CN106227305A - A kind of computer motherboard and computer thereof - Google Patents
A kind of computer motherboard and computer thereof Download PDFInfo
- Publication number
- CN106227305A CN106227305A CN201610596878.5A CN201610596878A CN106227305A CN 106227305 A CN106227305 A CN 106227305A CN 201610596878 A CN201610596878 A CN 201610596878A CN 106227305 A CN106227305 A CN 106227305A
- Authority
- CN
- China
- Prior art keywords
- power supply
- slot
- computer motherboard
- mainboard body
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of computer motherboard and computer thereof, it is provided with power supply slot on mainboard body, CPU slot and slot mounting groove, mainboard body is arranged in the radiating tube of square shape by high temperature resistant binder is embedded, mainboard body edge is evenly distributed with some wiring holes, radiating tube is provided with the through hole matched with wiring hole, chute is offered bottom power supply slot, power supply is flexibly connected with chute by the slide block of band servomechanism installation, the inwall of power supply slot is provided with the first thermal insulation layer, power supply slot side is provided with USB female, power supply side is provided with the USB male joint matched with USB female, USB female is connected with CPU slot and groups of slots respectively by wire.The present invention uses special graphite cake as mainboard, there is excellent corrosion resistance, thermal diffusivity and heat stability, power supply and groups of slots separated with mainboard body thermal insulation layer, it is to avoid heat transmission each other, further increase the heat dispersion of entirety.
Description
Technical field
The present invention relates to computer fittings technical field, particularly relate to a kind of computer motherboard and computer thereof.
Background technology
Due to the electrostatic interaction of computer, mainboard is easy to, by contaminating erosion such as flue dust, corrosive gas, dusts, so can
Computer motherboard is caused heavy corrosion, substantially reduces the service life of computer, cause computer system often to break down and ask
Topic, owing to having the part of multiple precision on computer motherboard, each part is connected with each other further through a large amount of wires, and usual wire is all
Being on mainboard, in disorder put, such structure easily makes the precision component on computer motherboard be touched by wire and be subject to
Damage, easily shines into the damage of computer, and it is poor that the most existing computer motherboard generally exists heat dispersion, it is impossible to remotely controls
The defect of system switch.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of computer motherboard and computer thereof, uses special graphite cake
As mainboard, there is excellent corrosion resistance, thermal diffusivity and heat stability, simultaneously by power supply and groups of slots and mainboard body
Separate with thermal insulation layer, it is to avoid heat transmission each other, thus further increase the heat dispersion of entirety, and can lead to
Its switch of process control too far.
For solving above-mentioned technical problem, embodiments of the invention provide a kind of computer motherboard, including mainboard body, mainboard
Being provided with power supply slot, CPU slot and slot mounting groove on body, described mainboard body passes through the embedded installation of high temperature resistant binder
In in the radiating tube of square shape, mainboard body edge is evenly distributed with some wiring holes, and radiating tube is provided with and wiring
The through hole matched in hole, is movably installed with power supply in described power supply slot, offer chute bottom power supply slot, and power supply is by band
The slide block of servomechanism installation is flexibly connected with chute, and the inwall of power supply slot is provided with the first thermal insulation layer, described power supply slot side
Being provided with USB female, described power supply side is provided with the USB male joint matched with USB female, on the inwall of each slot mounting groove all
Being provided with the second thermal insulation layer, be mounted on groups of slots in each slot mounting groove, described USB female is inserted with CPU respectively by wire
Groove is connected with groups of slots, is provided with anti-electric original copy between described power supply slot and CPU slot, and the bottom of described groups of slots sets respectively
It is equipped with safe Resistance box；Described mainboard body is prepared from by the raw material of following weight portion:
Graphite powder 55-75 part, chemicals-resistant modifying agent 10-20 part, nano silicon 10-15 part, heat-resistant agent 3-6 part,
Core-shell acrylic elastic emulsion 10-15 part.
Preferably, described first thermal insulation layer is provided with the opening matched with USB female.
Preferably, the inwall of described first thermal insulation layer is provided with the first heat radiating fin lamella.
Preferably, the inwall of described second thermal insulation layer is provided with the second heat radiating fin lamella.
Preferably, described CPU slot 12 inner bottom surface is provided with heat dissipation plate tube layer 13, and heat dissipation plate tube layer 13 is provided with a heat conduction
Substrate.
Preferably, the slide block of described band servomechanism installation is by being wirelessly connected with mobile terminal.
Preferably, described chemicals-resistant modifying agent is the acrylic acid series additive of perfluoroalkyl.
Preferably, the particle diameter of graphite powder is 2-18 micron.
Preferably, described radiating tube is anticorodal pipe, and the outer wall of described radiating tube passes through heat-conducting silicone grease
Layer is fixed with some outer-finneds.
Present invention also offers a kind of computer, including above-mentioned computer motherboard.
Having the beneficial effect that of the technique scheme of the present invention: use special graphite cake as mainboard, have excellent
Corrosion resistance, thermal diffusivity and heat stability, power supply and groups of slots are separated with mainboard body thermal insulation layer simultaneously, it is to avoid
Heat transmission each other, thus further increase the heat dispersion of entirety, simultaneously by the side of mainboard body
End arranges the wiring hole of the circuit of connecting element, by wire according to sequential program(me), it is to avoid because wire is in disorder to mainboard
On part cause damage, by arranging anti-electric device on mainboard body, it is to avoid mainboard is caused damage by source-drain.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of computer motherboard of the embodiment of the present invention.
Detailed description of the invention
For making the technical problem to be solved in the present invention, technical scheme and advantage clearer, below in conjunction with accompanying drawing and tool
Body embodiment is described in detail.
As it is shown in figure 1, the present invention is directed to existing a kind of computer motherboard of not enough offer, including mainboard body 1, mainboard is originally
Being provided with power supply slot 3, CPU slot 12 and slot mounting groove 8 on body 1, described mainboard body 1 is embedded by high temperature resistant binder
Being arranged in the radiating tube 2 in square shape, mainboard body 1 edge is evenly distributed with some wiring holes, and radiating tube 2 is provided with
The through hole matched with wiring hole, is movably installed with power supply 6, offers chute bottom power supply slot 3 in described power supply slot 3,
Power supply 6 is flexibly connected with chute by the slide block of band servomechanism installation, and the inwall of power supply slot 3 is provided with the first thermal insulation layer 4, described
Power supply slot 3 side is provided with USB female 5, and described power supply 6 side is provided with the USB male joint 7 matched with USB female 5, each slotting
Being equipped with the second thermal insulation layer on the inwall of groove mounting groove 8, be mounted on groups of slots 9 in each slot mounting groove 8, described USB is female
5 are connected with CPU slot 12 and groups of slots 9 respectively by wire, are provided with anti-between described power supply slot 3 and CPU slot 12
Electric original copy 11, the bottom of described groups of slots 9 is respectively arranged with safe Resistance box 10；Described mainboard body 1 is by following weight portion
Raw material is prepared from:
Graphite powder 55-75 part, chemicals-resistant modifying agent 10-20 part, nano silicon 10-15 part, heat-resistant agent 3-6 part,
Core-shell acrylic elastic emulsion 10-15 part.
Described first thermal insulation layer 4 is provided with the opening matched with USB female 5.
The inwall of described first thermal insulation layer 4 is provided with the first heat radiating fin lamella.
The inwall of described second thermal insulation layer is provided with the second heat radiating fin lamella.
Described CPU slot 12 inner bottom surface is provided with heat dissipation plate tube layer 13, and heat dissipation plate tube layer 13 is provided with a heat-conducting substrate.
The slide block of described band servomechanism installation is by being wirelessly connected with mobile terminal.
Described chemicals-resistant modifying agent is the acrylic acid series additive of perfluoroalkyl.
The particle diameter of graphite powder is 2-18 micron.
Described radiating tube 2 is anticorodal pipe, and the outer wall of described radiating tube 2 is fixed by thermal conductive silicon lipid layer
There are some outer-finneds.
Described heat-resistant agent is copolymer or the copolymer of-methyl styrene of N-phenylmaleimide.
The above is the preferred embodiment of the present invention, it is noted that for those skilled in the art
For, on the premise of without departing from principle of the present invention, it is also possible to make some improvements and modifications, these improvements and modifications are also
Should be regarded as protection scope of the present invention.
Claims (10)
1. a computer motherboard, including mainboard body (1), mainboard body (1) is provided with power supply slot (3), CPU slot
(12) and slot mounting groove (8), it is characterised in that described mainboard body (1) is arranged in mouth by high temperature resistant binder is embedded
In the radiating tube (2) of font, mainboard body (1) edge is evenly distributed with some wiring holes, and radiating tube (2) is provided with and connects
The through hole that string holes matches, is movably installed with power supply (6) in described power supply slot (3), power supply slot (3) bottom offers cunning
Groove, power supply (6) is flexibly connected with chute by the slide block of band servomechanism installation, and it is heat insulation that the inwall of power supply slot (3) is provided with first
Layer (4), described power supply slot (3) side is provided with USB female (5), and described power supply (6) side is provided with matches with USB female (5)
USB male joint (7), the inwall of each slot mounting groove (8) is equipped with the second thermal insulation layer, in each slot mounting groove (8) all
Being provided with groups of slots (9), described USB female (5) is connected with CPU slot (12) and groups of slots (9) respectively by wire, described electricity
Being provided with anti-electric original copy (11) between source slot (3) and CPU slot (12), the bottom of described groups of slots (9) is respectively arranged with peace
Impedance box (10)；Described mainboard body (1) is prepared from by the raw material of following weight portion:
Graphite powder 55-75 part, chemicals-resistant modifying agent 10-20 part, nano silicon 10-15 part, heat-resistant agent 3-6 part, nucleocapsid
Acrylic elastic emulsion 10-15 part.
2. a kind of computer motherboard as claimed in claim 1, it is characterised in that described first thermal insulation layer (4) is provided with and USB
The opening that female (5) matches.
3. a kind of computer motherboard as claimed in claim 1, it is characterised in that set on the inwall of described first thermal insulation layer (4)
There is the first heat radiating fin lamella.
4. computer motherboard as claimed in claim 1 a kind of, it is characterised in that the inwall of described second thermal insulation layer is provided with the
Two heat radiating fin lamellas.
5. a kind of computer motherboard as claimed in claim 1, it is characterised in that described CPU slot (12) inner bottom surface is provided with
Heat dissipation plate tube layer (13), heat dissipation plate tube layer (13) is provided with a heat-conducting substrate.
6. a kind of computer motherboard as claimed in claim 1, it is characterised in that the slide block of described band servomechanism installation is by wireless
Connect and have mobile terminal.
7. a kind of computer motherboard as claimed in claim 1, it is characterised in that described chemicals-resistant modifying agent is perfluoroalkyl
Acrylic acid series additive.
8. a kind of computer motherboard as claimed in claim 1, it is characterised in that the particle diameter of graphite powder is 2-18 micron.
9. a kind of computer motherboard as claimed in claim 1, it is characterised in that described radiating tube (2) is high-strength corrosion-resistant aluminum
Compo pipe, the outer wall of described radiating tube (2) is fixed with some outer-finneds by thermal conductive silicon lipid layer.
10. a computer, it is characterised in that include the computer motherboard as described in any one of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610596878.5A CN106227305A (en) | 2016-07-26 | 2016-07-26 | A kind of computer motherboard and computer thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610596878.5A CN106227305A (en) | 2016-07-26 | 2016-07-26 | A kind of computer motherboard and computer thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106227305A true CN106227305A (en) | 2016-12-14 |
Family
ID=57534331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610596878.5A Pending CN106227305A (en) | 2016-07-26 | 2016-07-26 | A kind of computer motherboard and computer thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106227305A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107957760A (en) * | 2017-11-20 | 2018-04-24 | 安徽省未来博学信息技术有限公司 | Electronic equipment high temperature resistant mainboard |
| CN108012496A (en) * | 2017-11-29 | 2018-05-08 | 新华三技术有限公司 | Plate component and electronic equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5497825A (en) * | 1995-05-24 | 1996-03-12 | Symphony Group International Co., Ltd. | Heat-radiator for CPU of a computer |
| CN204347701U (en) * | 2015-01-09 | 2015-05-20 | 齐宁 | A kind of computing machine anti-tamper mainboard |
| CN204462959U (en) * | 2015-03-15 | 2015-07-08 | 西京学院 | A kind of computer motherboard of high efficiency and heat radiation |
| CN204990143U (en) * | 2015-10-10 | 2016-01-20 | 南京洛普云投资管理有限公司 | Improved computer case |
| CN105694418A (en) * | 2016-05-01 | 2016-06-22 | 王璐 | PC thin film material and preparation method thereof |
-
2016
- 2016-07-26 CN CN201610596878.5A patent/CN106227305A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5497825A (en) * | 1995-05-24 | 1996-03-12 | Symphony Group International Co., Ltd. | Heat-radiator for CPU of a computer |
| CN204347701U (en) * | 2015-01-09 | 2015-05-20 | 齐宁 | A kind of computing machine anti-tamper mainboard |
| CN204462959U (en) * | 2015-03-15 | 2015-07-08 | 西京学院 | A kind of computer motherboard of high efficiency and heat radiation |
| CN204990143U (en) * | 2015-10-10 | 2016-01-20 | 南京洛普云投资管理有限公司 | Improved computer case |
| CN105694418A (en) * | 2016-05-01 | 2016-06-22 | 王璐 | PC thin film material and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107957760A (en) * | 2017-11-20 | 2018-04-24 | 安徽省未来博学信息技术有限公司 | Electronic equipment high temperature resistant mainboard |
| CN108012496A (en) * | 2017-11-29 | 2018-05-08 | 新华三技术有限公司 | Plate component and electronic equipment |
| CN108012496B (en) * | 2017-11-29 | 2019-12-06 | 新华三技术有限公司 | Board assembly and electronic device |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161214 |