CN106182471A - A kind of polycrystalline silicon rod cutting method - Google Patents
A kind of polycrystalline silicon rod cutting method Download PDFInfo
- Publication number
- CN106182471A CN106182471A CN201610548901.3A CN201610548901A CN106182471A CN 106182471 A CN106182471 A CN 106182471A CN 201610548901 A CN201610548901 A CN 201610548901A CN 106182471 A CN106182471 A CN 106182471A
- Authority
- CN
- China
- Prior art keywords
- silicon rod
- cutting
- polycrystalline silicon
- cutting method
- tilt angle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
Abstract
The invention discloses a kind of polycrystalline silicon rod cutting method, before silicon rod is carried out multi-wire saw, adjust the tilt angle alpha of each silicon rod on cutting working platform, so that cutting gauze first cuts the glue layer of each silicon rod outgoing line side in the stage of returning sword.The polycrystalline silicon rod cutting method of the present invention has the advantages such as easy and simple to handle, cut quality is stable.
Description
Technical field
The invention mainly relates to silicon rod processing technique field, refer in particular to a kind of polycrystalline silicon rod cutting method.
Background technology
Multi-wire saw is that one is moved back and forth by high speed wiry, abrasive material is brought into semiconductor processing areas and grinds
Mill, is cut into the novel cutting process method of one of hundreds of plate sheet by hard brittle materials such as quasiconductors the most simultaneously.
Silicon chip is the main production material in the field such as quasiconductor and photovoltaic.Multi-wire wafer cutting technique be at present the most in the world than
More advanced silicon chip process technology, it is different from the cutting modes such as traditional knife saw sheet, grinding wheel, also different from advanced laser
Cutting and inner circle are cut, and its principle is to drive the cutting blade material being attached on steel wire to silicon by the steel wire of a high-speed motion
Rod rubs, thus reaches cutting effect.During whole, the steel wire guiding by ten several guide rollers, at main line roller
Upper formation one bracing cable net, and workpiece to be processed realizes the feeding of workpiece by the decline of workbench.
At present when carrying out cutting operation, it is in silicon rod meeting when cutting of same workbench end of incoming cables (such as left side)
The situation that quality is unstable occurs, and the silicon rod quality being in right side is more stable.Trace it to its cause, as it is shown in figure 1, have found that
Line bow (active force pressed down such as silicon rod), i.e. silicon rod is returned sword when, silicon rod two end-grain cutting is there is during silicon rod cutting on line
In the same horizontal line, first end of incoming cables can cut through silicon rod to not place, the position cut, and contacts adhesive-layer (glass plate and silicon
Between rod), due to running up of steel wire, thus produce substantial amounts of heat so that the glue of solidification liquefies rapidly, and glue is attached to
Steel wire have impact on the band sand ability of steel wire, and the silicon-carbide particles then participating in cutting reduce, and cutting power weakens, thus reduces
The cut quality of silicon rod.
Summary of the invention
The technical problem to be solved in the present invention is that the technical problem existed for prior art, and the present invention provides one
Plant polycrystalline silicon rod cutting method easy and simple to handle, cut quality is stable.
For solving above-mentioned technical problem, the technical scheme that the present invention proposes is:
A kind of polycrystalline silicon rod cutting method, before silicon rod is carried out multi-wire saw, on adjustment cutting working platform, each silicon rod inclines
Rake angle α, so that cutting gauze first cuts the glue layer of each silicon rod outgoing line side in the stage of returning sword.
Further improvement as technique scheme:
The tilt angle alpha of the silicon rod being positioned at inlet wire side on cutting working platform is adjusted.
The top of described silicon rod tilts toward the cut direction of cutting gauze.
The tilt angle alpha of described silicon rod is 5～10 degree.
In sandwiched implant between dovetail seat and the mounting groove of cutting working platform at silicon rod top to adjust silicon rod
Tilt angle alpha.
Described implant is iron bar.
Use the dovetail seat of inclined shape to adjust the tilt angle alpha of silicon rod.
Use the glass plate of inclined shape to adjust the tilt angle alpha of silicon rod.
When carrying out cutting operation, the cutting gauze between adjacent silicon rod is carried out sandblasting slurry process.
Compared with prior art, it is an advantage of the current invention that:
The polycrystalline silicon rod cutting method of the present invention, by adjusting the tilt angle alpha of silicon rod so that it is carrying out returning sword of multi-wire saw
Stage of returning sword during the stage first cuts the glue-line of each silicon rod outgoing line side, it is to avoid end of incoming cables is first cut glue-line and affected the band of cutting gauze
Sand ability, thus affect the cut quality of silicon rod back segment；And method of adjustment is easy and simple to handle, be easily achieved.
Accompanying drawing explanation
Silicon rod structural representation when Fig. 1 is to cut in prior art.
Fig. 2 is the method for the embodiment of the present invention one silicon rod cutting schematic diagram when application.
Fig. 3 is the method for the embodiment of the present invention two silicon rod cutting schematic diagram when application.
Fig. 4 is the method for the embodiment of the present invention three silicon rod cutting schematic diagram when application.
In figure, label represents: 1, workbench；11, mounting groove；12, implant；2, silicon rod；3, glue layer；4, glass plate；5、
Dovetail seat；6, cutting gauze；7, mortar pipe.
Detailed description of the invention
Below in conjunction with Figure of description and specific embodiment, the invention will be further described.
Embodiment one:
As in figure 2 it is shown, polycrystalline silicon rod 2 is affixed on cutting working platform 1, i.e. dovetail seat 5 is installed on the installation of cutting working platform 1
In groove 11, glass plate 4 is then pasted onto the lower surface of dovetail seat 5 by glue, and silicon rod 2 is then pasted onto glass plate 4 by glue layer 3
Lower surface on.The polycrystalline silicon rod cutting method of the present embodiment, then be before silicon rod 2 is carried out multi-wire saw, adjusts cutting
The tilt angle alpha (before normal condition be each silicon rod 2 and glue layer 3 is on horizontal plane) of each silicon rod 2 on workbench 1, so that
Cutting gauze 6 first cuts the glue-line of each silicon rod 2 outgoing line side in the stage of returning sword.Due to first cutting silicon rod 2 outgoing line side of cutting gauze 6
Glue-line, so that the cutting gauze 6 of cutting glue layer 3 is gone out from the outgoing line side of silicon rod 2, and is in the cutting of silicon rod 2 inlet wire side
Gauze 6 will not first contact glue-line, and it without impact, thus ensures the cut quality of silicon rod 2 to the cutting of silicon rod 2.
In the present embodiment, the tilt angle alpha of the silicon rod 2 that cutting working platform 1 is positioned at inlet wire side is adjusted, owing to cutting
The line bow degree problem of secant net 6, the silicon rod 2 being in outgoing line side does not have the affected problem of line of cut net 6, from without
Adjust, and have only to the silicon rod 2 of inlet wire side is adjusted.
In the present embodiment, the top of silicon rod 2 tilts toward the cut direction of cutting gauze 6, the angle of inclination and line bow degree
Relevant, can obtain through experiment, concrete tilt angle alpha is 5～10 degree, thus ensure cut gauze 6 can return sword the stage can head
First contact the glue-line of silicon rod 2 outgoing line side, it is ensured that the cutting gauze 6 of cutting silicon rod 2 will not be affected by glue layer 3.
As in figure 2 it is shown, in the present embodiment, at the mounting groove 11 of the dovetail seat 5 with cutting working platform 1 being positioned at silicon rod 2 top
Between sandwiched implant 12 with adjust silicon rod 2 tilt angle alpha, implant 12 can be iron bar, and its thickness inclines according to its needs
Depending on oblique angle.
As in figure 2 it is shown, in the present embodiment, cutting working platform 1 is provided with two silicon rods 2, it is divided into left silicon rod and right silicon rod, cuts
The cut direction of secant net 6 is from left to right, when being fixed left silicon rod, first in the peace of dovetail seat 5 with cutting working platform 1
Inserting certain thickness iron bar between tankage 11, then fasten left silicon rod, the tilt angle alpha making left silicon rod is 6 degree.Carry out
During cutting, along with workbench 1 constantly declines, silicon rod 2 declines simultaneously, and the cutting gauze 6 at the stage of returning sword, left silicon rod can first connect
Turn right out silicon rod 2 again in the right side touching glue layer 3, and the cutting gauze 6 on the left of left silicon rod is cutting left silicon rod always and not with glue
Water layer 3 contacts, until all silicon rod 2 has cut.Additionally between each silicon rod 2, it is equipped with mortar pipe 7, after to having cut
Cutting gauze 6 carry out sandblasting slurry operation, it is to avoid previous silicon rod 2 cutting on follow-up silicon rod 2 cutting impact.
In the present embodiment, cutting gauze 6 is steel wire, when cutting, between steel wire and silicon rod 2 by silicon carbide micro-powder and
The mortar that cutting liquid mixes by a certain percentage, when steel wire runs up, steel wire drives the silicon-carbide particles in mortar, makes
Silicon-carbide particles produce cutting force to silicon rod 2, so the cutting force of silicon-carbide particles determines the cutting power of sand line liquid, i.e. carbon
The shape of SiClx microgranule, size and number determines the cutting power of sand line liquid.If mortar has been mixed into other materials, carbonization
The accounting of silicon powder reduces, and thus can substantially weaken the cutting power of sand line liquid, thus have influence on the cut quality of silicon chip.
Embodiment two:
The present embodiment differs only in from embodiment one: the method adjusting silicon rod 2 heeling condition is different, as it is shown on figure 3, this reality
Execute the dovetail seat 5 using inclined shape in example to install silicon rod 2, so that silicon rod 2 is in heeling condition.Other not described content with
Embodiment one is identical, does not repeats them here.
Embodiment three:
The present embodiment differs only in from embodiment one: the method adjusting silicon rod 2 heeling condition is different, as shown in Figure 4, and this reality
Execute the glass plate 4 using inclined shape in example to install silicon rod 2, so that silicon rod 2 is in heeling condition.Other not described content with
Embodiment one is identical, does not repeats them here.
Below being only the preferred embodiment of the present invention, protection scope of the present invention is not limited merely to above-described embodiment,
All technical schemes belonged under thinking of the present invention belong to protection scope of the present invention.It should be pointed out that, for the art
For those of ordinary skill, some improvements and modifications without departing from the principles of the present invention, should be regarded as the protection of the present invention
Scope.
Claims (9)
1. a polycrystalline silicon rod cutting method, it is characterised in that before silicon rod (2) is carried out multi-wire saw, adjusts cutting work
The tilt angle alpha of the upper each silicon rod (2) of station (1), so that cutting gauze (6) first cuts each silicon rod (2) outgoing line side in the stage of returning sword
Glue layer (3).
Polycrystalline silicon rod cutting method the most according to claim 1, it is characterised in that to be positioned on cutting working platform (1) into
The tilt angle alpha of the silicon rod (2) of line side is adjusted.
Polycrystalline silicon rod cutting method the most according to claim 2, it is characterised in that the top of described silicon rod (2) is toward cutting
The cut direction of gauze (6) tilts.
Polycrystalline silicon rod cutting method the most according to claim 3, it is characterised in that the tilt angle alpha of described silicon rod (2) is
5～10 degree.
Polycrystalline silicon rod cutting method the most as claimed in any of claims 1 to 4, it is characterised in that be positioned at silicon rod
(2) between dovetail seat (5) and the mounting groove (11) of cutting working platform (1) at top sandwiched implant (12) to adjust silicon rod (2)
Tilt angle alpha.
Polycrystalline silicon rod cutting method the most according to claim 5, it is characterised in that described implant (12) is iron bar.
Polycrystalline silicon rod cutting method the most as claimed in any of claims 1 to 4, it is characterised in that use inclined
The dovetail seat (5) of shape is to adjust the tilt angle alpha of silicon rod (2).
Polycrystalline silicon rod cutting method the most as claimed in any of claims 1 to 4, it is characterised in that use inclined
The glass plate (4) of shape is to adjust the tilt angle alpha of silicon rod (2).
Polycrystalline silicon rod cutting method the most as claimed in any of claims 1 to 4, it is characterised in that cutting
During operation, the cutting gauze (6) between adjacent silicon rod (2) is carried out sandblasting slurry process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610548901.3A CN106182471A (en) | 2016-07-13 | 2016-07-13 | A kind of polycrystalline silicon rod cutting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610548901.3A CN106182471A (en) | 2016-07-13 | 2016-07-13 | A kind of polycrystalline silicon rod cutting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106182471A true CN106182471A (en) | 2016-12-07 |
Family
ID=57477658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610548901.3A Pending CN106182471A (en) | 2016-07-13 | 2016-07-13 | A kind of polycrystalline silicon rod cutting method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106182471A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10128738A (en) * | 1996-10-29 | 1998-05-19 | Tokyo Seimitsu Co Ltd | Method for cutting work of wire saw |
| JP2004082282A (en) * | 2002-08-27 | 2004-03-18 | Kyocera Corp | Method for slicing semiconductor block |
| JP2004306250A (en) * | 2003-04-01 | 2004-11-04 | Hct Shaping Systems Sa | Wire type slicing method and device |
| CN202378191U (en) * | 2011-12-21 | 2012-08-15 | 浙江思博恩新材料科技有限公司 | Silicon ingot fixing device for multi-wire cutting |
-
2016
- 2016-07-13 CN CN201610548901.3A patent/CN106182471A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10128738A (en) * | 1996-10-29 | 1998-05-19 | Tokyo Seimitsu Co Ltd | Method for cutting work of wire saw |
| JP2004082282A (en) * | 2002-08-27 | 2004-03-18 | Kyocera Corp | Method for slicing semiconductor block |
| JP2004306250A (en) * | 2003-04-01 | 2004-11-04 | Hct Shaping Systems Sa | Wire type slicing method and device |
| CN202378191U (en) * | 2011-12-21 | 2012-08-15 | 浙江思博恩新材料科技有限公司 | Silicon ingot fixing device for multi-wire cutting |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161207 |
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| RJ01 | Rejection of invention patent application after publication |