CN106216886A - A kind of brazing flux without chloride ion for priming system copper alloy Yu nichrome wire soldering - Google Patents
A kind of brazing flux without chloride ion for priming system copper alloy Yu nichrome wire soldering Download PDFInfo
- Publication number
- CN106216886A CN106216886A CN201610630976.6A CN201610630976A CN106216886A CN 106216886 A CN106216886 A CN 106216886A CN 201610630976 A CN201610630976 A CN 201610630976A CN 106216886 A CN106216886 A CN 106216886A
- Authority
- CN
- China
- Prior art keywords
- brazing flux
- chloride ion
- nichrome wire
- rosin
- tin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention provides a kind of without chloride ion brazing flux, and its component represents by mass percentage and is respectively as follows: ammonium fluoroborate 10 30%, triethanolamine 10 25%, salicylic acid 1 10%, rosin 1 10%, surplus distilled water.The brazing flux coupling tin-lead solder that the present invention provides uses, and seam appearance is good, and after-welding brazing flux is cleaned easily.Due to the present invention not chloride ion-containing, it is particularly well-suited to the priming system soldering of the copper alloy electrode with epoxy resin as covering material and nichrome wire, brazing flux is little to the corrosivity of brazed seam, copper electrode, nichrome wire and epoxide resin material, is easy to long term storage after cleaning.
Description
Technical field
The invention belongs to priming system soldering and manufacture field, relate to a kind of brazing flux, be specifically related to a kind of for epoxy
Resin is the copper electrode soldering acid with nichrome wire of covering material.
Background technology
Priming system product category is many, and the market demand is big.In the manufacturing, determine the key of priming system success igniting
Depend on the brazing quality of copper electrode and nichrome wire.The solder that priming system soldering uses is tin-lead solder, brazing flux main
Component is ZnCl2.Nichrome wire has higher resistance, simultaneously because it contains higher nickel and chromium, holds on the surface of silk material
It is easily formed one layer of fine and close passivating film, hinders molten tin lead solder wettability thereon.Brazing process uses ZnCl2Pricker
Agent, effectively eliminates the passivating film on nichrome wire surface, and protect brazed seam and nichrome wire surface is not oxidized and
Form new passivating film, improve the wettability of molten tin lead solder, make brazed seam well shape.
But, after soldering, the chloride ion in remaining brazing flux is very strong to the corrosivity on tin-lead brazed seam and nichrome wire surface,
Must be thoroughly washed with nichrome wire surface by the copper electrode of brazing filler metal near brazed seam and brazed seam.Especially to epoxy
For resin is the priming system components and parts of covering material, chloride ion is the biggest to the corrosivity of epoxy resin.If remaining brazing flux is clear
Wash not thorough, leave the hidden danger of corrosion failure can to priming system epoxy resin covering material, be not easy to long term storage.Once occur
Epoxide resin material is corroded by remaining brazing flux, makes the insulation between copper electrode be destroyed, it will to there is priming system loss of ignition
Risk.Further, since chloride ion and zinc in brazing flux can volatilize in brazing process and be sucked in lung by welder, to welder's
Health causes damage.
Through finding prior art literature retrieval, the Chinese patent of Publication No. CN200410016987 discloses " a kind of
Brazing flux without chlorine and the application in Bronze Relics soldering is repaired thereof ", disclosed brazing flux without chlorine mates with tin-lead silver solder for Gu
Bronze Relics is repaired, and the key component of brazing flux is weak acid, and the removal to the surface film oxide of bell metal has good effect,
But the passivating film for the higher nichrome wire surface of Ni and Cr contained alloying element is the most helpless.It addition, in electronics industry
Although existing No clean brazing flux at postwelding to brazed seam, corrosion-free by brazing filler metal material, but nichrome wire surface cannot be removed
Passivating film, during soldering, wettability is poor, easily causes the rosin joint of nichrome wire and copper electrode, does not reaches the soldering matter of priming system
Amount requirement.Therefore, it is necessary to develop the nothing that nichrome wire, molten tin lead solder and copper electrode material are all had good wettability
Chloride ion brazing flux, changes to remove because of brazing flux remaining after soldering during current priming system is manufactured and the most thoroughly causes soldered fitting
With epoxy resins insulation corrosion failure problem, improving priming system can not the present situation of long term storage.
Summary of the invention
It is an object of the invention to overcome above-mentioned deficiency of the prior art, it is provided that a kind of for priming system nichrome wire
With copper electrode soldering with without chloride ion brazing flux, reach to remove by brazing filler metal material surface passivating film during priming system soldering, improve melted
The purpose of tin-lead solder wettability, and brazing flux itself is little to the corrosivity of soldered fitting.
The present invention is achieved by the following technical solutions,
A kind of brazing flux without chloride ion for priming system copper alloy Yu nichrome wire soldering, this forms without chloride ion brazing flux
Composition includes ammonium fluoroborate, triethanolamine, salicylic acid and rosin, the mass percent of the described constituent of brazing flux without chloride ion
As follows:
Ammonium fluoroborate 10-30%；
Triethanolamine 10-25%；
Salicylic acid 1-15%；
Rosin 0-10%；
Surplus distilled water.
The each component of brazing flux of the present invention is in the range of mentioned component, and its optimization formula is by mass percentage:
Ammonium fluoroborate 15-25%；
Triethanolamine 15-20%；
Salicylic acid 8-12%；
Rosin 0-10%；
Surplus distilled water.
The content of described rosin component, when using the tin-lead solder containing Colophonium, can not use in brazing flux component
Rosin.
The design of components principle of the present invention is as follows:
Brazing flux can be divided into inorganic brazing flux and organic brazing flux by its component, and the corrosivity of inorganic brazing flux is stronger；Organic brazing flux
Corrosivity is more weak.When the research principles of brazing flux of the present invention is soldering, the corrosivity to insulating epoxy material is little, brazing property
Well.Therefore avoid selecting inorganic brazing flux and the inorganic salts component with Cl ion when developing, select the group of organic principle
Divide the brazing flux of development of new.
The ammonium fluoroborate that the present invention selects is as activator.Ammonium fluoroborate thermally decomposes to generate high living at about 100 DEG C
HF and BF of property3.The removal of nichrome wire surface passivated membrane relies primarily on HF and by BF3Organic fluoride boron is generated with triethanolamine
Compound.Although the use of ammonium fluoroborate creates HF in brazing process, because the ability phase combined between hydrogen atom and fluorine atom
To stronger so that HF can not ionize in water completely, therefore defining the Fluohydric acid. of a kind of low concentration, it is to nichrome wire material
Material has extremely strong corrosivity, more weak to epoxide resin material corrosiveness.
Triethanolamine is important ion couplant, as ligand and many kinds of metal ions, the life that interacts can occur
Producing corresponding couplings or complex, effect in the present invention mainly coordinates ammonium fluoroborate to remove nichrome wire further
The passivating film on surface, improves the wettability of molten tin lead solder.
The effect of Colophonium, primarily as coverture, covers the nichrome wire surface after removing surface passivated membrane and goes
Except the copper electrode surface after surface film oxide and molten tin lead solder surface, prevent from brazed seam forming process is passivated again or
Oxidation.If solder inherently contains Colophonium, brazing flux can be added without Colophonium.
Salicylic effect mainly relies on the effect of carboxyl, removes the oxidation on tin-lead brazed seam surface with the form of metallic soap
Film.
In the present invention, the effect of distilled water is primarily as the solvent of said components.
The agent without chloride ion of the present invention mates tin-lead at priming system nichrome wire in the brazing process of copper electrode material
Solder, has good wettability, and seam appearance is good, and remaining brazing flux easily cleans, to brazed seam, by brazing filler metal material and epoxy
The corrosivity of resin-coating material is the least.
Detailed description of the invention
Below embodiments of the invention are elaborated: the present embodiment is carried out under premised on technical solution of the present invention
Implement, provide embodiment and concrete operating process, but protection scope of the present invention is not limited to following embodiment.
Embodiment 1
The brazing flux component of the present embodiment is as follows according to mass percent:
Ammonium fluoroborate 10%；
Triethanolamine 10%；
Salicylic acid 1%；
Surplus is distilled water.
The manufacture process of the present embodiment is: first with measuring cup take a certain amount of distilled water weigh after pour beaker into, subsequently
Ammonium fluoroborate, triethanolamine and salicylic acid weigh in proportion, slowly put in distilled water, put into while stir, until fully
Mix homogeneously, brazing flux configuration terminates.
Embodiment 2
The brazing flux component of the present embodiment is as follows according to mass percent:
Ammonium fluoroborate 15%；
Triethanolamine 13%；
Salicylic acid 5%；
Rosin 3%；
Surplus distilled water.
The manufacture process of the present embodiment is: first with measuring cup take a certain amount of distilled water weigh after pour beaker into, subsequently
Ammonium fluoroborate, triethanolamine, rosin and salicylic acid weigh in proportion, slowly put in distilled water, put into while stir, directly
To being sufficiently mixed uniformly, brazing flux configuration terminates.
Embodiment 3
The brazing flux component of the present embodiment is as follows according to mass percent:
Ammonium fluoroborate 20%；
Triethanolamine 19%；
Salicylic acid 9%；
Rosin 5%；
Surplus distilled water.
The manufacture process of the present embodiment is: first with measuring cup take a certain amount of distilled water weigh after pour beaker into, subsequently
Ammonium fluoroborate, triethanolamine, rosin and salicylic acid weigh in proportion, slowly put in distilled water, put into while stir, directly
To being sufficiently mixed uniformly, brazing flux configuration terminates.
Embodiment 4
The brazing flux component of the present embodiment is as follows according to mass percent:
Ammonium fluoroborate 25%；
Triethanolamine 22%；
Salicylic acid 13%；
Rosin 8%；
Surplus distilled water.
The manufacture process of the present embodiment is: first with measuring cup take a certain amount of distilled water weigh after pour beaker into, subsequently
Ammonium fluoroborate, triethanolamine, rosin and salicylic acid weigh in proportion, slowly put in distilled water, put into while stir, directly
To being sufficiently mixed uniformly, brazing flux configuration terminates.
Embodiment 5
The brazing flux component of the present embodiment is as follows according to mass percent:
Ammonium fluoroborate 30%；
Triethanolamine 25%；
Salicylic acid 15%；
Rosin 10%；
Surplus distilled water.
The manufacture process of the present embodiment is: first with measuring cup take a certain amount of distilled water weigh after pour beaker into, subsequently
Ammonium fluoroborate, triethanolamine, rosin and salicylic acid weigh in proportion, slowly put in distilled water, put into while stir, directly
To being sufficiently mixed uniformly, brazing flux configuration terminates.
Comparative example 1
Use ZnCl2Brazing flux is as the present embodiment brazing flux.Appropriate ZnCl is added in distilled water2Stir.
Comparative example 2
Do not use brazing flux as embodiment
Spreadability test
Spreadability test process is as follows:
(1) configuration of brazing flux is carried out according to embodiment 1-5 and comparative example 1, standby after having configured brazing flux；
(2) corrosion resistant plate close with priming system nichrome wire composition is selected, first smooth with sand papering, then use ethanol
Wiped clean is standby；
(3) brazing flux of a kind of component of stainless-steel sheet surface smear at test；
(4) dip in brazing flux under 1-2 with the suitable electric soldering bit of temperature, then tin-lead welding wire is melted in stainless-steel sheet
Surface；
Etc. (5), after tin-lead welding wire cooled and solidified, other position, stainless-steel sheet surface, repetitive process (1)-(4) are selected；
(6) ZnCl is included2After brazing flux and the tin-lead solder joint without brazing flux all obtain, observe tin-lead solder joint exterior appearance and paving
Exhibition situation.
Tin-lead solder joint exterior appearance and situation of sprawling to embodiment 1-5, comparative example 1 and comparative example 2 are observed respectively
And contrast, result shows: without (comparative example 2) during brazing flux, tin-lead welding spot forming is very poor, and spreadability is the poorest, and solder joint is in irregularly
Shape；With compared with tin-lead solder joint during brazing flux, use ZnCl2Tin-lead welding spot forming during brazing flux (comparative example 1) and spreadability
Well；With compared with tin-lead solder joint during brazing flux, use embodiment 1-5 brazing flux obtain tin-lead solder joint formability with sprawl
Property is the most fine；Use the brazing flux of embodiment 1-5, it is thus achieved that formability and the spreadability of tin-lead weldering solder joint be better than using ZnCl2Pricker
The formability of tin-lead solder joint and spreadability during agent (comparative example 1).The tin-lead welding spot forming using the brazing flux of the present invention to obtain is good, paving
Malleability is good.Wherein, as ammonium fluoroborate 15-25%, triethanolamine 15-20%, salicylic acid 8-12%, during rosin 0-10%,
The shaping of tin-lead solder joint and sprawl all right, the especially result of the embodiment of the present invention 3 is best, ammonium fluoroborate 20%, three second
Hydramine 19%, salicylic acid 9%, the shaping of tin-lead solder joint and to sprawl situation best during rosin 5%.
Claims (4)
1. the brazing flux without chloride ion for priming system copper alloy and nichrome wire soldering, it is characterised in that this without chlorine from
Sub-brazing flux constituent includes ammonium fluoroborate, triethanolamine, salicylic acid and rosin, the described constituent of brazing flux without chloride ion
Mass percent is as follows:
Ammonium fluoroborate 10-30%；
Triethanolamine 10-25%；
Salicylic acid 1-15%；
Rosin 0-10%；
Surplus distilled water.
Brazing flux without chloride ion the most according to claim 1, it is characterised in that the matter of the described constituent of brazing flux without chloride ion
Amount percentage ratio is as follows:
Ammonium fluoroborate 15-25%；
Triethanolamine 15-20%；
Salicylic acid 8-12%；
Rosin 0-10%；
Surplus distilled water.
Brazing flux without chloride ion the most according to claim 1 and 2, it is characterised in that match with described brazing flux without chloride ion
Solder be tin-lead solder.
Brazing flux without chloride ion the most according to claim 2, it is characterised in that when described tin-lead solder contains Colophonium, then institute
State without chloride ion brazing flux does not contains rosin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610630976.6A CN106216886B (en) | 2016-08-04 | 2016-08-04 | It is a kind of to be used for priming system copper alloy with nichrome wire soldering without chlorion brazing flux |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610630976.6A CN106216886B (en) | 2016-08-04 | 2016-08-04 | It is a kind of to be used for priming system copper alloy with nichrome wire soldering without chlorion brazing flux |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106216886A true CN106216886A (en) | 2016-12-14 |
| CN106216886B CN106216886B (en) | 2018-09-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610630976.6A Expired - Fee Related CN106216886B (en) | 2016-08-04 | 2016-08-04 | It is a kind of to be used for priming system copper alloy with nichrome wire soldering without chlorion brazing flux |
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| CN (1) | CN106216886B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU718240A1 (en) * | 1978-08-23 | 1980-02-28 | Предприятие П/Я В-2481 | Flux for soldering with low-melting solders |
| SU1659189A1 (en) * | 1989-06-09 | 1991-06-30 | Предприятие П/Я А-3900 | Flux for low-temperature soldering |
| US20020100521A1 (en) * | 1999-06-17 | 2002-08-01 | Sameja Ashraf I | Soldering flux |
| CN1669722A (en) * | 2004-03-17 | 2005-09-21 | 上海博物馆 | Chlorine free soldering flux and its application in bronze historical relics soldering repair |
| CN101412168A (en) * | 2008-11-26 | 2009-04-22 | 华南理工大学 | Scaling powder for aluminium soldering tin wire core and preparation method thereof |
| JP2012024804A (en) * | 2010-07-23 | 2012-02-09 | Tetsuo Harada | Liquid flux |
| CN105057923A (en) * | 2015-09-06 | 2015-11-18 | 湖北长海新能源科技有限公司 | Water-borne soldering flux for welding lead-acid storage battery pole plates |
| CN105414801A (en) * | 2015-11-01 | 2016-03-23 | 四川泛华航空仪表电器有限公司 | Preparation method for aluminum foil welding solder organic flux |
-
2016
- 2016-08-04 CN CN201610630976.6A patent/CN106216886B/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU718240A1 (en) * | 1978-08-23 | 1980-02-28 | Предприятие П/Я В-2481 | Flux for soldering with low-melting solders |
| SU1659189A1 (en) * | 1989-06-09 | 1991-06-30 | Предприятие П/Я А-3900 | Flux for low-temperature soldering |
| US20020100521A1 (en) * | 1999-06-17 | 2002-08-01 | Sameja Ashraf I | Soldering flux |
| CN1669722A (en) * | 2004-03-17 | 2005-09-21 | 上海博物馆 | Chlorine free soldering flux and its application in bronze historical relics soldering repair |
| CN101412168A (en) * | 2008-11-26 | 2009-04-22 | 华南理工大学 | Scaling powder for aluminium soldering tin wire core and preparation method thereof |
| JP2012024804A (en) * | 2010-07-23 | 2012-02-09 | Tetsuo Harada | Liquid flux |
| CN105057923A (en) * | 2015-09-06 | 2015-11-18 | 湖北长海新能源科技有限公司 | Water-borne soldering flux for welding lead-acid storage battery pole plates |
| CN105414801A (en) * | 2015-11-01 | 2016-03-23 | 四川泛华航空仪表电器有限公司 | Preparation method for aluminum foil welding solder organic flux |
Non-Patent Citations (1)
| Title |
|---|
| 闫静，钱航: "三乙醇胺-氟硼酸盐型钎剂中有机基体的作用研究", 《化学与粘合》 * |
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| CN106216886B (en) | 2018-09-14 |
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