CN106181130B - Laboratory BGA nano reinforcement solder balls and the preparation method of thermal fatigue resistance bga device - Google Patents
Laboratory BGA nano reinforcement solder balls and the preparation method of thermal fatigue resistance bga device Download PDFInfo
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- CN106181130B CN106181130B CN201610534736.6A CN201610534736A CN106181130B CN 106181130 B CN106181130 B CN 106181130B CN 201610534736 A CN201610534736 A CN 201610534736A CN 106181130 B CN106181130 B CN 106181130B
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- bga
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- soldering paste
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Abstract
Laboratory BGA nano reinforcement solder balls and the preparation method of thermal fatigue resistance bga device, belong to technical field of welding materials.Include the following steps：By SAC305 eutectic powders and nano particle according to proportioning mechanical agitation mixed grinding, gained composite powder mixes according to a certain percentage with colophony type weld-aiding cream, classification addition stirring, soldering paste is printed on a glass through the mesh of silk screen or printed steel mesh with scraper, the steel mesh for being printed on certain volume soldering paste-glass plate equipment integrating is put into and melts ball processed in vacuum heat-retaining case or heating plate, then molding scraping, cleaning, drying screening.The tin ball sieved, which centainly select, can carry out BGA welding plant ball use, and have studied the fatigue resistance of packaging under nano reinforcement.
Description
Technical field
The present invention relates to a kind of preparation method of use for laboratory BGA nano reinforcement solder balls, using classification stirring, screen printing
Brush prepares reinforced by nanoparticles solder ball, and is further prepared into the bga device with thermal fatigue resistance attribute, belongs to weldering
Connect field of material technology, specially Electronic Encapsulating Technology.
Background technology
Solder ball be electronic component encapsulation connection essential industry raw material, be widely used in electronics industry, manufacturing industry,
Auto manufacturing, maintenance industry etc. are present among various BGA structures, also provide reference for solder Solders Research.
At present the preparation flow of conventional, lead-free solder ball have gas atomization, centrifugal atomization, chopping remelting process and swing into
Type technique etc., these methods use for reference conventional powder production technology, then the detection means by profession, obtain available solder ball,
The production cost of these methods is high, and product quality is not readily available guarantee.In gas atomization production, some technological parameters are as being atomized
The pressure of gas, atomization gas medium character can all have an impact the dispersion degree of atomizing particle, size and shape, point of tin grain
Divergence is wider, it is necessary to can just obtain disclosure satisfy that the particle of requirement by repeatedly sieving and detecting.And centrifugal atomizing produces
Efficiency is higher, but the distribution of particles produced is more dispersed and out of roundness is not high, it is necessary to by repeatedly screening and examine and could obtain
To the particle for meeting requirement.The filament of certain specification must be first made in solder by chopping remelting process, more complicated and right
The required precision for manufacturing machinery is very high, and the thickness that drawing process be easy to cause solder wire is uneven, can further influence production
The size of particle, meanwhile, metal is during remelting, temperature, the type of liquid medium, the control of remelting time and
Solder bead out of roundness, surface quality and the crystalline structure that the control of technique will all influence production, thus to product in BGA
Quality in encapsulation has an impact.These methods are of high cost, and equipment cost consumable quantity is big, are only applicable to the system of big batch solder ball
It is standby, and heating temperature is higher, and depollution of environment requirement is high, and technological process is complicated, the experiment for small lot nano reinforcement material
Room research application is unsuitable.
In view of the above problems, the present invention has built platform prepared by a kind of use for laboratory BGA solder balls, and it is convenient and efficient, it can
To prepare the solder ball of the different-diameter size of various ingredients on a small quantity, and cost is extremely low, using existing resource, for colleges and universities and
The research of research institute has convenience.
At present on the market using it is wider be exactly SAC305 Pb-free solder ball, have in lead-free solder relatively best
Weldability, but its fatigue resistance is poor.Current unleaded eutectic alloy is also required to promote self performance to meet Electronic Packaging day
The increased requirement of benefit, lead-free solder is industry concern there are two development trend, first, the multicomponent alloy of lead-free solder, i.e., with
Based on the lead-free solders such as existing Sn bases or Sn-Ag bases, multicomponent alloy element is added wherein, to increase the side of constituent element
Formula improves the performance of solder；Another direction is then compound lead-free solder, mainly with Sn bases or Sn-Ag, Sn-Ag-Cu
Based on the lead-free solders such as base, compound lead-free solder is prepared by way of Nei Sheng or addition reinforced phase.Develop Combined Welding
The main purpose of material is by keeping a stable microscopic structure and homogeneous deformation inside reinforced phase solder, so as to improve
The reliability of solder improves and makes up certain deficiencies in matrix alloy performance, improves the mechanical property of solder joint, particularly heat resistanceheat resistant
Power fatigue behaviour and creep-resistant property, and then the service life of General Promotion solder joint.In addition, another important spy of this reinforcing
Sign is the operational characteristiies such as fusing point, the wetability that will not change protocorm solder substantially, while can effectively expand its work temperature
Range is spent, effective refinement microstructure also is able to when the size of enhanced particles is less than 1 μm.
With the rise of nano material, start gradually in the preparation applied to composite soldering.Add POSS particles, CNTs
The composite soldering reliability of nano particle etc. has certain the study found that electromigration rate can effectively be slowed down by adding certain POSS,
And extend thermal fatigue life of solder joint, and carbon nanotube is as a kind of brand-new material, excellent conductive conductivity of heat, high resiliency mould
Amount, good toughness, composite soldering also have very big researching value.
The present invention is exactly to be conceived to the preparation problem of traditional BGA Pb-free solder balls, is provided a kind of suitable for laboratory
Can be with the production method of do-it-yourself new material (reinforced by nanoparticles) BGA solder balls, and incorporate existing equipment
Resource, which has been built, to prepare platform with what student oneself operated, and the preparation for providing a kind of thermal fatigue resistance attributes encapsulation device is real
Example, the reliability consideration for later novel nano reinforced lead-free tin ball sealing piece installing are provided convenience.
Invention content
The object of the present invention is to provide a kind of laboratory preparation methods of BGA nano reinforcement Pb-free solder balls, adopt
The BGA nano reinforcements Pb-free solder ball prepared with the method for the present invention can devise a kind of BGA with thermal fatigue resistance attribute
Packaging.The Dispersed precipitate energy efficient hardening matrix solder of nano particle, while the service life of BGA solder balls is carried
It is high.
To achieve the above object, the present invention provides a kind of preparation method of laboratory BGA nano reinforcement solder balls,
It has main steps that：
(1) prepared by powder：SAC305 eutectic powders are mixed with nano particle (such as POSS, CNTs) according to proportioning mechanical agitation
It closes, using the speed ball milling mixing 8-10 hour per minute turned not higher than 70-80 so that nano particle can be uniformly distributed in
In the parent solder of SAC305 eutectic powders, it is Al to test selected ball-milling medium2O3Ceramic Balls, ratio of grinding media to material 10：1；
(2) it is prepared by classification stirring, soldering paste：A small amount of colophony type weld-aiding cream is taken in soldering paste bottle, is stirred 3 minutes with blender,
Then composite powder obtained by step (1) is added with the rate of 4-5g/min while stirring, stirs half an hour, make its mixing equal
It is even, refrigerator storage is put into, composite powder accounts for colophony type weld-aiding cream and the 11%-13% of composite powder gross mass, preferably 12%；
(3) silk-screen printing：Step (2) soldering paste is taken out, stirring reuses at least 5 minutes, and soldering paste is applied to silk with scraper
On net-glass integration apparatus or printed steel mesh-glass integration apparatus, make soldering paste through silk screen or the mesh of printed steel mesh
And print on a glass, it is scraped twice, is ensured uniform clockwise and anticlockwise；Silk screen-glass integration apparatus or printing steel
Silk screen or printed steel mesh are close to glass surface and are fixed together in net-glass integration apparatus, and glass is placed on heating plate
On, silk screen or printed steel mesh face are above；
(4) ball is made in fusing：Step (3) is printed on to steel mesh-glass plate movement equipment of certain volume soldering paste, puts vacuum into
On thermal protection case or heating plate, heating and temperature control is 10 DEG C -20 DEG C more than matrix SAC305 melting points, initial setting 240
DEG C, 10s-15s is kept the temperature, scaling powder is made to volatilize, since soldering paste is nonwetting with glass plate, ball is molten under surface tension effects,
And isolation and the molding effect of steel mesh are so that soldered ball separation, avoids convergence in fusion process；
(5) molding scraping：It treats small ball forming and scaling powder volatilization finishes, steel mesh-glass plate is taken out, it is air-cooled；By steel
The fixing of net-glass plate is taken down, separation of glasses plate, is easily scraped bead from glass plate with tweezers, Sheng takes, and puts well；
(6) it cleans：Bead is put into acetone, is cleaned by ultrasonic, removal oxidation and surface are dirty；
(7) drying screening：The bead cleaned is put into air dry oven, it is dry preferably at 60 DEG C；It will be complete
Bead is screened with sieve, ensures to plant ball effect.
Plant ball, encapsulation：Bead is implanted in by heating plate on bare chip, then is welded chip and pcb board by reflow machine
Conjunction is encapsulated, and is used and experimental study.
The preferred POSS particles (polyhedral oligomeric silsesquioxane) of step (1) nano particle or carbon nanotube (CNTs), into
Mass percentage in one step POSS particles composite powder obtained by the step (1) is 1%-3%, preferably 3%, surplus is
Sn3.0Ag0.5Cu；Mass percentage of the carbon nanotube (CNTs) in composite powder obtained by step (1) is 0.05%-1%,
It is preferred that 0.05%, surplus Sn3.0Ag0.5Cu.
The present invention can adjust the soldering paste through mesh by the diameter or thickness of the mesh for adjusting silk screen or printed steel mesh
Volume so as to adjust the volume of bead.
Since quality is minimum, fixing fabric structure is considered, size screening is carried out using sieve.The tin ball sieved is centainly chosen
Choosing can carry out BGA welding and plant ball use.
In conclusion the method for the present invention is convenient, and it is at low cost, a platform has been built using laboratory existing resource, it can
To complete small batch, the preparation of the solder ball of various nano components all sizes, and thermal fatigue resistance is made in the addition of the second phase
With having a significant impact, facility is provided for follow-up study.
The present invention preferably prepares reinforced by nanoparticles by adding 3%POSS, 0.05%CNTs in SAC305 matrixes
BGA solder balls.Using tradition, easily method is prepared for BGA solder balls under nano reinforcement, for scientific research intractable at present
Scheme is provided with production application, SAC305 matrixes of the present invention ensure that well weldability, nano particle addition, disperse point
Cloth can improve solder joint thermal fatigue resistance with thinning microstructure, have important value for the electronic encapsulation device service life.
Description of the drawings
Fig. 1 is steel mesh-glass plate-heating plate experiment porch of the embodiment of the present invention.
Fig. 2 is steel mesh mesh figure of the embodiment of the present invention.
Fig. 3 is the appearance electron microscope of different-diameter nano reinforcement solder ball prepared by this experiment porch；
(a) corresponding 305 μm of diameter, (b) correspond to 298.5 μm of diameter, and (c) corresponds to 315 μm of diameter.
Fig. 4 is the microstructure figure in BGA package solder joint section；
(a) the encapsulation solder joint prepared for the SAC305 soldered balls that can be sold using the market of standard, (b) are used for this patent
Encapsulation solder joint prepared by the soldered ball of 3%POSS is added in SAC305, (c) is the weldering that 0.05%CNTs is added in SAC305
Encapsulation solder joint prepared by ball.
Fig. 5 is microscopic structure of the copper sheet ovelapping spot weld of composite solder paste preparation of the invention developed under 2000 times of Electronic Speculum
Figure,
(a) it is un-added SAC305 solder joints, (b) is the composite welding for being added to 3%POSS, (c) is to be added to
0.05%
The composite welding of CNTs.
Fig. 6 is surface topography of the heterogeneity BGA solder joints at -55 DEG C -125 DEG C after thermal shock 500 weeks
(a) it is un-added SAC305 solder joints, (b) is the composite welding for being added to 3%POSS, (c) is to be added to
0.05%
The composite welding of CNTs.
Specific embodiment
With reference to embodiment, the present invention will be further described, but the present invention is not limited to following embodiments.
Embodiment 1
A kind of BGA strengthens the preparation of solder ball, the unleaded eutectic powder of basis material SAC305 with nano particle (POSS particles)
The POSS nano particles of 3% content, mechanical agitation mixing half an hour, then with 60 revs/min of rotating speeds by mixed-powder are added in end
10 hours of high-energy ball milling, obtain certain physical bond.
By composite powder and colophony type weld-aiding cream with mass ratio 88：12 ratios mix, and classification addition, mechanical agitation are half small
When, it is uniformly mixed, refrigerator storage.Then using a diameter of 0.48mm in lower Fig. 2, the steel mesh circular hole of thickness 0.1mm, with glass
Plate fits into integration apparatus (such as schematic diagram 1), smears a small amount of composite solder paste on the steel plate, it is penetrated particular area with scraper
Mesh brush on a glass, then steel mesh-glass plate is integrally placed in the heating plate that temperature is 240 DEG C, keeps the temperature 10s,
Then cooling is removed, is scraped and is put into capsule with tweezers, small ball forming finishes.The POSS of the preparation beads strengthened are put into and are filled
In the beaker of acetone, it is cleaned by ultrasonic 30min, then outwells upper liquid, put it into 60 DEG C of air dry ovens, dries.
Section screening is carried out with 300 microns, 280 microns, 320 microns of sieve, bead is observed with light microscope, such as
Fig. 3, record bead are closely sized to 300um, and up-down error is in 15um.
It is verified by calculating：
The volume of solder of mono- hole printing of R=0.24mm：πR2× 0.1 × 88%=0.0159241mm3Bead R ≈
Bead 4/3 × π of volume R prepared by 0.15mm3=0.01413717mm3
It was found that being verified by volume, it is not much different, the BGA for obtaining diameter in the reinforced by nanoparticles of 300um or so is small
Ball further plants ball, is mounted chip and PCB by SMT reflux, it is found that weldability is good and the bead of market sale is no different.
Embodiment 2
In order to observe good connection effect and weldability, butt welding point section has carried out the observation of SEM microstructures.Fig. 4 (a)
For encapsulation solder joint prepared by the SAC305 soldered balls that can be sold using the market of standard, (b) is used for this patent and is added in SAC305
Encapsulation solder joint prepared by the soldered ball of 3%POSS, (c) be the encapsulation for the soldered ball preparation that 0.05%CNTs is added in SAC305
Solder joint, multiple are 300 times, and 50 times small compared to the first two multiple, the weldability that makes discovery from observation is good, and size is not much different.
Embodiment 3
The BGA solder balls that the present invention develops carry out mesh printing using composite solder paste and are prepared, due to Combined Welding
The additive effect of nano particle directly determines the additive effect of nano particle in BGA solder joints in cream, therefore using in overlap joint Cu
On piece smears a small amount of soldering paste and prepares simulating solder joint, the progress Electronic Speculum observation under 2000 times, and in Fig. 5, (a) is un-added SAC305
Solder joint, (b) are the composite welding for being added to 3%POSS, (c) is the composite welding for being added to 0.05%CNTs, it can be seen that aobvious
Micro-assembly robot is fined, and nano particle additive effect is good.
Embodiment 4
The bga device of tri- heterogeneities of SAC305, SAC305-3%POSS, SAC305-0.05CNTs is prepared, is returned
After stream, grinding and polishing is carried out to initial device one side, observes section, it is built-in dry then by three kinds of ingredient devices using the quartzy seal of tube
Dry ball carries out cold cycling impact under -55 DEG C -125 DEG C of temperature range, is then taken out after 500 weeks, carries out section and sees in situ
Examine, such as Fig. 6, same position solder joint under pulsating stress effect, be added to pad surface damage after 0.05%CNTs, 3%POSS,
Deformation has to be weakened to a certain degree, and the fatigue resistance of initial SAC305 solder joints is poor, this is because the pinning of Second Phase Particle
Dislocation acts on so that mechanical property improves, and hinders dislocation motion, glide band movement.
Claims (6)
1. a kind of laboratory BGA nano reinforcement solder ball preparation methods, which is characterized in that include the following steps：
(1) prepared by powder：SAC305 eutectic powders are mixed with nano particle according to proportioning mechanical agitation, using 70- per minute
80 turns of 8-10 hour of speed ball milling mixing so that nano particle can be uniformly distributed in the parent weldering of SAC305 eutectic powders
In material, it is Al to test selected ball-milling medium2O3Ceramic Balls, ratio of grinding media to material 10：1；
(2) it is prepared by classification stirring, soldering paste：A small amount of colophony type weld-aiding cream is taken in soldering paste bottle, with blender stir 3 minutes, then
Composite powder obtained by step (1) is added with the rate of 4-5g/min while stirring, stirs half an hour, it is uniformly mixed, puts
Enter refrigerator storage, composite powder accounts for colophony type weld-aiding cream and the 11%-13% of composite powder gross mass；
(3) silk-screen printing：Step (2) soldering paste is taken out, stirring reuses at least 5 minutes, and soldering paste is applied to printing steel with scraper
On net-glass integration apparatus, soldering paste is made to be printed through the mesh of silk screen or printed steel mesh on a glass, carried out clockwise
It scrapes twice, ensures uniform with counterclockwise；Printed steel mesh is close to glass surface and is consolidated in printed steel mesh-glass integration apparatus
It is scheduled on together, glass is put on hot plate, and printed steel mesh face is above；
(4) ball is made in fusing：Step (3) is printed on to steel mesh-glass integration apparatus of certain volume soldering paste, puts vacuum heat-retaining into
On case or heating plate, heating and temperature control keeps the temperature 10s-15s, makes to help weldering 10 DEG C -20 DEG C more than matrix SAC305 melting points
Agent is volatilized, and since soldering paste is nonwetting with glass plate, is molten into ball under surface tension effects, and in fusion process steel mesh every
From being acted on molding soldered ball is detached, avoid convergence；
(5) molding scraping：It treats small ball forming and scaling powder volatilization finishes, steel mesh-glass plate is taken out, it is air-cooled；By steel mesh-glass
The fixing of glass plate is taken down, separation of glasses plate, is easily scraped bead from glass plate with tweezers, Sheng takes, and puts well；
(6) it cleans：Bead is put into acetone, is cleaned by ultrasonic, removal oxidation and surface are dirty；
(7) drying screening：The bead cleaned is put into air dry oven, it is dry；Complete bead is sieved with sieve
Choosing；
Obtain the soldered ball of diameter 300um ± 15um.
A kind of 2. BGA described in accordance with the claim 1 reinforced by nanoparticles solder ball preparation methods, which is characterized in that step
(1) nano particle is POSS particles (polyhedral oligomeric silsesquioxane) or carbon nanotube (CNTs).
A kind of 3. BGA described in accordance with the claim 2 reinforced by nanoparticles solder ball preparation methods, which is characterized in that POSS
Mass percentage of the particle in composite powder obtained by step (1) is 1%-3%, surplus Sn3.0Ag0.5Cu；Carbon nanometer
It is 0.05%-0.1% to manage the mass percentage of (CNTs) in composite powder obtained by step (1), and surplus is
Sn3.0Ag0.5Cu。
4. a kind of BGA described in accordance with the claim 1 nano reinforcement solder ball preparation methods, which is characterized in that pass through adjusting
The diameter or thickness of printed steel mesh mesh adjusts the volume through the soldering paste of mesh so as to adjust the volume of bead, and make steel
Net is integrated with glass plate, and the thawing molding of bead is carried out under clamping state, tin cream under molten state is avoided and flows to form convergence.
A kind of 5. BGA described in accordance with the claim 1 reinforced by nanoparticles solder ball preparation methods, which is characterized in that step
(2) composite powder accounts for the 12% of colophony type weld-aiding cream and composite powder gross mass.
6. a kind of preparation method of the bga device with thermal fatigue resistance attribute, which is characterized in that plant ball, encapsulation：By right
It is required that the nano reinforcement solder ball that any one of 1-5 methods are prepared is implanted in by heating plate on bare chip, then pass through Reflow Soldering
Chip and pcb board soldering are encapsulated by machine.
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| CN201610534736.6A CN106181130B (en) | 2016-07-08 | 2016-07-08 | Laboratory BGA nano reinforcement solder balls and the preparation method of thermal fatigue resistance bga device |
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| CN201610534736.6A CN106181130B (en) | 2016-07-08 | 2016-07-08 | Laboratory BGA nano reinforcement solder balls and the preparation method of thermal fatigue resistance bga device |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107344239A (en) * | 2017-09-08 | 2017-11-14 | 张家港创博金属科技有限公司 | A kind of preparation method of nano level metal powder |
| CN113798722B (en) * | 2021-09-30 | 2022-09-27 | 大连理工大学 | Composite soldering paste and method for preparing BGA (ball grid array) soldering ball/soldering point with fine-grain beta-Sn crystal grains by applying composite soldering paste |
| CN117548897A (en) * | 2023-11-27 | 2024-02-13 | 北京理工大学 | Solid solution strengthening solder and preparation method of high-reliability interconnection joint thereof |
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