CN106190124A - A kind of LED chip luminous lamp strip baseplate material and LEDbulb lamp - Google Patents

A kind of LED chip luminous lamp strip baseplate material and LEDbulb lamp Download PDF

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Publication number
CN106190124A
CN106190124A CN201610550327.5A CN201610550327A CN106190124A CN 106190124 A CN106190124 A CN 106190124A CN 201610550327 A CN201610550327 A CN 201610550327A CN 106190124 A CN106190124 A CN 106190124A
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light
emitting section
led
chip
led chip
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张伯文
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Priority to CN201610550327.5A priority Critical patent/CN106190124A/en
Priority to PCT/CN2016/093190 priority patent/WO2018010233A1/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7774—Aluminates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/10—Process efficiency

Abstract

A kind of LED chip luminous lamp strip baseplate material and LEDbulb lamp are the present invention relates to, it is characterised in that LEDbulb lamp is made up of light-emitting section (1), driving power supply (2), glass bead cell-shell (3), glass supporter stem stem (4) and electric connector (5)；Wherein glass bead cell-shell (3) and support stem stem (4) vacuum are filled with high heat-conducting gas, support stem stem (4) and the light-emitting section (1) being fixed thereon and are contained in and seal in cavity after being sealed to cavity；Light-emitting section (1) is sequentially connected electrically with driving power supply (2) and electric connector (5)；The light-emitting section (1) of LED chip is fired on a face of baseplate material (6) by YAG:Ce material powder and nitride red fluorescent powder body and comprises LED blue chip (9) and form, blue chip (9) surface-coated phosphor powder layer (7).Prepared by the low cost that the present invention uses the aqueous tape casting forming technique of novel environmental protection to realize High-quality transparent fluorescence polycrystal baseplate material.Obtain specular removal, fluorescence polycrystal baseplate material that high color rendering index (CRI), high optics pass through and colour temperature concordance good heat dissipation, reliability are high, the bulb lamp of life-span length.

Description

A kind of LED chip luminous lamp strip baseplate material and LEDbulb lamp
Technical field
The present invention relates to a kind of LED chip luminous lamp strip baseplate material and preparation method and LEDbulb lamp, especially used Replace, with YAG fluorescence complex phase polycrystal, the technical scheme being now luminous lamp strip substrate with sapphire, aluminium oxide ceramics etc., and describe in detail The preparation method of this polycrystal lamp bar substrate, belongs to inorganic material preparation and illumination application thereof.
Background technology
White light LEDs as a kind of solid state lighting technology the most progressively in normal lighting, Landscape Lighting, automobile headlamp, tunnel The fields such as illumination have started that it is commonly used, and show its advantage such as extremely strong energy-saving and environmental protection, life-span length.Recently, in country Under the promotion of the double policy of " disabling electric filament lamp " and energy-saving and emission-reduction, LED filament lamp as a kind of can 360 degree luminous standing of full angle Body light source changes the white light LEDs present situation in domestic lighting field, and it is with electric filament lamp as prototype configuration, " traditional external form, upgrading ' formula ' ", it is seen that it is exactly familiar lighting that the LED lamp that it is made just can figure out it, disappeared once listing Expense person is accepted.Candle lamp with LED filament as light source, Crystal lamp, bulb lamp start to occur in a large number subsequently.
Generally, main flow LED filament technique is typically the LED chip Series Package of 28 0.02W at long 38mm, diameter In the substrate strip (or 30mm × 0.8mm × 0.4mm) of 1.5mm, then carry out mould closedtop fluorescent glue and realize.LED filament uses 10mA electric current drives, and voltage is 84V, and power is 0.84W, and luminous flux is 100lm, and light efficiency can reach more than 120lm/W, if Collocation red chip, color rendering index can reach more than 95.It addition, the high-tension characteristic of small area analysis that LED filament possesses, effectively Reduce the heating of LED and the cost of driver, there is prominent advantage.
But, owing to the luminescence of LED is from the luminescence of PN junction, the photon of PN junction outgoing injects with electronics in PN junction and is produced Energy difference have the electrical power of about 70% to be changed into heat, how amount of heat is dissipated, it is to avoid because of PN junction temperature raise cause Luminous efficiency deteriorates that even " to burn to death " be one of all power-type LEDs crucial problem of being faced of illumination.For LED filament lamp, Owing to its chip uses the packing forms of COB (Chip on Board), its substrate area is too small, is packaged with again at chip surface Fluorescent glue, the heat radiation thus caused is not enough and light decay is the critical bottleneck limiting its tremendous development.At present, LED filament lamp uses Tank rushes noble gas (as argon-mixed in nitrogen, nitrogen etc.) or liquid (ethylene glycol, oil etc.) with conduction of heat, convection current or the form of radiation Dispel the heat, but bigger with design effect difference in real world applications.The most how to efficiently reduce heating or quick conductive is LED filament lamp reduces light decay, extends life-span, the guarantee of raising reliability.And the chip of LED filament lamp is all mounted in substrate material On material, then it is connected with metal heat-conducting system such as copper, aluminum etc. and dispels the heat.As heat transfer and the first stage of heat conduction, heat-conducting substrate The selection of material is a kind of effective scheme.At present, the lamp bar baseplate material that filament lamp is main mainly has sapphire (single Brilliant), transparent alumina (polycrystalline) and translucent white pottery (99 aluminium oxidies or 96 aluminium oxidies etc.) and other materials.Wherein monocrystalline is blue Gem has the highest bending strength, heat conductivity, refractive index and light transmission rate, it is ensured that its as baseplate material intensity, Heat radiation and optical property, but its price is sufficiently expensive, it is difficult to practical.Translucent white its relatively low light light transmittance of pottery and heat radiation system Number is the most often difficult to reach Practical Performance index, although its Costco Wholesale is substantially reduced.Multi-crystal transparent aluminium oxide is as one Can be higher to equipment requirements with moderate its preparation process of baseplate material, high-end market and low-end market are respectively arranged with deficiency, Status is awkward.
The low side filament lamp of below 2W is mainly based on glass substrate in the market, because heat radiation energy bears, and price ratio Relatively inexpensive, produce yield the highest.High-end product uses sapphire substrate the most mostly, and ceramic substrate occupies the big portion of centre Divide the market share.The series of patents that Zhejiang Ruidisheng Optoelectronics Co., Ltd. announces is (such as PCT/CN2011/079234, WO2012/ 031533) have employed transparency carrier such as soft glass, Bohemian glass, quartz glass, crystalline ceramics or plastics etc. in make, improve The luminous efficiency of LED.But, the baseplate material of above employing the most simply plays substrate fixed chip and corresponding thermolysis, The most transparent or semitransparent attribute is provided for higher light transmission rate and luminous efficiency, still needs to coating at chip surface Phosphor powder layer, at work long hours lower fluorescent material mixing silica gel or epoxy resin as the aging of fluorophor and light decay, including indigo plant The light decay that the light decay of light LED self, the temperature quenching of fluorescent material and organic siliconresin are aging etc. causes.Sea light in the Chinese Academy of Sciences The patent (201410161313.5) that precision optical machinery institute is announced uses crystalline ceramics, and (Ce:YAG (includes Ce ion concentration It is the situation of zero) or Ce:Tb3Al5O12Or Ce, Cr:YAG or Ce, Pr:YAG or " Ce:YAG+MgAl2O4" or " Ce, Pr:YAG+ MgAl2O4" or " Ce, Cr:YAG+MgAl2O4One in ") it is that baseplate material is while playing substrate effect, it is also possible to rise To the effect of fluorescent material, can effectively solve the Problem of Phosphor Decay in Rare Earth of LED filament lamp.But, simple in this technical scheme YAG:Ce material system is as the material (MgAl launching green-yellow light2O4Or unadulterated YAG is crystalline ceramics matrix material, not Luminous), although its can replace with Tb, Cr and Pr codope increases the red color light component in spectrum, but its to increase effect limited, it is aobvious Color performance and colour temperature ability of regulation and control are poor, do not still meet performance requirement during specifically used.
Summary of the invention
It is an object of the invention to propose a kind of LED chip luminous lamp strip baseplate material for existing problem, this Bright another object is to provide the preparation method of aforesaid substrate material, and the present invention also has purpose to be to provide to utilize above-mentioned LED core The LEDbulb lamp of sheet luminous lamp strip baseplate material.
The technical scheme is that the present invention proposes the LEDbulb lamp of a kind of novelty, it is with YAG fluorescence complex phase polycrystalline Body replacement now uses sapphire, aluminium oxide ceramics etc. to be luminous lamp strip substrate, and refers in detail to the preparation of this polycrystal lamp bar substrate Mode, strengthens red emission by introducing nitride Hydrargyri Oxydum Rubrum, and adds sintering aid, sintering modifier to improve complex phase polycrystal Sintering Problem.The aqueous tape casting forming technique using novel environmental protection again realizes High-quality transparent fluorescence polycrystal baseplate material Prepared by low cost.With this fluorescence polycrystal as substrate, blue chip one side coating phosphor powder layer, another side is not coated by fluorescent material Layer, in conjunction with advanced economic heat radiation gas design of components, efficiently solves heat problem, ensures simultaneously and improves filament entirety Luminescent quality.Be finally obtained specular removal, fluorescence polycrystal baseplate material that high color rendering index (CRI), high optics pass through and colour temperature one Cause property and good heat dissipation, reliability height, the bulb lamp of life-span length.
The concrete technical scheme of the present invention is as follows: a kind of LED chip luminous lamp strip baseplate material, it is characterised in that be by YAG:Ce material powder and nitride red fluorescent powder body are by mass percentage for 100:(1～5) mix after the YAG fluorescence fired Complex phase polycrystal；Wherein YAG:Ce material powder meets stoichiometric proportion (Y1-xCex)3Al5O12, wherein 0.05%≤x≤ 1.0%；Its peak luminous wavelength of nitride red fluorescent powder body is positioned at the red light region of 610～680nm, and its luminous half-peak is a width of 75～120nm, granularity is 5～10 μm, efficiently can be excited by the blue light in 360～470nm wave bands.
The size of the most above-mentioned baseplate material is for thickness: wide: long ratio is 1:(1.5～3): (50～200), optics full impregnated Rate of crossing is 50%～70% at 600nm.
Present invention also offers the method preparing above-mentioned LED chip luminous lamp strip baseplate material, it concretely comprises the following steps:
1. dispensing and ball milling: by (Y1-xCex)3Al5O12, 0.05%≤x≤1.0%, stoichiometric proportion weighs Y2O3、Al2O3 And CeO2Material powder, sintering aid and nitride fluorescent material and sintering modifying agent, addition deionized water is as solvent, then adds Enter dispersant, to ball grinder, add ball-milling medium (generally 1/3～the 1/2 of ball grinder volume) dispersion ball milling；Then will Binding agent adds, and adds plasticiser and defrother in the lump in ball grinder；Ball milling is continued with same rotating speed；The most all raw material powders Body: solvent deionized water: dispersant: binding agent: plasticiser: the mass ratio of defrother is (50～60): (20～30): (0.5～ 1.5): (15～25): (1～2): (0.5～1.0)；
2. flow casting molding: slurry step 1. obtained sieves, froth in vacuum；Prevent from slurry flowing on casting machine Prolong；The blank being cast enters hothouse and is dried, and finally gives the curtain coating blank that thickness is 0.4～1.2mm；
3. temperature etc. and pre-cut: 2. obtained blank vacuum plastic sealing is placed in temperature isostatic pressing machine and carries out pressurizeing to improve Consistency, temperature 60-80 DEG C, pressure is 80～120Mpa, the time 5～10min；Pre-cut is carried out in the case of considering shrinkage ratio Cutting, to exempt the multicrystal cutting processing of follow-up finished product；
4. binder removal: blank step 3. obtained is placed in Muffle furnace and carries out binder removal, programming rate 0.5～1 DEG C/min, 500～800 DEG C of insulations 4～10h；
5. sinter and anneal: by the biscuit after binder removal 1730 DEG C～1850 DEG C of vacuum-sinterings 4～30h, being then placed in sky In 1300 DEG C～1550 DEG C annealing 10～25h in gas, obtaining fine and close YAG fluorescence complex phase transparent polycrystal, external force is the most a little Obtain LED chip luminous lamp strip baseplate material.
The most above-mentioned Y2O3、Al2O3And CeO2Quality purity be 99.9～99.99%；Y2O3And CeO2Raw material granularity It is 0.5～2 μm, Al2O3Raw material granularity is 0.2～0.8 μm；Sintering aid is analytically pure TEOS and analytically pure MgO, burns The addition of knot auxiliary agent TEOS is Y2O3、Al2O3And CeO2The 0.05～0.50% of material powder gross mass, sintering aid MgO's Addition is Y2O3、Al2O3And CeO2The 0.05～0.20% of material powder gross mass；Sintering modifying agent is analytical pure CaO, sintering The addition of modifying agent is Y2O3、Al2O3、CeO2With nitride red fluorescent powder body gross mass 0.1～0.5%；Described divides Powder is polyacrylamide；Described binding agent be mass concentration be the PVA aqueous solution of 10～15.0%；Described plasticiser is Polyethylene Glycol (PEG-400)；Described defrother is polypropylene glycol (P-1200)；The rotating speed of described step 1. middle ball mill is 80～150r/min, adding ball mill ball milling jitter time is 20～24h；Continuation Ball-milling Time is 20-24h；Step 2. middle mistake It is sieved through 80～200 mesh sieves；The vacuum of froth in vacuum is 0.05～0.1MPa, and the de-bubble time is 5～8min；The edge of a knife of casting machine It is highly 0.5mm～1.5mm, is cast speed 10～200mm/min；Described dry it is divided into 50～70,90～95 and 50～70 DEG C syllogic is dried.
The transmitted wave a length of 430～470nm of 1～3 string PN junction series aiding connections is comprised on one face of preferable substrate material 6 LED blue chip 9, chip connects with electric connection line to each other, and at blue chip 9 surface-coated phosphor powder layer 7 by blue for part Light is changed into white light, and (phosphor powder layer is by using ripe scheme by business YAG:Ce fluorescent material and silica gel or epoxy resin mix and blend Making, general silica gel or epoxy resin account for the 85%～95% of phosphor powder layer weight, can use after agitated de-bubble uniformly)； Baseplate material does not has the one side of LED blue chip to be not coated by phosphor powder layer；The two ends of light-emitting section are equipped with electric connection line 10.LED The light-emitting section of chip can go out light with 4 π.
Present invention also offers based on the above-mentioned LEDbulb lamp that LED chip luminous lamp strip is light-emitting section, it is characterised in that It is made up of light-emitting section 1, driving power supply 2, glass bead cell-shell 3, glass supporter stem stem 4 and the electric connector 5 with LED chip；Wherein Glass bead cell-shell 3 and support stem stem 4 vacuum are filled with high heat-conducting gas, support stem stem 4 and sending out of being fixed thereon after being sealed to cavity Rhizoma Dioscoreae (peeled) 1 is contained in sealing cavity；Light-emitting section 1 is sequentially connected electrically with driving power supply 2 and electric connector 5；When lighting, electrical connection Device 5 electrically connects with external power source to power to LED light-emitting section again.
The most above-mentioned can the quantity of the 4 π LED chip light-emitting section 1 that goes out light be 1～10, and each light-emitting section 1 one side The quantity of upper LED blue chip need to meet after all light-emitting section 1 serial or parallel connections, and its total driving voltage drives electricity equal to outer Pressure, chip connects with electric connection line to each other.
Above-mentioned quantity is 1～10 and can go out the LED chip light-emitting section 1 of light and can be serially connected or connection in series-parallel by 4 π, permissible Connecting into two-way exchange or Unidirectional direct-current work, arrangement mode can be various each other in the cavities for it, is all sealed in ball bubble In shell in 3.
Above-mentioned driving power supply 2 when luminous lamp strip (1) two-way exchange works, respectively at least 1 LED light-emitting section 1 positive direction, Opposite direction turns on, and is respectively turned on luminescence when alternating current positive and negative alternate；Power supply 2 is driven to work at luminous lamp strip 1 Unidirectional direct-current Time, directly power with external dc power, or add the blood pressure lowering current-limiting circuit and filter circuit being made up of electric capacity, resistance.
Preferably glass bead cell-shell 3 has light transmission, can be with frosted, additive color, and it is shaped as A or G type；Described glass supporter Stem stem 4 is high printing opacity flint glass post, is used for supporting luminous lamp strip；Electric connector 5 is the one in E40 or E27；Glass ball bulb The gaseous mixture that high heat-conducting gas is nitrogen and hydrogen that shell 3 and support stem stem 4 vacuum are filled with after being sealed to cavity, wherein hydrogen institute Accounting for gaseous mixture volume ratio is 3.0～5.0%, and under room temperature (25 DEG C), gross pressure is 0.01～0.1MPa.
The luminous efficiency of the LEDbulb lamp prepared by the present invention reaches 130～180lm/W, and color rendering index is 85～92.Have Concordance is good for adjustable color (2500～7000K), good heat dissipation, reliability height, life-span length, low cost and other advantages.
Beneficial effect:
(1) present invention uses to replace with YAG fluorescence complex phase polycrystal and now uses sapphire, aluminium oxide ceramics etc. as luminous lamp strip Substrate, while it both assume responsibility for substrate effect, it is also possible to plays the effect of fluorescent material, efficiently solves light decay problem, increases The service life of strong LED filament bulb lamp and reliability.
(2) present invention coats phosphor powder layer in LED filament lamp strip substrate side, and side is not coated by phosphor powder layer, is subtracting The motility of phosphor powder layer regulation and control photochromic to light fixture is remained, to meet difference easily while having lacked the consumption of phosphor powder layer The demand that power, different quality are photochromic.
(3) in the present invention YAG fluorescence complex phase polycrystal use aqueous tape casting forming technique prepare, environmental protection and energy saving, solvent without Pollute, to operator's fanout free region.Under the component formula and technological parameter of regulation, it is cast sheet thickness controllable precise, micro-knot Structure is uniform, avoids following process cutting.
(4) in the present invention, YAG fluorescence complex phase polycrystal arranges in pairs or groups out with YAG:Ce raw material powder and nitride Hydrargyri Oxydum Rubrum Filament bulb lamp goes out color rendering index and the colour temperature of light, and its light efficiency is high, and color developing and colour temperature concordance are good.
(5) in the present invention in the YAG multicrystal preparation process of fluorescence complex phase add sintering aid and be applicable to complex phase Multicrystal sintering modifying agent, efficiently solves biphase Polycrystalline body interface consistency problem and High-quality transparent polycrystal Technology of preparing.
(6) present invention is using on the basis of fluorescence complex phase polycrystal is lamp bar, by improving convection current in bulb lamp cavity The kind of gas and ratio, do not coat the intrinsic advantage of fluorescent material, it is thus achieved that the most right in conjunction with polycrystal bar substrate side Stream and the radiating effect of conduction of heat.
(7) cheap (the primary raw material Rare Earth Y used of the YAG fluorescence complex phase polycrystal lamp bar raw material that prepared by the present invention2O3Valency Lattice (99.99%, 50-60 unit/Kg) are even below Al2O3(99.99%, 100～120 yuan/Kg)), technique environmental protection, low cost.
(8) the YAG fluorescence complex phase polycrystal full transmitance of its optics that the present invention prepares at 600nm be 50%～ 70%, optical transmittance and luminous intensity are high, as its luminous efficiency of LEDbulb lamp of filament substrate design up to 130～ 180lm/W, color rendering index is 85～92, and adjustable color (2500～7000K) concordance is good.
Accompanying drawing explanation
Fig. 1 is the LED lamp bulb structure in present patent application embodiment 1 with YAG fluorescence complex phase polycrystal as luminous lamp strip Schematic diagram；Wherein, 1-with YAG fluorescence complex phase polycrystal as substrate, the LED chip light-emitting section of light can be gone out with 4 π；2-drives power supply； 3-glass bead cell-shell；4-glass supporter stem stem；5-electric connector.
Fig. 2 is YAG fluorescence complex phase polycrystal luminous lamp strip generalized section in present patent application embodiment 1；Wherein, 6-is glimmering Light polycrystal substrate；7-phosphor powder layer；8-series wiring；9-blue chip；10-electric connection line.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is explained in detail.These embodiments will assist in the skill of this area Art personnel are further appreciated by the present invention, but limit the scope of the present invention the most in any form.In addition, it is to be understood that without departing from this On the premise of bright design, the present invention is made various changes or modifications by those skilled in the art, and these broadly fall into the guarantor of the present invention Protect scope.
Embodiment 1
(1) preparation of YAG fluorescence complex phase polycrystal substrate:
1. dispensing and ball milling: stoichiometrically weigh Y2O3、Al2O3、CeO2Material powder, sintering aid and nitride material All powder body such as material and sintering modifying agent, addition deionized water is as solvent, and adding polyacrylamide is dispersant, to ball milling In tank, add the ball-milling medium of 1/3 volume；Ball milling 22h is disperseed under the speed of 150r/min；By be pre-configured with 15.0wt%PVA aqueous solution adds as binding agent, adds plasticiser Polyethylene Glycol (PEG-400) and defrother poly-the third two in the lump Alcohol P-1200 is in ball grinder；Continue with same rotating speed ball milling 24h；Wherein, all material powder (Y2O3、Al2O3And CeO2): molten Agent deionized water: dispersant polyacrylamide: binding agent PVA aqueous solution: plasticiser PEG: the mass ratio of defrother polypropylene glycol For 50:25:1.5:20:1:0.5.
Wherein, YAG:Ce material powder used, by meeting stoichiometric proportion (Y1-xCex)3Al5O12Raw material composition, wherein x =1.0%；Including high-purity Y2O3、Al2O3、CeO2(purity is 99.9～99.99%) and sintering aid tetraethyl orthosilicate And MgO (TEOS).Wherein, Y2O3、CeO2Raw material granularity is 0.5 μm, 1.0 μm, Al2O3Raw material granularity is 0.2 μm；Sintering aid More than the equal Analysis about Selection of TEOS Yu MgO is pure, its addition is respectively Y2O3、Al2O3、CeO2Material powder gross mass 0.05wt.%, 0.10wt.%.
Wherein, nitride fluorescent material used is commercial Sr2Si5N8:Eu2+Red fluorescence powder, its peak luminous wavelength is positioned at 640nm red light region, its luminous a width of 104nm of half-peak, granularity is 5 μm, and exciting scope is 360～470nm, center excitation wavelength 455nm。
Wherein, YAG:Ce material powder is 100:5 with the mass percent of nitride fluorescent material；Add and be used for improving again The sintering modifying agent analytical pure CaO of phase polycrystal performance is all powder (Y2O3、Al2O3、CeO2And nitride fluorescent material) add The 0.5wt.% of dosage.
2. flow casting molding: slurry step 1. obtained sieves 80 mesh sieves, then de-bubble 6min under 0.08MPa vacuum. Preventing from slurry being cast on casting machine, edge height is 0.5mm, is cast speed 10mm/min；The blank being cast is entered Entering hothouse to be dried, baking temperature is divided into syllogic, respectively 50,90,70 DEG C, finally gives the curtain coating base that thickness is 0.4mm Sheet.
3. temperature etc. and pre-cut: 2. obtained blank vacuum plastic sealing is placed in temperature isostatic pressing machine and carries out pressurizeing to improve Consistency, temperature 60 C, pressure is 120Mpa, time 5min, and pre-cut on pre-cut machine.
4. binder removal: blank step 3. obtained is placed in Muffle furnace and carries out binder removal, and 0.5 DEG C/min of programming rate, 600 DEG C insulation 8h.
5. sinter and anneal: by biscuit after binder removal at 1730 DEG C of vacuum-sintering 30h, being then placed in air and move back in 1400 DEG C Fire 20h, obtains fine and close YAG fluorescence complex phase transparent polycrystal, and external force separately i.e. can get the substrate material of luminous lamp strip (1) a little Material.
(2) thickness in the YAG fluorescence complex phase polycrystal size that step () obtains: wide: long ratio is 1:2:50, and optics is complete Transmission measurement is 70% at 600nm, and SEM shows its uniform microstructure.
(3) preparation of luminous lamp strip and connection: can the quantity of the 4 π LED chip light-emitting section (1) that goes out light be 2, and often The LED blue chip (launching wavelength 455nm) of 2 string PN junction series aiding connections, all light-emitting sections are comprised on piece light-emitting section (1) one side (1) series connection, connects into two-way exchange, its in the cavities each other arrangement mode see Fig. 1, be all sealed in ball cell-shell in (3), Its total driving voltage is close to outer driving voltage.
Light-emitting section (1) there is the one side of LED blue chip need to coat phosphor powder layer and some blue light is changed into white light, Light bisque by using ripe scheme to be made up with the LED special silica gel mix and blend of encapsulation of business YAG:Ce fluorescent material, silica gel, fluorescent material Quality accounting is 86.3%, 13.7%, can use after agitated de-bubble uniformly；And the upper YAG fluorescence complex phase polycrystalline of light-emitting section (1) Structure base board does not has LED blue chip one side to be not coated by phosphor powder layer, and generalized section is shown in Fig. 2.
(4) power supply (2) is driven: luminous lamp strip (1) two-way exchange works, 1 LED light-emitting section (1) positive direction, 1 negative side To conducting, it is respectively turned on luminescence when alternating current positive and negative alternate
(5) glass bead cell-shell (3) has light transmission, for water white transparency A type Lamp bulb case.Glass supporter stem stem (4) is high Printing opacity flint glass post, is used for supporting luminous lamp strip.Electric connector (5) is that E40 is now with bulb connection standard lamp holder handware.
(6) light-emitting section (1), driving power supply (2), glass bead cell-shell (3), glass supporter stem stem (4) and the electricity obtained respectively Adapter (5) is connected to each other；Wherein glass bead cell-shell (3) and support stem stem (4) vacuum are filled with high heat conduction nitrogen after being sealed to cavity Gas and the gaseous mixture of hydrogen, under room temperature, gross pressure is 0.1MPa, and volume ratio shared by hydrogen is 3.5%.Support stem stem (4) and solid Fixed light-emitting section thereon (1) is contained in sealing cavity；Light-emitting section (1) is electrically connected successively with driving power supply (2) and electric connector (5) Connect；When lighting, electric connector (5) electrically connects with external power source to power to LED light-emitting section again.
The final LEDbulb lamp schematic diagram prepared is Fig. 1, its luminous efficiency up to 180lm/W, color rendering index 92, color Temperature 2500.
Embodiment 2
(1) preparation of YAG fluorescence complex phase polycrystal substrate:
1. dispensing and ball milling: stoichiometrically weigh Y2O3、Al2O3、CeO2Material powder, sintering aid and nitride material All powder body such as material and sintering modifying agent, addition deionized water is as solvent, and adding polyacrylamide is dispersant, to ball milling In tank, add the ball-milling medium of 1/2 volume；Ball milling 24h is disperseed under the speed of 80r/min；By be pre-configured with 10.0wt%PVA aqueous solution adds as binding agent, adds plasticiser Polyethylene Glycol (PEG-400) and defrother poly-the third two in the lump Alcohol P-1200 is in ball grinder；Continue with same rotating speed ball milling 20h；Wherein, all material powders: solvent deionized water: dispersion Agent polyacrylamide: binding agent PVA aqueous solution: plasticiser PEG: the mass ratio of defrother polypropylene glycol is 60:20:0.5:15: 1.5:1.0。
Wherein, YAG:Ce material powder used, by meeting stoichiometric proportion (Y1-xCex)3Al5O12Raw material composition, wherein x =0.05%；Including high-purity Y2O3、Al2O3、CeO2(purity is 99.9～99.99%) and sintering aid tetraethyl orthosilicate And MgO (TEOS).Wherein, Y2O3、CeO2Raw material granularity is 2 μm, 0.5 μm, Al2O3Raw material granularity is 0.8 μm；Sintering aid TEOS More than Analysis about Selection equal with MgO is pure, its addition is respectively Y2O3、Al2O3、CeO2The 0.5wt.% of material powder gross mass, 0.05wt.%.
Wherein, nitride fluorescent material used is commercial Ca2Si5N8:Eu2+Red fluorescence powder, its peak luminous wavelength is positioned at 610nm red light region, its luminous half-peak breadth 120nm, granularity is 10 μm, and exciting scope is 360～470nm, center excitation wavelength 460nm。
Wherein, YAG:Ce material powder is 100:3 with the mass percent of nitride fluorescent material；Add and be used for improving again The 0.2wt.% that sintering modifying agent analytical pure CaO is all powder additions of phase polycrystal performance.
2. flow casting molding: slurry step 1. obtained sieves 200 mesh sieves, then de-bubble 8min under 0.10MPa vacuum. Preventing from slurry being cast on casting machine, edge height is 1.5mm, is cast speed 200mm/min；The blank being cast is entered Entering hothouse to be dried, baking temperature is divided into syllogic, respectively 70,95,60 DEG C, finally gives the curtain coating base that thickness is 1.2mm Sheet.
3. temperature etc. and pre-cut: 2. obtained blank vacuum plastic sealing is placed in temperature isostatic pressing machine and carries out pressurizeing to improve Consistency, temperature 80 DEG C, pressure is 80Mpa, time 10min, and pre-cut on pre-cut machine.
4. binder removal: blank step 3. obtained is placed in Muffle furnace and carries out binder removal, and 1.0 DEG C/min of programming rate, 500 DEG C insulation 10h.
5. sinter and anneal: by biscuit after binder removal at 1800 DEG C of vacuum-sintering 20h, being then placed in air and move back in 1300 DEG C Fire 25h, obtains fine and close YAG fluorescence complex phase transparent polycrystal, and external force separately i.e. can get the substrate material of luminous lamp strip (1) a little Material.
(2) thickness in the YAG fluorescence complex phase polycrystal size that step () obtains: wide: long ratio is 1:1.5:100, optics Full transmission measurement is 50% at 600nm, and SEM shows its uniform microstructure.
(3) preparation of luminous lamp strip and connection: can the quantity of the 4 π LED chip light-emitting section (1) that goes out light be 1, and send out Comprise the LED blue chip (launching wavelength 430nm) of 3 string PN junction series aiding connections on Rhizoma Dioscoreae (peeled) (1) one side, be sealed in ball cell-shell (3), in, its total driving voltage is close to outer driving voltage.
Light-emitting section (1) there is the one side of LED blue chip need to coat phosphor powder layer and some blue light is changed into white light, Light bisque by using ripe scheme to be made up with the LED special silica gel mix and blend of encapsulation of business YAG:Ce fluorescent material, silica gel, fluorescent material Quality accounting is 92.8%, 7.2%, can use after agitated de-bubble uniformly；And the upper YAG fluorescence complex phase polycrystalline of light-emitting section (1) Structure base board does not has the one side of LED blue chip to be not coated by phosphor powder layer.
(4) power supply (2) is driven: luminous lamp strip (1) Unidirectional direct-current works, and directly powers with external dc power,
(5) glass bead cell-shell (3) has light transmission, for frosted translucent G type Lamp bulb case.Glass supporter stem stem (4) is High printing opacity flint glass post, is used for supporting luminous lamp strip.Electric connector (5) is that E27 is now with bulb connection standard lamp holder handware.
(6) light-emitting section (1), driving power supply (2), glass bead cell-shell (3), glass supporter stem stem (4) and the electricity obtained respectively Adapter (5) is connected to each other；Wherein glass bead cell-shell (3) and support stem stem (4) vacuum are filled with high heat conduction nitrogen after being sealed to cavity Gas and the gaseous mixture of hydrogen, under room temperature, gross pressure is 0.01MPa, and volume ratio shared by hydrogen is 3.0%.Support stem stem (4) and The light-emitting section (1) being fixed thereon is contained in sealing cavity；Light-emitting section (1) and driving power supply (2) and electric connector (5) electricity successively Connect；When lighting, electric connector (5) electrically connects with external power source to power to LED light-emitting section again.
Final LEDbulb lamp luminous efficiency 130lm/W prepared, color rendering index 85, colour temperature 7000K.
Embodiment 3
(1) preparation of YAG fluorescence complex phase polycrystal substrate:
1. dispensing and ball milling: stoichiometrically weigh Y2O3、Al2O3、CeO2Material powder, sintering aid and nitride material All powder body such as material and sintering modifying agent, addition deionized water is as solvent, and adding polyacrylamide is dispersant, to ball milling In tank, add the ball-milling medium of 2/5 volume；Ball milling 20h is disperseed under the speed of 120r/min；By be pre-configured with 12.0wt%PVA aqueous solution adds as binding agent, adds plasticiser Polyethylene Glycol (PEG-400) and defrother poly-the third two in the lump Alcohol P-1200 is in ball grinder；Continue with same rotating speed ball milling 22h；Wherein, all material powders: solvent deionized water: dispersion Agent polyacrylamide: binding agent PVA aqueous solution: plasticiser PEG: the mass ratio of defrother polypropylene glycol is 55:30:1.0:25: 2:0.8。
Wherein, YAG:Ce material powder used, by meeting stoichiometric proportion (Y1-xCex)3Al5O12Raw material composition, wherein x =0.5%；Including high-purity Y2O3、Al2O3、CeO2(purity is 99.9～99.99%) and sintering aid tetraethyl orthosilicate And MgO (TEOS).Wherein, Y2O3、CeO2Raw material granularity is 1.0 μm, 1.5 μm, Al2O3Raw material granularity is 0.5 μm；Sintering aid More than the equal Analysis about Selection of TEOS Yu MgO is pure, its addition is respectively Y2O3、Al2O3、CeO2Material powder gross mass 0.2wt.%, 0.2wt.%.
Wherein, nitride fluorescent material used is commercial CaAlSiN3:Eu2+Red fluorescence powder, its peak luminous wavelength position In 680nm red light region, its luminous a width of 75nm of half-peak, granularity is 8 μm, and exciting scope is 360～470nm, center excitation wave Long 460nm.
Wherein, YAG:Ce material powder is 100:1 with the mass percent of nitride fluorescent material；Add and be used for improving again The 0.1wt.% that sintering modifying agent analytical pure CaO is all powder additions of phase polycrystal performance.
2. flow casting molding: slurry step 1. obtained sieves 150 mesh sieves, then de-bubble 5min under 0.05MPa vacuum. Preventing from slurry being cast on casting machine, edge height is 1.0mm, is cast speed 100mm/min；The blank being cast is entered Entering hothouse to be dried, baking temperature is divided into syllogic, respectively 60,92,50 DEG C, finally gives the curtain coating base that thickness is 0.8mm Sheet.
3. temperature etc. and pre-cut: 2. obtained blank vacuum plastic sealing is placed in temperature isostatic pressing machine and carries out pressurizeing to improve Consistency, temperature 70 C, pressure is 100Mpa, time 8min, and pre-cut on pre-cut machine.
4. binder removal: blank step 3. obtained is placed in Muffle furnace and carries out binder removal, 0.67 DEG C/min of programming rate, 800 DEG C of insulation 4h.
5. sinter and anneal: by biscuit after binder removal at 1850 DEG C of vacuum-sintering 4h, being then placed in air and move back in 1550 DEG C Fire 10h, obtains fine and close YAG fluorescence complex phase transparent polycrystal, and external force separately i.e. can get the substrate material of luminous lamp strip (1) a little Material.
(2) thickness in the YAG fluorescence complex phase polycrystal size that step () obtains: wide: long ratio is 1:3:200, and optics is complete Transmission measurement is 62% at 600nm, and SEM shows its uniform microstructure.
(3) preparation of luminous lamp strip and connection: can the quantity of the 4 π LED chip light-emitting section (1) that goes out light be 10, and The LED blue chip (launch wavelength 470nm) of 1 string PN junction series aiding connection is comprised on each light-emitting section (1) one side, the most each 5 After bar light-emitting section (1) series connection, both are in parallel, its prism-shaped arrangement each other in the cavities, are all sealed in ball cell-shell (3) In, its total driving voltage is close to outer driving voltage.
Light-emitting section (1) there is the one side of LED blue chip need to coat phosphor powder layer and some blue light is changed into white light, Light bisque by using ripe scheme to be made up with the LED special epoxy resin mix and blend of encapsulation of business YAG:Ce fluorescent material, asphalt mixtures modified by epoxy resin Fat, fluorescent material quality accounting are 88.2%, 11.8%, can use after agitated de-bubble uniformly；And the upper YAG of light-emitting section (1) is glimmering Light complex phase polycrystal substrate does not has the one side of LED blue chip to be not coated by phosphor powder layer.
(4) drive power supply (2): luminous lamp strip (1) Unidirectional direct-current works, use the blood pressure lowering current limliting being made up of electric capacity, resistance Circuit and filter circuit scheme.
(5) glass bead cell-shell (3) has light transmission, for pseudo-classic golden R type Lamp bulb case.Glass supporter stem stem (4) is high Printing opacity flint glass post, is used for supporting luminous lamp strip.Electric connector (5) is that GY is now with bulb connection standard lamp holder handware.
(6) light-emitting section (1), driving power supply (2), glass bead cell-shell (3), glass supporter stem stem (4) and the electricity obtained respectively Adapter (5) is connected to each other；Wherein glass bead cell-shell (3) and support stem stem (4) vacuum are filled with high heat conduction nitrogen after being sealed to cavity Gas and the gaseous mixture of hydrogen, under room temperature, gross pressure is 0.05MPa, and volume ratio shared by hydrogen is 5.0%.Support stem stem (4) and The light-emitting section (1) being fixed thereon is contained in sealing cavity；Light-emitting section (1) and driving power supply (2) and electric connector (5) electricity successively Connect；When lighting, electric connector (5) electrically connects with external power source to power to LED light-emitting section again.
The final LEDbulb lamp luminous efficiency prepared up to 145lm/W, color rendering index 87, colour temperature 4500.

Claims (10)

1. a LED chip luminous lamp strip baseplate material, it is characterised in that be glimmering with nitride red by YAG:Ce material powder Light powder body is by mass percentage for 100:(1～5) the YAG fluorescence complex phase polycrystal fired after mixing；Wherein YAG:Ce raw material powder Body meets stoichiometric proportion (Y1-xCex)3Al5O12, wherein 0.05%≤x≤1.0%；Its glow peak of nitride red fluorescent powder body Value wavelength is positioned at the red light region of 610～680nm, and its luminous half-peak a width of 75～120nm, granularity is 5～10 μm, can be by 360 ～the blue light in 470nm wave band efficiently excites.
2. the LED chip luminous lamp strip baseplate material as described in claim 1, it is characterised in that the size of baseplate material is thick: Wide: long ratio is 1:(1.5～3): (50～200), the full transmitance of optics is 50%～70% at 600nm.
3. the method preparing LED chip luminous lamp strip baseplate material as claimed in claim 1, it concretely comprises the following steps:
1. dispensing and ball milling: by (Y1-xCex)3Al5O12, 0.05%≤x≤1.0%, stoichiometric proportion weighs Y2O3、Al2O3With CeO2Material powder, sintering aid and nitride fluorescent material and sintering modifying agent, addition deionized water, as solvent, adds Dispersant, to ball grinder, adds ball-milling medium dispersion ball milling；Then binding agent is added, another and add plasticiser and Defrother is in ball grinder；Ball milling is continued with same rotating speed；The most all material powders: solvent deionized water: dispersant: bonding Agent: plasticiser: the mass ratio of defrother is (50～60): (20～30): (0.5～1.5): (15～25): (1～2): (0.5～ 1.0)；
2. flow casting molding: slurry step 1. obtained sieves, froth in vacuum；Prevent from slurry being cast on casting machine； The blank being cast enters hothouse and is dried, and finally gives the curtain coating blank that thickness is 0.4～1.2mm；
3. temperature etc. and pre-cut: 2. obtained blank vacuum plastic sealing is placed in temperature isostatic pressing machine and carries out pressurizeing to improve densification Degree, temperature 60-80 DEG C, pressure is 80～120Mpa, the time 5～10min；Pre-cutting is carried out in the case of considering shrinkage ratio Cut, to exempt the multicrystal cutting processing of follow-up finished product；
4. binder removal: blank step 3. obtained is placed in Muffle furnace and carries out binder removal, programming rate 0.5～1 DEG C/min, 500 ～800 DEG C of insulations 4～10h；
5. sinter and anneal: by the biscuit after binder removal 1730 DEG C～1850 DEG C of vacuum-sinterings 4～30h, being then placed in air In 1300 DEG C～1550 DEG C annealing 10～25h, obtaining fine and close YAG fluorescence complex phase transparent polycrystal, external force separately i.e. obtains a little LED chip luminous lamp strip baseplate material.
4. the method as described in claim 3, it is characterised in that described Y2O3、Al2O3And CeO2Quality purity be 99.9 ～99.99%；Y2O3And CeO2Raw material granularity is 0.5～2 μm, Al2O3Raw material granularity is 0.2～0.8 μm；Sintering aid is for dividing Analysing pure TEOS and analytically pure MgO, the addition of sintering aid TEOS is Y2O3、Al2O3And CeO2Material powder gross mass 0.05～0.50%, the addition of sintering aid MgO is Y2O3、Al2O3And CeO2The 0.05～0.20% of material powder gross mass； Sintering modifying agent is analytical pure CaO, and the addition of sintering modifying agent is Y2O3、Al2O3、CeO2Total with nitride red fluorescent powder body The 0.1～0.5% of quality；Described dispersant is polyacrylamide；Described binding agent be mass concentration be 10～15.0% PVA aqueous solution；Described plasticiser is Polyethylene Glycol；Described defrother is polypropylene glycol；Described step 1. middle ball milling The rotating speed of machine is 80～150r/min, and adding ball mill ball milling jitter time is 20～24h；Continuation Ball-milling Time is 20-24h； Step 2. middle mistake is sieved through 80～200 mesh sieves；The vacuum of froth in vacuum is 0.05～0.1MPa, and the de-bubble time is 5～8min；Stream The edge height prolonging machine is 0.5mm～1.5mm, is cast speed 10～200mm/min；Described dry be divided into 50～70,90～ 95 and 50～70 DEG C of syllogic are dried.
5. the LED chip light-emitting section with the YAG fluorescence complex phase polycrystalline material described in claim 1 as substrate, its feature It is on a face of baseplate material (6) that the LED comprising the transmitted wave a length of 430～470nm of 1～3 string PN junction series aiding connections is blue Optical chip (9), chip connects with electric connection line (10) to each other, and at blue chip (9) surface-coated phosphor powder layer (7) by portion Blue light is divided to be changed into white light；Baseplate material does not has the one side of LED blue chip to be not coated by phosphor powder layer；The two ends assembling of light-emitting section There is electric connection line.
6. the LEDbulb lamp with the LED chip luminous lamp strip described in claim 5 as light-emitting section, it is characterised in that by with The light-emitting section (1) of LED chip, driving power supply (2), glass bead cell-shell (3), glass supporter stem stem (4) and electric connector (5) group Become；Wherein glass bead cell-shell (3) and support stem stem (4) vacuum are filled with high heat-conducting gas after being sealed to cavity, support stem stem (4) and The light-emitting section (1) being fixed thereon is contained in sealing cavity；Light-emitting section (1) and driving power supply (2) and electric connector (5) electricity successively Connect；When lighting, electric connector (5) electrically connects with external power source to power to LED light-emitting section again.
7. the LEDbulb lamp as described in claim 6, it is characterised in that: the quantity of LED chip light-emitting section (1) is 1～10, And the quantity of LED blue chip need to meet after all light-emitting sections (1) serial or parallel connection on each light-emitting section (1) one side, its Total driving voltage is equal to outer driving voltage, and chip connects with electric connection line to each other.
8. the LEDbulb lamp as described in claim 6, it is characterised in that: drive power supply (2) in luminous lamp strip (1) two-way exchange During work, at least 1 LED light-emitting section (1) positive direction, opposite direction conducting, is respectively turned on when alternating current positive and negative alternate respectively Luminous；Drive power supply (2) when luminous lamp strip (1) Unidirectional direct-current works, directly power with external dc power, or add by electricity The blood pressure lowering current-limiting circuit of appearance, resistance composition and filter circuit.
9. the LEDbulb lamp as described in claim 6, it is characterised in that: glass bead cell-shell (3) be shaped as A or G type；Described Glass supporter stem stem (4) be high printing opacity flint glass post, be used for supporting luminous lamp strip；Electric connector (5) is in E40 or E27 One；The high heat-conducting gas that glass bead cell-shell (3) and support stem stem (4) vacuum are filled with after being sealed to cavity is nitrogen and hydrogen Gaseous mixture, wherein shared by hydrogen, gaseous mixture volume ratio is 3.0～5.0%, and under room temperature, gross pressure is 0.01～0.1MPa.
10. the LEDbulb lamp as described in claim 6, it is characterised in that: the luminous efficiency of LEDbulb lamp reaches 130～180lm/ W, color rendering index is 85～92.
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