CN106158813A - A kind of lead frame assembled inserts and the manufacture method of lead frame - Google Patents
A kind of lead frame assembled inserts and the manufacture method of lead frame Download PDFInfo
- Publication number
- CN106158813A CN106158813A CN201610792257.4A CN201610792257A CN106158813A CN 106158813 A CN106158813 A CN 106158813A CN 201610792257 A CN201610792257 A CN 201610792257A CN 106158813 A CN106158813 A CN 106158813A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- conducting strip
- frame assembled
- assembled inserts
- inserts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
Abstract
A kind of lead frame assembled inserts that the present invention provides and the manufacture method of lead frame, wherein lead frame assembled inserts includes limiting in lead frame between conducting strip relative to the first limiting structure of position and limits between described lead frame assembled inserts and described conducting strip the second limiting structure relative to position.Wire frame assembled inserts in the technical program make lead frame only need once to be molded can complete make, simplify the processing technology of lead frame so that cost is relatively low, production efficiency is higher.
Description
Technical field
The present invention relates to the making field of field lead frame, be specifically related to a kind of lead frame assembled inserts, this
The bright manufacture method simultaneously relating to a kind of lead frame.
Background technology
Lead frame, as the chip carrier of integrated circuit, is a kind of real by means of bonding material (spun gold, aluminium wire, copper wire)
Existing chip internal circuits exit and the electrical connection of outer lead, be the key structure part forming electric loop.Used for lead frame
Metallic conduction sheet replaces conventional wire or wiring board, serves the function served as bridge connected with outer lead, the half of the overwhelming majority
Conductor integrated package is required to use lead frame, is basic material important in electronics and information industry.
Lead frame typically requires and conducting strip becomes with plastic injection an entirety, is rigidly connected realizing it.Lead frame
Frame is in injection moulding process, for guaranteeing that inserts and conducting strip do not occur skew or leak outside, it will usually extra injection one layer on inserts
Plastic cement, by this layer of plastic cement to guarantee that inserts is not subjected to displacement when quadric injection mould.The program carries out twice injection due to needs,
Have that efficiency is low, cost is high and the shortcoming of complex process.
Summary of the invention
Therefore, the technical problem to be solved in the present invention is to overcome that efficiency of the prior art is low, cost is high and technique multiple
Miscellaneous defect, thus a kind of lead frame assembled inserts is provided.
Present invention simultaneously provides the manufacture method of a kind of lead frame, efficiency in prior art is low, cost is high solving and
The defect of complex process.
A kind of lead frame assembled inserts that the present invention provides, including limiting phase para-position between conducting strip in lead frame
The first limiting structure of putting and limit between described lead frame assembled inserts and described conducting strip the second limit relative to position
Structure processed.
Optionally, including be arranged at that described conducting strip both sides cooperate upper piece and lower piece.
Optionally, described upper piece and the described lower piece of outside away from described conducting strip be provided be easy to injection time plastics pass through
Guiding gutter.
Optionally, described upper piece be provided with towards described lower piece extend locating shaft, described lower piece be provided with fixed with described
The hole, location that position axle coordinates, the periphery of described locating shaft is provided with the interference muscle for location.
Optionally, the described upper piece adjacent described conducting strip of correspondence be arranged at intervals with at least two for limit adjacent described in lead
The spacing preiection of electricity sheet position, described spacing preiection is the first limiting structure.
Optionally, the described lower piece of containing groove being provided with accommodating described spacing preiection end.
Optionally, the adjacent described spacing preiection between adjacent described conducting strip forms locating slot, described locating slot and institute
The positioning convex stating conducting strip side coordinates, and described locating slot is the second limiting structure.
Present invention simultaneously provides the manufacture method of a kind of lead frame, including:
Lead frame assembled inserts described in any of the above-described item is assembled with conducting strip；
It is molded.
Technical solution of the present invention, has the advantage that
A kind of lead frame assembled inserts that the present invention provides, wire frame assembled inserts makes lead frame only need
Once injection can complete to make, and simplifies the processing technology of lead frame so that cost is relatively low, and production efficiency is higher.
Accompanying drawing explanation
In order to be illustrated more clearly that the specific embodiment of the invention or technical scheme of the prior art, below will be to specifically
In embodiment or description of the prior art, the required accompanying drawing used is briefly described, it should be apparent that, in describing below
Accompanying drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not paying creative work
Put, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
The structural representation A of upper block in a kind of lead frame assembled inserts that Fig. 1 provides for the present invention；
The structural representation B of upper block in a kind of lead frame assembled inserts that Fig. 2 provides for the present invention；
The structural representation A of lower block in a kind of lead frame assembled inserts that Fig. 3 provides for the present invention.
Description of reference numerals:
1-locating shaft, 2-spacing preiection, 3-locating slot, 4-guiding gutter, 5-position hole, 6-containing groove.
Detailed description of the invention
Below in conjunction with accompanying drawing, technical scheme is clearly and completely described, it is clear that described enforcement
Example is a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill
The every other embodiment that personnel are obtained under not making creative work premise, broadly falls into the scope of protection of the invention.
Fig. 1 to Fig. 3 shows a kind of lead frame assembled inserts embodiment that the present invention provides.
This lead frame assembled inserts include being positioned at conducting strip both sides cooperate upper piece and lower piece.Described upper piece set
Being equipped with towards the described lower piece of locating shaft 1 extended, described lower piece is provided with the hole, location 5 coordinated with described locating shaft 1.Described fixed
The periphery of position axle 1 is provided with interference muscle.Hole, described location 5, described locating shaft 1 and described interference muscle realize described upper piece and institute
State the location and installation of lower piece.
Described upper piece be provided with at the back side away from described conducting strip that plastic material melted when being easy to injection passes through lead
Chute 4.Correspondingly, described lower piece of same being provided with at the back side away from described conducting strip is easy to plastic material melted when being molded
The guiding gutter passed through.
Described upper piece on be provided with corresponding adjacent conductive sheet spacing preiection 2 be set.Described spacing preiection 2 is arranged at adjacent institute
Stating between conducting strip, width is equal with the spacing of adjacent described conducting strip.For limiting the relative position of adjacent described conducting strip.
In the technical program, between same adjacent described conducting strip, it is provided with spacing preiection 2 described at least two.Described spacing preiection 2
I.e. first limiting structure.
The containing groove 6 that accommodating described spacing preiection 2 end coordinates it is provided with in this actuating rod on described lower piece.Described appearance
The spacing preiection 2 put between the corresponding same adjacent described conducting strip of groove 6 is arranged.
Locating slot 3, described locating slot 3 and described conduction is formed between the adjacent described restriction projection of adjacent described conducting strip
Sheet side positioning convex coordinates, it is achieved consolidate relative position between described conducting strip with described lead frame assembled inserts
Fixed, prevent the position in both injection moulding process kinds from offseting.Described locating slot 3 that is second limiting structure.
In order to ensure conducting strip location on mould open/close direction when injection, described upper piece periphery is provided with has setting
The inclined-plane of angle.
Present invention simultaneously provides the manufacture method of a kind of lead frame, including:
The lead frame assembled inserts of any of the above-described technical characteristic is assembled with conducting strip；
It is molded.
According to above-mentioned manufacture method it can be seen that for relatively prior art, lead frame assembled inserts makes lead frame
Frame only needs once to be molded and can complete to make, and simplifies the processing technology of lead frame so that cost is relatively low, and production efficiency is relatively
High.
Obviously, above-described embodiment is only for clearly demonstrating example, and not restriction to embodiment.Right
For those of ordinary skill in the field, can also make on the basis of the above description other multi-form change or
Variation.Here without also cannot all of embodiment be given exhaustive.And the obvious change thus extended out or
Change among still in the protection domain of the invention.
Claims (8)
1. a lead frame assembled inserts, it is characterised in that: include limiting in lead frame between conducting strip position relatively
The first limiting structure and limit between described lead frame assembled inserts and described conducting strip relative to position second restriction
Structure.
Lead frame assembled inserts the most according to claim 1, it is characterised in that: include being arranged at described conducting strip two
Side cooperate upper piece and lower piece.
Lead frame assembled inserts the most according to claim 2, it is characterised in that: described upper piece and described lower piece away from
The outside of described conducting strip is provided with the guiding gutter that when being easy to injection, plastics pass through.
Lead frame assembled inserts the most according to claim 2, it is characterised in that: described upper piece be provided with towards described
The lower piece of locating shaft (1) extended, described lower piece is provided with the hole, location (5) coordinated with described locating shaft (1), described locating shaft
(1) periphery is provided with the interference muscle for location.
Lead frame assembled inserts the most according to claim 2, it is characterised in that: lead described in described upper piece correspondence is adjacent
Electricity sheet is arranged at intervals with at least two for limiting the spacing preiection (2) of adjacent described conducting strip position, described spacing preiection (2)
It it is the first limiting structure.
Lead frame assembled inserts the most according to claim 5, it is characterised in that: described lower piece (1) is provided with accommodating
The containing groove (6) of described spacing preiection (2) end.
Lead frame assembled inserts the most according to claim 5, it is characterised in that: the phase between adjacent described conducting strip
Adjacent described spacing preiection (2) forms locating slot (3), and described locating slot (3) coordinates with the positioning convex of described conducting strip side, institute
Stating locating slot (3) is the second limiting structure.
8. the manufacture method of a lead frame, it is characterised in that including:
Lead frame assembled inserts described in any one of claim 1 to 7 is assembled with conducting strip；
It is molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610792257.4A CN106158813B (en) | 2016-08-31 | 2016-08-31 | A kind of production method of lead frame assembled inserts and lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610792257.4A CN106158813B (en) | 2016-08-31 | 2016-08-31 | A kind of production method of lead frame assembled inserts and lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106158813A true CN106158813A (en) | 2016-11-23 |
| CN106158813B CN106158813B (en) | 2019-07-09 |
Family
ID=57344880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610792257.4A Active CN106158813B (en) | 2016-08-31 | 2016-08-31 | A kind of production method of lead frame assembled inserts and lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106158813B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100133681A1 (en) * | 2008-11-28 | 2010-06-03 | Mitsubishi Electric Corporation | Power semiconductor device |
| CN204271317U (en) * | 2014-12-31 | 2015-04-15 | 合兴集团有限公司 | For locating the positioning component containing needle connector inserts in plastic mould |
| CN205984973U (en) * | 2016-08-31 | 2017-02-22 | 合兴集团汽车电子有限公司 | Lead wire fabricated frame formula inserts |
-
2016
- 2016-08-31 CN CN201610792257.4A patent/CN106158813B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100133681A1 (en) * | 2008-11-28 | 2010-06-03 | Mitsubishi Electric Corporation | Power semiconductor device |
| CN204271317U (en) * | 2014-12-31 | 2015-04-15 | 合兴集团有限公司 | For locating the positioning component containing needle connector inserts in plastic mould |
| CN205984973U (en) * | 2016-08-31 | 2017-02-22 | 合兴集团汽车电子有限公司 | Lead wire fabricated frame formula inserts |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106158813B (en) | 2019-07-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105138161B (en) | Touch control display device | |
| CN109076700A (en) | For high speed, the backboard encapsulation part of high density electrical connector | |
| CN105493278A (en) | Ultra fine pitch and spacing interconnects for substrate | |
| CN106648202A (en) | Electronic equipment, touch display screen, touch component and touch conducting film | |
| CN106207540A (en) | A kind of flexible circuit board connector and electronic equipment | |
| CN106714441B (en) | Board structure of circuit and preparation method thereof | |
| CN109769344A (en) | The manufacturing method of circuit board and the circuit board | |
| CN205984973U (en) | Lead wire fabricated frame formula inserts | |
| CN104465590A (en) | Semiconductor Device And Lead Frame With Interposer | |
| CN106158813A (en) | A kind of lead frame assembled inserts and the manufacture method of lead frame | |
| CN105097757B (en) | Chip package base plate, chip-packaging structure and preparation method | |
| CN204560022U (en) | There is the board structure of circuit of embedded connector | |
| CN106332479A (en) | Mobile terminal, housing assembly and manufacturing method of housing assembly | |
| CN106231779A (en) | FPC winding displacement and mobile terminal for mobile terminal | |
| CN106876361A (en) | A kind of microelectronics Packaging lead frame of matrix arrangement | |
| CN102036506A (en) | Manufacturing method of golden fingers | |
| CN104966709B (en) | Package substrate and preparation method thereof | |
| CN105451469A (en) | Circuit board golden finger manufacturing method | |
| CN207731947U (en) | A kind of uniform LED support of injection molding | |
| CN207265238U (en) | Connection structure | |
| CN102548220A (en) | Manufacturing method of circuit board | |
| CN101488486B (en) | Circuit substrate capable of opening slots | |
| CN211297152U (en) | Concatenation formula printed circuit board structure | |
| CN208189578U (en) | Improved structure of lead frame with circuit | |
| CN110139485A (en) | A kind of method of continuous production flexible circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 325608 No. 1098, happy East Road, Hongqiao Town, Yueqing City, Wenzhou, Zhejiang Applicant after: Hop Hing automotive electronics Limited by Share Ltd Address before: 325608 No. 1098, happy East Road, Hongqiao Town, Yueqing City, Wenzhou, Zhejiang Applicant before: CWB Group Automotive Electronic Co., Ltd. |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |