CN106226884B - The processing technology of lens module - Google Patents
The processing technology of lens module Download PDFInfo
- Publication number
- CN106226884B CN106226884B CN201610702642.5A CN201610702642A CN106226884B CN 106226884 B CN106226884 B CN 106226884B CN 201610702642 A CN201610702642 A CN 201610702642A CN 106226884 B CN106226884 B CN 106226884B
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- CN
- China
- Prior art keywords
- pcb board
- product
- silicon rubber
- rubber cup
- support plate
- Prior art date
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/0006—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means to keep optical surfaces clean, e.g. by preventing or removing dirt, stains, contamination, condensation
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Studio Devices (AREA)
- Lens Barrels (AREA)
Abstract
The present invention relates to electronic technology fields, more particularly to a kind of processing technology of lens module, a kind of processing technology of camera module, some components are first installed on pcb board by it by pcb board separation again, thus substrate will not be caused to fall on chip surface because of separation after installing, reduce defect rate；And because being to be attached to separator well pcb board one by one on support plate again, can be freely combined in this way according to the size of pcb board and support plate, the utilization rate of such pcb board is higher, reduces the loss of PCB substrate；And camera lens is replaced using silicon rubber cup when crossing reflow ovens; because silicon rubber cup also has the function of protecting chip to pollute from dust well; and silicon rubber cup has preferable heat resistance; so replacing camera lens both to can solve the problem of camera lens is easy high temperature deformation using silicon rubber cup, and solve the problems, such as dust-proof.
Description
Technical field
The present invention relates to electronic technology field more particularly to a kind of processing technologys of lens module.
Background technique
Lens module is mainly used in mobile phone, laptop, tablet computer etc. in the product of camera function.It is existing
Technology lens module mainly has following defect when processing:
One, layout processing procedure is mainly used when prior art lens module is processed, i.e., after first having formed multiple semi-finished product
It is separated again, in this way because being restricted by factors such as equipment, clamp tool and product structures, the product that same pcb board is risked
Quantity is not to maximize, and the utilization rate of pcb board is lower；It also because semi-finished product separate again after having formed, and is to adopt
It is separated with punching machine, so the substrate at pcb board edge is easy to fall to chip surface, causes may have part stain in mould group,
I.e. defect rate is higher；
It two, include this procedure of reflow soldering in the lens module processing technology of the prior art, it will mainly be placed
The circuit board of camera lens melts tin cream, by reflux stove heating so that conductive sheet is connected with the weld pad on circuit board.And
And since the environmental condition in solder reflow process process is poor, so in order to avoid in dust contamination to chip, so existing
The lens module formed is put into reflow ovens by technology needs all over, i.e., camera lens will also pass through reflux stove heating, and
Because the camera lens material heat-resisting ability of the prior art is poor, rear lens are heated in reflow ovens and are easy to damage.
Summary of the invention
The technical problems to be solved by the present invention are: providing that a kind of pcb board utilization rate is higher, defect rate is lower and in processing
The processing technology for the lens module that camera lens is less likely to be damaged.
The technical scheme adopted by the invention is that: a kind of processing technology of camera module, it the following steps are included:
(1), PCB is cleaned: the flux cleaning of capacitor bottom on pcb board is fallen；
(2), it separates: monolith pcb board is separated into according to setting by single pcb board by laser equipment；
(3), pasting board: will enclose one layer of high-temp glue first on support plate, then all single pcb boards are attached to from support plate sky
In the high-temp glue that part out is spilt, the support plate include outline border and by the horizontal stripe that multiple portions are separated into outline border with
And vertical bar；
(4), chip: being fixed to the fixed area of the single pcb board after separation by die bond, until all single pcb boards
Fix chip；
(5), wiring: chip being connected with the functional area on single pcb board with gold thread, until all single pcb boards
On functional area be all connected with chip；
(6), it installs: the pedestal with silicon rubber cup is assembled on single pcb board, until being assembled on all pcb boards
There is pedestal；
(7), pickup: successively by the single pcb board being installed on support plate by removing by hand；
(8), it tests for the first time: removing the silicon rubber cup on single pcb board, loading onto shared Shot Detection image whether there is
It is dirty, then silicon rubber cup is installed again；
(9), examine appearance: whether light examines product appearance defective；
(10), the product after inspection appearance patch: is crossed into reflow ovens；
(11), it assembles camera lens: silicon rubber cup will be removed from the product taken out in reflow ovens, be then charged into camera lens；
(12), second test: lens focusing, and again detection image whether have it is dirty.
Using the above processing technology, the invention has the following advantages that
One, because using some components are first installed to this technique on pcb board again by pcb board separation, thus not
Substrate can be caused to fall on chip surface because of separating after installing, reduce defect rate；It and because is by one
A separator well pcb board is attached on support plate again, can be freely combined in this way according to the size of pcb board and support plate, such pcb board
Utilization rate is higher, reduces the loss of PCB substrate；
Two, cross reflow ovens when using silicon rubber cup replace camera lens because silicon rubber cup also have well protect chip from
The function of dust pollution, and silicon rubber cup has preferable heat resistance, so replacing camera lens that can solve well using silicon rubber cup
Camera lens of having determined is easy the problem of high temperature deformation, and solves the problems, such as dust-proof.
Preferably, craft described in step (7) remove specifically includes the following steps:
A, firstly, wherein a hand holds support plate, and this hand separates the back side that at least one finger withstands product；
B, secondly, another hand, which separates at least two fingers, grasps the two sides of product；
C, finally, the finger force for withstanding the product back side jacks up product, the fingers of product two sides is then grasp to same
Direction is exerted oneself, and then product is removed.
Using this manual pickup method, operator's pickup is more convenient quickly, and does not allow easy damaged product.
Preferably, support plate described in step (3) is made of metal material, and outline border, horizontal stripe and vertical bar one at
Type.Using metal support plate, it is not easy when in use in this way because the reasons such as the friction such as collision generate dust, so that setting exists
Pcb board on support plate is not easy more difficult by dust pollution.
Refer to preferably, then again installing silicon rubber cup described in step (8): taking a completely new silicon rubber cup
It installs.Because silicon rubber cup dismounting, which might have the sundries such as dust, enters silicon rubber cup, and is also possible to after silicon rubber cup placement
By dust pollution, so chip can preferably be protected by being reinstalled a new silicon rubber cup, prevent chip from receiving dust pollution.
Detailed description of the invention
Fig. 1 is the structural schematic diagram for the support plate mentioned in the processing technology of lens module of the present invention.
Specific embodiment
The present invention is described further below in conjunction with attached drawing and specific embodiment, but the present invention be not limited only to it is following
Specific embodiment.
A kind of processing technology of camera module, it the following steps are included:
(1), PCB is cleaned: the flux cleaning of capacitor bottom on pcb board is fallen；
(2), it separates: monolith pcb board is separated into according to setting by single pcb board by laser equipment；Swash described in this side
Light device is the laser separation apparatus that can be bought on the market；Because being cut by laser, monolith pcb board can be applied
Come, the substrate waste of such pcb board is less, and utilization rate is higher；
(3), pasting board: will enclose one layer of high-temp glue first on support plate, then all single pcb boards are attached to from support plate sky
In the high-temp glue that part out is spilt, the support plate include outline border and by the horizontal stripe that multiple portions are separated into outline border with
And vertical bar；This layer of high-temp glue upward, does not have sticking one down similar to adhesive tape, the sticking one side of adhesive tape, will be sticking
It adheres on support plate lower end surface, then puts down single pcb board from support plate upper surface on one side, adhere to the sticking one side of high-temp glue
On, quantity and position can be with unrestricted choices；
(4), chip: being fixed to the fixed area of the single pcb board after separation by die bond, until all single pcb boards
Fix chip；
(5), wiring: chip being connected with the functional area on single pcb board with gold thread, until all single pcb boards
On functional area be all connected with chip；
(6), it installs: the pedestal with silicon rubber cup is assembled on single pcb board, until being assembled on all pcb boards
There is pedestal；
(7), pickup: successively by the single pcb board being installed on support plate by removing by hand；
The pickup mainly comprises the steps that
A, firstly, wherein a hand holds support plate, and this hand separates the back side that at least one finger withstands product；Here
Preferably left hand holds support plate, and the index finger of left hand withstands the product back side, really withstands high-temp glue and does not have sticking one side, indirectly
Withstand the product back side；
B, secondly, another hand, which separates at least two fingers, grasps the two sides of product；Right hand thumb is grabbed respectively with index finger
The firmly two sides of product；
C, finally, the finger force for withstanding the product back side jacks up product, the fingers of product two sides is then grasp to same
Direction is exerted oneself, and then product is removed.First left index finger firmly carrys out product jack-up, and then right hand thumb and index finger are toward one
Direction firmly has product from high-temp glue removes in sticking one side.
(8), it tests for the first time: removing the silicon rubber cup on single pcb board, loading onto shared Shot Detection image whether there is
It is dirty, then silicon rubber cup is installed again；This silicon rubber cup removed returns cleaning of taking away at this time, and what is be reinstalled is one
New clean silicon rubber cup；
(9), examine appearance: whether light examines product appearance defective；
(10), the product after inspection appearance patch: is crossed into reflow ovens；
(11), it assembles camera lens: silicon rubber cup will be removed from the product taken out in reflow ovens, be then charged into camera lens；
(12), second test: lens focusing, and again detection image whether have it is dirty.
Claims (3)
1. a kind of processing technology of camera module, which is characterized in that it the following steps are included:
(1), PCB is cleaned: the flux cleaning of capacitor bottom on pcb board is fallen；
(2), it separates: monolith pcb board is separated into according to setting by single pcb board by laser equipment；
(3), pasting board: will enclose one layer of high-temp glue first on support plate, then all single pcb boards are attached to from support plate and are available
The high-temp glue that spills of part on, the support plate includes outline border and will be separated into the horizontal stripe of multiple portions and perpendicular in outline border
Item；
(4), chip: being fixed to the fixed area of the single pcb board after separation by die bond, until all single pcb boards are solid
Set chip；
(5), wiring: chip being connected with the functional area on single pcb board with gold thread, until on all single pcb boards
Functional area is all connected with chip；
(6), it installs: the pedestal with silicon rubber cup is assembled on single pcb board, until being each equipped with base on all pcb boards
Seat；
(7), pickup: successively by the single pcb board being installed on support plate by removing by hand；
(8), it tests for the first time: removing the silicon rubber cup on single pcb board, load onto shared Shot Detection image with the presence or absence of dirty
Then dirt again installs silicon rubber cup；
(9), examine appearance: whether light examines product appearance defective；
(10), the product after inspection appearance patch: is crossed into reflow ovens；
(11), it assembles camera lens: silicon rubber cup will be removed from the product taken out in reflow ovens, be then charged into camera lens；
(12), second test: lens focusing, and again detection image whether have it is dirty；
And then silicon rubber cup is installed again described in step (8) and is referred to: a completely new silicon rubber cup being taken to install.
2. the processing technology of camera module according to claim 1, it is characterised in that: craft described in step (7)
Remove specifically includes the following steps:
A, firstly, wherein a hand holds support plate, and this hand separates the back side that at least one finger withstands product；
B, secondly, another hand, which separates at least two fingers, grasps the two sides of product；
C, finally, the finger force for withstanding the product back side jacks up product, the fingers of product two sides is then grasp to same direction
Firmly, and then by product it removes.
3. the processing technology of camera module according to claim 1, it is characterised in that: support plate described in step (3)
It is made of metal material, and outline border, horizontal stripe and vertical bar are integrally formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610702642.5A CN106226884B (en) | 2016-08-23 | 2016-08-23 | The processing technology of lens module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610702642.5A CN106226884B (en) | 2016-08-23 | 2016-08-23 | The processing technology of lens module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106226884A CN106226884A (en) | 2016-12-14 |
| CN106226884B true CN106226884B (en) | 2018-12-25 |
Family
ID=57553493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610702642.5A Active CN106226884B (en) | 2016-08-23 | 2016-08-23 | The processing technology of lens module |
Country Status (1)
| Country | Link |
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| CN (1) | CN106226884B (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101521166A (en) * | 2008-09-10 | 2009-09-02 | 李东 | Method and structure for packaging digital image acquisition module |
| CN102263887A (en) * | 2010-05-31 | 2011-11-30 | 昆山西钛微电子科技有限公司 | Mobile phone camera module and manufacturing process thereof |
| CN103731607B (en) * | 2013-12-24 | 2016-09-28 | 惠州市桑莱士光电有限公司 | A kind of mobile phone camera module group assembling method |
| CN105470270B (en) * | 2014-06-11 | 2019-01-29 | 比亚迪股份有限公司 | The packaging method and camera module of COB chip camera module |
| US9276140B1 (en) * | 2014-09-16 | 2016-03-01 | Amazon Technologies, Inc. | Imager module with interposer chip |
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| Publication number | Publication date |
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| CN106226884A (en) | 2016-12-14 |
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Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee after: Shenzhen helitai photoelectric Co., Ltd Address before: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee before: SHENZHEN BYD ELECTRONIC COMPONENT Co.,Ltd. |