CN106133846A - 导电粒子、导电性粘接剂、连接体的制造方法、电子部件的连接方法及连接体 - Google Patents

导电粒子、导电性粘接剂、连接体的制造方法、电子部件的连接方法及连接体 Download PDF

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Publication number
CN106133846A
CN106133846A CN201580016482.2A CN201580016482A CN106133846A CN 106133846 A CN106133846 A CN 106133846A CN 201580016482 A CN201580016482 A CN 201580016482A CN 106133846 A CN106133846 A CN 106133846A
Authority
CN
China
Prior art keywords
particles
metal layer
conducting particles
metal level
evaluation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201580016482.2A
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English (en)
Chinese (zh)
Inventor
深谷达朗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of CN106133846A publication Critical patent/CN106133846A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/12—Adsorbed ingredients, e.g. ingredients on carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN201580016482.2A 2014-03-26 2015-02-25 导电粒子、导电性粘接剂、连接体的制造方法、电子部件的连接方法及连接体 Pending CN106133846A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2014-063130 2014-03-26
JP2014063130 2014-03-26
JP2015024163A JP2015195178A (ja) 2014-03-26 2015-02-10 導電性粒子、導電性接着剤、接続体の製造方法、電子部品の接続方法、及び接続体
JP2015-024163 2015-02-10
PCT/JP2015/055318 WO2015146434A1 (ja) 2014-03-26 2015-02-25 導電性粒子、導電性接着剤、接続体の製造方法、電子部品の接続方法、及び接続体

Publications (1)

Publication Number Publication Date
CN106133846A true CN106133846A (zh) 2016-11-16

Family

ID=54194968

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580016482.2A Pending CN106133846A (zh) 2014-03-26 2015-02-25 导电粒子、导电性粘接剂、连接体的制造方法、电子部件的连接方法及连接体

Country Status (4)

Country Link
JP (1) JP2015195178A (enExample)
CN (1) CN106133846A (enExample)
TW (1) TW201537584A (enExample)
WO (1) WO2015146434A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105513673B (zh) * 2016-02-03 2017-07-07 郑州职业技术学院 一种导电粒子及其制备方法
KR102124997B1 (ko) * 2018-10-05 2020-06-22 주식회사 아이에스시 도전성 입자의 제조방법 및 그 제조방법으로 제조된 도전성 입자

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102089832A (zh) * 2008-07-24 2011-06-08 索尼化学&信息部件株式会社 导电性粒子、各向异性导电膜、接合体以及连接方法
JP4950451B2 (ja) * 2005-07-29 2012-06-13 積水化学工業株式会社 導電性微粒子、異方性導電材料、及び、接続構造体
WO2013094636A1 (ja) * 2011-12-21 2013-06-27 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
CN103594146A (zh) * 2008-02-05 2014-02-19 日立化成工业株式会社 导电粒子及导电粒子的制造方法
CN105593947A (zh) * 2014-01-08 2016-05-18 积水化学工业株式会社 背接触式的太阳能电池模块用导电性粒子、导电材料及太阳能电池模块

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101049609B1 (ko) * 2005-11-18 2011-07-14 히다치 가세고교 가부시끼가이샤 접착제 조성물, 회로 접속 재료, 접속 구조 및 회로부재의접속방법
JP6212366B2 (ja) * 2013-08-09 2017-10-11 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4950451B2 (ja) * 2005-07-29 2012-06-13 積水化学工業株式会社 導電性微粒子、異方性導電材料、及び、接続構造体
CN103594146A (zh) * 2008-02-05 2014-02-19 日立化成工业株式会社 导电粒子及导电粒子的制造方法
CN102089832A (zh) * 2008-07-24 2011-06-08 索尼化学&信息部件株式会社 导电性粒子、各向异性导电膜、接合体以及连接方法
WO2013094636A1 (ja) * 2011-12-21 2013-06-27 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
CN103748636A (zh) * 2011-12-21 2014-04-23 积水化学工业株式会社 导电性粒子、导电材料及连接结构体
CN105593947A (zh) * 2014-01-08 2016-05-18 积水化学工业株式会社 背接触式的太阳能电池模块用导电性粒子、导电材料及太阳能电池模块

Also Published As

Publication number Publication date
JP2015195178A (ja) 2015-11-05
TW201537584A (zh) 2015-10-01
WO2015146434A1 (ja) 2015-10-01

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