CN106206675B - OLED display screen and its manufacturing method - Google Patents
OLED display screen and its manufacturing method Download PDFInfo
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- CN106206675B CN106206675B CN201610871920.XA CN201610871920A CN106206675B CN 106206675 B CN106206675 B CN 106206675B CN 201610871920 A CN201610871920 A CN 201610871920A CN 106206675 B CN106206675 B CN 106206675B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 100
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 238000000034 method Methods 0.000 claims description 14
- 238000010276 construction Methods 0.000 claims description 12
- 230000008569 process Effects 0.000 claims description 9
- 238000002347 injection Methods 0.000 claims description 7
- 239000007924 injection Substances 0.000 claims description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims description 6
- 230000027756 respiratory electron transport chain Effects 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 5
- 230000008859 change Effects 0.000 claims description 4
- 230000008020 evaporation Effects 0.000 claims description 4
- 238000001704 evaporation Methods 0.000 claims description 4
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/88—Dummy elements, i.e. elements having non-functional features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention provides a kind of OLED display screen and its manufacturing methods, magneto strictive material is formed on substrate, the magneto strictive material is located at adjacent pixel section, it forms shared layer and covers the magneto strictive material and multiple pixel regions, by the periphery magnetic field strength for changing the magneto strictive material, so that the magneto strictive material occurs to stretch, so that the shared layer is broken in adjacent pixel section, thus adjacent pixel can be avoided since the influence of other pixel can also work, that is, reduce the pixel cross-talk problem of OLED display screen.
Description
Technical field
The present invention relates to display fabrication techniques field, in particular to a kind of OLED display screen and its manufacturing method.
Background technique
In recent years, monitor market center is gradually shared by flat-panel monitor (Flat Panel Display, FPD)
According to.Large scale can be manufactured using FPD and thin and light display equipment.This kind of FPD includes liquid crystal display (Liquid
Crystal Display, LCD), plasma display panel (Plasma Display Panel, PDP), organic light-emitting diodes
Manage (Organic Light Emitting Diode, OLED) display screen etc..
OLED display screen is a kind of emerging flat-panel monitor, has self-luminous, and it is high, thick to be not required to backlight, contrast
It is excellent to spend that thin, visual angle is wide, reaction speed is fast, it is wide to can be used for flexibility panel, use temperature range, construction and processing procedure are simpler etc.
Characteristic, therefore have extraordinary development prospect.
High PPI (number of pixels that per inch is possessed) is the trend of display industry development.With the promotion of PPI, phase
The distance between adjacent pixel is increasingly closer, for OLED display screen, since the organic material of shared layer has conductive characteristic,
Often make when not needing adjacent pixel work, adjacent pixel can also be worked due to the influence of other pixel.High PPI is easier to produce
Raw crosstalk, can seriously affect OLED display screen coloration and contrast in this way.Along with the implanted layer and transport layer material of high mobility
It is more serious to often lead to OLED display screen crosstalk phenomenon for the application of material.
Therefore, the pixel cross-talk problem for how reducing OLED display screen, at those skilled in the art it is urgently to be resolved one
A technical problem.
Summary of the invention
The purpose of the present invention is to provide a kind of OLED display screen and its manufacturing methods, to solve OLED in the prior art
There is pixel cross-talk in display screen.
In order to solve the above technical problems, the present invention provides a kind of OLED display screen, the OLED display screen includes: substrate,
There are multiple pixel regions on the substrate;The magneto strictive material being formed on the substrate, the magneto strictive material
Positioned at adjacent pixel section;And cover the shared layer of the multiple pixel region and the magneto strictive material;Wherein, described total
It is broken due to the flexible of the magneto strictive material in adjacent pixel section with layer.
Optionally, in the OLED display screen, the OLED display screen further includes the picture being formed on the substrate
Plain confining layers, the pixel confining layer limit the position of the multiple pixel region, wherein the magneto strictive material is formed in
In the pixel confining layer.
Optionally, in the OLED display screen, the pixel region confining layers pixel confining layer includes multiple restriction knots
Structure, has multiple support constructions spaced apart on each limiting structure, and the magneto strictive material insertion is formed in described more
In in gap between a support construction.
Optionally, in the OLED display screen, the material of the magneto strictive material includes TbFe2、DyFe2With
SmFe2One of or it is a variety of.
Optionally, in the OLED display screen, the shared layer includes the hole injection layer sequentially formed, hole biography
Defeated layer, electron transfer layer and electron injecting layer.
The present invention also provides a kind of manufacturing method of OLED display screen, the manufacturing method of the OLED display screen includes:
Substrate is provided, there are multiple pixel regions on the substrate;
Magneto strictive material is formed on the substrate, and the magneto strictive material is located at adjacent pixel section;
Shared layer is covered on the multiple pixel region and the magneto strictive material;
Change the periphery magnetic field strength of the magneto strictive material, so that the magneto strictive material occurs to stretch,
So that the shared layer is broken in adjacent pixel section.
Optionally, in the manufacturing method of the OLED display screen, magneto strictive material is formed on the substrate
Before, the manufacturing method of the OLED display screen further include:
Pixel confining layer is formed on the substrate, and the pixel confining layer limits the position of the multiple pixel region;
Wherein, the magneto strictive material is formed in the pixel confining layer.
Optionally, in the manufacturing method of the OLED display screen, the pixel confining layer includes multiple limiting structures,
There is support construction, the magneto strictive material is embedded in the support construction on each limiting structure.
Optionally, in the manufacturing method of the OLED display screen, magneto strictive material is formed on the substrate
It comprises the technical steps that:
Magneto strictive material is formed by press mold moulding process under vacuum conditions;
The magneto strictive material is solidified under protection of argon gas.
Optionally, in the manufacturing method of the OLED display screen, in the multiple pixel region and the magnetostriction
Shared layer is covered in material layer to comprise the technical steps that:
The substrate is adsorbed by magnet plate;
The magnet plate for being adsorbed with substrate is fixed on coldplate;
Shared layer is formed using evaporation process, the shared layer covers the multiple pixel region and the magnetostriction materials
Layer.
In OLED display screen provided by the invention and its manufacturing method, magneto strictive material is formed on substrate, institute
It states magneto strictive material and is located at adjacent pixel section, form shared layer and cover the magneto strictive material and multiple pixels
Area, by changing the periphery magnetic field strength of the magneto strictive material, so that the magneto strictive material occurs to stretch, from
And the shared layer is broken in adjacent pixel section, thus adjacent pixel can be avoided to influence due to other pixel
Meeting work, that is, reduce the pixel cross-talk problem of OLED display screen.
Detailed description of the invention
FIG. 1 to FIG. 4 is that the manufacturing method of the OLED display screen of the embodiment of the present invention is formed by the diagrammatic cross-section of structure.
Specific embodiment
OLED display screen proposed by the present invention and its manufacturing method are made below in conjunction with the drawings and specific embodiments further
It is described in detail.According to following explanation and claims, advantages and features of the invention will be become apparent from.It should be noted that attached drawing
It is all made of very simplified form and uses non-accurate ratio, only to convenient, lucidly the aid illustration present invention is implemented
The purpose of example.
FIG. 1 to FIG. 4 is please referred to, the manufacturing method for the OLED display screen of the embodiment of the present invention is formed by cuing open for structure
Face schematic diagram.
As shown in Figure 1, the manufacturing method of the OLED display screen includes: to provide substrate 10, have on the substrate 10 more
A pixel region.Common, the substrate 10 is glass substrate.
In the embodiment of the present application, anode 12 is then formed on the substrate 10.Wherein, the material of the anode 12 can
Transparent conductive material or metal material are thought, for example, the material of the anode 12 can be the conjunction of the alloy, Al, Al of Ag, Ag
Gold, the alloy of Cu, Cu, alloy of Pt or Pt etc.;Or ITO, IZO, AZO or ZTO etc..
With continued reference to FIG. 1, in the embodiment of the present application, then, forming pixel confining layer 11, institute on the substrate 10
State the position that pixel confining layer 11 limits the multiple pixel region.Specifically, the pixel confining layer 11 is tied including multiple restrictions
Structure has support construction on each limiting structure.It can be to a certain extent to adjacent pixel area by the pixel confining layer 11
Buffer action is played, i.e., avoids the pixel being subsequently formed that can also work due to the influence of other pixel to a certain extent.Preferably, institute
The material for stating pixel confining layer 11 is organic gel.That is, specifically the pixel restriction can be formed by depositing, etching organic glue-line
Layer 11.
Next referring to Fig. 2, magneto strictive material 13 is formed on the substrate 10.In the embodiment of the present application, have
Body is that magneto strictive material 13 is formed in the pixel confining layer 11.Further, the magneto strictive material 13
It is embedded in multiple support constructions of the pixel confining layer 11.Wherein, the magneto strictive material 13 can be formed by press mold
Technique is formed.Preferably, the magneto strictive material 13 is formed by press mold moulding process under vacuum conditions.Further
, after the magneto strictive material 13 is formed by press mold moulding process, is also solidified under protection of argon gas, thus may be used
To improve the quality and reliability for being formed by magneto strictive material 13.Wherein, the material of the magneto strictive material 13
Including TbFe2、DyFe2And SmFe2One of or it is a variety of.In addition to this, the magneto strictive material 13 can also use it
He forms material, as long as selected materials can satisfy the periphery magnetic field strength for changing the magneto strictive material 13, can make
The magneto strictive material 13 is obtained to occur to stretch.
As shown in figure 3, then, forming shared layer 14, the shared layer 14 covers the multiple pixel region and the mangneto
Strictive material 13.In the embodiment of the present application, the shared layer 14 is formed by evaporation process.Specifically, passing through magnet plate
The 20 absorption substrate 10 (i.e. the another side of the substrate 10 opposite with 10 one side of substrate where magneto strictive material 13);It connects
Formed on the magneto strictive material 13 using evaporation process (being transferred to the pattern on mask plate 21 on substrate 10)
Shared layer 14, wherein the shared layer 14 also covers the pixel confining layer 11 and anode 12.
Further, the magnet plate 20 for being adsorbed with substrate 10 is fixed on coldplate 22.To be formed altogether in vapor deposition
It during with layer 14, can cool down to shared layer 14 is formed by, and then improve the quality for being formed by shared layer 14
With reliability.
In the embodiment of the present application, the shared layer 14 is specific can include: hole injection layer;It is formed in the hole injection
Hole transmission layer on layer;It the electron transfer layer that is formed on the hole transmission layer and is formed on the electron transfer layer
Electron injecting layer.Further, after forming hole injection layer and hole transmission layer, hair is formed on the hole transport layer
Photosphere then re-forms electron transfer layer and electron injecting layer.
Then, as shown in figure 4, changing the magnetic field strength of the magnet plate 20, the magneto strictive material 13 is sent out as a result,
It is raw flexible, so that the shared layer 14 is broken in adjacent pixel section.In the embodiment of the present application, shared layer 14 is being formed
During use magnet plate 20, therefore can very easily change the magnetic field strength of the magnet plate 20, and then make the mangneto
Strictive material 13 occurs flexible.It, can also be in the magneto strictive material 13 in the other embodiments of the application
Periphery externally-applied magnetic field, it is flexible that the magneto strictive material 13 occurs for the intensity by changing the externally-applied magnetic field, to this
Application is not construed as limiting.
In the embodiment of the present application, the fracture of the shared layer 14 occurs mainly in 11 side wall of pixel confining layer, or
Person says the side wall occurred in the magneto strictive material 13.It is therefore advantageous to, the pixel confining layer 11 and the mangneto are stretched
Compression material floor 13 is only arranged between adjacent pixel area.
In addition, allowing for the magnetostriction after can also forming hole injection layer in the other embodiments of the application
Material layer 13 occurs flexible;Hole transmission layer is re-formed, so that the magneto strictive material 13 occurs to stretch;Re-form hole
Transport layer, so that the magneto strictive material 13 occurs to stretch ..., the rest may be inferred.
Further, cathode and polaroid etc. can be then formed on the shared layer 14.It is subsequent can be according to the prior art
Continue to manufacture, the embodiment of the present application repeats no more this.
After above-mentioned technique, pixel cross-talk problem can be can be greatly reduced by being formed by OLED display screen.It is specifically included:
Substrate 10 has multiple pixel regions on the substrate 10;The magneto strictive material 13 being formed on the substrate 10, the magnetic
Strictive material 13 is caused to be located at adjacent pixel section;And the multiple pixel region of covering and the magneto strictive material 13 are total to
With layer 14;Wherein, the shared layer 14 occurs disconnected due to the flexible of the magneto strictive material 13 in adjacent pixel section
It splits.
Further, the OLED display screen further includes the pixel confining layer 11 being formed on the substrate 10, the picture
Plain confining layers 11 limit the position of the multiple pixel region, wherein the magneto strictive material 13 is formed in the pixel limit
In given layer 11.The pixel confining layer 11 includes multiple limiting structures, has multiple supports spaced apart on each limiting structure
Structure, the magneto strictive material 13 are formed in the gap between the multiple support construction.
Preferably, the material of the magneto strictive material 13 includes TbFe2、DyFe2And SmFe2One of or it is a variety of.
The magneto strictive material 13 is formed by press mold moulding process.The shared layer 14 includes the hole injection sequentially formed
Layer, hole transmission layer, electron transfer layer and electron injecting layer.The OLED display screen further include: be formed on the substrate 10
Anode 12;And it is formed in cathode and polariscope etc. on the shared layer 14.
To sum up, in OLED display screen provided in an embodiment of the present invention and its manufacturing method, magnetic is formed on substrate
Strictive material is caused, the magneto strictive material is located at adjacent pixel section, forms shared layer and covers the magnetostriction material
The bed of material and multiple pixel regions, by changing the periphery magnetic field strength of the magneto strictive material, so that the magnetostriction material
The bed of material occur it is flexible so that the shared layer is broken in adjacent pixel section, thus can avoid adjacent pixel by
It can also work in the influence of other pixel, that is, reduce the pixel cross-talk problem of OLED display screen.
Foregoing description is only the description to present pre-ferred embodiments, not to any restriction of the scope of the invention, this hair
Any change, the modification that the those of ordinary skill in bright field does according to the disclosure above content, belong to the protection of claims
Range.
Claims (10)
1. a kind of OLED display screen, which is characterized in that the OLED display screen includes: substrate, has multiple pictures on the substrate
Plain area;The magneto strictive material being formed on the substrate, the magneto strictive material are located at adjacent pixel section;And it covers
Cover the shared layer of the multiple pixel region and the magneto strictive material;Wherein, the shared layer is due to the magnetostriction
Material layer is stretched and is broken in adjacent pixel section.
2. OLED display screen as described in claim 1, which is characterized in that the OLED display screen further includes being formed in the base
Pixel confining layer on plate, the pixel confining layer limit the position of the multiple pixel region, wherein the magnetostriction materials
Layer is formed in the pixel confining layer.
3. OLED display screen as claimed in claim 2, which is characterized in that the pixel confining layer includes multiple limiting structures,
There is support construction, the magneto strictive material is embedded in the support construction on each limiting structure.
4. OLED display screen according to any one of claims 1 to 3, which is characterized in that the magneto strictive material
Material includes TbFe2、DyFe2And SmFe2One of or it is a variety of.
5. OLED display screen according to any one of claims 1 to 3, which is characterized in that the shared layer includes successively shape
At hole injection layer, hole transmission layer, electron transfer layer and electron injecting layer.
6. a kind of manufacturing method of OLED display screen, which is characterized in that the manufacturing method of the OLED display screen includes:
Substrate is provided, there are multiple pixel regions on the substrate;
Magneto strictive material is formed on the substrate, and the magneto strictive material is located at adjacent pixel section;
Shared layer is covered on the multiple pixel region and the magneto strictive material;
Change the periphery magnetic field strength of the magneto strictive material, so that the magneto strictive material occurs to stretch, thus
So that the shared layer is broken in adjacent pixel section.
7. the manufacturing method of OLED display screen as claimed in claim 6, which is characterized in that form mangneto on the substrate and stretch
Before compression material layer, the manufacturing method of the OLED display screen further include:
Pixel confining layer is formed on the substrate, and the pixel confining layer limits the position of the multiple pixel region;
Wherein, the magneto strictive material is formed in the pixel confining layer.
8. the manufacturing method of OLED display screen as claimed in claim 7, which is characterized in that the pixel confining layer includes multiple
Limiting structure, has support construction on each limiting structure, and the magneto strictive material is embedded in the support construction.
9. the manufacturing method of the OLED display screen as described in any one of claim 6~8, which is characterized in that in the substrate
Upper formation magneto strictive material comprises the technical steps that:
Magneto strictive material is formed by press mold moulding process under vacuum conditions;
The magneto strictive material is solidified under protection of argon gas.
10. the manufacturing method of OLED display screen as claimed in claim 6, which is characterized in that in the multiple pixel region and institute
Covering shared layer on magneto strictive material is stated to comprise the technical steps that:
The another side of the substrate opposite with the substrate side where magneto strictive material is adsorbed by magnet plate;
The magnet plate for being adsorbed with substrate is fixed on coldplate;
Shared layer is formed using evaporation process, the shared layer covers the multiple pixel region and the magneto strictive material.
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CN109713009B (en) * | 2018-03-06 | 2020-12-29 | 广东聚华印刷显示技术有限公司 | Electroluminescent device and manufacturing method thereof |
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CN105489631A (en) * | 2015-12-22 | 2016-04-13 | 昆山国显光电有限公司 | Organic light-emitting display device and preparation method thereof |
CN105590954A (en) * | 2015-12-22 | 2016-05-18 | 昆山国显光电有限公司 | Oled display panel and manufacturing method thereof |
CN105895664A (en) * | 2016-05-31 | 2016-08-24 | 上海天马有机发光显示技术有限公司 | Display panel, manufacturing method and electronic equipment |
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CN105489631A (en) * | 2015-12-22 | 2016-04-13 | 昆山国显光电有限公司 | Organic light-emitting display device and preparation method thereof |
CN105590954A (en) * | 2015-12-22 | 2016-05-18 | 昆山国显光电有限公司 | Oled display panel and manufacturing method thereof |
CN105895664A (en) * | 2016-05-31 | 2016-08-24 | 上海天马有机发光显示技术有限公司 | Display panel, manufacturing method and electronic equipment |
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