CN104576496A - Lifting device for semiconductor chip - Google Patents

Lifting device for semiconductor chip Download PDF

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Publication number
CN104576496A
CN104576496A CN201510031351.3A CN201510031351A CN104576496A CN 104576496 A CN104576496 A CN 104576496A CN 201510031351 A CN201510031351 A CN 201510031351A CN 104576496 A CN104576496 A CN 104576496A
Authority
CN
China
Prior art keywords
thimble
semiconductor wafer
fixed head
detection platform
picking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510031351.3A
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Chinese (zh)
Inventor
徐杰
郭金源
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Co Ltd Of Mechanical Group Is Opened Up In Beijing
Original Assignee
Co Ltd Of Mechanical Group Is Opened Up In Beijing
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Co Ltd Of Mechanical Group Is Opened Up In Beijing filed Critical Co Ltd Of Mechanical Group Is Opened Up In Beijing
Priority to CN201510031351.3A priority Critical patent/CN104576496A/en
Publication of CN104576496A publication Critical patent/CN104576496A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Abstract

The invention provides a lifting device for semiconductor chips, and relates to an auxiliary device used for carrying the semiconductor chips to a detecting platform with the cooperation of a mechanical arm, and particularly to the lifting device of the semiconductor chips used for carrying the semiconductor chips to the detecting platform with the cooperation of an ejecting pin and the mechanical arm. The lifting device mainly comprises an ejecting pin fixing plate (7) parallel to the detecting platform (6) and a linear telescoping mechanism (8) used for driving the ejecting pin fixing plate (7) to move up and down, the linear telescoping mechanism (8) is fixedly connected with the detecting platform (6) through a linear telescoping mechanism fixing plate, the ejecting pin fixing plate (7) is a plane plate, detecting platform guide holes (11) are formed in the detecting platform (6), so that ejecting pins (5) of the ejecting pin fixing plate (7) are capable of passing through the detecting platform guide holes (11) to lift up the semiconductor chips. The lifting device solves the problem that when spectrum detection is conducted, the heights between the backgrounds of the bottoms of the semiconductor chips and the upper surface of a plate carrying platform are different, so that different light reflecting effects and light transmission effects are generated, and therefore a consequence that intensity index is closest to actual measured value in spectrum detection results is obtained.

Description

The picking-up device of semiconductor wafer
Technical field
The present invention relates to a kind of cooperative mechanical hand carrying semiconductor wafer to the servicing unit on monitor station, especially a kind of ejector pin mechanism cooperative mechanical hand carrying semiconductor wafer is to the picking-up device of the semiconductor wafer on monitor station.
Background technology
In the automatic equipments such as the current noncontact fluorescence spectral measuring at semiconductor wafer, film thickness measuring, albedo measurement and transmissivity measurement, often adopt Manipulator Transportation semiconductor wafer.Namely by manipulator, semiconductor wafer is taken out in magazine, with manipulator, semiconductor wafer is removed on positive machine again, after positive machine positive, from positive machine, semiconductor wafer is carried in detection platform by manipulator again, after having detected semiconductor wafer, by manipulator, semiconductor wafer is moved from detection platform again, put back in magazine.Because semiconductor wafer front is grown layer, for ensureing that grown layer does not destroy because of contact, semiconductor wafer front can not be touched during Manipulator Transportation, so the end effector mechanism of Manipulator Transportation semiconductor wafer is flat sucker, as shown in Figure 3, sucker center has vacuum hole, for adsorbing semiconductor wafer.During carrying semiconductor wafer, manipulator drives end effector mechanism, is stretched into by flat sucker bottom the semiconductor wafer in magazine, as shown in Figure 4.Then flat sucker lifts under the drive of manipulator, plane on flat sucker is contacted with semiconductor wafer lower surface, then takes out negative pressure by the negative pressure sucker on flat sucker, be adsorbed on flat sucker by semiconductor wafer.Other handling process is similar.When carrying out above non-contact detection to semiconductor wafer, need semiconductor wafer to be placed in a detection platform, then by the detection light source of about 1mm diameter, project on semiconductor wafer, semiconductor wafer sizes is generally 2 to 6 inch band trimming disks, all can detect to realize each point on semiconductor wafer, detection platform needs to move under the drive of drive unit, to ensure that detection light source can project difference on semiconductor wafer, above the light source projecting semiconductor wafer, light path gathering system and corresponding detector are generally installed, to realize the detection to each position on semiconductor wafer.In this testing process, can relate to and how the semiconductor wafer under flat for manipulator sucker suction is placed in detection platform, and how to take semiconductor wafer away from the flat sucker of detection platform manipulator.Existing in detection platform get sheet and film releasing solution is in the detection platform of semiconductor wafer, have a square recess, be illustrated in figure 5 the structural representation of existing detection platform, the flat sucker thickness of its depth ratio is slightly dark, width is slightly wider than flat sucker, when its length picks and places sheet than flat sucker, required length of stretching out is slightly long, surplus is reserved, to ensure that flat sucker can not collide with slide holder to flat sucker when more than having more part for picking and placeing sheet.During film releasing, the flat sucker of absorption semiconductor wafer is under the driving of manipulator, sink in the square recess on slide holder, when semiconductor wafer bottom surface and slide holder are used for the upper plane contact of slide glass, flat sucker is under the control of manipulator control system, negative pressure is discharged, semiconductor wafer is made no longer to be adsorbed on flat sucker, then flat sucker is not when with in detection platform, the lower surface of square recess contacts, sink again a certain amount of, then flat sucker is extracted out under the driving of manipulator in recess, when to ensure that flat sucker does not collide with slide holder, semiconductor wafer is placed on slide holder.Contrary with film releasing order when getting sheet.But due to the detection platform of this device having square recess, semiconductor wafer lower surface is not being placed in detection platform of fitting completely, and some positions directly contact with slide holder upper surface, and some positions are positioned at above square recess.When doing spectral detection, due to background bottom semiconductor wafer because distance slide holder upper level is different, and different reflective and translucent effects can be produced.Thus intensity index in spectral detection result is affected by this factor, there is certain deviation with the tested situation of reality.Device designed by the present invention is used for when realizing the flat sucker of manipulator and picking and placeing sheet, solves the above reflective and inconsistent detection error problem brought of translucent effect.
Summary of the invention
The object of the invention is to carry the picking-up device of semiconductor wafer to the semiconductor wafer on monitor station by a kind of cooperative mechanical hand, solve that above background technology mentions when doing spectral detection, due to background bottom semiconductor wafer because distance slide holder upper level is different, and produce the problem of different reflective and translucent effects, thus finally obtain intensity index and the immediate result of actual measured value in spectral detection result.
The technical scheme that the present invention is adopted in order to achieve the above object is as follows:
The present invention mainly comprises the thimble fixed head 7 parallel with detection platform 6, and drive thimble fixed head 7 upper and lower displacement linear telescopic mechanism 8, linear telescopic mechanism 8 is fixedly connected by linear telescopic mechanism fixed head 9 and detection platform 6, thimble fixed head 7 is a flat board, three vertical thimbles 5 are at least set thereon, detection platform 6 arranges detection platform pilot hole 11, makes the thimble 5 of thimble fixed head 7 can hold up semiconductor wafer 2 through detection platform pilot hole 11; Described thimble fixed head 7 is shoulder hole for the hole of fixing thimble 5, lower thick upper thin, corresponding thimble 5 is also stepped, lower thick upper thin, thimble 5 shape and shoulder hole form fit, and the low side of thimble 5 is fixedly connected by trim ring 10 and fixed head 7; The thimble spacing of wherein any two of described thimble 5 is greater than the width of the flat sucker 1 picking and placeing sheet robot drives; Described linear telescopic mechanism 8 can be cylinder, or the motor-driven sliding straight telescoping mechanism be made up of screw mandrel, nut, guide rail etc., or the sliding straight telescoping mechanism be made up of motor-driven belt, pulley, guide rail etc.
The advantage of checkout gear of the present invention realizes manipulator flat sucker when picking and placeing sheet, solves the reflective and inconsistent detection error problem brought of translucent effect.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is the assembling schematic diagram of ejector pin mechanism in the present invention;
Fig. 3 is the schematic diagram of flat sucker;
Fig. 4 is the schematic diagram that flat sucker sucker stretches in semiconductor wafer magazine;
Fig. 5 is the schematic diagram of existing semiconductor wafer monitor station.
Embodiment
Be further described the technology of the present invention feature and correlation technique feature thereof by embodiment below in conjunction with accompanying drawing: as shown in accompanying drawing 1-5, label wherein represents respectively: the existing semiconductor wafer monitor station of the flat sucker of 1-, 2-semiconductor wafer, 3-magazine, 4-, 5-thimble, 6-detection platform, 7-thimble fixed head, 8-linear telescopic mechanism, 9-linear telescopic mechanism fixed head, 10-thimble trim ring, 11-detection platform pilot hole.
The present embodiment mainly comprises: thimble 5, detection platform 6, thimble fixed head 7, linear telescopic mechanism 8, linear telescopic mechanism fixed head 9, thimble trim ring 10, wherein, thimble 5 forms by two sections, one section is thin oval shell of column, body diameter is 2-3mm is optimum size, another section is slightly thick section, the plane that thin oval shell of column and slightly thick segment interface place protrude, perpendicular with thin segment cylinder axis, ensure that the thimble direction of motion parallels with the direction of motion of the movable telescopic section of linear telescopic mechanism, the quantity of thimble 5 is no less than 3 or more, each thimble size shape is the same, detection platform 6 is used for bearing semiconductor wafer 2, it have more bigger than thimble 5 thin segment diameter, the detection platform pilot hole 11 identical with thimble 5 quantity, the axis of each pilot hole and detection platform 6 are for the upper plane being perpendicular of slide glass, and each pilot hole consistent size, thimble fixed head 7 has the irregularly-shaped hole identical with thimble 5 quantity, irregularly-shaped hole is two sector holes that thickness is different, thin one section is the circular hole slightly thick compared with thimble thin segment, the hole that a section is slightly slightly thick compared with the thick section of thimble, each hole relative position is consistent with detection platform pilot hole 11 relative position, thimble fixed head 7 gross porosity end has pitch thread in a section, there is external screw thread thimble trim ring 10 outside, external screw thread model is identical with pitch thread model in thimble fixed head 7 gross porosity end, can screw in mutually, linear telescopic mechanism 8 comprises standing part and movable telescopic section, described linear telescopic mechanism 8 can be cylinder, can by the motor-driven sliding straight telescoping mechanism be made up of screw mandrel, nut, guide rail etc., the sliding straight telescoping mechanism that also can be made up of motor-driven belt, pulley, guide rail etc., the linear telescopic mechanism 8 of described different structure is different from the fixed form of related components, the stroke of the movable telescopic section of linear telescopic mechanism 8 can ensure, when thimble 5 rises to the highest, thimble 5 thin segment end-to-end distance can make the flat sucker 1 of robot drives stretch into wherein from detection platform 6 for the vertical range of the upper plane of slide glass, prevent flat sucker 1 when picking and placeing sheet and semiconductor wafer or detection platform 6 interfere, when thimble 5 drops to minimum, thimble 5 thin segment end is lower than the upper plane of detection platform 6 for slide glass, the upper surface of the lower surface of semiconductor wafer 2 and detection platform 6 is made to realize the laminating of maximum area, reach the optimization of Detection results, in the present embodiment, the standing part of detection platform 6 and linear telescopic mechanism 8 all fixes with linear telescopic mechanism fixed head 9, thimble 5 thin segment with thimble fixed head 7 pore for guiding, thimble 5 is stretched into by thimble fixed head 7 gross porosity end, lean out from thimble fixed head 7 pore end, by screwing of pitch thread in thimble trim ring 10 external screw-thread and thimble fixed head 7 gross porosity end, thimble 5 is fixed on thimble fixed head 7, thimble fixed head 9 fixes with the movable telescopic section of linear telescopic mechanism, and the taper end of thimble 5 fixed thereon upward, thimble fixed head 9 is arranged in immediately below detection platform 6, when the movable telescopic section of linear telescopic mechanism stretches out, with the thimble 5 that thimble trim ring 10 is fixing on thimble fixed head 7, stretch into from detection platform pilot hole 11, along with the moving up and down of movable telescopic section of linear telescopic mechanism, thimble 5 moves up and down along the axis of detection platform pilot hole 11, be arranged in semiconductor wafer 2 within the scope of thimble jack-up along with thimble 5 realizes the motion of above-below direction under the promotion of linear telescopic mechanism 8, described thimble 5 thin segment end is immediately below semiconductor wafer 2, and have at least the thimble spacing of two thimbles 5 to be greater than the width of the flat sucker 1 picking and placeing sheet robot drives, the installation direction of all thimbles 5 is consistent, detection platform is consistent with thimble quantity with the quantity of respective aperture on thimble fixed head, described thimble trim ring 10 is by screwing in the interior pitch thread of thimble fixed head 7 irregularly-shaped hole end, the length of the interior pitch thread of thimble fixed head 7 irregularly-shaped hole end can ensure, thick for thimble 5 section and thin segment are protruded plane and thimble fixed head 7 irregularly-shaped hole gross porosity and pore to protrude plane and fit, play is there is not in thimble 5 along the thin round hole axial direction of thimble fixed head 7, on described thimble fixed head 7, the axis perpendicular of plane and pore is protruded in the junction of gross porosity and pore, each irregularly-shaped hole thin segment axis is parallel to each other, wherein pore section consistent size.
Although the above design to the object of the invention and embodiment have been done to elaborate; but those of ordinary skill in the art can recognize; under the precondition not departing from claim limited range; still can make various improvement and conversion to the present invention, and this improvement and conversion still should belong to protection scope of the present invention.

Claims (4)

1. the picking-up device of semiconductor wafer, it is characterized in that, mainly comprise the thimble fixed head (7) parallel with detection platform (6), and drive thimble fixed head (7) upper and lower displacement linear telescopic mechanism (8), linear telescopic mechanism (8) is fixedly connected with detection platform (6) by linear telescopic mechanism fixed head (9), thimble fixed head (7) is a flat board, three vertical thimbles (5) are at least set thereon, detection platform (6) arranges detection platform pilot hole (11), make the thimble (5) of thimble fixed head (7) semiconductor wafer can be held up through detection platform pilot hole (11).
2. the picking-up device of semiconductor wafer according to claim 1, it is characterized in that, hole for fixing thimble (5) on described thimble fixed head (7) is shoulder hole, lower thick upper thin, corresponding thimble (5) is also stepped, lower thick upper thin, thimble (5) shape and shoulder hole form fit, the low side of thimble (5) is fixedly connected by trim ring (10) and fixed head (7).
3. the picking-up device of semiconductor wafer according to claim 1, is characterized in that, the thimble spacing of wherein any two of described thimble (5) is greater than the width of the flat sucker (1) picking and placeing sheet robot drives.
4. the picking-up device of semiconductor wafer according to claim 1, it is characterized in that, described linear telescopic mechanism (8) can be cylinder, or the motor-driven sliding straight telescoping mechanism be made up of screw mandrel, nut, guide rail etc., or the sliding straight telescoping mechanism be made up of motor-driven belt, pulley, guide rail etc.
CN201510031351.3A 2015-01-22 2015-01-22 Lifting device for semiconductor chip Pending CN104576496A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510031351.3A CN104576496A (en) 2015-01-22 2015-01-22 Lifting device for semiconductor chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510031351.3A CN104576496A (en) 2015-01-22 2015-01-22 Lifting device for semiconductor chip

Publications (1)

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Application Number Title Priority Date Filing Date
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106158708A (en) * 2016-06-27 2016-11-23 昆山国显光电有限公司 Reaction cavity and dry etching board
CN109433479A (en) * 2019-01-11 2019-03-08 田丽玖 A kind of Full-automatic semiconductor wafer glue-spraying mechanism and its glue spraying equipment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1809744A (en) * 2003-05-19 2006-07-26 微-埃普西龙测量技术有限两合公司 Method and apparatus for optically controlling the quality of objects having a circular edge
CN101261306A (en) * 2008-04-14 2008-09-10 无锡市易控系统工程有限公司 Full-automatic wafer test method and equipment accomplishing the method
CN202332809U (en) * 2011-11-25 2012-07-11 中芯国际集成电路制造(上海)有限公司 Reaction cabinet and reaction cavity
CN204361073U (en) * 2015-01-22 2015-05-27 北京中拓机械集团有限责任公司 The picking-up device of semiconductor wafer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1809744A (en) * 2003-05-19 2006-07-26 微-埃普西龙测量技术有限两合公司 Method and apparatus for optically controlling the quality of objects having a circular edge
CN101261306A (en) * 2008-04-14 2008-09-10 无锡市易控系统工程有限公司 Full-automatic wafer test method and equipment accomplishing the method
CN202332809U (en) * 2011-11-25 2012-07-11 中芯国际集成电路制造(上海)有限公司 Reaction cabinet and reaction cavity
CN204361073U (en) * 2015-01-22 2015-05-27 北京中拓机械集团有限责任公司 The picking-up device of semiconductor wafer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106158708A (en) * 2016-06-27 2016-11-23 昆山国显光电有限公司 Reaction cavity and dry etching board
CN109433479A (en) * 2019-01-11 2019-03-08 田丽玖 A kind of Full-automatic semiconductor wafer glue-spraying mechanism and its glue spraying equipment

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Application publication date: 20150429