CN206024405U - There is the ECU of heat sinking function - Google Patents
There is the ECU of heat sinking function Download PDFInfo
- Publication number
- CN206024405U CN206024405U CN201621073415.2U CN201621073415U CN206024405U CN 206024405 U CN206024405 U CN 206024405U CN 201621073415 U CN201621073415 U CN 201621073415U CN 206024405 U CN206024405 U CN 206024405U
- Authority
- CN
- China
- Prior art keywords
- pcb board
- lower house
- boss
- aluminum alloy
- selenium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 24
- 239000000956 alloy Substances 0.000 claims abstract description 21
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052711 selenium Inorganic materials 0.000 claims abstract description 19
- 239000011669 selenium Substances 0.000 claims abstract description 19
- 239000000853 adhesive Substances 0.000 claims abstract description 15
- 230000001070 adhesive effect Effects 0.000 claims abstract description 15
- 239000011505 plaster Substances 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 7
- 238000006073 displacement reaction Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Building Environments (AREA)
Abstract
The utility model discloses the ECU with heat sinking function, including the lower house of aluminum alloy material, pcb board, boss are provided with the lower casing body of aluminum alloy material, the material of boss is aluminium alloy, boss is provided with heat conduction selenium adhesive plaster, one end face of pcb board is used for installing high performance components, and another end face is coordinated with heat conduction selenium blanket contacts.The lower house of aluminum alloy material fast and effectively can be dispersed into the heat that high power device part produces on whole lower house, so as to reduce the series of problems brought due to high temperature to pcb board.Increase the heat conduction selenium adhesive plaster of high thermal conductivity between lower house and pcb board, the heat that can efficiently transmit pcb board does not affect the heat transfer between pcb board and lower house.The presence of selenium adhesive plaster can avoid causing insullac on pcb board to may wear to by the lower house of aluminum alloy material in production or using in as lower house and pcb board occur relative displacement, cause circuit on pcb board to produce with the lower house short-circuit conditions of aluminum alloy material.
Description
Technical field
This utility model is related to ECU, and in particular to the ECU with heat sinking function.
Background technology
The present integrated circuit power of development of electronic technology is followed more to do more large volume and but do less and less.Automobile-used ECU is
Through being a highly integrated equipment, the CPU of only high speed does not also have many powerful metal-oxide-semiconductors etc., so highdensity collection
A unavoidable problem high power device heating problem is brought into ECU.
Content of the invention
This utility model is directed to problems of the prior art, there is provided the ECU with heat sinking function, using aluminium alloy material
The lower house of matter simultaneously arranges boss and heat conduction selenium adhesive plaster in the lower casing body, so as to solve the lower house positioned at aluminum alloy material
The Heat Conduction Problems of interior pcb board.
For solving above-mentioned technical problem, the technical scheme that this utility model is adopted is：There is the ECU of heat sinking function,
Including the lower house of aluminum alloy material, pcb board, boss in the lower casing body of aluminum alloy material, is provided with, the material of boss is heat conduction
Material, boss are provided with heat conduction selenium adhesive plaster, and one end face of pcb board is used for installing high performance components, another end face and heat conduction
Selenium blanket contacts coordinate.
Used as the preferred of such scheme, the material of boss is aluminium alloy, boss and described lower casing body by integral forming or weldering
Connect or be spirally connected.
Used as the preferred of such scheme, heat conduction selenium adhesive plaster is bonded on boss.
The beneficial effects of the utility model are：The lower house of aluminum alloy material can fast and effectively by high power device portion
Divide the heat for producing to be dispersed on the lower house of whole aluminum alloy material, so as to reduce due to high temperature to pcb board brings one be
Row problem.Increase the heat conduction selenium adhesive plaster of high thermal conductivity between the lower house and pcb board of aluminum alloy material, efficiently can transmit
The heat of pcb board does not affect the heat transfer between the lower house of pcb board and aluminum alloy material.The presence of selenium adhesive plaster can be avoided
Production causes on pcb board insullac by aluminum as the lower house and pcb board of aluminum alloy material occur relative displacement using in
The lower house of alloy material may wear to, and cause short-circuit conditions generation between circuit and the lower house of aluminum alloy material on pcb board.
Description of the drawings
Fig. 1 is the structural representation of lower house；
Fig. 2 is the structural representation of lower house and selenium adhesive plaster；
Fig. 3 is structural representation of the present utility model.
Specific embodiment
With reference to embodiment, specific embodiment of the present utility model is further described.
As Figure 1-3, the ECU with heat sinking function, including the lower house 1 of aluminum alloy material, under aluminum alloy material
It is provided with pcb board 4, boss 2 in housing, the material of boss is aluminium alloy, the lower house one of boss and described aluminum alloy material
Body formed or weldering even or is spirally connected, and boss is provided with heat conduction selenium adhesive plaster 3, and one end face of pcb board is used for installing high performance components, separately
One end face is coordinated with heat conduction selenium blanket contacts, and heat conduction selenium adhesive plaster is bonded on boss.
Wherein, heat conduction selenium adhesive plaster is using the selenium adhesive plaster with high thermal conductivity.
For a person skilled in the art, still the technical scheme described in foregoing embodiments can be repaiied
Changing, or equivalent being carried out to which part technical characteristic, all within spirit of the present utility model and principle, that made is any
Modification, equivalent, improvement etc., should be included within protection domain of the present utility model.
Claims (3)
1. there is the ECU of heat sinking function, it is characterised in that including the lower house of aluminum alloy material, the lower house of aluminum alloy material
Pcb board, boss be inside provided with, the material of boss is heat-conducting, boss is provided with heat conduction selenium adhesive plaster, and one end face of pcb board is used
In high performance components are installed, another end face is coordinated with heat conduction selenium blanket contacts.
2. the ECU with heat sinking function as claimed in claim 1, it is characterised in that the material of boss is aluminium alloy, boss with
Described lower casing body by integral forming or weldering even or are spirally connected.
3. there is the ECU of heat sinking function as claimed in claim 1, it is characterised in that heat conduction selenium adhesive plaster is bonded on boss.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621073415.2U CN206024405U (en) | 2016-09-23 | 2016-09-23 | There is the ECU of heat sinking function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621073415.2U CN206024405U (en) | 2016-09-23 | 2016-09-23 | There is the ECU of heat sinking function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206024405U true CN206024405U (en) | 2017-03-15 |
Family
ID=58261152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621073415.2U Expired - Fee Related CN206024405U (en) | 2016-09-23 | 2016-09-23 | There is the ECU of heat sinking function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206024405U (en) |
-
2016
- 2016-09-23 CN CN201621073415.2U patent/CN206024405U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: ECU with heat dissipation function Effective date of registration: 20180907 Granted publication date: 20170315 Pledgee: Agricultural Bank of China Limited by Share Ltd. Jiaxing science and Technology Branch Pledgor: JIAXING E-XON POWER TECHNOLOGY CO.,LTD. Registration number: 2018330000266 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20201201 Granted publication date: 20170315 Pledgee: Agricultural Bank of China Limited by Share Ltd. Jiaxing science and Technology Branch Pledgor: JIAXING E-XON POWER TECHNOLOGY Co.,Ltd. Registration number: 2018330000266 |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170315 |