425, such as pump.In the exemplary embodiment illustrated in fig. 2, substrate is substantially to erect
Directly it is oriented in load lock chamber and processes in chamber.Should be appreciated that the substrate being vertically oriented can be in the processing system
Have and certain deviation that vertically (that is, 90 °) are orientated, in order to allow the stable transmission that the several years tilt, i.e. substrate can have
Be vertically oriented ± deviation of 20 ° or less (such as, ± 10 ° or less).
According to some embodiments, load lock chamber as described herein can be adapted to for large-area substrates.According to
Some embodiments, large-area substrates or respective carrier can have at least 0.67m2Size, wherein these carriers have multiple
Substrate.Generally, described size can be about 0.67m2(0.73m × 0.92m straight 4.5th generation) or more than, more typically about 2m2Extremely
About 9m2Or even it is up to 12m2.Generally, the base of structure, system, chamber, lock and valve according to embodiment described herein it is provided with
Plate or carrier are large-area substrates as described herein.For example, large-area substrates or carrier can be the 4.5th generation, the 5th generation,
In 7.5th generation, the 8.5th generation or the even the 10th generation, in the 4.5th generation, corresponded to about 0.67m2Substrate (0.73m × 0.92m), the 5th generation
Corresponding to about 1.4m2Substrate (1.1m × 1.3m), the 7.5th generation correspond to about 4.29m2Substrate (1.95m × 2.2m), the 8.5th
In generation, is corresponding to about 5.7m2Substrate (2.2m × 2.5m), the 10th generation correspond to about 8.7m2Substrate (2.85m × 2.5mmm).Very
Can be similarly implemented to higher generation (such as the 11st generation and the 12nd generation) and counterpart substrate area.According to can with described herein other
Some embodiments that embodiment combines, described system can be configured for TFT and manufactures, such as, utilizes static sedimentation.
According to some embodiments, load lock chamber as described herein, it parts (such as substrate support or with
Track system, slit valve or lock) or process as described herein chamber and adaptation can carry out carrying substrate, surround substrate (such as glass base
Plate or the substrate being made up of plastic material, i.e. for such as manufacturing the substrate of display).According to can be with described herein other be real
Some embodiments that the mode of executing combines, embodiment described herein is displayed for device manufacture, such as, PVD, i.e. use
Sputtering sedimentation in the large-area substrates of monitor market.
As it has been described above, load lock chamber can include device for vacuum generation (such as vacuum pump), and can be adapted to use
In such as by providing corresponding sealing member to maintain the vacuum of load lock chambers indoor at chamber door, window, slit valve or lock.
According to some embodiments, load lock chamber as described herein is adapted for providing the vacuum less than 1mbar.One
In a little embodiments, load lock chamber is adapted for providing typically true between about 0.01mbar and about 1mbar
Sky, the more typically vacuum between about 0.1mbar to about 1mbar, and the most typically about 0.5mbar with about
Vacuum between 1mbar.
According to some embodiments that can combine with other embodiments described herein, application of vacuum as described herein
Chamber can be adapted to high-vacuum chamber.For example, process chamber and can include corresponding vacuum pump, sealing member, valve and lock, use
In producing and maintaining the vacuum processed in chamber.In some embodiments, process chamber offer is provided to be less than
About 10-5The vacuum of mbar.In some embodiments, process chamber offer is provided to have typically about 10- 12Mbar and about 10-5Between mbar, more typically about 10-9Mbar and about 10-5Between mbar and the most typically about
10-7Mbar and about 10-5The ultrahigh vacuum of the pressure between mbar.
Fig. 5 illustrates the processing system 100 according to embodiment described herein.Described processing system includes the first vacuum chamber
101, the second vacuum chamber the 102, the 3rd vacuum chamber 103 and the 4th vacuum chamber 121.These vacuum chambers can be deposition chambers
Or other process chamber, in wherein vacuum results from these chambers.In fig. 5, it can be seen that load lock chamber 122, load
Locking cavity 122 provides the transition of the vacuum condition in the atmospheric condition outside processing system to processing system chamber.Load
Locking cavity 122 can be load lock chamber as described in detail above, and can include that at one or more wall granule is caught
Storage 127.Pass through according to embodiment as herein described, load lock chamber 122 and vacuum chamber 101,102,103 and 121
Transmission system connects via linear transmission path.According to embodiment described herein, transmission system can include that double track transmission is
System, described double track transmission system includes some transporting rails 161,163,164.In the most seen example, transmission system is entered
One step includes rotary module 150, and described rotary module allows substrate to rotate along transmission path.For example, it is generally used for showing
Show that the large-area substrates that device manufactures can the linear transmission path along base plate processing system 100 transmit.Generally, these linear transfer
Path is to be provided by transporting rail 161 and 163 (such as having the linear transfer track of the multiple rollers arranged such as along the line).
Can be by the transmission of the bottom at large-area substrates according to exemplary embodiment, transporting rail and/or swing-around trajectory
System, and the guiding system offer at the top of the large-area substrates being substantially perpendicularly orientated.
According to the different embodiments that can combine from other embodiments described herein, at vacuum chamber (in such as Fig. 5
Shown vacuum chamber 122,121,101,102 and 103) in double track transmission system, i.e. there is the first transmission path and second
The transmission system in transmission path, can be carried by fixing double track system, moveable monorail system or moveable double track system
Supply.Fixing double track system includes the first transporting rail and the second transporting rail, wherein the first transporting rail and the second transporting rail
Cannot transverse shift, i.e. substrate cannot move up in the side being perpendicular to transmit direction.Movably monorail system is by having
Linear transfer track provides double track transmission system, and described linear transfer track can be essentially displaced laterally, i.e. is perpendicular to transmit direction and comes
Displacement so that substrate or may be provided on the first transmission path, or may be provided on the second transmission path, wherein the first transmission road
Footpath is with the second transmission path away from each other.Movably double track system includes the first transporting rail and the second transporting rail, wherein
Described two transporting rails can be essentially displaced laterally, i.e. they relevant positions can be cut by two transporting rails from the first transmission path
Shifting to the second transmission path, vice versa.
Utilize load lock chamber and include the processing system of load lock chamber according to embodiment described herein,
It is possible to reduce the pollution in processing system.The grain catcher according to embodiments more described herein is used to allow to hold
Easily and less complicated method catches the granule in load lock chamber, meanwhile, has limited material by use special
Property (all outgassing rates as defined) respective material reduce pollution risk.Grain catcher is positioned at the wall of load lock chamber
Place, thus not only allow for the effective particle capture in the dead band of this load lock chamber, and allow grain catcher easy
Assembling and exchange, be also simultaneously closely and joint space-efficient.
Although foregoing teachings is for embodiments of the present invention, but also can be in the feelings of the elemental range without departing substantially from the present invention
Design other and the further embodiment of the present invention under condition, and the scope of the present invention is to be determined by appended claims.
Claims (15)
1. the load lock chamber (122 for vacuum flush system；422；522), described load lock chamber includes:
Load-lock wall (430；528；529；530；531), described load-lock wall forms load lock chamber volume；
Device for vacuum generation (425), described device for vacuum generation is used for evacuating described load lock chamber；
And
Grain catcher (127；427；527), described grain catcher is positioned at least one wall of described load lock chamber
(430；528；529；530；531) place.
2. load lock chamber as claimed in claim 1, wherein said grain catcher (127；427；527) bonding is included
Agent, especially adhesive foil or glue.
3. such as load lock chamber in any one of the preceding claims wherein, wherein said grain catcher (127；427；
527) include that binding agent and foamed adhesive, described binding agent comprise at least one base material, specifically polypropylene film, poly-
Vinyl film, PET, OPP, PES or metal forming, described foamed adhesive specifically acryloid cement or glue.
4. such as load lock chamber in any one of the preceding claims wherein, wherein said grain catcher (127；427；
527) comprise there is about 1.0E-8mbar*l/ (s*cm2) and about 1.0E-6mbar*l/ (s*cm2Degassing value between)/every 1 hour
The material of a1h.
5. such as load lock chamber in any one of the preceding claims wherein, wherein said grain catcher (127；427；
527) there is about 0.2m2With about 10m2Between, the most about 0.5m2To 10m2Between area.
6. such as load lock chamber in any one of the preceding claims wherein, wherein said load lock chamber (122；422；
522) it is adapted to provide the vacuum in the range of substantially between about 0.05mbar to about 1mbar.
7. such as load lock chamber in any one of the preceding claims wherein, wherein said load lock chamber (122；422；
522) wall (430；528；529；530；531) at least one sidewall (529 is included；531), diapire (430；530) and roof
, and wherein said grain catcher (127 (528)；427；527) it is positioned at described load lock chamber (122；422；522)
Described diapire (430；530) place.
8. such as load lock chamber in any one of the preceding claims wherein, wherein said load lock chamber (122；422；
522) metal fixture for being maintained in described load lock chamber by described grain catcher is included.
9. such as load lock chamber in any one of the preceding claims wherein, wherein said load lock chamber (122；422；
522) include for unwinding and recoil described grain catcher (127；427；527) unwinding/Rewind System.
10. such as load lock chamber in any one of the preceding claims wherein, wherein said load lock chamber (122；422；
522) include that one or more dead band, the geometry in one or more dead band described make granule to accumulate, especially described negative
Carry locking cavity (122；422；522) accumulate during ventilation, and wherein said grain catcher (127；427；527) it is positioned at
At one or more dead band described of described load lock chamber.
11. such as load lock chamber in any one of the preceding claims wherein, wherein said load lock chamber (122；422；
522) include that rail set or mechanical hand, described rail set or mechanical hand are configured in described load lock chamber with described
Process and between chamber, transmit substrate.
12. 1 kinds of vacuum flush systems being used for processing substrate, described vacuum flush system includes:
Application of vacuum chamber (424；524), described application of vacuum chamber is adapted to process described substrate (410；510)；
According to the load lock chamber (122 according to any one of claim 1 to 11；422；522), described load lock chamber
It is configured to described substrate (410；510) it is transferred to described application of vacuum chamber from atmospheric condition.
13. vacuum flush systems as claimed in claim 12, the vacuum in wherein said process chamber (424,524) is to have
About 10-8Mbar and about 10-5The ultrahigh vacuum of the pressure in the range of between mbar.
14. vacuum flush systems as according to any one of claim 12 to 13, wherein said vacuum flush system is adapted
Become for described process chamber (424；524) depositing operation in, especially sputtering technology or PVD or CVD technique.
15. 1 kinds of vacuum flush systems being used for processing substrate, described vacuum flush system includes:
Vacuum loading locking chamber (122；422；522), described vacuum loading locking chamber has load lock chambers locular wall (430；
528；529；530；531；430), and the first salable valve of vacuum and the salable valve of the second vacuum are included, described first true
Empty salable valve enters the entrance of described vacuum loading locking chamber, the described second salable valve of vacuum for providing described substrate
For providing described substrate to leave the outlet of described load lock chamber, described load lock chamber (122；422；522) one is entered
Step includes the substrate transport system for transmitting described substrate；
Application of vacuum chamber (424；524), described application of vacuum chamber includes for described substrate performs the one or many of technique
Individual process components, wherein said load lock chamber (122；422；522) and described process chamber (424；524) described is utilized
The two salable valves of vacuum are coupled to each other so that pending substrate can be by described substrate transport system from described load lock chamber
It is sent to described process chamber through the described second salable valve of vacuum；And
Grain catcher (127；427；527), described grain catcher is located at least in described load lock chamber (122；422；
522) a wall (430；528；529；530；531) place.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2014/057804 WO2015158384A1 (en) | 2014-04-16 | 2014-04-16 | Load lock chamber for a vacuum processing system and vacuum processing system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106232863A true CN106232863A (en) | 2016-12-14 |
| CN106232863B CN106232863B (en) | 2020-11-20 |
Family
ID=50543046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480078013.9A Active CN106232863B (en) | 2014-04-16 | 2014-04-16 | Load lock chamber for vacuum processing system and vacuum processing system |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2017514305A (en) |
| KR (1) | KR102261651B1 (en) |
| CN (1) | CN106232863B (en) |
| TW (1) | TW201606901A (en) |
| WO (1) | WO2015158384A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111433389A (en) * | 2017-11-29 | 2020-07-17 | 新格拉斯科技集团 | Vacuum lock and method for transporting substrate carriers |
| CN112005337A (en) * | 2018-02-13 | 2020-11-27 | 生物梅里埃有限公司 | Loadlock chamber assembly for sample analysis system and related mass spectrometer system and method |
| CN112420555A (en) * | 2019-08-23 | 2021-02-26 | 细美事有限公司 | Transfer unit and substrate processing apparatus including the same |
| TWI793303B (en) * | 2018-05-18 | 2023-02-21 | 德商辛格拉斯科技股份有限公司 | Continuous apparatus and method for coating substrates |
| CN116153826A (en) * | 2023-04-23 | 2023-05-23 | 上海陛通半导体能源科技股份有限公司 | Load lock apparatus for chemical vapor deposition apparatus |
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| JP6674869B2 (en) * | 2016-08-30 | 2020-04-01 | 株式会社日立ハイテクマニファクチャ＆サービス | Wafer transfer device |
| JP2018190783A (en) * | 2017-04-28 | 2018-11-29 | 東京エレクトロン株式会社 | Transport device and transport method |
| WO2019052669A1 (en) * | 2017-09-18 | 2019-03-21 | Applied Materials, Inc. | A vacuum processing system and method |
| WO2022128112A1 (en) * | 2020-12-17 | 2022-06-23 | Applied Materials, Inc. | Roller for a carrier transport assembly, substrate processing system, method of maintaining a substrate processing system, and method of manufacturing a device |
| TW202230583A (en) * | 2020-12-22 | 2022-08-01 | 日商東京威力科創股份有限公司 | Substrate processing system and particle removal method |
| KR102567143B1 (en) * | 2022-05-03 | 2023-08-14 | 이재철 | Vacuum evaporation apparatus |
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| CN116153826A (en) * | 2023-04-23 | 2023-05-23 | 上海陛通半导体能源科技股份有限公司 | Load lock apparatus for chemical vapor deposition apparatus |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20160145164A (en) | 2016-12-19 |
| WO2015158384A1 (en) | 2015-10-22 |
| CN106232863B (en) | 2020-11-20 |
| TW201606901A (en) | 2016-02-16 |
| KR102261651B1 (en) | 2021-06-04 |
| JP2017514305A (en) | 2017-06-01 |
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