CN106206232B - Substrate board treatment - Google Patents
Substrate board treatment Download PDFInfo
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- CN106206232B CN106206232B CN201510315762.5A CN201510315762A CN106206232B CN 106206232 B CN106206232 B CN 106206232B CN 201510315762 A CN201510315762 A CN 201510315762A CN 106206232 B CN106206232 B CN 106206232B
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Abstract
The present invention provides substrate board treatment, and the support that energy stable support has maximized simultaneously can prevent from, because support maximization causes the high capacity of lock chamber, shortening the switching time of the atmosphere of lock chamber.The substrate board treatment includes：Handle the process chamber of substrate；House the lock chamber of substrate；The conveying chamber of conveying substrate between process chamber and lock chamber；Two supports for keeping different substrate respectively in the process chamber are set；Support travel mechanism, makes two supports be moved between substrate receiving position and substrate processing position, two supports is in the state being arranged above and below in substrate receiving position；And substrate carrying mechanism, the substrate being contained in lock chamber is uniformly transported on two supports of substrate receiving position with the state being arranged above and below.In addition, support travel mechanism possesses the linear movement mechanism of two mobile supports and makes the rotating mechanism of two holder pivots.In addition, the position supporting support of two ends of the linear movement mechanism on the moving direction than support more in the inner part.
Description
Technical field
The present invention relates to the substrate board treatment in process chamber to processing such as substrate embodiment such as ion implantings.
Background technology
As conventional substrate board treatment, as Patent Document 1, there are following devices：The device possesses：Processing
Room, irradiates ion beam to the substrate erected in the chamber；And lock chamber (prechamber), set with process chamber adjoining
Put, substrate was fallen and houses substrate for the state of level.The substrate board treatment is by using the branch being arranged in process chamber
Frame travel mechanism alternately reciprocates be arranged in process chamber two in flat support (platen), to being maintained at support
On substrate carry out ion implanting.
Specifically illustrate, the support travel mechanism is made up of linear movement mechanism and rotating mechanism, it is described linear
Motion is constituted by the ball-screw that is arranged in process chamber and with the ball nut that the ball-screw is threadedly coupled, described turn
Motivation structure makes support be rotated between horizontality and raised state.
Support supporting arm be L-shaped, the root arm for possessing on ball nut and vertically extending with ball-screw, with
And the supporting arm extended parallel to from the front end of the root arm with ball-screw, the front end of the support supporting arm is provided with
The lateral margin of the support.In addition, stent cover and the face that is formed by the root arm and supporting arm are in approximately the same plane.
By this structure, substrate is moved from lock chamber to process chamber in such a way.
First, even if also support turns into horizontal making support supporting arm turn into the state fallen by the rotating mechanism
After state, support is entered the lock chamber by the linear movement mechanism, the substrate in horizontality is maintained on support.
Then, retreat the support for maintaining substrate and be drawn off processing interior.Then, branch is made by using the rotating mechanism
Frame supporting arm is rotated and erected, and the substrate for making support and being maintained on the support is erected.Then, the state of the posture is being kept
Under, substrate is moved to the ion beam irradiation region of irradiation ion beam by the linear movement mechanism.Ion is made illuminated
Substrate after beam is returned in lock chamber with the step opposite with the step.
It was found from the structure, the lateral margin (that is, the ora terminalis vertical with the moving direction moved by ball-screw) of support
The front end of support supporting arm is supported in a cantilever fashion.In addition, the ball nut of the support supporting arm is supported, in the branch
It is located at the outside of support on the moving direction of frame.
But, the size of glass substrate maximizes in recent years, reached the tenth generation (substrate size 2850mm ×
Degree 3050mm).Furthermore, it is necessary to which the maximization met with substrate independently improves wanting for the productivity ratio of substrate board treatment
Ask.
Think, the substrate board treatment of described patent document 1 due to be by the mode of overlapping conveying above and below two substrates,
So can not only reduce plant bulk, productivity ratio can also be improved.
But, in the conventional structure, because the maximization because of substrate causes to keep the support of substrate also to maximize,
So the problem of producing for example following.
(1) in conventional structure, between lock chamber and process chamber, side changes it in the way of not in midway handing-over substrate
Posture side is kept and moving substrate with single support, therefore the supporting structure of support becomes complicated and reluctantly (such as in order to be able to will
In substrate insertion lock chamber, support supporting arm is formed as into the isometric shape of foregoing L-shaped, and with the support supporting arm with cantilever
Mode supports the lateral margin of support), thus, due to the maximizing of substrate and support, heavyization, so becoming often in the support
The excessive power of the upper effect such as described linear movement mechanism and rotating mechanism of supporting arm and the mobile support supporting arm.
Specifically illustrate, due to the ball nut by L-shaped brackets supporting arm in the outer of support moving direction
Side bearing support, if so support maximizes and weight increase, no matter support is to erect posture or flat-hand position
Free position in the case of, all there are following problems：Big torque can be always acted on ball nut, the supporting of support becomes not
It is stable, the flatness of the movement of ball nut can be damaged.
(2) have to use can make the support after maximization enter lock chamber structure, it is necessary to increase the volume of lock chamber.
(3) because lock chamber is used to that without process chamber is returned to air atmosphere substrate can be picked and placeed between process chamber and air,
So being changed into air atmosphere from vacuum atmosphere in exchange substrate time gating room or being changed into vacuum atmosphere from air atmosphere.As described above,
If the volume of lock chamber becomes big, the meeting for switching the time that the atmosphere of lock chamber is spent becomes many.
Prior art literature
Patent document 1：Flat No. 10-135146 of Japanese Laid-Open Patent Publication
The content of the invention
Therefore, the problem of present invention is for solving described and the invention made, the main object of the present invention are to provide one
Substrate board treatment is planted, it can stably support the support maximized, and can prevent from leading because of the maximization of support
The high capacity of lock chamber is caused, and the time for the atmosphere for switching the lock chamber can be shortened.
That is, the present invention provides a kind of substrate board treatment, and it includes：Process chamber, in the chamber under vacuum atmosphere
Handle substrate；Lock chamber, houses the substrate, is switched to air atmosphere or vacuum atmosphere；Conveying chamber, is arranged on the process chamber
Between the lock chamber, the substrate is conveyed between the process chamber and the lock chamber under vacuum atmosphere；Two supports, if
Put in the process chamber, substrate is kept respectively；Support travel mechanism, at least makes described two supports receive from the conveying
Moved between the receiving position for the substrate that room conveying comes and the processing position of the processing substrate, and in the received bit
Putting makes described two supports turn into the state being arranged above and below；And substrate carrying mechanism, it is arranged in the conveying chamber, will houses
The substrate in the lock chamber is uniformly transported to described two positioned at the receiving position with the state being arranged above and below
Frame, the support travel mechanism includes：Linear movement mechanism, making described two supports, edge is set in regulation by each support respectively
Axial direction on mobile route movement different from each other；And rotating mechanism, make described two supports around the defined axial direction
Rotate, the position of two ends of the linear movement mechanism on the defined axial direction than the support more in the inner part supports institute
State support.
In a word, the substrate board treatment be not as in the past by support and support supporting arm from lock chamber to process chamber
The conveying substrate in the way of not joining in way, but the substrate carrying mechanism set by centre, the base that will be housed in lock chamber
Plate is transported on the support set in the process chamber.
Therefore, as long as substrate carrying mechanism with possessing the posture that the does not change substrate conveying substrate between lock chamber and conveying chamber
Function, its structure certainly can simply and miniaturization.Furthermore it is possible to make to take out substrate from lock chamber or substrate is put into lock
The simple in construction and miniaturization of the substrate carrying mechanism of room, so can be suppressed to Min., example by the high capacity of lock chamber
If shortening the switching time of the atmosphere of lock chamber.
On the other hand, as long as support travel mechanism makes support only in processing indoor moving, moved as a result, constituting support
The linear movement mechanism of motivation structure, the position supporting support of the two ends of the support on than the axial direction more in the inner part.
This, " the position supporting support of the two ends of the support on than the axial direction more in the inner part " refers to, is set in linear movement mechanism
On support supporting portion at least a portion, positioned at than support two ends substantially more in the inner part, i.e. positioned at can obtain and this
Inner side (a little supporting portion be located at outside can also) in the range of invention same effect.Therefore, according to this configuration, it can make
The supporting portion is as close possible to support, so as to stably support support.
Preferably, the rotating mechanism makes described two supports separately rotate.
Compared in the past that make the structure that two supports and linear movement mechanism are rotated together, if this make two
The structure that support is separately rotated, then can reduce driving force.This structure especially has in the case of support has maximized
Effect.
Preferably, the rotating mechanism makes the substrate for example as horizontality by making the holder pivots
Lodging location and for example as being carried out between the set-up positions of plumbness in posture changing, the rotary shaft of described two supports
Under stagger so that when the support for making a side is in the lodging location, the support of one not with the support of the opposing party
Rotary shaft is interfered.
In this mode, can be eliminated by simple structure can in the case where making two supports separately rotate
The interference of the rotary shaft of the support of a side and the support of the opposing party caused by energy.
Stagger above and below rotary shaft due to making two supports, although so for example not having two supports positioned at lodging location
Wrong holding substrate of turning up the soil, but if by described holder pivots to set-up positions, then the position of substrate can also stagger.Therefore,
Preferably, the substrate board treatment also includes substrate position correction mechanism, and the substrate position correction mechanism makes described one
When the position of the above-below direction of substrate when the support of side is in set-up positions is in set-up positions with the support of described the opposing party
Substrate above-below direction position consistency.
In this mode, the substrate being maintained on the support of a side and the substrate being maintained on the support of the opposing party can be made
The above-below direction such as ion implanting processing position it is consistent.
Preferably, the substrate position correction mechanism is arranged on the Substrate table in the lock chamber, by making point
At least one party above and below not being placed with the upside table top and downside table top of two substrates relatively moves relative to the opposing party, makes institute
State upside table top and the offset of downside table top and staggering for the substrate position that is produced by the rotation of described two supports
Amount is identical.
Thus, by the way that substrate position correction mechanism is arranged at into Substrate table, compared to being arranged at substrate carrying mechanism or branch
The situation of frame etc., can simplify structure.
Due to lock chamber because between vacuum atmosphere and air atmosphere switch and internally produce convection current, so by substrate position
Put in the case that correction mechanism is arranged in lock chamber, there is the problem of substrate position correction mechanism is as particle generating source.In addition,
Because the capacity of lock chamber can become this part of large substrates position correction mechanism, the switching time of the atmosphere of lock chamber is elongated, can be right
Productivity ratio produces baneful influence.
It is preferred, therefore, that the substrate position correction mechanism is arranged on the substrate carrying mechanism, by making difference
At least one party above and below being placed with the upside conveyor surface and downside conveyor surface of two substrates relatively moves relative to the opposing party, makes
The offset of the upside conveyor surface and the downside conveyor surface and the substrate produced by the rotation of described two supports
The offset of position is identical.
So, by the way that substrate position adjustment mechanism is arranged at into substrate carrying mechanism, the capacity of lock chamber can be reduced, can
Shorten the switching time of the atmosphere of lock chamber, so as to improve productivity ratio.
Preferably, described two supports include top bracket and bottom bracket, and the substrate position correction mechanism is set
On the bracket, on the rotating mechanism or between the support and the rotating mechanism, by making to maintain respectively above and below
At least one party in the top bracket and the bottom bracket of two substrates relatively moves relative to the opposing party, makes on described
The offset of side stand and the bottom bracket staggers with the substrate position that is produced by the rotation of described two supports
Amount is identical.
So, by the way that substrate position adjustment mechanism is set on the bracket, on the rotating mechanism or the support
Between the rotating mechanism, the capacity of lock chamber can be reduced, the switching time of the atmosphere of lock chamber can be shortened, so as to carry
High production rate.Here, by making substrate position correction mechanism utilize the power of the rotating mechanism, the new power without setting.
According to the present invention of the composition, the support maximized can be stably supported, and can prevent because of support
Maximization cause the high capacity of lock chamber, and the time for the atmosphere for switching the lock chamber can be shortened.
Brief description of the drawings
Fig. 1 is the schematic diagram of the structure for the substrate board treatment for representing an embodiment of the invention.
Fig. 2 is to schematically show front view and the side with Fig. 1 for the structure of the support travel mechanism of identical embodiment
View.
Fig. 3 is to schematically show the stereogram with Fig. 1 for the structure of the support travel mechanism of identical embodiment.
Fig. 4 is to represent the lodging location and the schematic diagram of set-up positions with Fig. 1 for two supports of identical embodiment.
Fig. 5 is that the feelings with Fig. 1 for the substrate position correction mechanism of identical embodiment are provided with substrate carrying mechanism
The schematic diagram of condition.
Fig. 6 is that the showing for the situation of the substrate position correction mechanism of identical embodiment with Fig. 1 is provided with Substrate table
It is intended to.
Fig. 7 is that the signal with Fig. 1 for the situation of the substrate position correction mechanism of identical embodiment is provided with support
Figure.
Fig. 8 is to represent the processing position and the schematic diagram of retreating position with Fig. 1 for the substrate of identical embodiment.
Fig. 9 is the schematic diagram of the supporting portion for the sliding block for representing the other embodiment of the present invention.
Figure 10 is the schematic diagram of the supporting portion for the sliding block for representing another embodiment of the present invention.
Description of reference numerals
100 substrate board treatments
W substrates
S1 process chambers
S2 lock chambers
S3 conveying chambers
21 top brackets (support)
22 bottom brackets (support)
P1 receiving positions
P2 processing positions
3 support travel mechanisms
5 substrate carrying mechanisms
31 linear movement mechanisms
32 rotating mechanisms
Q1 lodging location
Q2 set-up positions
4 rotary shafts
6 substrate position correction mechanisms
7 Substrate tables
Side stage on 71
72 times side stages
51 upside hands
52 downside hands
Embodiment
Below, it is described with reference to an embodiment of the substrate board treatment of the present invention.
The substrate board treatment 100 of present embodiment, to for flat-panel monitor etc., large-scale substrate in vacuum chamber
W irradiates ion beam IB to the substrate W processing.Here, the substrate W of present embodiment includes such as glass substrate, had
The substrate of the glass substrates of alignment films, semiconductor substrate and other irradiation ion beams.In addition, substrate W shape is in this implementation
It is substantially rectangular in cross section thin plate in mode, but can also be rounded.
Specifically, as shown in figure 1, the substrate board treatment 100 includes：Process chamber S1, in the inside of vacuum chamber,
Ion beam IB is irradiated to substrate W processing to substrate W under vacuum atmosphere；Lock chamber S2, switches to air atmosphere or vacuum atmosphere,
Substrate W is picked and placeed in the state of process chamber S1 is maintained vacuum atmosphere and houses the substrate W；And conveying chamber S3, with
The mode of process chamber S1 and lock chamber S2 adjoinings is arranged between process chamber S1 and lock chamber S2, under vacuum atmosphere in process chamber S1 and
Conveying substrate W between lock chamber S2.Process chamber S1~each rooms of conveying chamber S3 coupling part provided with the vacuum valve such as gate valve, can be by
Process chamber S1~each rooms of conveying chamber S3 separately maintain vacuum state.In addition, importing such as banding into process chamber S1
Ion beam IB, the ion beam IB of the banding drawn by extraction electrode from ion gun, and passed through analysis electromagnet and point
Analyse the quality analysis systems such as slit.
In addition, as shown in Figures 2 and 3, the top bracket 21 provided with holding substrate W respectively in process chamber S1 is collateral with
The support travel mechanism 3 of the two supports of frame 22 and mobile the two supports of the top bracket 21 and bottom bracket 22.
Top bracket 21 and bottom bracket 22 the two supports are in each other identical shape, can pass through support travel mechanism 3
Separately move.
As shown in figure 1, support travel mechanism 3 makes top bracket 21 and the two supports of bottom bracket 22 receive from conveying
Move, and make in receiving position P1 between the substrate W of room S3 conveyings receiving position P1 and processing substrate W processing position P2
Top bracket 21 and the two supports of bottom bracket 22 are as the state being arranged above and below.
Specifically, as shown in Figures 2 and 3, support travel mechanism 3 possesses：Linear movement mechanism 31, makes top bracket 21
The two supports press each support 21,22 along defined axial movement with bottom bracket 22；And rotating mechanism 32, make collateral
Frame 21 and bottom bracket 22 the two supports are around defined axial rotation.In addition, " the defined axial direction " of present embodiment be as
Axial direction crosscutting ion beam, along left and right directions shown in Fig. 1.
Linear movement mechanism 31 makes top bracket 21 and each support of bottom bracket 22, and edge is set in the defined axle respectively
Upward, parallel to each other and different mobile route rectilinear movement.
Specifically, linear movement mechanism 31 possesses：First guide rail 31a, provides the mobile route of the support 21 of a side；The
One sliding block 31b, slides and supports the support 21 of a side on the first guide rail 31a；Driver (not shown), makes described first
Sliding block 31b is moved on the first guide rail 31a；Second guide rail 31c, provides the mobile route of the support 22 of the opposing party；Second sliding block
31d, slides and supports the support 22 of the opposing party on the second guide rail 31c；And driver (not shown), make described second
Sliding block 31d is moved on the second guide rail 31c.
First guide rail 31a and the second guide rail 31c is located in parallel to one another along the defined axial direction (left and right directions), at this
Be respectively formed in embodiment single track component 301, on opposite face (front and back sides) relative to each other.
First sliding block 31b supports the support 21 of one in the lower section of the support 21 of a side, and the second sliding block 31d is another
The lower section of the support 22 of side supports the support 22 of described the opposing party.More specifically, the first sliding block 31b and the second sliding block 31d are each
Sliding block is respectively in bulk, the branch for the U shape opened wide above supporting portion X1, X2 for being respectively arranged at their upper surface is supported
Support frame 32a (specific aftermentioned) bottom side portion, the supporting frame 32a pivotally keeps top bracket 21 and bottom bracket
22.That is, supporting portion X1, X2 on linear movement mechanism 31 is set in order to support top bracket 21 and bottom bracket 22,
Configuration substantially than top bracket 21 and each support of bottom bracket 22 the axial two ends (left and right ends) more in the inner part
Lower section position.
As shown in figure 3, rotating mechanism 32 makes top bracket 21 and bottom bracket 22 the two supports separately rotate,
Make top bracket between the substrate W lodging location Q1 and substrate W for turning into horizontality turns into the set-up positions Q2 of plumbness
21 and 90 ° of each holder pivots of bottom bracket 22.In addition, substrate in lodging location without certain level, if for example in lock chamber
Substrate keep posture be slightly slanted, then the lodging location of substrate can coordinate inclination with it.In addition, substrate is in set-up positions
Without necessarily vertical, for example, the irradiating angle of ion beam can be coordinated to tilt.
Specifically, as shown in Figures 2 and 3, rotating mechanism 32 is separately positioned on top bracket 21 and bottom bracket 22 is each
On support, rotating mechanism 32 possesses：Supporting frame 32a, by along the defined axially arranged rotary shaft 4 with rotatable side
Formula supports top bracket 21 and bottom bracket 22 respectively；The driver 32b such as motor, is arranged on the lower section of the supporting frame 32a；With
And transmission connecting rod 32c, by transmitting the driving force of the driver 32b to the rotary shaft 4, make the top bracket 21 with
Side stand 22 is rotated.Left and right side of the rotary shaft 4 respectively with top bracket 21 and bottom bracket 22 is connected, and supporting frame 32a is in just
U shape during the observation of face substantially upward, and the rotary shaft 4 of the left and right sides with supporting top bracket 21 and bottom bracket 22
Left and right sidewall.
By the rotating mechanism 32, the top bracket 21 and bottom bracket 22 of present embodiment as shown in Figure 3 and Figure 4,
With minimum angle of rotation between lodging location Q1 when receiving substrate W and the set-up positions Q2 that ion beam IB is injected to substrate W
Degree is rotated.For example, in the case where set-up positions Q2 is substrate is turned into vertical upright position, rotating mechanism 32 makes collateral
Frame 21 and bottom bracket 22 rotate 90 degree between lodging location Q1 and set-up positions Q2.
In addition, in the present embodiment, in the lower surface of the supporting frame 32a of rotating mechanism 32 lower wall, being respectively fixed with
The the first sliding block 31b and the second sliding block 31d of linear movement mechanism 31.That is, linear movement mechanism 31 passes through in rotating mechanism 32
Lower section support rotary mechanism 32, to support top bracket 21 and bottom bracket 22.
The support travel mechanism 3 constituted as described above, in top bracket 21 and bottom bracket 22 the two supports
All in lodging location Q1 receiving position P1, the two supports of the top bracket 21 and bottom bracket 22, which turn into, to be arranged above and below
State.Therefore, the rotary shaft 4 of top bracket 21 and bottom bracket 22 the two supports is staggered in the vertical direction so that
When the support 21 of a side turns into lodging location Q1, the rotary shaft 4 that the support 21 of one will not be with the support 22 of the opposing party
Interfere.Specifically, in receiving position P1, the rotary shaft 4 positioned at the support 21 of a side of upside staggers for than under
The rotary shaft 4 of the support 22 of the opposing party of side is upper.
In addition, being provided with substrate carrying mechanism 5 in conveying chamber S3, the substrate carrying mechanism 5 will be contained in lock chamber S2
Substrate W conveyed to the top bracket 21 and bottom bracket 22 the two supports of the receiving position P1 positioned at process chamber S1.
The substrate carrying mechanism 5 is by be housed on lock chamber S2 Substrate table 7 two states of the substrate W to be arranged above and below
Uniformly it is transported on receiving position P1 top bracket 21 and bottom bracket 22 the two supports.Specifically, substrate is defeated
Mechanism 5 is sent to possess：The substrate W of upside above and below upside hand 51, conveying in two substrate W；Substrate on the downside of downside hand 52, conveying
W；And hand driving device 53, upside hand 51 and downside hand 52 is moved between lock chamber S2 and process chamber S1.In this embodiment party
In formula, upside hand 51 and downside hand 52 are integrally formed by common hand support 54.
Then, the action of substrate carrying mechanism 5 and support travel mechanism 3 is illustrated.
First, by support travel mechanism 3 positioned at the two branch of receiving position P1 top bracket 21 and bottom bracket 22
Frame, all in lodging location Q1 and as the state being arranged above and below.In this condition, it is collateral upwards by substrate carrying mechanism 5
Frame 21 and each support of bottom bracket 22 convey and place a substrate W respectively.
Then, top bracket 21 and the two supports of bottom bracket 22 are made to be rotated from lodging location Q1 by rotating mechanism 32
To set-up positions Q2.Then, by linear movement mechanism 31 by top bracket 21 and one one, bottom bracket 22 the two supports
It is individual alternately to reciprocate processing position P2 along mobile route.Thus, irradiate ion beam IB to each substrate W and carry out ion implanting
Processing.Processing position P2 described herein has defined width in the axial direction as shown in Figure 8, and refers to (a) from such as Fig. 8
The lateral margin of shown, ion implanted regions that are being set on substrate W a sides is exposed to ion beam IB position to such as Fig. 8
(b) lateral margin of the opposing party of shown in, described ion implanted regions is exposed to the scope untill ion beam IB position.In addition,
Linear movement mechanism 31 in this such as shown in Fig. 8 (c), can be such that the top bracket 21 and bottom bracket that maintain substrate W 22 surpasses
Retreating position (processing end position) P3 that the processing position P2 is moved to the opposite side for being set in receiving position P1 is crossed, but
It is that linear movement mechanism 31 can also be configured to be only capable of making the top bracket 21 and bottom bracket 22 that maintain substrate W move everywhere
Manage position P2.
Then, after processing terminates, top bracket 21 and the two supports of bottom bracket 22 pass through the He of linear movement mechanism 31
Rotating mechanism 32 is moved to receiving position P1, by substrate carrying mechanism 5 by the substrate W handled from process chamber S1 to lock chamber S2
Conveying.
As shown in figure 4, in the substrate board treatment 100 of present embodiment, due to top bracket 21 and bottom bracket 22
The rotary shaft 4 of the two supports staggers in the vertical direction, so in order that being pointed on set-up positions Q2 each support 21,22
The processing height (position of the ion beam center of ion beam) that the substrate W of holding is handled is identical, it is necessary to will be located at lodging position
Put the substrate W kept on Q1 each support 21,22 (the conveying sides conveyed to top bracket 21 and bottom bracket 22 along the longitudinal direction
To) stagger ormal weight.So-called herein " ormal weight " refers to the rotary shaft 4 of the two supports of top bracket 21 and bottom bracket 22
The rotary shaft 4 of offset Yu top bracket 21 and bottom bracket 22 the two supports in the vertical direction fore-and-aft direction (to
The conveying direction that top bracket 21 and bottom bracket 22 are conveyed) on offset it is total.
Therefore, the substrate board treatment 100 of present embodiment includes substrate position correction mechanism 6, and the substrate position is repaiied
The position of the above-below direction of substrate W when positive mechanism 6 makes to be located at the support 21 of a side into set-up positions Q2 with, by described the opposing party
Support 22 be located at set-up positions Q2 when substrate W above-below direction position consistency.
Specifically, as substrate position correction mechanism 6, it may be considered that situation as described below：(1) it is arranged on conveying chamber
Situation in S3, in the case that (2) are arranged in lock chamber S2, (3) are arranged on the situation in process chamber S1.
(1) it is arranged on the situation in conveying chamber S3
It is used as situation about being arranged in conveying chamber S3, it may be considered that be arranged at the substrate carrying mechanism 5 in conveying chamber S3.
Specifically, as shown in figure 5, as make above and below placing respectively two substrate W, upside hand 51 conveyor surface (on
Side conveyor surface) and the conveyor surface (downside conveyor surface) of downside hand 52 at least one party relative to the structure that the opposing party moves, make
The offset of upside conveyor surface and downside conveyor surface with because top bracket 21 and the two supports of bottom bracket 22 are from lodging location
The offset of the position for the substrate W that Q1 is rotated and produced to set-up positions Q2 is identical.
An example shown in Fig. 5, by making upside conveyor surface is relative in the longitudinal direction relative to downside conveyor surface to move
Move to carry out position correction, the substrate position correction mechanism 6 possesses：Driver 6a1, is located at such as vacuum servo motor
The hand support 54 of supporting downside hand 52；Straight line guide mechanism 6a2, between the hand support 54 and upside hand 51, edge
Fore-and-aft direction extends；And the transfer part 6a3 such as timing belt, the driving force of the driver 6a1 is passed into the upside hand 51,
Make the upside hand 51 using straight line guide mechanism 6a2 rectilinear movements.In addition, passing through cable carrier pipe (not shown)
(CABLEVEYOR (registration mark)) etc. is to driver 6a1 supply electric powers.
The position correction action of the substrate W to being carried out by the substrate position correction mechanism 6 is illustrated below.
When substrate carrying mechanism 5 takes out two substrate W from lock chamber S2 Substrate table 7, on upside hand 51 and downside hand 52
Lower position is identical, is individually positioned in upside the two two substrate W upper-lower positions on hand of hand 51 and downside hand 52 identical.This
Outside, during substrate carrying mechanism 5 conveys two substrate W from lock chamber S2 to process chamber S1, substrate position correction mechanism 6 makes
Side hand 51 is relatively moved relative to downside hand 52, thus corrects substrate W position.In this condition, position is given by two substrate W
In process chamber S1 receiving position P1 top bracket 21 and bottom bracket 22 the two supports.Thus, when have received substrate W's
When top bracket 21 and the two holder pivots of bottom bracket 22 are to set-up positions Q2, the He of top bracket 21 is respectively retained
The processing height (to the height of each substrate W ion beam IB irradiated ion beam center) of substrate W on bottom bracket 22 is identical.
In addition, when the substrate handled W is housed onto lock chamber S2 Substrate table 7 from top bracket 21 and bottom bracket 22, substrate
Position correction mechanism 6 carries out the action opposite with the action, when the substrate W that will have been handled houses the Substrate table 7 to lock chamber S2
When upper, upside hand 51 is identical with the upper-lower position of downside hand 52.
(2) it is arranged on the situation in lock chamber S2
It is used as situation about being arranged in lock chamber S2, it may be considered that be arranged on the Substrate table 7 in lock chamber S2.
Specifically, as shown in fig. 6, as making the placed side (upside of two substrate W upper side stage 71 above and below placing respectively
Table top) and the placed side (downside table top) of lower side stage 72 at least one party relative to the structure that the opposing party relatively moves, make
The offset of side stage face and downside table top with because top bracket 21 and the two supports of bottom bracket 22 are from lodging location Q1 to vertical
The offset of the position for the substrate W for rising position Q2 to rotate and producing is identical.
An example shown in Fig. 6, by make downside table top relative to upside table top handing-over direction on relative movement come
Position correction is carried out, the substrate position correction mechanism 6 possesses：The driver such as servomotor 6b1；Straight line guide mechanism 6b2, if
Put in the downside of lower side stage 72, along the extension of handing-over direction；And link rod part 6b3, by the way that the driving force of the driver 6b1 is passed
Lower side stage 72 is passed, makes the lower side stage 72 using straight line guide mechanism 6b2 rectilinear movements.
The position correction action of the substrate W to being carried out by the substrate position correction mechanism 6 is illustrated below.
When substrate is housed onto lock chamber S2 Substrate table 7 from the outside (air) of vacuum chamber, upper side stage 71 and downside
The upper-lower position of platform 72 is identical.Then, in the state of lock chamber S2 air atmosphere or vacuum atmosphere, substrate position correction mechanism 6
By making lower side stage 72 be relatively moved relative to upper side stage 71, to correct substrate W position.Then, substrate carrying mechanism 5 is upper
Side hand 51 and downside hand 52 receive the substrate W on side stage 71 and lower side stage 72 respectively, and two substrate W are handed to positioned at place
Manage room S1 receiving position P1 top bracket 21 and bottom bracket 22 the two supports.In addition, coordinating the upper He of side stage 71
The offset of lower side stage 72, sets the upside hand 51 of substrate carrying mechanism 5 and the length of downside hand 52.Thus, when have received base
When plate W top bracket 21 and the two holder pivots of bottom bracket 22 are to set-up positions Q2, to being kept at the upside
The processing height that substrate W on support 21 and bottom bracket 22 is handled is (to each substrate W ion beam IB irradiated ion beam
The height at center) turn into identical.In addition, being housed by the substrate handled W from top bracket 21 and bottom bracket 22 to lock chamber
When on S2 Substrate table 7, substrate position correction mechanism 6 carries out the action opposite with the action, and the substrate W handled is housed
After on to lock chamber S2 Substrate table 7, upper side stage 71 is identical with the lower upper-lower position of side stage 72.
(3) it is arranged on the situation in process chamber S1
It is used as situation about being arranged in process chamber S1, it may be considered that the support 21,22 being arranged in process chamber S1 and rotation
Between mechanism 32.
Specifically, as shown in fig. 7, as making the top bracket 21 and bottom bracket of two substrate W above and below keeping respectively
At least one party in 22 relative to the structure that the opposing party relatively moves, by modifying factor top bracket 21 and bottom bracket 22 this two
The offset of the position for the substrate W that individual support is rotated and produced from lodging location Q1 to set-up positions Q2, makes to be held in positioned at vertical
The top bracket 21 for playing position Q2 is consistent with the height and position of on bottom bracket 22 the two supports, substrate W above-below direction.
An example shown in Fig. 7, position is carried out by making top bracket 21 be relatively moved relative to bottom bracket 22
Amendment, during top bracket 21 turns to set-up positions Q2 from lodging location Q1, top bracket 21 is downward relative to rotary shaft 4
Side is moved back, during lodging location Q1 is turned to from set-up positions Q2, and top bracket 21 is stretched relative to rotary shaft 4 to conveying direction
Go out.
More specifically, substrate position correction mechanism 6 possesses：Rotating base 6c1, connects with the support side end of rotary shaft 4
Connect, rotated together with rotary shaft 4；Fixed gear 6c2, is fixed in the rotary shaft 4；Planetary gear 6c4, is fixed on pitman arm
On 6c3, and rotated by being engaged with the fixed gear 6c2, the pitman arm 6c3 in a rotatable manner with described turn
Moving base 6c1 connections；Follower link 6c5, one end is connected with the pitman arm 6c3, and the other end is connected with top bracket 21；And
Straight line guide mechanism 6c6, is arranged between the rotating base 6c1 and the support 21.In addition, follower link 6c5 is flexible
Connecting rod, possesses：First connecting rod component 6c51, one end is fixed on pitman arm 6c3；And second connecting rod component 6c52, to turn
Dynamic mode freely is connected with the other end of the first connecting rod component 6c51, and in a rotatable manner with support 21
Connection.
The position correction action of the substrate W to being carried out by the substrate position correction mechanism 6 is illustrated below.
When substrate carrying mechanism 5 by two substrates to the top bracket 21 and bottom bracket 22 positioned at receiving position P1 this two
During the conveying of individual support, two support upper-lower positions are identical, are placed on the top bracket 21 and bottom bracket 22 the two supports
On two substrate W upper-lower positions it is identical.
Then, rotating mechanism 32 makes top bracket 21 and each support of bottom bracket 22 from lodging location Q1 to set-up positions Q2
Rotate.Now, if the rotating mechanism 32 of top bracket 21 rotates the rotary shaft 4 of top bracket 21, with and this, it is fixed
Gear 6c2 and rotating base 6c1 is rotated, and planetary gear 6c4 rotates movement around fixed gear 6c2.Pass through the planetary gear
6c4 rotation movement, pitman arm 6c3 is rotated, and is fixed on pitman arm 6c3 follower link 6c5 first connecting rod component
6c51 is rotated, and follower link 6c5 stretches, and top bracket 21 is slided along straight line guide mechanism 6c6.In the present embodiment, it is adjoint
Top bracket 21 is rotated from lodging location Q1 to set-up positions Q2, and follower link 6c5 shrinks, with support from position of standing up to
Lie prostrate position to rotate, follower link stretches.Thus, when the top bracket 21 that have received substrate W and bottom bracket 22 the two supports
When being rotated to set-up positions Q2 from lodging location Q1, the substrate on the top bracket 21 and bottom bracket 22 is kept at
W processing height (to the height of each substrate W ion beam IB irradiated ion beam center) is identical.In addition, working as from set-up positions
When Q2 is rotated to lodging location Q1, the substrate W upper-lower positions on the top bracket 21 and bottom bracket 22 are kept at
It is identical.
<The effect of present embodiment>
The substrate board treatment 100 of the present embodiment constituted as described above, process chamber S1 and lock chamber S2 it
Between be provided with conveying chamber S3, because the substrate carrying mechanism 5 by being arranged in the conveying chamber S3 is housed in lock chamber S2
Substrate W be transported on the top bracket 21 and bottom bracket 22 being arranged in process chamber S1, so top bracket 21 need not be made
Enter lock chamber S2 with bottom bracket 22, can prevent from causing lock chamber S2 big because of the maximization of top bracket 21 and bottom bracket 22
It is capacity, and the switching time of lock chamber S2 atmosphere can be shortened.
Further, since two ends of the linear movement mechanism 31 on the defined axial direction than top bracket 21 and bottom bracket 22
Lower section supporting top bracket 21 and bottom bracket 22 more in the inner part, so the branch of top bracket 21 and bottom bracket 22 can be made
Bearing portion position is close to top bracket 21 and bottom bracket 22, so as to stably support top bracket 21 and bottom bracket 22.
In addition, because possessing substrate position correction mechanism 6, even if top bracket 21 and bottom bracket 22 the two branch
The rotary shaft of frame staggers about 4, can also make the substrate W being maintained on the support 21 of a side and be maintained at the support 22 of the opposing party
On substrate W on the above-below direction such as ion implanting processing position it is consistent.
Here, substrate position correction mechanism 6 is arranged on into the situation on lock chamber S2 Substrate table 7, compared to being arranged on base
Situation on plate conveying mechanism 5 or top bracket 21 and the grade of bottom bracket 22, can make structure become simple.In addition, by substrate
Position correction mechanism 6 is arranged on the situation on conveying chamber S3 substrate carrying mechanism 5, can reduce lock chamber S2 capacity, and
The switching time of lock chamber S2 atmosphere can be shortened, thus, it is possible to improve productivity ratio.In addition, substrate position correction mechanism 6 is set
The situation between process chamber S1 top bracket 21 and bottom bracket 22 and rotating mechanism 32 is put, lock chamber S2 appearance can be reduced
Amount, can shorten the switching time of lock chamber S2 atmosphere, thus, it is possible to improve productivity ratio.Now, due to the base of present embodiment
Board position correction mechanism 6, so new power need not be set, can simplify apparatus structure using the power of rotating mechanism 32
And miniaturization.
<Other variant embodiments>
In addition, the invention is not restricted to the embodiment.
For example, as shown in figure 9, the first sliding block 31b (the second sliding block 31d) can also be divided into two pieces and be arranged on upper collateral
Below the both side edges portion of frame 21 (bottom bracket 22).In addition, as shown in Figure 10, one of the first sliding block 31b (the second sliding block 31d)
Point it can be arranged on more more outward than the both sides edge of top bracket 21 (bottom bracket 22).But, as long as supporting portion X1
(X2) it is positioned essentially at the both sides edge position more in the inner part than top bracket 21 (bottom bracket 22).Observe the figure
When 10, although strictly supporting portion X1 is located at the slightly outside of top bracket 21, but it is due to supporting portion X1 supporting holdings
The supporting frame 32a of the both side edges of top bracket 21 bottom side portion, so supporting portion X1 is positioned essentially at the interior of top bracket 21
Side.
In addition, two supports of the embodiment can keep containing the disk of multiple substrates.So, it can unify to locate
Manage multiple substrates.
In addition, in said embodiment, with two lock chambers, but can also have a lock chamber, or can have
There is the lock chamber of more than three.
In addition, in the case where substrate position correction mechanism is set in the process chamber, except being arranged on support and rotation
Beyond situation between mechanism, support can also be arranged on, or rotating mechanism can be arranged on.In addition,
Linear movement mechanism can also be arranged on.Here, being set respectively in the linear movement mechanism for making two supports move respectively
Put in each of each support and in each guide rail by the case that different components is constituted, can be by making described lead
Rail relatively moves to correct substrate position.
Additionally, this invention is not limited to the embodiment, various changes can be carried out in the scope for not departing from present inventive concept
Shape.
Technical characteristic described in each embodiment of the present invention can be mutually combined and form new technical scheme.
Claims (7)
1. a kind of substrate board treatment, it is characterised in that
The substrate board treatment includes：
Process chamber, handles substrate under vacuum atmosphere in the chamber；
Lock chamber, houses the substrate, is switched to air atmosphere or vacuum atmosphere；
Conveying chamber, is arranged between the process chamber and the lock chamber, in the process chamber and the lock chamber under vacuum atmosphere
Between convey the substrate；
Two supports, are arranged in the process chamber, substrate are kept respectively；
Support travel mechanism, at least makes described two supports receive the received bit of the substrate come from conveying chamber conveying
Moved between the processing position for putting and handling the substrate, and turn into described two supports in the receiving position and arranged up and down
The state of row；And
Substrate carrying mechanism, is arranged in the conveying chamber, by the substrate being housed in the lock chamber to be arranged above and below
State is uniformly transported to described two supports positioned at the receiving position,
The support travel mechanism includes：
Linear movement mechanism, makes described two supports different from each other on defined axial direction along being set in by each support respectively
Mobile route is moved；And
Rotating mechanism, makes described two supports around the defined axial rotation,
The position of two ends of the linear movement mechanism on the defined axial direction than the support more in the inner part supports institute
State support.
2. substrate board treatment according to claim 1, it is characterised in that the rotating mechanism makes described two supports point
Do not rotate independently.
3. substrate board treatment according to claim 2, it is characterised in that
The rotating mechanism makes the substrate carry out posture between lodging location and set-up positions by making the holder pivots
Change,
Stagger above and below the rotary shaft of described two supports so that when the support for making a side is in the lodging location, described one
The support of side is not interfered with the rotary shaft of the support of the opposing party.
4. substrate board treatment according to claim 3, it is characterised in that the substrate board treatment also includes substrate position
Put correction mechanism, the above-below direction of the substrate when substrate position correction mechanism makes the support of one in set-up positions
Substrate when being in set-up positions of the support of position and described the opposing party above-below direction position consistency.
5. substrate board treatment according to claim 4, it is characterised in that the substrate position correction mechanism is arranged on
On Substrate table in the lock chamber, by making above and below being placed with respectively in the upside table top and downside table top of two substrates extremely
A few side relatively moves relative to the opposing party, makes the offset of the upside table top and downside table top and because of described two supports
The offset of the position for the substrate for rotating and producing is identical.
6. substrate board treatment according to claim 4, it is characterised in that the substrate position correction mechanism is arranged on institute
State on substrate carrying mechanism, by making above and below being placed with respectively in the upside conveyor surface and downside conveyor surface of two substrates at least
One side relative to the opposing party relatively move, make the offset of the upside conveyor surface and the downside conveyor surface with because described two
The rotation of support and the offset of the position of the substrate that produces is identical.
7. substrate board treatment according to claim 4, it is characterised in that
Described two supports include top bracket and bottom bracket,
The substrate position correction mechanism is set on the bracket, on the rotating mechanism or the support and the rotating machine
Between structure, by making at least one party's phase above and below maintaining respectively in the top bracket and the bottom bracket of two substrates
For the opposing party's relative movement, make the offset of the top bracket and the bottom bracket and the rotation because of described two supports
And the offset of the position of the substrate produced is identical.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014191994A JP6086254B2 (en) | 2014-09-19 | 2014-09-19 | Substrate processing equipment |
| JP2014-191994 | 2014-09-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106206232A CN106206232A (en) | 2016-12-07 |
| CN106206232B true CN106206232B (en) | 2017-10-13 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510315762.5A Active CN106206232B (en) | 2014-09-19 | 2015-06-10 | Substrate board treatment |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6086254B2 (en) |
| KR (1) | KR101885124B1 (en) |
| CN (1) | CN106206232B (en) |
| TW (1) | TWI582888B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112239069A (en) * | 2019-07-19 | 2021-01-19 | 亚智科技股份有限公司 | Forked substrate conveying device and method thereof |
| JP7163944B2 (en) * | 2020-09-15 | 2022-11-01 | 日新イオン機器株式会社 | Substrate holder and ion implanter |
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- 2015-06-29 TW TW104120935A patent/TWI582888B/en active
- 2015-07-13 KR KR1020150098869A patent/KR101885124B1/en active IP Right Grant
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| CN1568379A (en) * | 2001-10-12 | 2005-01-19 | 尤纳克西斯巴尔策斯公司 | Methods for the production of components and ultra high vacuum cvd reactor |
| CN101894779A (en) * | 2003-08-29 | 2010-11-24 | 交叉自动控制公司 | The method and apparatus that is used for semiconductor processes |
| CN101226878A (en) * | 2007-01-15 | 2008-07-23 | 大日本网目版制造株式会社 | Substrate processing apparatus and substrate processing method |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201613022A (en) | 2016-04-01 |
| JP2016063166A (en) | 2016-04-25 |
| CN106206232A (en) | 2016-12-07 |
| JP6086254B2 (en) | 2017-03-01 |
| TWI582888B (en) | 2017-05-11 |
| KR20160034178A (en) | 2016-03-29 |
| KR101885124B1 (en) | 2018-08-03 |
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