CN106229280B - Diode lead correction method and device - Google Patents

Diode lead correction method and device Download PDF

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Publication number
CN106229280B
CN106229280B CN201610775761.3A CN201610775761A CN106229280B CN 106229280 B CN106229280 B CN 106229280B CN 201610775761 A CN201610775761 A CN 201610775761A CN 106229280 B CN106229280 B CN 106229280B
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China
Prior art keywords
correcting
conveying belt
diode
plate
correction
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CN201610775761.3A
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Chinese (zh)
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CN106229280A (en
Inventor
陈国辉
石治洪
向明军
文海
冯广彦
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GUIZHOU YAGUANG ELECTRONICS TECHNOLOGY CO LTD
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GUIZHOU YAGUANG ELECTRONICS TECHNOLOGY CO LTD
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Abstract

The invention discloses a method and a device for correcting a diode lead, wherein the method adopts a lead-up mode to vertically place a diode into a conveyer belt, the conveyer belt is provided with correction plates twice, and the two correction plates adopt a twisting and pressing mode to correct the verticality and the straightness of the lead.

Description

Method and device for correcting diode lead
Technical Field
The invention relates to the field of diode processing, in particular to a method and a device for correcting a diode lead.
Background
In the existing diode processing process, after the diode is assembled and plastic-packaged, the diode needs to be detected, such as lead correction, polarity detection, laser lithography and the like, however, the existing technology has no feasible automation equipment capable of solving the technical problems
Disclosure of Invention
The technical problem to be solved by the invention is as follows: a method and apparatus for calibrating a diode lead are provided to overcome the deficiencies of the prior art.
The invention is realized in the following way:
a method for correcting the leading wire of diode features that the diode is vertically conveyed to conveyer belt in the mode of leading wire up, and the correcting plates are arranged on the conveyer belt twice for correcting the verticality and straightness of leading wire by rubbing and pressing.
In the method for correcting the diode lead, the two correction plates are placed at two sides of the conveyer belt in a rubbing and pressing manner, and the vertical height distance between the bottom surfaces of the correction plates and the surface of the conveyer belt is 1-5mm greater than the thickness of the bottom of the diode, wherein one correction plate moves back and forth along the direction of the conveyer belt, the other correction plate moves back and forth perpendicular to the conveying direction of the conveyer belt, and the minimum gap between the two correction plates during movement is the diameter of the diode lead.
In the method for correcting the diode lead, at least three sections of continuous rubbing and pressing surfaces are sequentially arranged on the working surface of the correcting plate which moves back and forth along the direction of the conveying belt, and the rubbing and pressing surfaces are matched with the correcting plate which moves back and forth and is vertical to the direction of the conveying belt, so that the diode lead is sequentially corrected from the bottom, the middle and the upper part respectively.
A correction device for a diode lead comprises a conveyor belt, wherein a first correction plate is arranged on one side of the middle of the conveyor belt, a second correction plate is arranged on the other side of the middle of the conveyor belt, the first correction plate corresponds to the second correction plate, a first hydraulic driving device is arranged at the tail part of the first correction plate to move the first correction plate back and forth in a direction perpendicular to the conveying direction of the conveyor belt, and a second hydraulic driving device is arranged at the tail part of the second correction plate to move the second correction plate back and forth in a direction parallel to the conveying direction of the conveyor belt.
In the aforementioned correction device for diode lead, the bottom surface of the first correction plate and the bottom surface of the second correction plate are at the same horizontal height, and the vertical height distance between the bottom surface of the first correction plate and the bottom surface of the second correction plate and the surface of the conveyor belt is greater than the bottom thickness of the diode by 1-5mm.
In the correction device for the diode lead, the second hydraulic driving device comprises a track parallel to the conveying direction of the conveying belt, the driving motor is mounted on the track, and the driving motor is integrally fixed at the tail of the second correction plate to move back and forth.
In the correction device for the diode lead, the working surface of the second correction plate comprises at least three rubbing surfaces, the rubbing height ranges of the three rubbing surfaces are different, the rubbing surfaces are sequentially arranged from low to high along the conveying direction of the conveying belt according to the rubbing heights, and the rubbing ranges of adjacent rubbing surfaces are partially overlapped.
Due to the adoption of the technical scheme, compared with the prior art, the method has the advantages that the lead of the diode is corrected in a segmented mode in a twisting and pressing mode, the working efficiency is high, the calibration degree is high, and the practicability is high.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Detailed Description
The embodiment of the invention comprises the following steps: a method for correcting the leading wire of diode features that the diode is vertically conveyed to conveyer belt in the mode of leading wire up, and the correcting plates are arranged on the conveyer belt twice for correcting the verticality and straightness of leading wire by rubbing and pressing.
The rubbing and pressing mode is that two correcting plates are placed on two sides of a conveying belt, the vertical height distance between the bottom surfaces of the correcting plates and the surface of the conveying belt is 1-5mm larger than the thickness of the bottom of a diode, one correcting plate moves back and forth along the conveying belt direction, the other correcting plate moves back and forth perpendicular to the conveying belt direction, the minimum gap between the two correcting plates when the two correcting plates move is the diameter of a diode lead, at least three sections of continuous rubbing and pressing surfaces are sequentially arranged on the working surface of the correcting plate which moves back and forth along the conveying belt direction, and the rubbing and pressing surfaces are matched with the correcting plates which move back and forth perpendicular to the conveying belt direction, so that the diode lead is sequentially corrected from the bottom, the middle and the upper part respectively.
The correction device for the diode lead formed according to the method comprises a conveying belt 3, wherein a first correction plate 4 is arranged on one side of the middle of the conveying belt 3, a second correction plate 5 is arranged on the other side of the middle of the conveying belt 3, the first correction plate 4 corresponds to the second correction plate 5 in position, a first hydraulic driving device 6 is arranged at the tail of the first correction plate 4 to realize the reciprocating motion of the first correction plate 4 perpendicular to the conveying direction of the conveying belt 3, and a second hydraulic driving device 7 is arranged at the tail of the second correction plate 5 to realize the reciprocating motion of the second correction plate 5 parallel to the conveying direction of the conveying belt 3.
The bottom surface of the first correcting plate 4 and the bottom surface of the second correcting plate 5 are at the same horizontal height, the vertical height distance between the bottom surface of the first correcting plate 4 and the bottom surface of the second correcting plate 5 and the surface of the conveying belt 3 is larger than the thickness of the bottom of the diode by 1-5mm, the second hydraulic driving device 7 comprises a track 8 parallel to the conveying direction of the conveying belt 3, a driving motor 9 is installed on the track 8, the driving motor 9 is integrally fixed at the tail part of the second correcting plate 5 to realize the back and forth movement of the second correcting plate 5, the working surface of the second correcting plate 5 comprises at least three sections of rubbing and pressing surfaces 10, the rubbing and pressing height ranges of the three sections of rubbing and pressing surfaces 10 are different, the rubbing and pressing surfaces 10 are sequentially arranged from low to high along the conveying direction of the conveying belt according to the rubbing and pressing height, and the rubbing and pressing ranges of the adjacent rubbing and pressing surfaces 10 are partially overlapped.
The above-described arrangements are described to facilitate understanding and use of the invention by those of ordinary skill in the art. Various modifications to the embodiments will be readily apparent to those skilled in the art. Therefore, the present invention is not limited to the above embodiments, and those skilled in the art should make improvements and modifications to the method according to the present invention without departing from the scope of the present invention.

Claims (6)

1. A method for correcting a diode lead is characterized by comprising the following steps: the method adopts a lead wire upward mode to vertically place the diode into a conveyer belt, correction plates are arranged on the conveyer belt twice, and the two correction plates adopt a twisting and pressing mode to correct the verticality and the straightness of the lead wire;
the rubbing and pressing mode is that two correcting plates are placed on two sides of the conveying belt, the vertical height distance between the bottom surfaces of the correcting plates and the surface of the conveying belt is 1-5mm greater than the thickness of the bottom of the diode, one of the correcting plates moves back and forth along the conveying belt direction, the other correcting plate moves back and forth perpendicular to the conveying belt direction, and the minimum gap between the two correcting plates is the diameter of the diode lead when the two correcting plates move.
2. The method for correcting the diode lead wire according to claim 1, wherein: at least three sections of continuous rubbing and pressing surfaces are sequentially arranged on the working surface of the correcting plate which moves back and forth along the direction of the conveying belt, and the rubbing and pressing surfaces are matched with the correcting plate which moves back and forth and is vertical to the direction of the conveying belt, so that the diode leads are sequentially corrected from the bottom, the middle and the upper part respectively.
3. A diode lead correction device comprises a conveying belt (3), and is characterized in that: the correcting plate I (4) is arranged on one side of the middle of the conveying belt (3), the correcting plate II (5) is arranged on the other side of the middle of the conveying belt (3), the correcting plate I (4) corresponds to the correcting plate II (5), a hydraulic driving device I (6) is arranged at the tail part of the correcting plate I (4) to achieve reciprocating motion of the correcting plate I (4) perpendicular to the conveying direction of the conveying belt (3), and a hydraulic driving device II (7) is arranged at the tail part of the correcting plate II (5) to achieve reciprocating motion of the correcting plate II (5) parallel to the conveying direction of the conveying belt (3).
4. A diode lead correction device as claimed in claim 3, wherein: the bottom surface of the first correction plate (4) and the bottom surface of the second correction plate (5) are at the same horizontal height, and the vertical height distance between the bottom surface of the first correction plate (4) and the bottom surface of the second correction plate (5) and the surface of the conveying belt (3) is 1-5mm greater than the thickness of the bottom of the diode.
5. A diode lead correction device as claimed in claim 3, wherein: the second hydraulic driving device (7) comprises a track (8) parallel to the conveying direction of the conveying belt (3), a driving motor (9) is installed on the track (8), and the driving motor (9) is integrally fixed at the tail of the second correcting plate (5) to move back and forth.
6. The diode lead correction device of claim 3, wherein: the working surface of the second correcting plate (5) comprises at least three sections of kneading surfaces (10), the kneading height ranges of the three sections of kneading surfaces (10) are different, the kneading surfaces (10) are sequentially arranged from low to high along the conveying direction of the conveying belt according to the kneading height, and the kneading ranges of adjacent kneading surfaces (10) are partially overlapped.
CN201610775761.3A 2016-08-31 2016-08-31 Diode lead correction method and device Active CN106229280B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610775761.3A CN106229280B (en) 2016-08-31 2016-08-31 Diode lead correction method and device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610775761.3A CN106229280B (en) 2016-08-31 2016-08-31 Diode lead correction method and device

Publications (2)

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CN106229280A CN106229280A (en) 2016-12-14
CN106229280B true CN106229280B (en) 2023-04-07

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4625374A (en) * 1984-11-09 1986-12-02 Equipment Technology Incorporated Capacitor lead wire manufacture
GB9125104D0 (en) * 1990-12-07 1992-01-22 Rohm Co Ltd Lead mounting apparatus
CN1779933A (en) * 2004-11-26 2006-05-31 大连隆正光饰机制造有限公司 Diode lead straightener and method thereof
CN203003013U (en) * 2013-01-07 2013-06-19 张成骏 Primary alignment device of diode outgoing lines
CN206225330U (en) * 2016-08-31 2017-06-06 贵州雅光电子科技股份有限公司 A kind of means for correcting of diode lead

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4625374A (en) * 1984-11-09 1986-12-02 Equipment Technology Incorporated Capacitor lead wire manufacture
GB9125104D0 (en) * 1990-12-07 1992-01-22 Rohm Co Ltd Lead mounting apparatus
CN1779933A (en) * 2004-11-26 2006-05-31 大连隆正光饰机制造有限公司 Diode lead straightener and method thereof
CN203003013U (en) * 2013-01-07 2013-06-19 张成骏 Primary alignment device of diode outgoing lines
CN206225330U (en) * 2016-08-31 2017-06-06 贵州雅光电子科技股份有限公司 A kind of means for correcting of diode lead

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
扁平封装集成电路引线成形模具设计;宗超等;《机械与电子》;20081224(第12期);76-78 *

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