CN204462959U - A kind of computer motherboard of high efficiency and heat radiation - Google Patents

A kind of computer motherboard of high efficiency and heat radiation Download PDF

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Publication number
CN204462959U
CN204462959U CN201520156904.3U CN201520156904U CN204462959U CN 204462959 U CN204462959 U CN 204462959U CN 201520156904 U CN201520156904 U CN 201520156904U CN 204462959 U CN204462959 U CN 204462959U
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CN
China
Prior art keywords
mainboard body
power supply
heat
dissipating layer
heat dissipating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520156904.3U
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Chinese (zh)
Inventor
刘杰
董三锋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xijing University
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Xijing University
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Filing date
Publication date
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Priority to CN201520156904.3U priority Critical patent/CN204462959U/en
Application granted granted Critical
Publication of CN204462959U publication Critical patent/CN204462959U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of computer motherboard of high efficiency and heat radiation, comprise mainboard body and power supply mounting groove, be arranged on the CPU slot on mainboard body and some slots, and the wiring hole that mainboard body edge is arranged, described mainboard body side is provided with USB male joint, described power supply mounting groove side is provided with USB female, in described power supply mounting groove, power supply is installed, described USB female is connected with described power supply by power lead, dust cover is covered with above described mainboard body, described CPU slot four limit offers some through holes, radiator fan is had by support installing in described through hole, described mainboard body bottom surface is provided with heat dissipating layer.The utility model is by separating power supply and mainboard body, thus the heat that power supply and mainboard body are produced is separated, and is convenient to heat radiation; Below mainboard body, be provided with heat dissipating layer simultaneously, and fan and heat loss through radiation coating are set in heat dissipating layer, further increase the heat dispersion of mainboard.

Description

A kind of computer motherboard of high efficiency and heat radiation
Technical field
The utility model relates to computer fittings technical field, particularly relates to a kind of computer motherboard of high efficiency and heat radiation.
Background technology
Due to the electrostatic interaction of computer; mainboard is easy to by contaminating erosion such as flue dust, corrosive gas, dusts; heavy corrosion can be caused like this to vandal-proof computer main board; substantially reduce the serviceable life of computer; computer system is caused often to break down problem; dust is entered in PCI slot particularly on mainboard and memory bank; usually can cause loose contact after long-term no idle slot insertion equipment; short circuit is even caused to burn mainboard; simultaneously the heat dispersion of existing mainboard is poor, brings puzzlement to a certain degree to the use of user.
Utility model content
For solving the problem, the utility model provides a kind of computer motherboard of high efficiency and heat radiation.
For achieving the above object, the technical scheme that the utility model is taked is:
A kind of computer motherboard of high efficiency and heat radiation, comprise mainboard body and power supply mounting groove, be arranged on the CPU slot on mainboard body and some slots, and the wiring hole that mainboard body edge is arranged, described mainboard body side is provided with USB male joint, described power supply mounting groove side is provided with USB female, in described power supply mounting groove, power supply is installed, described USB female is connected with described power supply by power lead, dust cover is covered with above described mainboard body, described CPU slot four limit offers some through holes, radiator fan is had by support installing in described through hole, described mainboard body bottom surface is provided with heat dissipating layer, described heat dissipating layer is the cube structure that wire netting is woven into, the inwall of described heat dissipating layer is provided with heat loss through radiation coating, in described heat dissipating layer, some fans are installed.
As preferably, one end of described slot is connected with safe Resistance box.
As preferably, between described USB male joint and CPU slot, be provided with anti-electric original copy.
The utility model has following beneficial effect:
By power supply and mainboard body being separated, thus the heat that power supply and mainboard body are produced is separated, and is convenient to heat radiation; By arranging radiator fan in CPU slot, can start when cpu temperature is too high, easy to use, below mainboard body, be provided with heat dissipating layer simultaneously, and fan and heat loss through radiation coating are set in heat dissipating layer, further increase the heat dispersion of mainboard.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the structural representation of heat dissipating layer in the utility model.
Embodiment
In order to make the purpose of this utility model and advantage clearly understand, below in conjunction with embodiment, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
As shown in Figure 1-2, the utility model provides a kind of computer motherboard of high efficiency and heat radiation, comprise mainboard body 1 and power supply mounting groove 12, be arranged on the CPU slot 5 on mainboard body 1 and some slots 6, and the wiring hole that mainboard body 1 edge is arranged, described mainboard body 1 side is provided with USB male joint 8, described power supply mounting groove 12 side is provided with USB female 13, in described power supply mounting groove 12, power supply 11 is installed, described USB female 13 is connected with described power supply 11 by power lead, dust cover 2 is covered with above described mainboard body 1, described CPU slot 5 four limit offers some through holes 10, radiator fan is had by support installing in described through hole 10, described mainboard body 1 bottom surface is provided with heat dissipating layer 14, the cube structure that described heat dissipating layer 14 is woven into for wire netting, the inwall of described heat dissipating layer 14 is provided with heat loss through radiation coating 9, in described heat dissipating layer 14, some fans 15 are installed.
One end of described slot 6 is connected with safe Resistance box 7.
Anti-electric original copy 8 is provided with between described USB male joint 8 and CPU slot 5.
Wherein, described USB male joint 8, anti-electric original copy 8, CPU slot 5, safe Resistance box 7 are connected by power lead, and described radiator fan is provided with inductive switch, and described inductive switch is by being wirelessly connected with telepilot.
This is specifically implemented by power supply and mainboard body being separated, thus the heat that power supply and mainboard body are produced is separated, and is convenient to heat radiation; By arranging radiator fan in CPU slot, cpu temperature detection can be carried out or carry Programmable detection by computer starting by downloading certain application program when cpu temperature is too high, easy to use, below mainboard body, be provided with heat dissipating layer simultaneously, and fan and heat loss through radiation coating are set in heat dissipating layer, further increase the heat dispersion of mainboard.
The above is only preferred implementation of the present utility model; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the utility model principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection domain of the present utility model.

Claims (3)

1. the computer motherboard of a high efficiency and heat radiation, comprise mainboard body (1) and power supply mounting groove (12), be arranged on the CPU slot (5) on mainboard body (1) and some slots (6), and the wiring hole that mainboard body (1) edge is arranged, it is characterized in that, described mainboard body (1) side is provided with USB male joint (8), described power supply mounting groove (12) side is provided with USB female (13), in described power supply mounting groove (12), power supply (11) is installed, described USB female (13) is connected with described power supply (11) by power lead, described mainboard body (1) top is covered with dust cover (2), described CPU slot (5) four limit offers some through holes (10), radiator fan is had by support installing in described through hole (10), described mainboard body (1) bottom surface is provided with heat dissipating layer (14), the cube structure that described heat dissipating layer (14) is woven into for wire netting, the inwall of described heat dissipating layer (14) is provided with heat loss through radiation coating (9), some fans (15) are installed in described heat dissipating layer (14).
2. the computer motherboard of a kind of high efficiency and heat radiation according to claim 1, is characterized in that, one end of described slot (6) is connected with safe Resistance box (7).
3. the computer motherboard of a kind of high efficiency and heat radiation according to claim 1, is characterized in that, is provided with anti-electric original copy (8) between described USB male joint (8) and CPU slot (5).
CN201520156904.3U 2015-03-15 2015-03-15 A kind of computer motherboard of high efficiency and heat radiation Expired - Fee Related CN204462959U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520156904.3U CN204462959U (en) 2015-03-15 2015-03-15 A kind of computer motherboard of high efficiency and heat radiation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520156904.3U CN204462959U (en) 2015-03-15 2015-03-15 A kind of computer motherboard of high efficiency and heat radiation

Publications (1)

Publication Number Publication Date
CN204462959U true CN204462959U (en) 2015-07-08

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520156904.3U Expired - Fee Related CN204462959U (en) 2015-03-15 2015-03-15 A kind of computer motherboard of high efficiency and heat radiation

Country Status (1)

Country Link
CN (1) CN204462959U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106227305A (en) * 2016-07-26 2016-12-14 季苏利 A kind of computer motherboard and computer thereof
CN107728867A (en) * 2017-11-16 2018-02-23 江苏铁锚玻璃股份有限公司 The encapsulating structure and its method for packing of double glazing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106227305A (en) * 2016-07-26 2016-12-14 季苏利 A kind of computer motherboard and computer thereof
CN107728867A (en) * 2017-11-16 2018-02-23 江苏铁锚玻璃股份有限公司 The encapsulating structure and its method for packing of double glazing

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150708

Termination date: 20180315

CF01 Termination of patent right due to non-payment of annual fee