CN106158708A - Reaction cavity and dry etching board - Google Patents
Reaction cavity and dry etching board Download PDFInfo
- Publication number
- CN106158708A CN106158708A CN201610479534.6A CN201610479534A CN106158708A CN 106158708 A CN106158708 A CN 106158708A CN 201610479534 A CN201610479534 A CN 201610479534A CN 106158708 A CN106158708 A CN 106158708A
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- Prior art keywords
- jack
- parts
- reaction cavity
- board
- top board
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
Abstract
The invention discloses a kind of reaction cavity, including: top board, division board, multiple jack-up parts and driving means, it is provided with multiple hole in the one side of described top board, the plurality of jack-up parts are respectively arranged in multiple described hole, described division board is positioned at the one side of described top board, and driving means connects described jack-up parts.When the non-jack-up of the described jack-up parts of described driving means control, described jack-up parts are fully located in described hole, and described division board can be fixed on described top board.In the reaction cavity of the present invention, when described division board is taken off from described top board by needs, the described jack-up parts jack-up of described driving means control, one end of described jack-up parts ejects described hole from the one side of described top board, division board described in described jack-up parts jack-up, thus by described division board from described top board jack-up, such that it is able to easily described division board is taken away, it is to avoid damage is caused to described division board.
Description
Technical field
The present invention relates to semi-conductor device technology field, particularly relate to a kind of reaction cavity and dry etching board.
Background technology
Etching is that the one in semiconductor fabrication process, microelectronics IC manufacturing process and minute manufacturing technique is quite important
Processing step, be a kind of main technique that graphical (pattern) being associated with photoetching is processed.From the point of view of in broad sense, etching
Become to be peeled off by solution, reactive ion or other mechanical systems, remove a kind of general designation of material, become what micro Process manufactured
A kind of pervasive call.Etching the simplest the most frequently used classification is dry etching and wet etching.Dry etching species is a lot, including light
Volatilization, gaseous corrosion, plasma etching etc..The anisotropy of dry etching is good, selects ratio high, controllability, flexibility, repetition
Property good, easily realize automation, without chemical waste fluid, processing procedure is not introduced into polluting, cleanliness factor height.
Dry etching is carried out in reaction cavity in dry etching board, and reaction cavity forms a confined space, institute
The roof stating reaction cavity has a top board, and a division board is fixed on described top board towards the one side of described confined space.Entering
During row etching reaction, there is in described confined space the reacting gas such as plasma, but, the material of described top board is generally gold
Belong to material, so needing to arrange described division board to completely cut off described top board and confined space.
But, the material of described division board is pottery, such as quartz, and described division board is frangible, described pulling down and installing
During division board, described division board is susceptible to breakage, and installation difficulty is big, time-consumingly long, and the price of described division board is high.Existing skill
Art generally uses sucker described division board is taken off from described top board, but through Long-Time Service, force of suction cup is not enough, leads
Cause described division board easily to drop, cause damage.
Content of the invention
For solving above-mentioned technical problem, the present invention provides a kind of reaction cavity, comprising:
Top board, the one side of described top board is provided with multiple hole；
Multiple jack-up parts, are respectively arranged in multiple described hole；
Division board, described division board is positioned at the one side of described top board；And
For driving the driving means of described jack-up parts, connect described jack-up parts, when described driving means controls institute
When stating the non-jack-up of jack-up parts, described jack-up parts are fully located in described hole；When the described jack-up of described driving means control
During parts jack-up, one end of described jack-up parts ejects described hole from the one side of described top board, and by described top board jack-up.
Further, in described reaction cavity, described jack-up parts are elastic jack-up parts.
Further, in described reaction cavity, described jack-up parts include that a matrix and is positioned at described matrix one
The spring of side, the described matrix of described driving means control moves up and down.
Further, in described reaction cavity, described jack-up parts also include a top cap, and described top cap is positioned at described bullet
Spring deviates from the side of described matrix, and the material of described top cap is flexible insulating material.
Further, in described reaction cavity, the material of described top cap is FFKM.
Further, in described reaction cavity, the surface of described matrix and spring is insulating materials.
Further, in described reaction cavity, described top board includes frame structure, and described hole is positioned at described framework knot
In structure.
Further, in described reaction cavity, multiple described holes are evenly arranged in described frame structure.
Further, in described reaction cavity, described reaction cavity includes multiple described driving means, drives described in each
Jack-up parts described in dynamic device coupling part respectively.
According to the another side of the present invention, also provide a kind of dry etching board, including the as above reaction described in any one
Cavity.
There is provided in a kind of reaction cavity and dry etching board in the present invention, described reaction cavity includes top board, isolation
Plate, multiple jack-up parts and driving means, the one side of described top board is provided with multiple hole, and the plurality of jack-up parts divide
Not being arranged in multiple described hole, described division board is positioned at the one side of described top board, and driving means connects described jack-up parts.
When the non-jack-up of the described driving means described jack-up parts of control, described jack-up parts are fully located in described hole, described every
Can be fixed on described top board from plate；When described division board is taken off from described top board by needs, described driving means control
Making described jack-up parts jack-up, one end of described jack-up parts ejects described hole, described jacking part from the one side of described top board
Division board described in part jack-up, thus by described division board from described top board jack-up, such that it is able to easily by described division board
Take away, it is to avoid damage is caused to described division board.
Further, described jack-up parts are elastic jack-up parts, can be at division board described in described jack-up parts jack-up
When, increase the buffering to described division board for the described jack-up parts, avoid further causing damage to described division board.
Brief description
Fig. 1 is the profile of the reaction cavity of one embodiment of the invention；
Fig. 2 is a face top view of the top board of one embodiment of the invention；
Fig. 3 is the schematic diagram of jack-up parts non-jack-up division board in one embodiment of the invention；
Fig. 4 is the schematic diagram of jack-up parts jack-up division board in one embodiment of the invention；
Fig. 5 is the schematic diagram of jack-up parts in one embodiment of the invention.
Specific embodiment
It is described in more detail below in conjunction with reaction cavity and dry etching board to the present invention for the schematic diagram, its
In illustrate the preferred embodiments of the present invention, it should be appreciated that those skilled in the art can change invention described herein, and
Still the advantageous effects of the present invention is realized.Therefore, description below is appreciated that extensively knowing for those skilled in the art
Road, and it is not intended as limitation of the present invention.
Referring to the drawings the present invention more particularly described below by way of example in the following passage.According to following explanation, the present invention
Advantages and features will be apparent from.It should be noted that, accompanying drawing all uses the form simplifying very much and all uses non-ratio accurately,
Only in order to purpose convenient, the aid illustration embodiment of the present invention lucidly.
The core concept of the present invention is, the present invention provides a kind of reaction cavity, comprising: top board, the one side of described top board
On be provided with multiple hole；Multiple jack-up parts, are respectively arranged in multiple described hole；Division board, described division board is positioned at
The one side of described top board；And, for driving the driving means of described jack-up parts, connect described jack-up parts.
When the non-jack-up of the described jack-up parts of described driving means control, described jack-up parts are fully located at described hole
In, described division board can be fixed on described top board；When described division board is taken off from described top board by needs, described drive
The described jack-up parts jack-up of dynamic device control, one end of described jack-up parts ejects described hole from the one side of described top board, institute
State division board described in jack-up parts jack-up, thus by described division board from described top board jack-up, such that it is able to easily by institute
State division board to take away, it is to avoid cause damage to described division board.
According to above-mentioned core concept, the present invention also provides a kind of dry etching board including described reaction cavity.
Hereinafter refer to Fig. 1 to Fig. 5 and illustrate reaction cavity and the dry etching board of the present invention, at the present embodiment
In, the reaction cavity that described reaction cavity 1 is dry etching board, carry out dry etching reaction in described reaction cavity 1.
As it is shown in figure 1, described reaction cavity 1 includes cavity wall the 110th, division board the 120th, top board 130, described division board 120
Form a confined space 111, described division board between the one side 131 of described top board 130, described cavity wall 110 and division board 120
120 are arranged on described top board 130 towards the one side 131 of described confined space 111, general, can be by fixtures such as screws
Described division board 120 is fixed to the one side 131 of top board 130, more described division board 120 is fixed together with top board 130 afterwards
Above described cavity wall 110.The material of described division board 120 can be the ceramic materials such as quartz, and described division board 120 is easily sent out
Raw breakage.
Being provided with multiple hole 132 in the one side 131 of described top board 130, multiple jack-up parts 140 are respectively arranged at multiple
In described hole 132, the size of described hole 132 is simultaneously not particularly limited, it is also preferred that the left the degree of depth of described hole 132 can be
1cm～5cm, such as 3cm, the diameter of described hole 132 can be 1cm～10cm, such as 3cm, 5cm, can accommodate described top
Play parts 140, be unlikely to again to affect the performance of described top board 130.
As in figure 2 it is shown, in the present embodiment, described top board 130 includes frame structure 1301, and described hole 132 is positioned at institute
State in frame structure 1301.In the present embodiment, the material of described frame structure 1301 is metal, such as metallic aluminium etc..Institute
Being also provided with ceramic block 1302 in the framework stating frame structure 1301, the material of described ceramic block 1302 can be quartz
Deng.Multiple described holes 132 are evenly arranged in described frame structure 1301, and the distribution to ensure described jack-up parts 140 is equal
Even, when division board 120 described in jack-up, it is ensured that the uniform force of described division board 120.
As in figure 2 it is shown, described reaction cavity 1 includes driving means 150, described driving means 150 connects described jacking part
Part 140, for driving the motion of described jack-up parts 140, described driving means 150 can be connected described by connector 151
Jack-up parts 140.Specifically arranging and being not particularly limited of described driving means 150, can be the modes such as connecting rod driving, and this is
It will be appreciated by those skilled in the art that, therefore not to repeat here.
Described reaction cavity 1 can include one or more driving means 150, when described reaction cavity 1 includes multiple driving
During dynamic device 150, jack-up parts 140 described in each described driving means 150 coupling part respectively, to facilitate to top each described
Play parts 140 to reach accurately to control.In fig. 2, described reaction cavity 1 can include two driving means 150, and described driving fills
Put 150 to be symmetrical arranged relative to described top board 130.
When described reaction cavity 1 normally works, as it is shown in figure 1, described division board 120 is arranged on described top board 130.As
When needing to unload described division board 120, need first described division board 120 to be unloaded together with top board 130 from described cavity wall 110
Under, as it is shown on figure 3, set up described division board 120 face, and will be used for fixing the spiral shell of described division board 120 and top board 130
Nail unloads, and the one side 131 of described top board 130 supports described division board 120, and now described driving means 150 controls described jack-up
During parts 140 non-jack-up, described jack-up parts 140 are fully located in described hole 132；Then, described driving means 150 controls
During described jack-up parts 140 jack-up, one end of described jack-up parts 140 ejects described hole from the one side 131 of described top board 130
132, described jack-up parts 140 exceed the one side 131 of described top board 130, division board 120 described in described jack-up parts 140 jack-up,
Thus by described division board 120 from described top board 130 jack-up, such that it is able to easily described division board 120 is taken away, it is to avoid
Damage is caused to described division board 120.
In like manner, can also utilize described jack-up parts 140 that described division board 120 is positioned over the one side of described top board 130
131, according to the foregoing description of the present invention, this is it will be understood by those skilled in the art that, and therefore not to repeat here.
It is also preferred that the left described jack-up parts 140 are elastic jack-up parts, can described in described jack-up parts 140 jack-up every
When plate 120, increase the buffering to described division board 120 for the described jack-up parts 140, avoid further to described division board 120
Cause damage.
In the present embodiment, as it is shown in figure 5, described jack-up parts 140 include a matrix 141 and spring 142.In order to keep away
Exempt from described spring 142 to scratch described division board 120, it is also preferred that the left described jack-up parts 140 also include a top cap 143, described top
Cap 143 is positioned at the side that described spring 142 deviates from described matrix 141, and described top cap 143 is positioned at the one of described jack-up parts 140
End, described matrix 141 is positioned at the other end of described jack-up parts 140, and described top cap 143 is used for ejecting described division board 120,
In the present embodiment, by described matrix 141, described jack-up parts 140 can be arranged at described hole 132, concrete setting side
Formula is it will be understood by those skilled in the art that, and therefore not to repeat here.
The material of described top cap 143 is flexible insulating material, it is preferred that the material of described top cap is FFKM.Described
The surface of matrix 141 and spring 142 is insulating materials, and for example, described matrix 141 can be coated with metal, institute for polyether-ether-ketone
State spring 142 and can be ambroin cladding metal etc..
In the present embodiment, described driving means 150 controls described matrix 141 and moves up and down, and described matrix 141 drives institute
State spring 142 and top cap 143 is moved, thus division board 120 described in jack-up.
Presently preferred embodiments of the present invention as described above, but the present invention is not limited to scope disclosed above, for example:
In other embodiments of the invention, described jack-up parts are not limited to include a matrix and spring, for example, institute
Stating jack-up parts can also be one block of elastic caoutchouc etc., as long as the stress to described division board can be buffered, also in the present invention
Thought range within；
Additionally, described reaction cavity is not limited to the cavity for dry etching board, in other embodiments of the invention,
Also can be by the board of other the semiconductor manufacturing of described reaction cavity of the present invention, it is embodied as step and thinking and Ben Fa
Bright above-described embodiment is similar, and under the enlightenment of the embodiment of the present invention, the extension of this application is to those of ordinary skill in the art
For be easy to understand and realize, do not repeat them here.
To sum up, the present invention provides a kind of reaction cavity, and described reaction cavity includes top board, division board, multiple jack-up parts
And driving means, the one side of described top board is provided with multiple hole, the plurality of jack-up parts are respectively arranged at multiple institute
Stating in hole, described division board is positioned at the one side of described top board, and driving means connects described jack-up parts.When described driving means
When controlling the non-jack-up of described jack-up parts, described jack-up parts are fully located in described hole, and described division board can be fixed on
On described top board；When described division board is taken off from described top board by needs, the described jack-up parts of described driving means control
Jack-up, one end of described jack-up parts ejects described hole from the one side of described top board, isolates described in described jack-up parts jack-up
Plate, thus by described division board from described top board jack-up, such that it is able to easily described division board is taken away, it is to avoid to described
Division board causes damage.
Obviously, those skilled in the art can carry out various change and the modification essence without deviating from the present invention to the present invention
God and scope.So, if these modifications of the present invention and modification belong to the scope of the claims in the present invention and equivalent technologies thereof
Within, then the present invention is also intended to comprise these changes and modification.
Claims (10)
1. a reaction cavity, it is characterised in that include:
Top board, the one side of described top board is provided with multiple hole；
Multiple jack-up parts, are respectively arranged in multiple described hole；
Division board, described division board is positioned at the one side of described top board；And
For driving the driving means of described jack-up parts, connect described jack-up parts, when the described top of described driving means control
When playing the non-jack-up of parts, described jack-up parts are fully located in described hole；When the described jack-up parts of described driving means control
During jack-up, one end of described jack-up parts ejects described hole from the one side of described top board, and by described top board jack-up.
2. reaction cavity as claimed in claim 1, it is characterised in that described jack-up parts are elastic jack-up parts.
3. reaction cavity as claimed in claim 2, it is characterised in that it is described that described jack-up parts include that a matrix and is positioned at
The spring of matrix side, the described matrix of described driving means control moves up and down.
4. reaction cavity as claimed in claim 3, it is characterised in that described jack-up parts also include a top cap, described top cap position
Deviate from the side of described matrix in described spring, the material of described top cap is flexible insulating material.
5. reaction cavity as claimed in claim 4, it is characterised in that the material of described top cap is FFKM.
6. reaction cavity as claimed in claim 3, it is characterised in that the surface of described matrix and spring is insulating materials.
7. reaction cavity as described in any one in claim 1 to 6, it is characterised in that described top board includes frame structure, institute
State hole and be positioned at described frame structure.
8. reaction cavity as claimed in claim 7, it is characterised in that multiple described holes are evenly arranged in described frame structure
On.
9. reaction cavity as claimed in claim 1, it is characterised in that described reaction cavity includes multiple described driving means, often
Jack-up parts described in individual described driving means coupling part respectively.
10. a dry etching board, it is characterised in that include reaction chamber as in one of claimed in any of claims 1 to 9
Body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610479534.6A CN106158708B (en) | 2016-06-27 | 2016-06-27 | Reaction cavity and dry etching machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610479534.6A CN106158708B (en) | 2016-06-27 | 2016-06-27 | Reaction cavity and dry etching machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106158708A true CN106158708A (en) | 2016-11-23 |
| CN106158708B CN106158708B (en) | 2020-02-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610479534.6A Active CN106158708B (en) | 2016-06-27 | 2016-06-27 | Reaction cavity and dry etching machine |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11260805A (en) * | 1998-03-16 | 1999-09-24 | Sony Corp | Plasma etching device |
| CN2505200Y (en) * | 2001-09-25 | 2002-08-14 | 恩德科技股份有限公司 | Material-returning device for forming machine of printed circuit board |
| CN1851898A (en) * | 2005-12-07 | 2006-10-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Thimble device |
| CN101947591A (en) * | 2010-08-27 | 2011-01-19 | 哈尔滨工业大学 | High-temperature deep drawing method for plate by quickly taking member through member taking supporting plate |
| CN201711447U (en) * | 2010-05-14 | 2011-01-19 | 上海汇众汽车制造有限公司 | Elastic stripping device of cold work die |
| CN104576496A (en) * | 2015-01-22 | 2015-04-29 | 北京中拓机械集团有限责任公司 | Lifting device for semiconductor chip |
-
2016
- 2016-06-27 CN CN201610479534.6A patent/CN106158708B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11260805A (en) * | 1998-03-16 | 1999-09-24 | Sony Corp | Plasma etching device |
| CN2505200Y (en) * | 2001-09-25 | 2002-08-14 | 恩德科技股份有限公司 | Material-returning device for forming machine of printed circuit board |
| CN1851898A (en) * | 2005-12-07 | 2006-10-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Thimble device |
| CN201711447U (en) * | 2010-05-14 | 2011-01-19 | 上海汇众汽车制造有限公司 | Elastic stripping device of cold work die |
| CN101947591A (en) * | 2010-08-27 | 2011-01-19 | 哈尔滨工业大学 | High-temperature deep drawing method for plate by quickly taking member through member taking supporting plate |
| CN104576496A (en) * | 2015-01-22 | 2015-04-29 | 北京中拓机械集团有限责任公司 | Lifting device for semiconductor chip |
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| Publication number | Publication date |
|---|---|
| CN106158708B (en) | 2020-02-18 |
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