CN106158813B - A kind of production method of lead frame assembled inserts and lead frame - Google Patents
A kind of production method of lead frame assembled inserts and lead frame Download PDFInfo
- Publication number
- CN106158813B CN106158813B CN201610792257.4A CN201610792257A CN106158813B CN 106158813 B CN106158813 B CN 106158813B CN 201610792257 A CN201610792257 A CN 201610792257A CN 106158813 B CN106158813 B CN 106158813B
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- lead frame
- conductive sheet
- frame assembled
- assembled inserts
- inserts
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Abstract
The production method of a kind of lead frame assembled inserts and lead frame provided by the invention, wherein lead frame assembled inserts includes the second limiting structure for limiting in lead frame the first limiting structure of relative position between conductive sheet and limiting relative position between the lead frame assembled inserts and the conductive sheet.Wire frame assembled inserts in the technical program makes lead frame only need once injection molding that production can be completed, and simplifies the manufacture craft of lead frame, so that cost is relatively low, production efficiency is higher.
Description
Technical field
The present invention relates to the production fields of field lead frame, and in particular to a kind of lead frame assembled inserts, this hair
It is bright while being related to a kind of production method of lead frame.
Background technique
Chip carrier of the lead frame as integrated circuit is a kind of real by means of bonding material (spun gold, aluminium wire, copper wire)
The electrical connection of existing chip internal circuits exit and outer lead, is the key structure part to form electric loop.It is used for lead frame
Metallic conduction piece replaces conventional conducting wire or wiring board, plays function served as bridge connect with outer lead, it is most partly
It is required to be basic material important in electronics and information industry using lead frame in conductor integrated package.
Lead frame is usually required conductive sheet and plastic injection at an entirety, to realize its rigid connection.Lead frame
Frame is in injection moulding process, to ensure that inserts and conductive sheet do not shift or leak outside, it will usually additionally be molded one layer on inserts
Plastic cement, by this layer of plastic cement to ensure that inserts is not subjected to displacement in quadric injection mould.The program due to need be molded twice,
Have the shortcomings that low efficiency, at high cost and complex process.
Summary of the invention
Therefore, the technical problem to be solved in the present invention is that overcoming low efficiency in the prior art, at high cost and technique multiple
Miscellaneous defect, to provide a kind of lead frame assembled inserts.
Present invention simultaneously provides a kind of production method of lead frame, with solve in the prior art low efficiency, it is at high cost and
The defect of complex process.
Opposite position between conductive sheet in a kind of lead frame assembled inserts provided by the invention, including limitation lead frame
Second limit of relative position between the first limiting structure and the limitation lead frame assembled inserts and the conductive sheet set
Structure processed.
Optionally, including be set to the conductive sheet two sides it is mutually matched upper piece and lower piece.
Optionally, it is described upper piece and described lower piece pass through convenient for plastics when injection molding far from being provided on the outside of the conductive sheet
Diversion trench.
Optionally, it is described upper piece be provided with towards described lower piece extend locating shaft, described lower piece be provided with it is described fixed
The location hole of position axis cooperation, the periphery of the locating shaft is provided with interference muscle used for positioning.
Optionally, the upper piece corresponding adjacent conductive sheet is arranged at intervals at least two for limiting adjacent described lead
The retention bead of electric piece position, the retention bead are the first limiting structure.
Optionally, it is provided with the containing groove for accommodating the retention bead end for described lower piece.
Optionally, the adjacent retention bead between the adjacent conductive sheet forms locating slot, the locating slot and institute
The positioning protrusion cooperation of conductive sheet side is stated, the locating slot is the second limiting structure.
Present invention simultaneously provides a kind of production methods of lead frame, comprising:
Lead frame assembled inserts described in any of the above embodiments and conductive sheet are assembled；
It is molded.
Technical solution of the present invention has the advantages that
A kind of lead frame assembled inserts provided by the invention, wire frame assembled inserts need lead frame only
Production can be completed in primary injection molding, simplifies the manufacture craft of lead frame, so that cost is relatively low, production efficiency is higher.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram A of upper block in a kind of lead frame assembled inserts provided by the invention；
Fig. 2 is the structural schematic diagram B of upper block in a kind of lead frame assembled inserts provided by the invention；
Fig. 3 is the structural schematic diagram A of lower block in a kind of lead frame assembled inserts provided by the invention.
Description of symbols:
1- locating shaft, 2- retention bead, 3- locating slot, 4- diversion trench, 5- location hole, 6- containing groove.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
Personnel's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
Fig. 1 to Fig. 3 shows a kind of lead frame assembled inserts embodiment provided by the invention.
The lead frame assembled inserts include be located at conductive sheet two sides it is mutually matched upper piece and lower piece.It is described upper piece set
It is equipped with the locating shaft 1 extended towards described lower piece, described lower piece is provided with the location hole 5 with the locating shaft 1 cooperation.It is described fixed
The periphery of position axis 1 is provided with interference muscle.The location hole 5, the locating shaft 1 and the interference muscle realize it is described upper piece and institute
State lower piece of location and installation.
It is described upper piece when the back side far from the conductive sheet is provided with convenient for injection molding leading of passing through of the plastic material that melts
Chute 4.Correspondingly, the back side far from the conductive sheet is equally provided with the plastic material convenient for melting when injection molding for described lower piece
By diversion trench.
It is described upper piece on be provided with corresponding adjacent conductive piece setting retention bead 2.The retention bead 2 is set to adjacent institute
It states between conductive sheet, width is equal with the spacing of the adjacent conductive sheet.For limiting the relative position of the adjacent conductive sheet.
In the technical program, at least two retention beads 2 are provided between the same adjacent conductive sheet.The retention bead 2
That is the first limiting structure.
It is provided on described lower piece and accommodates the containing groove 6 that 2 end of retention bead cooperates in the actuating rod.The appearance
The retention bead 2 set between the corresponding same adjacent conductive sheet of groove 6 is arranged.
Locating slot 3, the locating slot 3 and the conduction are formed between the adjacent limitation protrusion of the adjacent conductive sheet
Relative position between the conductive sheet and the lead frame assembled inserts is consolidated in the cooperation of piece side positioning protrusion, realization
It is fixed, it prevents from shifting in the position of both injection moulding process kinds.The locating slot 3 is the second limiting structure.
In order to ensure positioning of the conductive sheet in injection molding on mould open/close direction, the upper piece periphery, which is provided with, has setting
The inclined-plane of angle.
Present invention simultaneously provides a kind of production methods of lead frame, comprising:
The lead frame assembled inserts of any of the above-described technical characteristic and conductive sheet are assembled；
It is molded.
It can be seen that compared with the prior art according to above-mentioned production method, lead frame assembled inserts makes lead frame
Frame, which only needs once to be molded, can be completed production, simplify the manufacture craft of lead frame so that cost is relatively low, production efficiency compared with
It is high.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes still within the protection scope of the invention.
Claims (5)
1. a kind of lead frame assembled inserts, it is characterised in that: including be set to conductive sheet two sides it is mutually matched upper piece and
Lower piece；The upper piece corresponding adjacent conductive sheet is arranged at intervals at least two for limiting the adjacent conductive sheet position
Retention bead (2)；The adjacent retention bead (2) between the adjacent conductive sheet forms locating slot (3), the locating slot
(3) and the cooperation of the positioning protrusion of the conductive sheet side is to limit between the lead frame assembled inserts and the conductive sheet
Relative position.
2. lead frame assembled inserts according to claim 1, it is characterised in that: it is described upper piece and described lower piece it is separate
The diversion trench passed through convenient for plastics when injection molding is provided on the outside of the conductive sheet.
3. lead frame assembled inserts according to claim 1, it is characterised in that: it is described upper piece be provided with towards described in
The locating shaft (1) of lower piece of extension, described lower piece is provided with the location hole (5) with the locating shaft (1) cooperation, the locating shaft
(1) periphery is provided with interference muscle used for positioning.
4. lead frame assembled inserts according to claim 1, it is characterised in that: lower piece (1) is provided with accommodating
The containing groove (6) of retention bead (2) end.
5. a kind of production method of lead frame characterized by comprising
The described in any item lead frame assembled inserts of Claims 1-4 and conductive sheet are assembled；
It is molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610792257.4A CN106158813B (en) | 2016-08-31 | 2016-08-31 | A kind of production method of lead frame assembled inserts and lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610792257.4A CN106158813B (en) | 2016-08-31 | 2016-08-31 | A kind of production method of lead frame assembled inserts and lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106158813A CN106158813A (en) | 2016-11-23 |
| CN106158813B true CN106158813B (en) | 2019-07-09 |
Family
ID=57344880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610792257.4A Active CN106158813B (en) | 2016-08-31 | 2016-08-31 | A kind of production method of lead frame assembled inserts and lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106158813B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204271317U (en) * | 2014-12-31 | 2015-04-15 | 合兴集团有限公司 | For locating the positioning component containing needle connector inserts in plastic mould |
| CN205984973U (en) * | 2016-08-31 | 2017-02-22 | 合兴集团汽车电子有限公司 | Lead wire fabricated frame formula inserts |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4607995B2 (en) * | 2008-11-28 | 2011-01-05 | 三菱電機株式会社 | Power semiconductor device |
-
2016
- 2016-08-31 CN CN201610792257.4A patent/CN106158813B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204271317U (en) * | 2014-12-31 | 2015-04-15 | 合兴集团有限公司 | For locating the positioning component containing needle connector inserts in plastic mould |
| CN205984973U (en) * | 2016-08-31 | 2017-02-22 | 合兴集团汽车电子有限公司 | Lead wire fabricated frame formula inserts |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106158813A (en) | 2016-11-23 |
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| C06 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 325608 No. 1098, happy East Road, Hongqiao Town, Yueqing City, Wenzhou, Zhejiang Applicant after: Hop Hing automotive electronics Limited by Share Ltd Address before: 325608 No. 1098, happy East Road, Hongqiao Town, Yueqing City, Wenzhou, Zhejiang Applicant before: CWB Group Automotive Electronic Co., Ltd. |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |