CN106181132B - A kind of high-temp solder preparation method based on Ag@Sn nucleocapsid structures - Google Patents
A kind of high-temp solder preparation method based on Ag@Sn nucleocapsid structures Download PDFInfo
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- CN106181132B CN106181132B CN201610564486.0A CN201610564486A CN106181132B CN 106181132 B CN106181132 B CN 106181132B CN 201610564486 A CN201610564486 A CN 201610564486A CN 106181132 B CN106181132 B CN 106181132B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Abstract
The present invention provides a kind of high-temp solder preparation methods based on Ag@Sn nucleocapsid metal powders, the high-temp solder uses micro-, nanoscale Ag@Sn nucleocapsid metal powders, and the plating subsidiary formula method for the thick tin layers for attaching solderability thickness by micro-, Nanometer Copper ball surface plating is realized.Welding is carried out using preset that the high-temp solder is suppressed, and (250 DEG C) welding of low temperature can be realized, gained solder joint is amenable to (480 DEG C) military services of high temperature, and the stability for greatly improving welding spot reliability and weld seam can be widely applied to various high-temperature soldering fields.
Description
Technical field
The invention belongs to materials chemistries and material machining cross technical field, are related to a kind of based on Ag@Sn nucleocapsid structures
Metal powder type high-temp solder preparation method.
Background technology
Due to needing to use high power device in numerous areas (such as automobile, space exploration), high power device is got over
To be more concerned by people.Although now on the market generally using silicon as the raw material of IGBT chips, due to silicon materials
Some disadvantages itself having make the development of the material receive prodigious restriction.At the same time, present electronic product is got over
More tend to miniaturization, integrated development, therefore chip interior current density is higher and higher, more heats needs distribute.It makes a general survey of
Semiconductor material with wide forbidden band on the market now, wherein it is most ripe with the development of silicon carbide (SiC) material, it is advantageous that significantly
The performances such as maximum operating temperature, switching loss, breakdown voltage, the power dissipation of power device are improved, are therefore particularly suited for
Application under high power, high-frequency and hot environment.In recent years, the third generation silicon carbide that can be worked at high temperature
(SiC) semiconductor puts into commercial applications in some fields, and dystectic high lead solder is widely used in power half
Conductor chip is bonded.Due to the promulgation of unleaded ban, most solder containing lead is substituted by other compositions, but is suitable for
The high-temp solder of silicon carbide (SiC) power device is considerably less.Therefore need to develop a kind of novel solder, feature is can be
Connection is formed under low temperature, does not destroy other devices, and can be on active service under high temperature environment.
Nowadays, for solve high power device connection technology there are mainly three types of：
The first solution is to use superalloy solder, and common combination has auri system, lead base system, Zinc Matrix
System and bismuthino system.But the high-temp solder of these systems all has respective limitation, auri system solder is after welding
The hardness of the compound of formation is larger, so that the problems such as weld seam of gained easy tos produce stress concentration, CTE mismatch.Simultaneously
The high-temp solder of the system needs that noble metal gold is added, so that the cost raising of solder is unfavorable for actual production utilization.To the greatest extent
Pipe lead base solder has many advantages, such as, but with the unleaded propulsion of electronic product, this solder is no longer applicable in.And zinc-base pricker
The wetting and spreading performance of material is poor, while this kind of solder hard crisp phase occurs so as to cause weld seam after reflow soldering, in seam organization
Moulding difference, the problem of easy ting produce stress concentration.Since electronic product is based on copper pad, and profit of the bismuthino solder on copper
Wet spreading property is poor, because without being widely used property.
Second workaround is to use nano silver sintering process.Since the silver of nanoscale can be burnt at low temperature
Knot, and there is excellent conduction (240Wm after sintering-1K-1), heat conductivility (4.1 × 10-7Sm-1) and high-melting-point (961
DEG C), therefore nano silver sintering process thinks that most potential technology is used for substituting high-temp leadless solder by industry.But the technology
There are problems that some are difficult to overcome, such as silver itself is expensive is used as connecting material that production cost is greatly improved, while by
In sintering neck limitation thus hole existing for still meeting in weld seam after sintering, this is provided for the generation and expansion of later stage crackle
It may.In addition to this, the problem of silver has electromigration in high-temperature service, this can also impact the reliability of weld seam.
The third solution is Transient liquid phase sintering process (TLPS) or solid-liquid counterdiffusion (Solid Liquid
Interdiffusion).This technique is placed among higher melting-point material using lower melting-point brazing material, by temperature
Add to the fusing point of brazing material, the brazing material of the low melting point wetting and spreading on materials with high melting point, while applying certain pressure
Make entire seam organization tight；In reflux course later, low melting point solder occurs with materials with high melting point in interface mutual
Diffusion motion simultaneously generates compound, constantly grows up with the carry out compound of diffusion motion and finally consumes whole low melting point materials
Material forms the solder joint that commissure is entirely compound.And the fusing point of compound is usually higher, therefore the weld seam that this kind of method is formed
It can be on active service at high temperature.But this technology is there is also defect, since whole process is solid-liquid diffusion, reaction rate compared with
The problem of low to obtain the larger seam organization of thickness, and thin weld seam is also easy to produce stress concentration, at the same time full compound knot
The seam organization of structure is more crisp to be also easy to produce crackle, to which weld seam can be made to be easy Cracking Failure during being on active service.
The present invention is based on problem possessed by current various soldering tech and solder, studies and prepared a kind of novel
Nucleocapsid solder, and this nucleocapsid solder is applied to the connection of high power device, it is general in the industry to successfully solve
All over the problem faced.
Invention content
In order to solve above-mentioned the shortcomings of the prior art, the present invention provides a kind of based on Ag@Sn nucleocapsid structures
High-temp solder preparation method, the high-temp solder use micro-, nanoscale Ag Sn nucleocapsid metal powders, pass through micro-, nanometer ping-pong ball
Surface plating attaches the LT-TLPS of the realization of plating subsidiary formula method and the connection of this low-temperature transient liquid phase of the thick tin layers of solderability
Application of (the Low Time-Transient Liquid Phase Soldering) metal powder in high-temp solder field.
Specifically, the present invention is realized by following scheme：A kind of high-temp solder preparation based on Ag@Sn nucleocapsid structures
Method, including：
(1), complexant, stabilizer and antioxidant are weighed, super clean deionized water is added, is placed in ultrasonic device simultaneously
Apply stirring, until solution is completely dissolved to obtain solution A；
(2), appropriate silver powder, cleaning removal surface blot and oxide layer are weighed, and activates ping-pong ball surface, then uses deionization
Water cleans, for use；
(3), it weighs appropriate stannous chloride and is dissolved in hydrochloric acid, as solution B；
(4), at 80 DEG C by solution B pour into stirring in solution A in, it is to be mixed uniformly after adjustment bath temperature with
PH value is to OK range；
The suitable temperature of adjustment plating solution is preferably 75-80 DEG C after described two solution mixing, and the suitable pH values are preferably
8.8~9.
The rate that stannous ion is restored in plating solution under room temperature is slow, can not meet the requirement of experiment, and temperature mistake
It is high that lead to react precipitation rate again too uneven and then influence subsequent welding point so as to cause silver powder surface cladding tin soon
Performance.By testing preferred 75-80 DEG C, the uniformity that precipitation rate in turn ensures cladding had both been improved.Similarly, the PH of plating solution
Tin is hardly precipitated when in acidity, need to be selected under alkaline environment and carry out, but precipitation rate is slow when plating solution PH is between 7-8.8
Slowly, and PH more than plating solutions after 9 can unstabilitys to not be precipitated tin, therefore preferably 8.8~9.
(5), step (2) processing is obtained silver powder to pour into the mixed solution of A and B, improves stir speed (S.S.), guarantor of moving in circles
Card reaction 2h；
The stir speed (S.S.) improved after described two solution mixing is preferably 300rpm.
(6), it filters plating solution and cleans metal powder, obtain surface plating with thick tin layers based on Ag@Sn nucleocapsid structures
High-temp solder.
The heating and stirring refer to electromagnetic agitation in a water bath.
Micro-, the nanoscale Ag@Sn nucleocapsid metal powders refer to each size class between 20nm and 50 μm
Galactic nucleus surface plating attached solderability thickness (>3 μm) tin metal layer nucleocapsid.
The complexant is preferably sodium citrate, nitrilotriacetic acid, and the reducing agent is preferably titanium trichloride, the stabilizer
Preferably disodium ethylene diamine tetraacetate, the antioxidant is preferably hydroquinone or ascorbic acid, wherein mass ratio, to benzene two
Phenol：Water=0.004~0.008, ascorbic acid：Water=0.006~0.01, sodium citrate：Water=0.07~1.02, three second of ammonia
Acid：Water=0.03~0.05, disodium ethylene diamine tetraacetate：Water=0.02~0.04, titanium trichloride：Water=0.04~0.07.
Compared to other complexants and antioxidant, the reagent price selected by the present invention it is relatively inexpensive and meanwhile to environment without dirt
Dye, is the sustainable reagent used；And reducing agent select the reason of titanium trichloride be titanium trichloride can make continuously be precipitated to reach
To the requirement of solderability, other reducing agents then cannot.
In the step (2) preferably using by silver powder be placed in containing thiocarbamide, citric acid, potassium carbonate solution in, by quality
Than thiocarbamide：Deionized water=0.02~0.06, citric acid：Deionized water=0.09~0.15, potassium carbonate：Deionized water=
0.02~0.06, surfactant is added simultaneously applies ultrasound silver powder is carried out, then for use with deionized water cleaning silver powder 3 times, institutes
State the ethanol solution that surfactant is preferably polyethylene glycol, in mass ratio, polyethylene glycol：Ethyl alcohol=0.008~0.016.
Removal surface blot and oxide layer can be not only cleaned by this method, and activates ping-pong ball surface, due to this hair
Bright is to select reduction method that tin directly is precipitated on ping-pong ball surface, if there are spot or oxide layers on ping-pong ball surface, ping-pong ball surface is just
It loses activity, being unable to the precipitation of ping-pong ball surface so as to cause tin achievees the effect that cladding.
Material conditions needed for the method for the present invention are simple, it is of low cost promoted and applied with boundless enterprise practical before
Scape, in addition, the material that the preparation method the method for comparing other high-melting-point solder joints such as nano material sintering prepares is welded
It is more preferable with reflow soldering producing line compatibility in traditional industry when connecing, it is very beneficial for being prepared on the basis of existing process equipment
And popularization and application.
Details are as follows for more specifically limited preparation method step：
(1), sodium citrate (a concentration of 0.1~0.3mol/L after water is added) is weighed, nitrilotriacetic acid (is added dense after water
Degree is 0.15~0.3mol/L), (a concentration of 0.002~0.004mol/L after water is added) in hydroquinone, ethylenediamine tetra-acetic acid
Disodium (a concentration of 0.05~0.08mol/L being added after water) is dissolved in 100ml deionized waters, is placed in ultrasonic device and applies
Stirring, waits for that solute is completely dissolved to obtain solution A；
(2), weigh silver powder 3g, be placed in containing thiocarbamide, citric acid, potassium carbonate solution in, in mass ratio, thiocarbamide：Go from
Sub- water=0.02~0.06, citric acid：Deionized water=0.09~0.15, potassium carbonate：Deionized water=0.02~0.06；Simultaneously
The ethanol solution cleaning of the surfactant polyethylene glycol of 8~12g/L is added, finally uses deionized water cleaning silver powder 3 times for use；
(3), 1~2g stannous chlorides are weighed and are dissolved in 1ml pure hydrochloric acids, as solution B；
(4), solution B is poured into the solution A in stirring at room temperature, by the method tune for adding ammonium hydroxide and hydrochloric acid
Whole plating solution pH is between 8.8-9, and solution is constantly in the state stirred with 100rpm in whole process；
(5), pickling in second step before and the silver powder being surface-treated are poured into the mixed solution of A and B at 80 DEG C, together
Shi Tigao electromagnetic agitations rate is to 300rpm；Electromagnetic agitation often carries out 20~30min and is switched to 5~10min of ultrasonic disperse, and
5~7g titanium trichlorides are added in 40~60min of every reaction, adjusts PH between 8.8-9, moves in circles and ensure that the reaction time is
2h；
(6), after step (5), 100ml plating solutions is prepared again according to step (1) to (4) and set the metal powder of gained
In the 100ml plating solutions just prepared, step (5) is repeated；
(7), it filters plating solution and cleans metal powder, obtain surface plating with thick tin layers based on Ag@Sn nucleocapsid structures
High-temp solder.
It is still another object of the present invention to provide preset of a kind of high-temp solder, pass through following preparation method step system
It is standby to obtain：(8), Ag Sn nucleocapsids metal powder is pressed into preset under 40Mpa pressure.
Welding is carried out using preset of the high-temp solder of the compacting, and (250 DEG C) welding of low temperature, gained weldering can be realized
Point is amenable to the purpose of high temperature (480 DEG C).
The present inventor after lot of experiments by having found, 20 μm~50 μ m in size of inventive formulation and test method pair
Ping-pong ball in range may be implemented in ping-pong ball surface and plate the attached one layer pure stannum layer with solderability thickness, use this nucleocapsid
Preset of metal powder compacting can greatly shorten the time needed for the complete IMCization of weld seam when being welded, in the short time
It can be realized under low temperature.
Compared with prior art, the advantage of the invention is that：
1, due to Ag3The Young's modulus of Sn and Ag is respectively 78.9GPa, 73.2GPa, respectively lower than copper (116.5GPa) with
Copper compound Cu6Sn5(112.3GPa) and Cu3The Young's modulus of Sn (134.2GPa), therefore can significantly alleviate commissure because not
With caused by material thermal expansion coefficient difference the problem of stress concentration, to greatly improve the reliability of solder joint.
2, silver with tin at 250 DEG C reaction rate quickly, thus consume ping-pong ball coating surface tin layers needed for time it is big
Amplitude is reduced, and then is reduced and flowed back the required time in welding process, this greatly reduces device because living through prolonged
The possibility of reflux and heated damage.
3, due to Ag3The resistivity of Sn and Ag is respectively 6.02 μ Ω cm, 1.5 μ Ω cm, so welding line structure by
Ag3The resistivity that Sn and Ag is constituted should be between 1.5~6.02 μ Ω cm, the resistance of weld seam after this is sintered with nano silver
Rate is very close to (2.5-10 μ Ω cm), at this time by Ag3The electric conductivity for the weld seam that Sn and Ag is constituted is excellent.Simultaneously because weld seam
In structure based on the content of silver, thus weld seam equally has preferable heat conductivility.
4, the cost of Ag@Sn nucleocapsids solders required drug during plating prepared by the present invention is relatively low, processing technology letter
It is single, the nucleocapsid solder of gained can at low temperature (250 DEG C) formed connection and can at high temperature (480 DEG C) be on active service, while with
The carry out silver tin compound of military service process by Ag3Sn is to Ag4Sn is converted, and Ag4The fusing point of Sn is 724 DEG C, therefore weld seam can
To be resistant to higher temperature.
Description of the drawings
Fig. 1 is to interconnect solder joint, figure using the high-melting-point that Ag@Sn nucleocapsids metal powders are prepared under the conditions of low-temperature short-time
In：0101 is copper base；0102 preset be pressed into for Ag@Sn nucleocapsid metal powders；0103 is the metal of the plating on copper coin
Silver.
Fig. 2 is the preset tissue enlarged drawing prepared using Ag@Sn nucleocapsid metal powders, wherein：0201 is galactic nucleus,
0202 is that galactic nucleus surface plates attached tin shell parts and is converted to dystectic Ag upon reflowing before reflux3Sn compounds.
Fig. 3 be the obtained core-shell structure particles of one embodiment of the present invention and seam organization schematic diagram wherein, particle
Schematic cross-section 3 (a), seam organization schematic diagram 3 (b), 3 (c) are the partial enlarged view of 3 (b).
Specific implementation mode
Illustrate the realization means of the present invention below by specific example and Figure of description, but the present invention is not limited to this.
Based on considerations above, we have invented this micro-nano ping-pong ball table by largely testing trial and data analysis
The plating subsidiary formula method of attached solderability thickness tin layers is plated in face, is successfully realized at room temperature in micro/nano level ping-pong ball table by this plating subsidiary formula method
Plate the purpose of attached thick tin layers in face.
Embodiment one
This method specifically includes following steps (to use 100ml plating solutions tin plating and final for 40 μm of silver powder to 3g grain sizes
It is made into for high temperature resistant solder joint)：
(1), sodium citrate 7.5g, nitrilotriacetic acid 4g, hydroquinone 0.04g are weighed, disodium ethylene diamine tetraacetate 3g is dissolved in
In 100ml deionized waters and apply stirring, solution is placed in ultrasonic device and is applied stirring, waits for molten by stir speed (S.S.) 100rpm
Matter is completely dissolved to obtain solution A.
(2), it is 40 μm of silver powder 3g to weigh grain size, be placed in containing thiocarbamide, citric acid, potassium carbonate solution in (mass ratio,
Thiocarbamide：Citric acid：Potassium carbonate：Deionized water=1:3:1:25) in, be added surfactant and apply ultrasound to silver powder carry out,
Deionized water cleaning silver powder is used again 3 times for use.
(3), 1.52g stannous chlorides are weighed and are dissolved in 1ml pure hydrochloric acids, as solution B；
(4), solution B is poured into the solution A in stirring at room temperature, by the method tune for adding ammonium hydroxide and hydrochloric acid
Whole plating solution pH is between 8.8-9, and solution is constantly in the state stirred with 100rpm in whole process；
(5), pickling in second step before and the silver powder being surface-treated are poured into the mixed solution of A and B at 80 DEG C, together
Shi Tigao electromagnetic agitations rate is to 300rpm；But to intert ultrasonic disperse while electromagnetic agitation to ensure particle in the plating solution
State it is uniform, electromagnetic agitation often carries out 20min and is switched to ultrasonic disperse 5min, and 6g tri-chlorinations are added in every reaction 40min
Titanium adjusts PH between 8.8-9, moves in circles and ensures that the reaction time is 2h；
(6), after step (5), 100ml plating solutions is prepared again according to step (1) to (4) and set the metal powder of gained
In the 100ml plating solutions just prepared, step (5) is repeated；
(7), it filters plating solution and cleans metal powder, obtain the bis- gold of Ag@Sn that surface plating is 40 μm with the grain size of thick tin layers
Belong to nucleocapsid.
(8), Ag Sn nucleocapsids metal powders under 40Mpa pressure are pressed into preset, are welded using preset of compacting
It connects and (250 DEG C) welding of low temperature can be realized, gained solder joint is amenable to the purpose of high temperature (480 DEG C).
Embodiment two, with reference to figure 1,2 and 3
(1), sodium citrate 8g, nitrilotriacetic acid 4.5g, hydroquinone 0.04g are weighed, disodium ethylene diamine tetraacetate 3.5g is molten
In 100ml deionized waters and apply stirring, solution is placed in ultrasonic device and is applied stirring, waits for by stir speed (S.S.) 100rpm
Solute is completely dissolved to obtain solution A.
(2), it is 40 μm of silver powder 3g to weigh grain size, be placed in containing thiocarbamide, citric acid, potassium carbonate solution in (mass ratio,
Thiocarbamide：Citric acid：Potassium carbonate：Deionized water=1:3:1:25) in, be added surfactant and apply ultrasound to silver powder carry out,
Deionized water cleaning silver powder is used again 3 times for use.
(3), 1.52g stannous chlorides are weighed and are dissolved in 1ml pure hydrochloric acids, as solution B；
(4), solution B is poured into the solution A in stirring at room temperature, by the method tune for adding ammonium hydroxide and hydrochloric acid
Whole plating solution pH is between 8.8-9, and solution is constantly in the state stirred with 100rpm in whole process；
(5), pickling in second step before and the silver powder being surface-treated are poured into the mixed solution of A and B at 80 DEG C, together
Shi Tigao electromagnetic agitations rate is to 300rpm；But to intert ultrasonic disperse while electromagnetic agitation to ensure particle in the plating solution
State it is uniform, electromagnetic agitation often carries out 20min and is switched to ultrasonic disperse 5min, and 7g tri-chlorinations are added in every reaction 40min
Titanium adjusts PH between 8.8-9, moves in circles and ensures that the reaction time is 2h；
(6), after step (5), 100ml plating solutions is prepared again according to step (1) to (4) and set the metal powder of gained
In the 100ml plating solutions just prepared, step (5) is repeated；
(7), it filters plating solution and cleans metal powder, obtain the bis- gold of Ag@Sn that surface plating is 40 μm with the grain size of thick tin layers
Belong to nucleocapsid.
(8), Ag Sn nucleocapsids metal powders under 40Mpa pressure are pressed into preset, are welded using preset of compacting
It connects and (250 DEG C) welding of low temperature can be realized, gained solder joint is amenable to the purpose of high temperature (480 DEG C)
Shown in gained core-shell structure particles and the following Fig. 3 (a) -3 (c) of seam organization：
Through lot of experiment validation, the resistivity of this weld seam is 5.70 μ Ω cm, and electric conductivity is much better than traditional tinbase
The pure IMC solder joints being made of completely silver-tin compound made from solder (11.5 μ Ω cm) and tradition TLP techniques, with nanometer
Weld seam after silver sintering is in same order (2.5-10 μ Ω cm).
The above content is the further details of explanations for combining specific preferred embodiment to be the present invention, but not
Indicate that the specific implementation of the present invention is limited to these explanations.For those skilled in the art,
Under the premise of not departing from present inventive concept, several simple deductions or replacement can also be made, is regarded as belonging to the present invention's
Protection domain.
Claims (4)
1. a kind of high-temp solder preparation method based on Ag@Sn nucleocapsid structures, which is characterized in that
(1), sodium citrate, nitrilotriacetic acid, hydroquinone, disodium ethylene diamine tetraacetate are weighed, 100ml deionized waters is dissolved in, adds
It is 0.1~0.3mol/L to enter the sodium citrate concentration after water, and a concentration of 0.15~0.3mol/L of nitrilotriacetic acid after water is added, adds
Enter a concentration of 0.002~0.004mol/L of hydroquinone after water, a concentration of 0.05 of disodium ethylene diamine tetraacetate after water is added
~0.08mol/L is placed in ultrasonic device and applies stirring, waits for that solute is completely dissolved to obtain solution A；
(2), weigh silver powder 3g, be placed in containing thiocarbamide, citric acid, potassium carbonate solution in, in mass ratio, thiocarbamide：Deionized water
=0.02~0.06, citric acid：Deionized water=0.09~0.15, potassium carbonate：Deionized water=0.02~0.06；It is added simultaneously
The ethanol solution of the surfactant polyethylene glycol of 8~12g/L cleans, and finally uses deionized water cleaning silver powder 3 times for use；
(3), 1~2g stannous chlorides are weighed and are dissolved in 1ml pure hydrochloric acids, as solution B；
(4), solution B is poured into the solution A in stirring at room temperature, plating is adjusted by the method for adding ammonium hydroxide and hydrochloric acid
Liquid pH is between 8.8-9, and solution is constantly in the state stirred with 100rpm in whole process；
(5), pickling in second step before and the silver powder being surface-treated are poured into the mixed solution of A and B at 80 DEG C, is carried simultaneously
High electromagnetic agitation rate is to 300rpm；Electromagnetic agitation often carries out 20~30min and is switched to 5~10min of ultrasonic disperse, and every anti-
It answers 40~60min that 5~7g titanium trichlorides are added, adjusts PH between 8.8-9, move in circles and ensure that the reaction time is 2h；
(6), after step (5), 100ml plating solutions is prepared again according to step (1) to (4) and are placed in the metal powder of gained just
In the 100ml plating solutions prepared, step (5) is repeated；
(7), it filters plating solution and cleans metal powder, obtain high temperature pricker based on Ag@Sn nucleocapsid structure of the surface plating with thick tin layers
Material.
2. a kind of high-temp solder based on Ag@Sn nucleocapsid structures, which is characterized in that the high-temp solder passes through claim 1 institute
The preparation method stated is prepared.
3. a kind of preset preparation method of high-temp solder, which is characterized in that by the Ag@Sn nucleocapsid gold described in claim 2
Belong to powder and is pressed into preset under 40Mpa pressure.
4. preset of a kind of high-temp solder, which is characterized in that be prepared, made by the preparation method described in claim 3
It is welded with preset of the high-temp solder, it can be achieved that 250 DEG C of welding of low temperature, gained solder joint are amenable to 480 DEG C of clothes of high temperature
The purpose of labour.
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| JP6897237B2 (en) * | 2017-03-31 | 2021-06-30 | 三菱マテリアル株式会社 | Molded body for joining and its manufacturing method |
| CN107234367B (en) * | 2017-06-20 | 2019-09-03 | 哈尔滨工业大学深圳研究生院 | A kind of high-temp solder and preparation method thereof based on Ag@In core-shell structure |
| CN109848501B (en) * | 2019-01-16 | 2020-11-20 | 安徽省华瑞网业有限公司 | High-strength brazing method for molybdenum-copper alloy and stainless steel |
| CN110814569A (en) * | 2019-11-13 | 2020-02-21 | 哈尔滨理工大学 | Multi-scale Cu @ Ag micro-nano composite brazing filler metal for power device packaging and preparation method |
| CN111230352B (en) * | 2020-01-19 | 2021-12-24 | 深圳第三代半导体研究院 | Preparation method and application of nano metal soldering paste with silver-tin core-shell structure |
| CN112735670B (en) * | 2020-12-16 | 2023-03-24 | 昆明理工大学 | Preparation method and application of micron-sized silver-coated tin conductive particles |
| CN113385857A (en) * | 2021-06-15 | 2021-09-14 | 广东工业大学 | Multi-size micro-nano metal particle soldering paste in-situ interconnection process and product thereof |
| CN113649567B (en) * | 2021-08-19 | 2023-05-23 | 合肥工业大学 | Ag@SiO 2 @Sn three-layer core-shell structure and preparation method thereof |
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