CN106145026B - Air-tight packaging structure and method for packing for MEMS - Google Patents
Air-tight packaging structure and method for packing for MEMS Download PDFInfo
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- CN106145026B CN106145026B CN201610509749.8A CN201610509749A CN106145026B CN 106145026 B CN106145026 B CN 106145026B CN 201610509749 A CN201610509749 A CN 201610509749A CN 106145026 B CN106145026 B CN 106145026B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/001—Bonding of two components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/03—Bonding two components
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Abstract
The invention discloses a kind of encapsulating structure and method for packing for MEMS air-tight packagings.The encapsulating structure includes：First substrate；The first metal layer, is arranged on the upper surface of first substrate, and is formed as surrounding MEMS annular, and MEMS is arranged on the upper surface of first substrate；First solder ball, the first printing position of the first metal layer is formed at by way of printing and flowing back；Second substrate, it is arranged on the top of first substrate；Second metal layer, is arranged on the lower surface of second substrate, and is formed as annular；Second solder ball, the second printing position of second metal layer is formed at by way of printing and flowing back；Wherein, the first metal layer and second metal layer are overlapped, and the first solder ball and the second solder ball are connected with each other, and airtight volume is formed between first substrate and second substrate.So, compared with the mode of plating, sealing cost is reduced, and is not limited by substrate size, the sealing that can complete large-size substrate makes.
Description
Technical field
The present invention relates to semiconductor packaging, in particular it relates to a kind of air-tight packaging structure and envelope for MEMS
Dress method.
Background technology
MEMS (MEMS, Micro-Electro-Mechanical System) is by electronics and mechanical composition
Integrated device or system, it is made up of multiple microcomponents, to provide one or more specific functions.MEMS package is MEMS design
With a key factor in manufacture, it is necessary to meet MEMS on a variety of need such as environmental protection, mechanical support, power path
Ask.Many MEMSs, the device (such as accelerometer, gyroscope, pressure sensor) particularly comprising high-speed motion structure
It is required for carrying out air-tight packaging.
The air-tight packaging technology of MEMS mainly carries out anode linkage, diaphragm seal under high vacuum environment at present
Technique and metal are diffusion interlinked etc..Anode linkage is usually silicon on glass bonding, and bonding temperature is 300~400 DEG C, biases and is
500~1000V.The high temperature high voltage used in bonding process is extremely limited its application.Bulk silicon bonding technology utilizes
The method of sacrifice layer etches cavity structure, by vacuum environment when aperture and deposition film on cavity, has cavity
Certain vacuum.Film is selectively deposited at aperture sealing, completes Vacuum Package.In the technology, the vacuum of cavity
Limited by thin film deposition processes, meanwhile, hot environment during thin film deposition has very big limitation for the compatibility of technique.
In the diffusion interlinked technology of metal, generally using method be by plating metal by the way of form cyclic structure, in wafer scale key
Complete sealing ring is formed after closing technique, so as to reach the requirement of air-tight packaging.But the mode cost of plating is higher and right
Need for the larger MEMS of sealed chamber that there is certain technical problem in some.
The content of the invention
It is an object of the invention to provide a kind of air-tight packaging structure and method for packing for MEMS, for relatively low
Cost realizes MEMS air-tight packaging.
To achieve these goals, the present invention provides a kind of encapsulating structure for MEMS air-tight packagings.The encapsulation
Structure includes：First substrate；The first metal layer, is arranged on the upper surface of the first substrate, and is formed as surrounding the MEMS
Annular, the MEMS is arranged on the upper surface of the first substrate；First solder ball, formed by way of printing and flowing back
In the first printing position of the first metal layer；Second substrate, it is arranged on the top of the first substrate；Second metal layer,
The lower surface of the second substrate is arranged on, and is formed as annular；Second solder ball, it is formed at by way of printing and flowing back
Second printing position of the second metal layer；Wherein, the first metal layer and the second metal layer overlap, and described first
Solder ball and second solder ball are connected with each other, and air-tightness sky is formed between the first substrate and the second substrate
Between.
Alternatively, first printing position complementation on the first metal layer with second printing position.
Alternatively, first printing position is uniformly distributed on the first metal layer, and second printing position exists
It is uniformly distributed in the second metal layer.
Alternatively, the first metal layer is formed as on symmetrical axisymmetric figure, and first printing position is in institute
State on symmetry axis complementation on the first metal layer, second printing position is in the second metal layer on described right
Claim axle complementary.
Alternatively, the encapsulating structure also includes：First salient point, the upper surface of the first substrate is arranged on, and by institute
State in the first metal layer area encompassed；3rd solder ball, first salient point is formed at by way of printing and flowing back
In first printing salient point on；Second salient point, the lower surface of the second substrate is arranged on, and is wrapped by the second metal layer
In the region enclosed, first salient point and second salient point overlap correspondingly；4th solder ball, by printing and flowing back
Mode be formed in second salient point second printing salient point on, wherein, first salient point and corresponding second salient point
Connected by the 3rd solder ball or the 4th solder ball, the first printing salient point and the second printing salient point are in institute
State complementary on the first salient point.
Alternatively, the first metal layer is formed as on symmetrical axisymmetric figure, and first printing position is in institute
State on symmetry axis complementation on the first metal layer, second printing position is in the second metal layer on described right
Claim axle complementary；First salient point is formed as on the symmetrical axisymmetric figure, and the first printing salient point is described the
It is complementary on the symmetry axis on one salient point.
The present invention also provides a kind of method for packing for MEMS air-tight packagings.The method for packing includes：First
The first metal layer is laid in the upper surface of substrate, and the first metal layer is formed as surrounding the annular of the MEMS, and the MEMS is set
Put in the upper surface of the first substrate；In the first printing position cloth of the first metal layer by way of printing and flowing back
If the first solder ball；Second metal layer is laid in the upper surface of second substrate, the second metal layer is formed as annular；Pass through print
Brush and the mode of backflow lay the second solder ball in the second printing position of the second metal layer；By the second substrate back-off
Closed in the enterprising line unit of the first substrate so that the first metal layer and the second metal layer overlap, first solder
Ball and second solder ball are connected with each other, and form airtight volume between the first substrate and the second substrate.
Alternatively, first printing position complementation on the first metal layer with second printing position.
Alternatively, first printing position is uniformly distributed on the first metal layer, and second printing position exists
It is uniformly distributed in the second metal layer.
Alternatively, the first metal layer is formed as on symmetrical axisymmetric figure, and first printing position is in institute
State on symmetry axis complementation on the first metal layer, second printing position is in the second metal layer on described right
Claim axle complementary.
Alternatively, it is described the second substrate is tipped upside down on to the step of enterprising line unit of the first substrate closes before, institute
Stating method for packing also includes：In the upper surface of the first substrate, and laid in the first metal layer area encompassed
First salient point；The 3rd solder ball is laid on the first printing salient point by way of printing and flowing back in first salient point；
In the upper surface of the second substrate, and the second salient point is laid in the second metal layer area encompassed；Pass through printing
With the mode of backflow the 4th solder ball is laid on the second printing salient point in second salient point；Wherein, by second base
Plate, which tips upside down on the step of enterprising line unit of the first substrate closes, also to be included：So that first salient point and second salient point are one by one
Accordingly overlap, first salient point and corresponding second salient point are connected by the 3rd solder ball or the 4th solder ball
Connect, the first printing salient point and the second printing salient point are complementary on first salient point.
Alternatively, the first metal layer is formed as on symmetrical axisymmetric figure, and first printing position is in institute
State on symmetry axis complementation on the first metal layer, second printing position is in the second metal layer on described right
Claim axle complementary；First salient point is formed as on the symmetrical axisymmetric figure, and the first printing salient point is described the
It is complementary on the symmetry axis on one salient point.
Pass through above-mentioned technical proposal, by the way of printing and backflow, solder ball is formed on the annular metallic layer of substrate,
And being mutually bonded by two substrates so that the annular metallic layer on two substrates overlaps, by solder ball interconnection come
Carry out air-tight packaging.So, compared with the mode of plating, sealing cost is reduced, and is not limited by substrate size, energy
The sealing for enough completing large-size substrate makes.
Other features and advantages of the present invention will be described in detail in subsequent specific embodiment part.
Brief description of the drawings
Accompanying drawing is for providing a further understanding of the present invention, and a part for constitution instruction, with following tool
Body embodiment is used to explain the present invention together, but is not construed as limiting the invention.In the accompanying drawings：
Fig. 1 is the profile for the encapsulating structure that an exemplary embodiment provides；
Fig. 2 a and Fig. 2 b are the disassembly diagrams for the encapsulating structure that an exemplary embodiment provides；
Fig. 3 a and Fig. 3 b are the disassembly diagrams for the encapsulating structure that another exemplary embodiment provides；
Fig. 4 a and Fig. 4 b are the disassembly diagrams for the encapsulating structure that further example embodiment provides；
Fig. 5 is the profile for the encapsulating structure that further example embodiment provides；
Fig. 6 a and Fig. 6 b are the disassembly diagrams for the encapsulating structure that further example embodiment provides；
Fig. 7 a and Fig. 7 b are the disassembly diagrams for the encapsulating structure that further example embodiment provides；
Fig. 8 is the profile for the encapsulating structure that further example embodiment provides；And
Fig. 9 is the flow chart for the method for packing that an exemplary embodiment provides.
Description of reference numerals
The solder ball of 101 first substrate, 102 the first metal layer 103 first
The solder ball of 104 second substrate, 105 second metal layer 106 second
The salient point of the 3rd solder ball of 107 first salient point 108 109 second
The upper surface of 110 the 4th solder ball 101a first substrates
The lower surface of 104a second substrates
Embodiment
The embodiment of the present invention is described in detail below in conjunction with accompanying drawing.It should be appreciated that this place is retouched
The embodiment stated is merely to illustrate and explain the present invention, and is not intended to limit the invention.
In the present invention, in the case where not making opposite explanation, the noun of locality that uses such as " upper and lower, left and right, horizontal, vertical " is logical
Often defined in the case of encapsulating structure normal use provided by the invention, specifically refer to the figure shown in Fig. 1 to Fig. 8
Face direction.It should be noted that these nouns of locality are served only for the explanation present invention, it is not intended to limit the invention.
Fig. 1 is the profile for the encapsulating structure that an exemplary embodiment provides.As shown in figure 1, the encapsulating structure can wrap
Include first substrate 101.Wherein, the first substrate 101 can be made using organic substrate, ceramic substrate or lead frame,
And it can be made as needed using different materials.Or the first substrate 101 can also be printed circuit board
(PCB).In addition, the size and thickness of first substrate 101 can be set according to the difference and actual demand of technique.For example,
The size of first substrate can be from several millimeters to several centimetres, and the thickness of first substrate 101 can be from hundreds of microns to number in the least
Rice.
In addition, as shown in figure 1, the encapsulating structure can also include the first metal layer 102.The first metal layer 102 can be with
The upper surface 101a of first substrate 101 is arranged on, and is formed as surrounding the annular of MEMS (not shown), the MEMS is arranged on the
The upper surface 101a of one substrate 101.The first metal layer 102 can be laid for example, by the mode of electro-coppering.The ring
Shape can be circular, square, rectangle and shapes of other closures.The first metal layer 102 can be used as gold under salient point
Belong to (under bump metal, UBM) layer, the air tight structure that salient point is formed for after and forms sealing MEMS establishes base
Plinth.
In addition, as shown in figure 1, the encapsulating structure can also include the first solder ball 103.In first substrate 101 and second
Before substrate (being described in detail below) is bonded, first solder ball 103 can be formed by way of printing and flowing back
In the first printing position of the first metal layer 101.Wherein, the first solder ball 103 can be multiple, accordingly, the first printing position
It can also be multiple to put.Specifically, multiple perforates corresponding with the first printing position can be set, will be printed in steel mesh domain
Brush solder drains to the first printing position by these perforates, and printing solder thus has been imprinted on into the first printing position.Afterwards, lead to
Cross reflux technique and the solder in the first printing position is formed into corresponding first solder ball 103.
As shown in figure 1, the encapsulating structure can also include second substrate 104, the solder ball of second metal layer 105 and second
106.Wherein, second substrate 104 is arranged on 101 top of first substrate.With first substrate 101 similarly, second substrate 104
Can be made using organic substrate, ceramic substrate or lead frame, and can as needed using different materials come
Make.Or second substrate 104 can also be PCB.In addition, the size and thickness of second substrate 104 can be according to techniques not
With and actual demand set.
Second metal layer 105 is arranged on the lower surface 104a of second substrate 104, and is formed as annular.Second substrate 104
Lower surface 104a can also be provided with MEMS, and be surrounded by second metal layer 105.The second metal layer 105 can be for example, by
The mode of electro-coppering is laid.The annular can be circular, square, rectangle and shapes of other closures.This
Two metal levels 105 can be used as UBM layer, and salient point is formed for after and formation sealing structure lays the foundation.
The encapsulating structure can also include the second solder ball 106.Second solder ball 106 can be by printing and flowing back
Mode is formed at the second printing position of second metal layer 105.Wherein, the second solder ball 106 can be multiple, accordingly,
Two printing positions can also be multiple.Specifically, can be in steel before first substrate 101 and second substrate 104 are bonded
In half tone figure, multiple perforates corresponding with the second printing position are set, printing solder is drained into the second printing by these perforates
Position, printing solder the second printing position is imprinted on thus.Afterwards, by reflux technique by the weldering in the second printing position
Second solder ball 106 corresponding to material formation.Then, when first substrate 101 and second substrate 104 are bonded, by the second base
Plate 104 is tipped upside down on first substrate 101.
Also, the first metal layer 102 and second metal layer 105 overlap, the first solder ball 103 and the phase of the second solder ball 106
Connect, and airtight volume is formed between first substrate 101 and second substrate 104.Wherein, the coincidence refers to the first gold medal
Belong to the projection of layer 102 and second metal layer 105 on the direction vertical with first substrate 101 (or second substrate 104) to overlap.Figure
In 1, second metal layer 105 is located at the top of the first metal layer 102.
First solder ball 103 and the second solder ball 106 can fill up phase when being mutually bonded by the mobility of solder
Gap between adjacent solder ball, interconnects.Because the first metal layer 102 and second metal layer 105 overlap, and the
One solder ball 103 and the second solder ball 106 are connected with each other again, so allow for the first metal layer 102, second metal layer 105, the
One solder ball 103 and the second solder ball 106 together, airtight volume are formed between first substrate 101 and second substrate 104,
So as to complete air-tight packaging.
Fig. 2 a and Fig. 2 b are the disassembly diagrams for the encapsulating structure that an exemplary embodiment provides.Fig. 2 a are an exemplary embodiments
The top view of the first substrate 101 of offer.Fig. 2 b are the upward views for the second substrate 104 that an exemplary embodiment provides.Wherein,
Second substrate 104 is covered on first substrate 101, is formed as the encapsulating structure shown in Fig. 1 after bonding.Fig. 1 schematic diagram is figure
Profile after being cut in 2a and Fig. 2 b along dotted line.
It is it is understood that (namely airtight in the inside that the first metal layer 102 (or second metal layer 105) is surrounded
The inside in property space), the MEMS and wire structures (not shown) of sealed chamber in need can be set.So, just will
MEMS seals, and to ensure the normal work of MEMS, and wire structures is also carried out into air-tight packaging, isolation
The interference of adverse circumstances, enhance the reliability of encapsulating structure.
Pass through above-mentioned technical proposal, by the way of printing and backflow, solder ball is formed on the annular metallic layer of substrate,
And being mutually bonded by two substrates so that the annular metallic layer on two substrates overlaps, by solder ball interconnection come
Carry out air-tight packaging.So, compared with the mode of plating, sealing cost is reduced, and is not limited by substrate size, energy
The sealing for enough completing large-size substrate makes.
In the above-described embodiments, the first printing position and the second printing position can enable to the first solder ball 103
With the second solder ball 106 in bonding process, the optional position of confined space is interconnected to form by flowing.
In another embodiment of the invention, the first printing position can be in the first metal layer 102 with the second printing position
Upper complementation.It is, have on the optional position of the first metal layer 102 (or second metal layer 105) solder ball (including flowing
The solder ball opened), and there was only the first solder ball 103 or only the second solder ball 106 on same position.In other words,
On the optional position of one metal level 102 or (second metal layer 105), have and only the first solder ball 103 and the second solder ball 106
In any one.So, can either ensureing to have on each position of the first metal layer 102 solder ball, (including flowing is opened
Solder ball), it also avoid printing excessive solder ball and cause unnecessary waste.
Sealed due to of the invention using the mobility of solder ball when being bonded, therefore, in the embodiment above, as long as
Ensure the first printing that the first solder ball 103 and the second solder ball 106 can rely on mobility to be interconnected to form sealing space
Position and the second printing position, are included within protection scope of the present invention.
In another embodiment of the present invention, the first solder ball 103 can be equably laid on the first metal layer 102,
The second solder ball 106 is equably laid in second metal layer 105.Fig. 3 a and Fig. 3 b are the envelopes that another exemplary embodiment provides
The disassembly diagram of assembling structure.Fig. 3 a are the top views for the first substrate 101 that another exemplary embodiment provides.Fig. 3 b are another examples
Property embodiment provide second substrate 104 upward view.Wherein, the first printing position (or first solder 103) is in the first metal
It is uniformly distributed on layer 102, the second printing position (or second solder 106) 105 is uniformly distributed in second metal layer.It is,
The distance between two adjacent the first solders 103 are equal, and the distance between two adjacent second solders 106 are equal.So,
It can ensure that the solder dosage between the first metal layer 102 and second metal layer 105 is uniform, good sealing effect.
In the above-described embodiments, due to first printing position of first solder ball 103 in the first metal layer 102 and
Second printing position of second solder ball 106 in second metal layer 105 may be different, therefore, printed on first substrate 101
First solder ball 103 and when printing the second solder ball 106 on second substrate 104, can be utilized respectively two different steel meshes.
In another embodiment of the present invention, can by setting suitable first printing position and the second printing position,
So that when printing the second solder ball 106 of the first solder ball 103 and printing, identical steel mesh can be utilized.Specifically, the first gold medal
Category layer 102 can be formed as on symmetrical axisymmetric figure, and the first printing position on the first metal layer 102 on symmetrical
Axle is complementary, and the second printing position is complementary on symmetry axis in second metal layer 105.It is, the first solder ball 103 on
Without the first solder ball 103 of printing on symmetrical axisymmetric position, and without the first solder ball of printing on the first metal layer 102
103 position on symmetrical axisymmetric position on being printed with the first solder ball 103.Similarly, the second solder ball 106 on
Without the second solder ball 106 of printing on symmetrical axisymmetric position, and without the second solder ball of printing in second metal layer 105
106 position on symmetrical axisymmetric position on being printed with the second solder ball 106.
Fig. 4 a and Fig. 4 b are the disassembly diagrams for the encapsulating structure that further example embodiment provides.Fig. 4 a are another exemplary realities
The top view of the first substrate 101 of example offer is provided.Fig. 4 b are looking up for the second substrate 104 that further example embodiment provides
Figure.In this embodiment, the first metal layer 102 and second metal layer 105 are both configured to the annular of square shape.Dotted line is pair
Claim axle.In the correspondence position for the steel mesh applied, the four edges of the first metal layer 102 can be respectively classified into even number section, on
Bar horizontal edge is counted only to each odd positions perforate from a left side, and right side vertical edge is counted only from above to the perforate of each even number position, lower bar
Horizontal edge is counted only to each odd positions perforate from the right side, and left side vertical edge is counted only from down to the perforate of each even number position.So, pass through
After printing and backflow, the layout of the first solder ball 103 as shown in fig. 4 a is formed on first substrate 101.Similarly, using phase
Same steel mesh can also lay the second solder ball 106 in second metal layer 105, form the second solder ball as shown in Figure 4 b
106 layout.So, when the second substrate 104 shown in Fig. 4 b tips upside down on along the vertical direction in paper first shown in Fig. 4 a
When 101 enterprising line unit of substrate closes, the first solder ball 103 and the second solder ball 106 is uniformly distributed and locations complementary.
In the embodiment shown in Fig. 4 a and Fig. 4 b, encapsulating structure provided by the invention is made, identical steel can be used
Net, therefore, simplify the process for making steel mesh.In addition, (including the first base of two parts up and down for the encapsulating structure being made
Plate 101, the first metal layer 102, the Part I of the first solder ball 103 and including second substrate 104, second metal layer 105,
The Part II of two solder balls 106) can be with identical, this way it is not necessary to which intended distinction above-mentioned two part, simplifies encapsulation
Process.
In addition, while air-tight packaging is carried out, can also be by the wire structures being arranged on first substrate 101 (not
Show) and the wire structures (not shown) that is arranged on second substrate 104 be attached by way of print solder ball.Fig. 5
It is the profile for the encapsulating structure that further example embodiment provides.As shown in figure 5, on the basis of Fig. 1, the encapsulating structure
The first salient point 107, the 3rd solder ball 108, the second salient point 109 and the 4th solder ball 110 can also be included.
Wherein, the first salient point 107 is arranged on the upper surface 101a of first substrate 101, and is surrounded by the first metal layer 102
Region in.First salient point 107 can include multiple salient points, at least one salient point in the first salient point 107 and be arranged on first
Wire structures electrical connection on substrate 101.First salient point 107 can be laid by way of electro-coppering.
Second salient point 109 is arranged on the lower surface 104a of second substrate 104, and the area surrounded by second metal layer 105
In domain.First salient point 107 and the second salient point 109 overlap correspondingly.Second salient point 109 can include multiple salient points, and second
At least one salient point in salient point 109 electrically connects with the wire structures being arranged on second substrate 104.Second salient point 109 can be with
Laid by way of electro-coppering.
3rd solder ball 108 is formed at by way of printing and flowing back on the first printing salient point in the first salient point 107.
4th solder ball 110 is formed at by way of printing and flowing back on the second printing salient point in the second salient point 109.With the first weldering
Similarly, the 3rd solder ball 108 and the 4th solder ball 110 can pass through the perforate on steel mesh to the solder ball 106 of pellet 103 and second
The mode of printing obtains.And it is possible to the first solder ball 103 and the position corresponding to the 3rd solder ball 108 on same steel mesh
Upper perforate, the first solder ball 103 and the 3rd solder ball 108 are printed simultaneously；The second solder ball 106 and the 4th on same steel mesh
Perforate on position corresponding to solder ball 110, the second solder ball 106 and the 4th solder ball 110 are printed simultaneously.
First salient point 107 and corresponding (being overlapped with first salient point 107) second salient point 109 pass through the 3rd solder ball
108 or the 4th solder ball 110 connect.Wherein, the first salient point 107 and the second salient point 108 being connected with wire structures can play
The effect of electric connection in encapsulating structure.The first salient point 107 and the second salient point 108 not being connected with wire structures, are being sealed
It can play a part of reinforcing encapsulating structure in assembling structure.
First printing salient point and the second printing salient point are complementary on the first salient point 107.It is, in each first salient point
There are solder ball, and only the 3rd solder ball 108 or only the 4th solder ball 110 on 107 (or second salient points 109).Or
Person says, on each first salient point 107 (or second salient point 109), has and only the 3rd solder ball 108 and the 4th solder ball 110
In any one.So, it can either ensure there is solder ball on each first salient point 107, it also avoid printing excessively
Solder ball causes unnecessary waste.
Fig. 6 a and Fig. 6 b are the disassembly diagrams for the encapsulating structure that further example embodiment provides.Fig. 6 a are another exemplary realities
The top view of the first substrate 101 of example offer is provided.Fig. 6 b are looking up for the second substrate 104 that further example embodiment provides
Figure.In this embodiment, there are 4 the first salient points 107, two the 3rd solder balls 108,4 the second salient points 109, two the 4th welderings
Pellet 110.Fig. 5 schematic diagram is the profile after being cut in Fig. 6 a and Fig. 6 b along dotted line.
In Fig. 6 a and Fig. 6 b embodiment, in order to print the 3rd solder ball 108 and the 4th solder ball 110, it is necessary to two
Different steel meshes.With Fig. 4 a and Fig. 4 b similarly, zhou duicheng tuxing is formed as in the first salient point 107 (or second salient point 109)
In the case of, the 3rd solder ball 108 and the 4th solder ball 110 can also be printed using same steel mesh.
In another embodiment of the present invention, the first metal layer 102 is formed as on symmetrical axisymmetric figure, the first print
It is complementary on symmetry axis on the first metal layer 102 to brush position, the second printing position is in second metal layer 105 on symmetry axis
It is complementary.Also, the first salient point is formed as on symmetrical axisymmetric figure, and the first printing salient point is on the first salient point on symmetrical
Axle is complementary.It is, it is used for the perforate of the 4th solder ball 110 of position of opening and printing for printing the 3rd solder ball 108 in steel mesh
Position is identical.In the embodiment, the steel that the first solder ball 103 and the 3rd solder ball 108 use is printed on first substrate 101
Net, the steel mesh used with printing the second solder ball 106 and the 4th solder ball 110 on second substrate 104 can be identical steel
Net, save the workload of design steel mesh.
Fig. 7 a and Fig. 7 b are the disassembly diagrams for the encapsulating structure that further example embodiment provides.Fig. 7 a are another exemplary realities
The top view of the first substrate 101 of example offer is provided.Fig. 7 b are looking up for the second substrate 104 that further example embodiment provides
Figure.In this embodiment, there are 16 the first salient points, 107,8 the 3rd solder balls 108,16 the second salient points, 109,8 the 4th welderings
Pellet 110.Wherein, 16 the first salient points 107 are formed as along the symmetrical figure of symmetry axis (dotted line AB), and the symmetry axis is also figure
Symmetry axis in 4a；16 the second salient points 109 are formed as along the symmetrical figure of symmetry axis (dotted line CD), and the symmetry axis is also figure
Symmetry axis in 4b.
As described above, the first solder ball 103 and the 3rd solder ball 108 are printed using steel mesh on first substrate 101, and
Steel mesh is being used to print the second solder ball 106 and during four solder balls 110 on second substrate 104, only pair of the first salient point 107
Claim the symmetrical overlapping of axles of axle and the first metal layer 102, first substrate 101 and second substrate 104 could use identical steel mesh to print
Brush solder ball.Also, the first salient point 107 or the second salient point 109 can be not on above-mentioned symmetry axis.
Fig. 8 is the profile for the encapsulating structure that further example embodiment provides.Fig. 8 schematic diagram is in Fig. 7 a and Fig. 7 b
The transversely profile after dotted line cutting.
In the embodiment, the solder ball on identical steel mesh printing first substrate 101 and second substrate 104 can be used,
Therefore, the process for making steel mesh is simplified.In addition, its upper and lower two part of the encapsulating structure being made (including first substrate
101st, the first metal layer 102, the first solder ball 103, the first salient point 107, the Part I of the 3rd solder ball 108 and including second
Substrate 104, second metal layer 105, the second solder ball 106, the second salient point 109, the Part II of the 4th solder ball 110) can be with
It is identical, this way it is not necessary to which intended distinction above-mentioned two part, simplifies encapsulation process.
The present invention also provides a kind of method for packing for MEMS air-tight packagings.Fig. 9 is that an exemplary embodiment provides
Method for packing flow chart.As shown in figure 9, the method for packing may comprise steps of.
In step s 11, the first metal layer is laid in the upper surface of first substrate, the first metal layer is formed as surrounding MEMS
Annular, MEMS is arranged on the upper surface of first substrate.
In step s 12, the first weldering is laid in the first printing position of the first metal layer by way of printing and flowing back
Pellet.
In step s 13, second metal layer is laid in the upper surface of second substrate, second metal layer is formed as annular.
In step S14, the second weldering is laid in the second printing position of second metal layer by way of printing and flowing back
Pellet.
In step S15, second substrate is tipped upside down on into the enterprising line unit of first substrate and closed so that the first metal layer and the second gold medal
Belong to layer to overlap, the first solder ball and the second solder ball are connected with each other, and form air-tightness between first substrate and second substrate
Space.
Alternatively, the first printing position and the second printing position are complementary on the first metal layer.
Alternatively, the first printing position is uniformly distributed on the first metal layer, and the second printing position is in second metal layer
It is uniformly distributed.
Alternatively, the first metal layer is formed as on symmetrical axisymmetric figure, and the first printing position is in the first metal layer
On it is complementary on symmetry axis, the second printing position is complementary on symmetry axis in second metal layer.
Alternatively, before the second substrate to be tipped upside down on to the step of enterprising line unit of first substrate closes (step S15), institute
Stating method for packing can also comprise the following steps.
In step s 16, in the upper surface of first substrate, and it is convex by laying first in the first metal layer area encompassed
Point.
In step S17, the 3rd is laid on the first printing salient point by way of printing and flowing back in the first salient point
Solder ball.
In step S18, in the upper surface of second substrate, and it is convex by laying second in second metal layer area encompassed
Point.
In step S19, the 4th is laid on the second printing salient point by way of printing and flowing back in the second salient point
Solder ball.
Wherein, second substrate being tipped upside down on into the step of enterprising line unit of first substrate closes (step S15) can also include：So that
First salient point and the second salient point overlap correspondingly, and the first salient point and corresponding second salient point pass through the 3rd solder ball or the 4th
Solder ball connects, and the first printing salient point and the second printing salient point are complementary on the first salient point.
Alternatively, the first metal layer is formed as on symmetrical axisymmetric figure, and the first printing position is in the first metal layer
On it is complementary on symmetry axis, the second printing position is complementary on symmetry axis in second metal layer.First salient point be formed as on
Symmetrical axisymmetric figure, the first printing salient point are complementary on symmetry axis on the first salient point.
On the method for packing in above-described embodiment, wherein the concrete mode that each step performs operation is somebody's turn to do relevant
It is described in detail in the embodiment of encapsulating structure, explanation will be not set forth in detail herein.
Pass through above-mentioned technical proposal, by the way of printing and backflow, solder ball is formed on the annular metallic layer of substrate,
And being mutually bonded by two substrates so that the annular metallic layer on two substrates overlaps, by solder ball interconnection come
Carry out air-tight packaging.So, compared with the mode of plating, sealing cost is reduced, and is not limited by substrate size, energy
The sealing for enough completing large-size substrate makes.
The preferred embodiment of the present invention is described in detail above in association with accompanying drawing, still, the present invention is not limited to above-mentioned reality
The detail in mode is applied, in the range of the technology design of the present invention, a variety of letters can be carried out to technical scheme
Monotropic type, these simple variants belong to protection scope of the present invention.
It is further to note that each particular technique feature described in above-mentioned embodiment, in not lance
In the case of shield, it can be combined by any suitable means.In order to avoid unnecessary repetition, the present invention to it is various can
The combination of energy no longer separately illustrates.
In addition, various embodiments of the present invention can be combined randomly, as long as it is without prejudice to originally
The thought of invention, it should equally be considered as content disclosed in this invention.
Claims (10)
1. a kind of encapsulating structure for MEMS air-tight packagings, it is characterised in that the encapsulating structure includes：
First substrate；
The first metal layer, is arranged on the upper surface of the first substrate, and is formed as surrounding the annular of the MEMS, the MEMS
It is arranged on the upper surface of the first substrate；
First solder ball, the first printing position of the first metal layer is formed at by way of printing and flowing back；
Second substrate, it is arranged on the top of the first substrate；
Second metal layer, is arranged on the lower surface of the second substrate, and is formed as annular；
Second solder ball, the second printing position of the second metal layer is formed at by way of printing and flowing back；
Wherein, the first metal layer and the second metal layer overlap, first solder ball and the second solder ball phase
Connect, and airtight volume is formed between the first substrate and the second substrate；
Wherein, the first metal layer is formed as on symmetrical axisymmetric figure, and first printing position is described first
Complementary on the symmetry axis on metal level, second printing position is mutual on the symmetry axis in the second metal layer
Mend.
2. encapsulating structure according to claim 1, it is characterised in that first printing position and second printing position
Put complementary on the first metal layer.
3. encapsulating structure according to claim 1, it is characterised in that first printing position is in the first metal layer
On be uniformly distributed, second printing position is uniformly distributed in the second metal layer.
4. according to the encapsulating structure described in any claim in claim 1-3, it is characterised in that the encapsulating structure also wraps
Include：
First salient point, the upper surface of the first substrate is arranged on, and by the first metal layer area encompassed；
3rd solder ball, it is formed at by way of printing and flowing back on the first printing salient point in first salient point；
Second salient point, is arranged on the lower surface of the second substrate, and by the second metal layer area encompassed, it is described
First salient point and second salient point overlap correspondingly；
4th solder ball, it is formed at by way of printing and flowing back on the second printing salient point in second salient point, wherein,
First salient point is connected with corresponding second salient point by the 3rd solder ball or the 4th solder ball, first print
Brush salient point and the second printing salient point are complementary on first salient point.
5. encapsulating structure according to claim 4, it is characterised in that
The first metal layer is formed as on symmetrical axisymmetric figure, and first printing position is in the first metal layer
On it is complementary on the symmetry axis, second printing position is complementary on the symmetry axis in the second metal layer；
First salient point is formed as on the symmetrical axisymmetric figure, and the first printing salient point is in first salient point
On it is complementary on the symmetry axis.
6. a kind of method for packing for MEMS air-tight packagings, it is characterised in that the method for packing includes：
The first metal layer is laid in the upper surface of first substrate, the first metal layer is formed as surrounding the annular of the MEMS,
The MEMS is arranged on the upper surface of the first substrate；
By way of printing and flowing back the first solder ball is laid in the first printing position of the first metal layer；
Second metal layer is laid in the upper surface of second substrate, the second metal layer is formed as annular；
By way of printing and flowing back the second solder ball is laid in the second printing position of the second metal layer；
The second substrate is tipped upside down on into the enterprising line unit of the first substrate to close so that the first metal layer and second gold medal
Belonging to layer to overlap, first solder ball and second solder ball are connected with each other, and in the first substrate and second base
Airtight volume is formed between plate；
Wherein, the first metal layer is formed as on symmetrical axisymmetric figure, and first printing position is described first
Complementary on the symmetry axis on metal level, second printing position is mutual on the symmetry axis in the second metal layer
Mend.
7. method for packing according to claim 6, it is characterised in that first printing position and second printing position
Put complementary on the first metal layer.
8. method for packing according to claim 6, it is characterised in that first printing position is in the first metal layer
On be uniformly distributed, second printing position is uniformly distributed in the second metal layer.
9. according to the method for packing described in any claim in claim 6-8, it is characterised in that described by described second
Substrate was tipped upside down on before the step of enterprising line unit of the first substrate closes, and the method for packing also includes：
In the upper surface of the first substrate, and the first salient point is laid in the first metal layer area encompassed；
The 3rd solder ball is laid on the first printing salient point by way of printing and flowing back in first salient point；
In the upper surface of the second substrate, and the second salient point is laid in the second metal layer area encompassed；
The 4th solder ball is laid on the second printing salient point by way of printing and flowing back in second salient point；
Wherein, the second substrate is tipped upside down on into the step of enterprising line unit of the first substrate closes also includes：So that described first
Salient point and second salient point overlap correspondingly, and first salient point and corresponding second salient point pass through the 3rd solder
Ball or the 4th solder ball connection, the first printing salient point and the second printing salient point are mutual on first salient point
Mend.
10. method for packing according to claim 9, it is characterised in that
The first metal layer is formed as on symmetrical axisymmetric figure, and first printing position is in the first metal layer
On it is complementary on the symmetry axis, second printing position is complementary on the symmetry axis in the second metal layer；
First salient point is formed as on the symmetrical axisymmetric figure, and the first printing salient point is in first salient point
On it is complementary on the symmetry axis.
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| CN201610509749.8A CN106145026B (en) | 2016-06-30 | 2016-06-30 | Air-tight packaging structure and method for packing for MEMS |
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| CN201610509749.8A CN106145026B (en) | 2016-06-30 | 2016-06-30 | Air-tight packaging structure and method for packing for MEMS |
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| CN101355038A (en) * | 2007-07-27 | 2009-01-28 | 李刚 | Method and chip for integrating micro electromechanical system device and integrated circuit |
| CN101996902A (en) * | 2009-08-12 | 2011-03-30 | 瑞萨电子株式会社 | Method of manufacturing semiconductor device |
| CN102208358A (en) * | 2011-04-25 | 2011-10-05 | 北京大学深圳研究生院 | Method for soldering flip chip on base plate and packaging apparatus |
| CN104051355A (en) * | 2013-03-15 | 2014-09-17 | 台湾积体电路制造股份有限公司 | Package-on-Package Structure and Method of Forming Same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5305148B2 (en) * | 2006-04-24 | 2013-10-02 | 株式会社村田製作所 | Electronic component, electronic component device using the same, and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101355038A (en) * | 2007-07-27 | 2009-01-28 | 李刚 | Method and chip for integrating micro electromechanical system device and integrated circuit |
| CN101996902A (en) * | 2009-08-12 | 2011-03-30 | 瑞萨电子株式会社 | Method of manufacturing semiconductor device |
| CN102208358A (en) * | 2011-04-25 | 2011-10-05 | 北京大学深圳研究生院 | Method for soldering flip chip on base plate and packaging apparatus |
| CN104051355A (en) * | 2013-03-15 | 2014-09-17 | 台湾积体电路制造股份有限公司 | Package-on-Package Structure and Method of Forming Same |
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