CN106191546A - A kind of durable type LED-baseplate composite heat dissipation material and production method thereof - Google Patents
A kind of durable type LED-baseplate composite heat dissipation material and production method thereof Download PDFInfo
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- CN106191546A CN106191546A CN201610662696.3A CN201610662696A CN106191546A CN 106191546 A CN106191546 A CN 106191546A CN 201610662696 A CN201610662696 A CN 201610662696A CN 106191546 A CN106191546 A CN 106191546A
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- auxiliary agent
- baseplate
- heat dissipation
- powder
- type led
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- 239000000463 material Substances 0.000 title claims abstract description 51
- 239000002131 composite material Substances 0.000 title claims abstract description 13
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000000843 powder Substances 0.000 claims abstract description 23
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims abstract description 22
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 15
- 239000004113 Sepiolite Substances 0.000 claims abstract description 11
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052624 sepiolite Inorganic materials 0.000 claims abstract description 11
- 235000019355 sepiolite Nutrition 0.000 claims abstract description 11
- 239000011780 sodium chloride Substances 0.000 claims abstract description 11
- 239000002994 raw material Substances 0.000 claims abstract description 10
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 7
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims abstract description 5
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 5
- 239000011572 manganese Substances 0.000 claims abstract description 5
- 238000003756 stirring Methods 0.000 claims description 12
- 239000000243 solution Substances 0.000 claims description 9
- 239000005995 Aluminium silicate Substances 0.000 claims description 8
- 235000012211 aluminium silicate Nutrition 0.000 claims description 8
- 239000012467 final product Substances 0.000 claims description 8
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- IYDGMDWEHDFVQI-UHFFFAOYSA-N phosphoric acid;trioxotungsten Chemical compound O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.OP(O)(O)=O IYDGMDWEHDFVQI-UHFFFAOYSA-N 0.000 claims description 5
- QMMJWQMCMRUYTG-UHFFFAOYSA-N 1,2,4,5-tetrachloro-3-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=C(Cl)C(Cl)=CC(Cl)=C1Cl QMMJWQMCMRUYTG-UHFFFAOYSA-N 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 238000000498 ball milling Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- 239000000706 filtrate Substances 0.000 claims description 4
- 238000001914 filtration Methods 0.000 claims description 4
- 238000000227 grinding Methods 0.000 claims description 4
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 4
- 238000002791 soaking Methods 0.000 claims description 4
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- 239000007864 aqueous solution Substances 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- 238000005245 sintering Methods 0.000 abstract description 7
- 239000000203 mixture Substances 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 239000004615 ingredient Substances 0.000 abstract description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 238000002156 mixing Methods 0.000 abstract description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- UYDPQDSKEDUNKV-UHFFFAOYSA-N phosphanylidynetungsten Chemical compound [W]#P UYDPQDSKEDUNKV-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0005—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with at least one oxide and at least one of carbides, nitrides, borides or silicides as the main non-metallic constituents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention relates to light fixture heat sink material, being specifically related to a kind of durable type LED-baseplate composite heat dissipation material and production method thereof, this heat sink material is made up of the raw material of following weight portion: aluminum 60 70, Pulvis Talci 78, manganese 8 10, nanometer silicon carbide 12 15, sodium chloride 23, sepiolite powder 68, styrene 13, auxiliary agent 45；The present invention combines the advantage of the compositions such as aluminum, manganese, nanometer silicon carbide, has good heat conduction and insulating properties concurrently, and reduces production cost; through sodium chloride, phenylethene modified after sepiolite powder; surface property is improved, and is more easy to compatible with other metal ingredient, and auxiliary agent can improve the sintering character of mixing material; shorten sintering time; the heat sink material compact structure that the present invention prepares, light weight insulate, and the capacity of heat transmission is strong; LED chip can be effectively protected, durable in use.
Description
Technical field
The present invention relates to light fixture heat sink material, be specifically related to a kind of durable type LED-baseplate composite heat dissipation material and production thereof
Method.
Background technology
LED is referred to as forth generation light source, has the advantages such as energy-saving and environmental protection, safety, low energy consumption, high brightness, at daily life
In be widely used, the heat dispersion of LED lamp itself is most important, directly influence light fixture service life and illumination effect
Really.Existing LED heat sink material is mainly made up of the metal material such as aluminum, copper, there is cost in actual use and limits, insulate
The performance shortcoming such as not, the formula of the most necessary improvement material, make material reach the best radiating effect, improve lamp
The serviceability of tool, increases the service life.
Summary of the invention
It is an object of the invention to, it is provided that a kind of durable type LED-baseplate composite heat dissipation material, reduce production cost,
Improving the purpose of material heat dispersion, to achieve these goals, the technical solution used in the present invention is as follows:
A kind of durable type LED-baseplate composite heat dissipation material, it is characterised in that material of the present invention is by the raw material of following weight portion
Make: aluminum 60-70, Pulvis Talci 7-8, manganese 8-10, nanometer silicon carbide 12-15, sodium chloride 2-3, sepiolite powder 6-8, styrene 1-
3, auxiliary agent 4-5.
Described auxiliary agent is made up of the raw material of following weight portion: butyl stearate 4-5, kaolin powder 15-18, Zirconium orthosilicate. 4-
5, phosphotungstic acid 1-2, iron powder 5-8, the preparation method of this auxiliary agent is: be first dissolved in appropriate water by phosphotungstic acid, is configured to concentration and is
The aqueous solution of 4-5%, and kaolin powder is put in solution, dispersed with stirring filters, after being washed to neutrality after uniformly soaking 8-10h
Being dried, gained material mixes with other residual components, and is heated to 45-55 DEG C, is cooled to room temperature after constant temperature dispersed with stirring 2-3h,
Material is ground to form 450-500 mesh fine powder again, to obtain final product；
Described durable type LED-baseplate composite heat dissipation material, its production method is as follows:
(1) sodium chloride is dissolved in the water of 15 times of its weight portions, subsequently sepiolite powder is put in solution, soak 8-
Filtering after 10h, filtrate is washed to cold drying after neutrality, adds styrene, standby after mixed grinding 2-3h；
(2) after step (1) gained material being mixed 2-3h with the stirring of other residual components, in input ball mill at ball milling
Reason, makes 10000-hole sieve surplus≤0.05% of gained material；
(3) material of step (2) gained is sent in mould compressing, under nitrogen atmosphere with the temperature of 600-650 DEG C
After degree sintering 5-6h, through naturally cooling to room temperature and get final product.
It is an advantage of the current invention that:
The present invention combines the advantage of the compositions such as aluminum, manganese, nanometer silicon carbide on raw material compared with conventional aluminum heat exchanging material, holds concurrently
Have good heat conduction and insulating properties, and reduce production cost, through sodium chloride, phenylethene modified after sepiolite powder, surface
Performance is improved, and is more easy to compatible with other metal ingredient, and auxiliary agent can improve the sintering character of mixing material, when shortening sintering
Between, the heat sink material compact structure that the present invention prepares, light weight insulate, and the capacity of heat transmission is strong, can be effectively protected LED chip,
Durable in use.
Detailed description of the invention
Embodiment 1:
The present embodiment durable type LED-baseplate composite heat dissipation material is made up of following raw material: aluminum 70, Pulvis Talci 8, manganese
10, nanometer silicon carbide 15, sodium chloride 3, sepiolite powder 8, styrene 3, auxiliary agent 5.
Described auxiliary agent is made up of the raw material of following weight portion: butyl stearate 5, kaolin powder 18, Zirconium orthosilicate. 5, phosphorus tungsten
Acid 2, iron powder 8, the preparation method of this auxiliary agent is: be first dissolved in appropriate water by phosphotungstic acid, be configured to concentration be 5% water-soluble
Liquid, and kaolin powder is put in solution, dispersed with stirring filters after uniformly soaking 10h, is dried, gained material after being washed to neutrality
Mix with other residual components, and be heated to 45-55 DEG C, be cooled to room temperature after constant temperature dispersed with stirring 3h, then material is ground to form
500 mesh fine powders, to obtain final product；
Described durable type LED-baseplate composite heat dissipation material, its production method is as follows:
(1) sodium chloride is dissolved in the water of 15 times of its weight portions, subsequently sepiolite powder is put in solution, soak
Filtering after 10h, filtrate is washed to cold drying after neutrality, adds styrene, standby after mixed grinding 3h；
(2), after step (1) gained material being mixed 3h with the stirring of other residual components, ball-milling treatment in ball mill is put into,
Make 10000-hole sieve surplus≤0.05% of gained material；
(3) material of step (2) gained is sent in mould compressing, under nitrogen atmosphere with the temperature of 600-650 DEG C
After degree sintering 6h, through naturally cooling to room temperature and get final product.
The heat conductivity of the heat sink material more conventional LED aluminum base heat sink material obtained by the present embodiment improves 23.5%,
Thermal diffusivity improves 26.8%, and heat balance time averagely shortens 165min, and light fixture improves 25.6% service life.
Embodiment 2:
The present embodiment durable type LED-baseplate composite heat dissipation material is made up of following raw material: aluminum 60, Pulvis Talci 7, manganese
8, nanometer silicon carbide 12, sodium chloride 2, sepiolite powder 6, styrene 1, auxiliary agent 4.
Described auxiliary agent is made up of the raw material of following weight portion: butyl stearate 4, kaolin powder 15, Zirconium orthosilicate. 4, phosphorus tungsten
Acid 1, iron powder 5, the preparation method of this auxiliary agent is: be first dissolved in appropriate water by phosphotungstic acid, be configured to concentration be 4% water-soluble
Liquid, and kaolin powder is put in solution, dispersed with stirring filters after uniformly soaking 8h, is dried, gained material after being washed to neutrality
Mix with other residual components, and be heated to 45-55 DEG C, be cooled to room temperature after constant temperature dispersed with stirring 2h, then material is ground to form
450 mesh fine powders, to obtain final product；
Described durable type LED-baseplate composite heat dissipation material, its production method is as follows:
(1) sodium chloride is dissolved in the water of 15 times of its weight portions, subsequently sepiolite powder is put in solution, soak 8h
Rear filtration, filtrate is washed to cold drying after neutrality, adds styrene, standby after mixed grinding 2h；
(2), after step (1) gained material being mixed 2h with the stirring of other residual components, ball-milling treatment in ball mill is put into,
Make 10000-hole sieve surplus≤0.05% of gained material；
(3) material of step (2) gained is sent in mould compressing, under nitrogen atmosphere with the temperature of 600-650 DEG C
After degree sintering 5h, through naturally cooling to room temperature and get final product.
The heat conductivity of the heat sink material more conventional LED aluminum base heat sink material obtained by the present embodiment improves 23.6%,
Thermal diffusivity improves 26.8%, and heat balance time averagely shortens 163min, and light fixture improves 25.5% service life.
Claims (1)
1. a durable type LED-baseplate composite heat dissipation material, it is characterised in that this material is made up of the raw material of following weight portion:
Aluminum 60-70, Pulvis Talci 7-8, manganese 8-10, nanometer silicon carbide 12-15, sodium chloride 2-3, sepiolite powder 6-8, styrene 1-3, auxiliary agent
4-5；
Described auxiliary agent is made up of the raw material of following weight portion: butyl stearate 4-5, kaolin powder 15-18, Zirconium orthosilicate. 4-5, phosphorus
Wolframic acid 1-2, iron powder 5-8, the preparation method of this auxiliary agent is: be first dissolved in appropriate water by phosphotungstic acid, and being configured to concentration is 4-5%
Aqueous solution, and kaolin powder is put in solution, dispersed with stirring filters after uniformly soaking 8-10h, is dried after being washed to neutrality,
Gained material mixes with other residual components, and is heated to 45-55 DEG C, is cooled to room temperature after constant temperature dispersed with stirring 2-3h, then will
Material grinds to form 450-500 mesh fine powder, to obtain final product；
Described durable type LED-baseplate composite heat dissipation material, its production method is as follows:
(1) sodium chloride is dissolved in the water of 15 times of its weight portions, subsequently sepiolite powder is put in solution, soak 8-10h
Rear filtration, filtrate is washed to cold drying after neutrality, adds styrene, standby after mixed grinding 2-3h；
(2), after step (1) gained material being mixed 2-3h with the stirring of other residual components, put into ball-milling treatment in ball mill, make
10000-hole sieve surplus≤0.05% of gained material；
(3) material of step (2) gained is sent in mould compressing, burn with the temperature of 600-650 DEG C under nitrogen atmosphere
After knot 5-6h, through naturally cooling to room temperature and get final product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610662696.3A CN106191546A (en) | 2016-08-11 | 2016-08-11 | A kind of durable type LED-baseplate composite heat dissipation material and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610662696.3A CN106191546A (en) | 2016-08-11 | 2016-08-11 | A kind of durable type LED-baseplate composite heat dissipation material and production method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106191546A true CN106191546A (en) | 2016-12-07 |
Family
ID=57515127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610662696.3A Pending CN106191546A (en) | 2016-08-11 | 2016-08-11 | A kind of durable type LED-baseplate composite heat dissipation material and production method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN106191546A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106676372A (en) * | 2016-12-31 | 2017-05-17 | 铜陵华科电子材料有限公司 | Formula of aluminum-based material for aluminum substrate with high thermal conductivity |
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2016
- 2016-08-11 CN CN201610662696.3A patent/CN106191546A/en active Pending
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| CN104087992A (en) * | 2014-06-17 | 2014-10-08 | 宁国新博能电子有限公司 | Electroplating processing method for copper-wire surface |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106676372A (en) * | 2016-12-31 | 2017-05-17 | 铜陵华科电子材料有限公司 | Formula of aluminum-based material for aluminum substrate with high thermal conductivity |
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Application publication date: 20161207 |