CN104141074A - Aluminum-based compound radiating material containing modified mullite powder for LED - Google Patents
Aluminum-based compound radiating material containing modified mullite powder for LED Download PDFInfo
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- CN104141074A CN104141074A CN201410322088.9A CN201410322088A CN104141074A CN 104141074 A CN104141074 A CN 104141074A CN 201410322088 A CN201410322088 A CN 201410322088A CN 104141074 A CN104141074 A CN 104141074A
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Abstract
The invention relates to a radiating material of a lamp and particularly relates to an aluminum-based compound radiating material containing modified mullite powder for an LED and a production method of the radiating material. The radiating material is prepared from the following raw materials in parts by weight: 68-74 parts of aluminum, 14-16 parts of aluminum nitride, 4-6 parts of spodumene, 5-8 parts of borax, 12-15 parts of mullite powder, 7-9 parts of a silica sol, 5-6 parts of sodium polyaluminate, 1-3 parts of sodium hexametaphosphate, 0.2-0.3 part of sodium selenite, 1-2 parts of vinyltriethoxysilane and 4-5 parts of an auxiliary. The radiating material provided by the invention integrates the advantages of the components such as aluminum, aluminum nitride and mullite powder and has good heat conductive and insulative performances at the same time. The mullite powder is put in a mixed solution of the components such as sodium hexametaphosphate and sodium selenite silica sol for soaking and modification, so that the heat conductive performance of the mullite powder is improved, the compatibility among the materials is enhanced, and the auxiliary is added to improve the sintering performance of the mixed material. The radiating material provided by the invention is compact in structure, not easy to corrode and fast in heat transfer and radiation, and the service life of an LED lamp is effectively prolonged.
Description
Technical field
The present invention relates to light fixture heat sink material, be specifically related to a kind of LED with do not come aluminum-base composite heat sink material and the production method thereof of powder containing modification.
Background technology
LED be called as the 4th generation light source, there is the advantages such as energy-saving and environmental protection, safety, less energy-consumption, high brightness, be widely used in daily life, the heat dispersion of LED lamp body itself is most important, directly has influence on work-ing life and the illuminating effect of light fixture.Existing LED heat sink material is mainly to be made by metallic substance such as aluminium, copper, there is in actual use the shortcomings such as cost restriction, insulating property be inadequate, so formula of necessary improvement material, make material reach more good radiating effect, the use properties of improving light fixture, increases the service life.
Summary of the invention
The object of the invention is to, provide a kind of LED with do not carry out the aluminum-base composite heat sink material of powder containing modification, to improve the use properties of material, improve the work-ing life of light fixture, to achieve these goals, the technical solution used in the present invention is as follows:
A kind of LED is with do not carry out the aluminum-base composite heat sink material of powder containing modification, it is characterized in that, material of the present invention is made by the raw material of following weight part: aluminium 68-74, aluminium nitride 14-16, triphane 4-6, borax 5-8, do not come powder 12-15, silicon sol 7-9, poly-sodium aluminate 5-6, Sodium hexametaphosphate 99 1-3, Sodium Selenite 0.2-0.3, vinyltriethoxysilane 1-2, auxiliary agent 4-5.
Described auxiliary agent is made by the raw material of following weight part: tung oil 6-8, phenyl silicone oil 1-2, zinc oxide nanowire 4-5, Silver Nitrate 1-2, carbon nanotube 6-8, white rouge aerogel 8-10, preparation method is: first Silver Nitrate is dissolved in appropriate water, be mixed with the aqueous solution that concentration is 6-8%, and by zinc oxide nanowire, carbon nanotube, white rouge aerogel drops in solution, dry after the evenly rear standing 5-8h of dispersed with stirring, the material of gained mixes with other remaining component again, concentrate drying after dispersed with stirring 2-3h, grind to form 400-500 order fine powder, obtain.
Described a kind of LED is not with carrying out the aluminum-base composite heat sink material of powder containing modification, its manufacture craft comprises following steps:
(1) first Sodium hexametaphosphate 99, Sodium Selenite are dissolved in to 15 times in the water of its total weight parts, add subsequently silicon sol, vinyltriethoxysilane, do not carry out powder, standing immersion 10-12h after stirring, subsequently that low-temperature material is dry, gained material is standby;
(2) step (1) gained material and other remaining component are mixed together after stirring 1-2h, drop into ball-milling processing in ball mill, make 10000-hole sieve surplus≤0.05% of gained material;
(3) material of step (2) gained is sent into compression moulding in mould, under nitrogen atmosphere with after the temperature sintering 4-6h of 650-700 ℃, through naturally cooling to room temperature and get final product.
The invention has the advantages that: compared with conventional aluminum heat exchanging material, on raw material, combine aluminium, aluminium nitride, do not carry out powder, silicon sol, the advantage of the compositions such as poly-sodium aluminate, have good heat conduction and insulating property concurrently, and will not come powder to put into Sodium hexametaphosphate 99, in the mixing solutions of the compositions such as Sodium Selenite silicon sol, soak modification, improved the heat conductivility that does not carry out powder, and improved the consistency of storeroom, the interpolation of auxiliary agent can improve the sintering character of mixing material, the heat sink material compact structure that the present invention prepares, be difficult for corrosion, conduct heat heat radiation fast, effectively extended the work-ing life of LED light fixture.
Embodiment
Embodiment
The present embodiment LED heat sink material is made by following weight part raw material: aluminium 72, aluminium nitride 16, triphane 6, borax 6, do not come powder 15, silicon sol 9, poly-sodium aluminate 6, Sodium hexametaphosphate 99 2, Sodium Selenite 0.2, vinyltriethoxysilane 2, auxiliary agent 5.
Described auxiliary agent is made by the raw material of following weight part: tung oil 6, phenyl silicone oil 2, zinc oxide nanowire 5, Silver Nitrate 2, carbon nanotube 8, white rouge aerogel 10, preparation method is: first Silver Nitrate is dissolved in appropriate water, be mixed with concentration and be 6.8% the aqueous solution, and zinc oxide nanowire, carbon nanotube, white rouge aerogel are dropped in solution, dry after the evenly rear standing 8h of dispersed with stirring, the material of gained mixes with other remaining component again, concentrate drying after dispersed with stirring 3h, grind to form 500 order fine powders, obtain.
Described a kind of LED is not with carrying out the aluminum-base composite heat sink material of powder containing modification, its manufacture craft comprises following steps:
(1) first Sodium hexametaphosphate 99, Sodium Selenite are dissolved in to 15 times in the water of its total weight parts, add subsequently silicon sol, vinyltriethoxysilane, do not carry out powder, standing immersion 12h after stirring, subsequently that low-temperature material is dry, gained material is standby;
(2) step (1) gained material and other remaining component are mixed together after stirring 2h, drop into ball-milling processing in ball mill, make 10000-hole sieve surplus≤0.05% of gained material;
(3) material of step (2) gained is sent into compression moulding in mould, under nitrogen atmosphere with after the temperature sintering 6h of 650-700 ℃, through naturally cooling to room temperature and get final product.
The more conventional LED of the prepared heat sink material of the present embodiment improves 26.3% with the thermal conductivity of the more conventional aluminium base heat sink material of heat sink material, and thermal diffusivity improves 28.8%, heat balance time shorten in average 164min, and light fixture improves 29.2% work-ing life.
Claims (2)
1. a LED is with do not carry out the aluminum-base composite heat sink material of powder containing modification, it is characterized in that, this heat radiation is made by the raw material of following weight part: aluminium 68-74, aluminium nitride 14-16, triphane 4-6, borax 5-8, do not come powder 12-15, silicon sol 7-9, poly-sodium aluminate 5-6, Sodium hexametaphosphate 99 1-3, Sodium Selenite 0.2-0.3, vinyltriethoxysilane 1-2, auxiliary agent 4-5;
Described auxiliary agent is made by the raw material of following weight part: tung oil 6-8, phenyl silicone oil 1-2, zinc oxide nanowire 4-5, Silver Nitrate 1-2, carbon nanotube 6-8, white rouge aerogel 8-10, preparation method is: first Silver Nitrate is dissolved in appropriate water, be mixed with the aqueous solution that concentration is 6-8%, and by zinc oxide nanowire, carbon nanotube, white rouge aerogel drops in solution, dry after the evenly rear standing 5-8h of dispersed with stirring, the material of gained mixes with other remaining component again, concentrate drying after dispersed with stirring 2-3h, grind to form 400-500 order fine powder, obtain.
2. a kind of LED as claimed in claim 1 is not with carrying out the aluminum-base composite heat sink material of powder containing modification, and its production method is as follows:
(1) first Sodium hexametaphosphate 99, Sodium Selenite are dissolved in to 15 times in the water of its total weight parts, add subsequently silicon sol, vinyltriethoxysilane, do not carry out powder, standing immersion 10-12h after stirring, subsequently that low-temperature material is dry, gained material is standby;
(2) step (1) gained material and other remaining component are mixed together after stirring 1-2h, drop into ball-milling processing in ball mill, make 10000-hole sieve surplus≤0.05% of gained material;
(3) material of step (2) gained is sent into compression moulding in mould, under nitrogen atmosphere with after the temperature sintering 4-6h of 650-700 ℃, through naturally cooling to room temperature and get final product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410322088.9A CN104141074A (en) | 2014-07-08 | 2014-07-08 | Aluminum-based compound radiating material containing modified mullite powder for LED |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410322088.9A CN104141074A (en) | 2014-07-08 | 2014-07-08 | Aluminum-based compound radiating material containing modified mullite powder for LED |
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| CN104141074A true CN104141074A (en) | 2014-11-12 |
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| CN201410322088.9A Pending CN104141074A (en) | 2014-07-08 | 2014-07-08 | Aluminum-based compound radiating material containing modified mullite powder for LED |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105543730A (en) * | 2015-12-21 | 2016-05-04 | 漳州优普激光科技有限公司 | Laser marking machine case and preparing method thereof |
| CN105924888A (en) * | 2016-04-19 | 2016-09-07 | 安徽路明光电科技有限公司 | Mainboard for LED lamp and production process thereof |
| CN106634812A (en) * | 2016-12-23 | 2017-05-10 | 铜陵安博电路板有限公司 | Organic silicon resin pouring sealant with high thermal conductivity and low viscosity for PCB (Printed Circuit Board) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101864532A (en) * | 2010-05-17 | 2010-10-20 | 盐城市赛瑞特半导体照明有限公司 | Superconductive aluminum-based alloy for LED heat dissipation device |
| CN102260810A (en) * | 2010-05-24 | 2011-11-30 | 薛洪春 | Novel light emitting diode (LED) radiator base material |
-
2014
- 2014-07-08 CN CN201410322088.9A patent/CN104141074A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101864532A (en) * | 2010-05-17 | 2010-10-20 | 盐城市赛瑞特半导体照明有限公司 | Superconductive aluminum-based alloy for LED heat dissipation device |
| CN102260810A (en) * | 2010-05-24 | 2011-11-30 | 薛洪春 | Novel light emitting diode (LED) radiator base material |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105543730A (en) * | 2015-12-21 | 2016-05-04 | 漳州优普激光科技有限公司 | Laser marking machine case and preparing method thereof |
| CN105543730B (en) * | 2015-12-21 | 2019-02-05 | 漳州优普激光科技有限公司 | A kind of laser marking machine cabinet and preparation method thereof |
| CN105924888A (en) * | 2016-04-19 | 2016-09-07 | 安徽路明光电科技有限公司 | Mainboard for LED lamp and production process thereof |
| CN106634812A (en) * | 2016-12-23 | 2017-05-10 | 铜陵安博电路板有限公司 | Organic silicon resin pouring sealant with high thermal conductivity and low viscosity for PCB (Printed Circuit Board) |
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Application publication date: 20141112 |