CN106211725A - 一种密封水冷服务器 - Google Patents

一种密封水冷服务器 Download PDF

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CN106211725A
CN106211725A CN201610801248.7A CN201610801248A CN106211725A CN 106211725 A CN106211725 A CN 106211725A CN 201610801248 A CN201610801248 A CN 201610801248A CN 106211725 A CN106211725 A CN 106211725A
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cabinet
heat
plate
water
cooled
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周哲明
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/06Hermetically-sealed casings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254Cold plates transferring heat from heat source to coolant
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718Forced ventilation of a gaseous coolant
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763Liquid cooling without phase change
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208Liquid cooling with phase change

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本发明涉及电子设备,特别是涉及服务器、网络设备等电脑设备产生的热量的排散。一种密封水冷服务器,包括密封机箱、水冷系统和热传导系统。密封机箱用于防止机箱外各个方向的冷却水渗入;水冷系统的多通道组合水冷板的板体安装在密封机箱内,多通道组合水冷板的防水挡板安装在机箱壁上,将焊缝及接头部分隔离在机箱外部。本发明的有益效果是,安装在机箱内的多通道组合水冷板的板体部分没有焊缝及接头,安全性极高,配合密封机箱,能对电脑设备进行可靠的防水保护;多通道组合水冷板容易被加工成不同形状以适应机箱内电脑设备的热源分布情况,安装和维护方便;能显著提高电脑设备的散热效率和均衡性,降低散热能耗。

Description

一种密封水冷服务器
技术领域
本发明涉及电子设备,特别是涉及服务器、网络设备等电脑设备产生的热量的排散。
背景技术
随着信息技术的发展,电子设备的集成度越来越高,计算机和服务器的性能越来越强,其相应的功率也越来越大,在带来性能提升的同时也带来了不断上升的发热量。当前,数据中心和高性能计算服务器也在朝着更高密度、更高计算能力的方向发展,与此同时也带来了更高的能耗和热量密度,为这些设备进行冷却和降低能耗成了很大的挑战。
现有的服务器水冷技术方面,一种常见的方案是通过直接在发热量大的电脑部件(如CPU)上分别安装水冷头,冷却水从水冷头内流过带走热量,各个水冷头之间通过水管连接。这种方案存在冷却水从管道接头泄露到机箱内的风险,冷却水泄露可能会直接对设备造成损坏;而且各个CPU的散热不均衡,对服务器的整体性能有一定影响。
申请人在申请201110132047.X中提出了一种密封水冷的解决方案,在机箱外安装水冷板散热,虽然解决了对电脑设备进行防水保护的问题,但是对于水冷板只能安装在机箱上盖的电子设备来说,打开机箱要拆装水冷板,维护麻烦。
申请人在申请201610233778.6中提出了一种多通道组合水冷板的解决方案,这种水冷板的板体没有焊缝,可以替代申请201110132047.X中所述的水冷板,并安装在机箱内,焊缝及接头部分可以隔离在机箱外部,可以满足对电脑设备进行防水保护的要求,并且能解决维护麻烦的问题。
发明内容
为解决现有散热方法中风冷散热效率低、能耗高、水冷对设备保护不足,和安装维护麻烦的问题,本发明提供一种安全的水冷散热方案,该方案不仅散热效率高、能耗低,能对电脑设备进行防水保护,而且安装维护方便,使设备散热均衡。
本发明解决其技术问题所采用的技术方案是:
一种密封水冷服务器,包括密封机箱、水冷系统和热传导系统。密封机箱用于防止机箱外各个方向的冷却水渗入,主板等电脑设备安装在密封机箱内;水冷系统包括多通道组合水冷板、冷却水管道和外部冷水源;多通道组合水冷板的板体安装在密封机箱内,多通道组合水冷板的防水挡板安装在机箱壁上,将焊缝及接头隔离在机箱外部;外部冷水源可以是机房的或建筑物内的水冷系统,或者可以由散热水箱和风扇组成;外部冷水源通过冷却水管道与多通道组合水冷板相连接。
热传导系统包括热传导冷热交换器和对流冷热交换器。热传导冷热交换器包括热管和导热金属板,热管的蒸发端和冷凝端焊接有导热金属板,热管的蒸发端的导热金属板与机箱内的发热量大的电脑部件紧密接触,能快速的传导热量,热管的冷凝端的导热金属板与多通道组合水冷板相连接。对流冷热交换器包括热管、导热金属板、吸热鳍片和风扇,吸热鳍片安装在热管的蒸发端,风扇安装在吸热鳍片附近,用来将热空气吹向吸热鳍片,热管的冷凝端焊接有导热金属板,热管的冷凝端的导热金属板与多通道组合水冷板相连接。
传导冷热交换器的一种简单形式是导热金属板,导热金属板直接与多通道组合水冷板相连接。
对流冷热交换器的一种简单形式是散热片和风扇,散热片直接与多通道组合水冷板相连接。
密封机箱的一种复杂形式是一种密封机柜,机柜内可以安装多套服务器等电子设备,多通道组合水冷板的板体安装在密封机柜内,多通道组合水冷板的防水挡板安装在机柜壁上,将焊缝及接头隔离在机柜外部。
本发明的有益效果是,安装在机箱内的多通道组合水冷板的板体部分没有焊缝及接头,安全性极高,配合密封机箱,能对电脑设备进行可靠的防水保护;多通道组合水冷板是由多根管道组合而成,板体容易被加工成不同形状以适应机箱内电脑设备的热源分布情况,安装和维护方便;多通道组合水冷板具有流道分布灵活、流道组合灵活、散热均衡效果好、流量流阻易调的优点,能显著提高电脑设备的散热效率,降低散热能耗,使设备散热均衡。
附图说明
图1是本发明的结构示意图。
图中,1.密封机箱,2.机箱壁,3.多通道组合水冷板,4.板体,5.防水挡板,6.焊缝和接头,7.导热金属板,8.散热片,9.风扇,10.主板。
具体实施方式
下面结合附图和实施例对本发明进一步说明。
如图1所示,本发明的实施例是一种密封水冷服务器。
如图1所示:
一种密封水冷服务器,包括密封机箱1、水冷系统和热传导系统。密封机箱1用于防止机箱外各个方向的冷却水渗入,主板10等电脑设备安装在密封机箱内;水冷系统包括多通道组合水冷板3、冷却水管道和外部冷水源;多通道组合水冷板3的板体4安装在密封机箱1内,多通道组合水冷板3的防水挡板5安装在机箱壁2上,将焊缝和接头6隔离在机箱外部;外部冷水源可以是机房的或建筑物内的水冷系统,或者可以由散热水箱和风扇组成;外部冷水源通过冷却水管道与多通道组合水冷板3相连接。热传导系统包括热传导冷热交换器和对流冷热交换器。热传导冷热交换器是导热金属板7,安装在多通道组合水冷板3上,并与机箱内的发热量大的电脑部件等紧密接触。对流冷热交换器包括散热片8和风扇9,散热片8与多通道组合水冷板3相连接。

Claims (6)

1.一种密封水冷服务器,包括密封机箱、水冷系统和热传导系统,热传导系统包括热传导冷热交换器和对流冷热交换器,其特征是:所述水冷系统使用多通道组合水冷板,所述多通道组合水冷板的板体安装在所述密封机箱内,所述多通道组合水冷板的防水挡板安装在所述密封机箱的机箱壁上,将所述多通道组合水冷板的焊缝及接头隔离在机箱外部。
2.根据权利要求1所述的密封水冷服务器,其特征是:所述密封机箱的一种复杂形式是一种密封机柜,所述密封机柜内可以安装多套电子设备,所述多通道组合水冷板的板体安装在所述密封机柜内,所述多通道组合水冷板的防水挡板安装在所述密封机柜壁上,将所述多通道组合水冷板的焊缝及接头隔离在机柜外部。
3.根据权利要求1所述的密封水冷服务器,其特征是:所述热传导冷热交换器包括热管和导热金属板;所述热管的蒸发端和冷凝端焊接有所述导热金属板,所述热管的蒸发端的导热金属板与机箱内的发热量大的电脑部件紧密接触,能快速的传导热量,所述热管的冷凝端的导热金属板与所述多通道组合水冷板相连接。
4.根据权利要求1所述的密封水冷服务器,其特征是:所述热传导冷热交换器是导热金属板;所述导热金属板与机箱内的发热量大的电脑部件紧密接触,所述导热金属板与所述多通道组合水冷板相连接。
5.根据权利要求1所述的密封水冷服务器,其特征是:所述对流冷热交换器包括热管、导热金属板、吸热鳍片和风扇;所述吸热鳍片安装在所述热管的蒸发端,所述风扇安装在所述吸热鳍片附近,所述热管的冷凝端焊接有所述导热金属板;所述热管的冷凝端的导热金属板与所述多通道组合水冷板相连接。
6.根据权利要求1所述的密封水冷服务器,其特征是:所述对流冷热交换器包括散热片和风扇,所述风扇安装在所述散热片附近,所述散热片与所述多通道组合水冷板相连接。
CN201610801248.7A 2016-09-05 2016-09-05 一种密封水冷服务器 Pending CN106211725A (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109570786A (zh) * 2017-09-29 2019-04-05 深圳市深普镭科技有限公司 用于激光焊接机的冷却系统
TWI673842B (zh) * 2018-10-24 2019-10-01 技嘉科技股份有限公司 散熱組件及主機板模組

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109570786A (zh) * 2017-09-29 2019-04-05 深圳市深普镭科技有限公司 用于激光焊接机的冷却系统
TWI673842B (zh) * 2018-10-24 2019-10-01 技嘉科技股份有限公司 散熱組件及主機板模組

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Application publication date: 20161207