CN106132105A - There is the polyimide film clean method of prebored hole - Google Patents
There is the polyimide film clean method of prebored hole Download PDFInfo
- Publication number
- CN106132105A CN106132105A CN201610403380.2A CN201610403380A CN106132105A CN 106132105 A CN106132105 A CN 106132105A CN 201610403380 A CN201610403380 A CN 201610403380A CN 106132105 A CN106132105 A CN 106132105A
- Authority
- CN
- China
- Prior art keywords
- processing procedure
- polyimide film
- corona
- wet process
- prebored hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0763—Treating individual holes or single row of holes, e.g. by nozzle
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Abstract
A kind of polyimide film clean method with prebored hole, it includes the following step: provide a polyimide film；This polyimide film is laser machined so that it is there is multiple prebored hole；Carrying out a face cleaning processing procedure, it includes a corona and a wet process, and this wet process is chemical immersion and ultrasonic wave concussion, and wherein, this chemical immersion processing procedure is that acid liquid medicine soaks；And a medicine liquid spray processing procedure, in order to spray this polyimide film.
Description
Technical field
The invention relates to a kind of polyimide film clean method with prebored hole, particularly relate to a kind of polyimides
Film, after Laser Processing, is removed impurity or dirt in its face and hole so that it is the metallization process after being more beneficial for.
Background technology
Pliability copper foil laminates (Flexible copper clad laminate, FCCL) is to be widely used in electronics
As circuit substrate (PCB) in industry, FCCL, in addition to having light, thin and flexible advantage, also has electricity with polyimide film
Outside the feature of performance, hot property and excellent heat resistance, its relatively low dielectric constant (Dk) property so that the signal of telecommunication is quickly passed
Pass, good hot property, assembly can be made to be prone to cooling, higher vitrification point (Tg), assembly can be made at a higher temperature
Good operation.
Flexible copper foil base material is broadly divided into two big classes, and one is tradition then three layers of flexible board substrate (3FCCL) of dosage form, another kind of
For novel without the big class of two layers of flexible board substrate (2FCCL) of solid two, this two classes substrate material, its manufacture method is different, and it is applied
Product item is the most different, and three layers of flexible board substrate are generally used on large soft board product, and two layers of flexible board substrate have compact
Advantage, can be applicable to higher-order soft board manufacture on.For the manufacture method of existing two layers of flexible board substrate, application type can be divided into
(Casting Type), pressing-type (Lamination), sputter type and four kinds of wet type plating method type, its all shape on a dielectric material
Becoming metal level, to complete the making of flexible metal substrate, these manufacture methods are all prior art, are not added with at this repeating.
And the manufacture of existing flexible circuit board, it is first aforementioned flexible copper foil substrate to be holed, makes on substrate
Form multiple perforation, then it is (as micro-in metallization such as traditional copper, electro-coppering and conventional conductive graphite to form conducting medium in perforation
Hole, to form conducting medium), electroplate secondary copper by carrying out on flexible metal substrate the most again, make above a copper and in perforation
Forming secondary copper, and obtain so that the upper and lower circuit turn-on of substrate, this kind of existing flexible circuit board is relatively complicated on manufacturing,
And relatively costly, and the thickness of circuit board is relatively big, is unfavorable for fine rule and highdensity demand, and the conventional conductive interlayer in perforation
Production method (such as the metallization micropore such as traditional copper, electro-coppering and conventional conductive graphite), its thickness is relatively big, is also unfavorable for micro-
The demand in hole.
Summary of the invention
For solving above-mentioned existing flexible circuit board and the shortcoming of making, inventor invents the present invention then, and it is poly-
First laser machine on acid imide film, to form prebored hole, then carry out subsequent chemistry nickel plating and electro-coppering processing procedure, on solving
The shortcoming stating prior art, but impurity/dirt will be remained in polyimides face and hole, the most after laser machining
Be beneficial to subsequent chemistry nickel plating and electro-coppering processing procedure, and, the most effectively clean the polyimide film after Laser Processing, and its efficiency and
The consideration of cost, is the important topic making great efforts research for industry.
The present invention has the polyimide film clean method of prebored hole, and it comprises the following steps: to provide a polyimide film；
This polyimide film is laser machined so that it is there is multiple prebored hole；Carrying out a face cleaning processing procedure, it includes an electricity
Swooning and a wet process, this wet process is chemical immersion and ultrasonic wave concussion, and wherein, this chemical immersion processing procedure is acid medicine
Water；And a medicine liquid spray processing procedure, in order to spray this polyimide film.
So, the impurity/dirt in face and hole can effectively be cleaned, in order to follow-up metallization process.
Accompanying drawing explanation
Fig. 1 is the first embodiment of the flow process of the clean method of volume to volume polyimide film of the present invention.
Fig. 2 is the second embodiment of the flow process of the clean method of volume to volume polyimide film of the present invention.
The schematic diagram of Fig. 3 direct plating for the present invention does not cleans.
Fig. 4 is the schematic diagram of the cleaned rear plating of the present invention.
[description of reference numerals]
One polyimide film S1, S11 is provided
Laser Processing processing procedure S2, S12
Glutinous dirt processing procedure S3, S13
Corona processing procedure S4, S15
Wet process S5, S14
Medicine liquid spray processing procedure S6, S16
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention clearer, below in conjunction with specific embodiment, and reference
Accompanying drawing, the present invention is described in further detail.
The present invention has the polyimide film clean method of prebored hole, and it is to add in order to this polyimide film is completed laser
Work forms multiple prebored hole, will result in this polyimide film surface when Laser Processing and hole remains impurity, and if follow-up desire
When carrying out metallization process (such as chemical nickel plating and electro-coppering), if this impurity fails effectively to be removed, will be to subsequent metallisation
Processing procedure adversely affects, and even has influence on the quality of flexible electric circuit board.
Referring to Fig. 1, it has a first embodiment of polyimide film clean method of prebored hole for the present invention, first,
One polyimide film (S1) is provided；Carry out this polyimide film laser machining processing procedure (S2), to form multiple prebored hole；Will be poly-
Acid imide film carries out one and sticks dirt processing procedure (S3), with glutinous except the impurity of larger particles；This polyimide film is carried out a face cleaning,
Wherein this face cleaning is first to carry out corona processing procedure (S4), makes the pollutant such as carbon slag come off or become loose structure, this corona
Processing procedure has further included one and has bled operation, to remove ozone and pollutant；Carrying out wet process (S5) again, wet process is chemical drugs
Immersion bubble and ultrasonic wave concussion, it is to soak with acid liquid medicine that chemical liquid soaks, and can be sodium peroxydisulfate, SODIUM PERCARBONATE or sulphuric acid,
Polyimide film is not resulted in and stings erosion, make damage of material；Ultrasonic wave concussion from bottom to top shakes in being placed in chemical liquid
Swing, to provide energy to make pollutant depart from polyimides face and hole；And a medicine liquid spray processing procedure (S6), sub-in order to spray polyamides
Amine film, can be water cutter or jet pipe sprinkling, to be removed by pollutant.
Referring to Fig. 2, it has second embodiment of polyimide film clean method of prebored hole for the present invention, first,
One polyimide film (S11) is provided；Carry out this polyimide film laser machining to form multiple prebored hole (S12)；By polyamides
Imines film carries out one and sticks dirt processing procedure (S13), with glutinous except the impurity of larger particles；This polyimide film is carried out a face cleaning,
Wherein this face cleaning is first to carry out wet process (S14), and wet process is that chemical liquid soaks and ultrasonic wave concussion, chemistry leaching
Bubble is to soak with acid liquid medicine, can be sodium peroxydisulfate, SODIUM PERCARBONATE or sulphuric acid, not result in polyimide film and sting erosion, make material
Expect impaired；Ultrasonic wave concussion from bottom to top shakes in being arranged at chemical liquid, to provide energy to make pollutant depart from polyamides
Imines face and hole；Carry out corona processing procedure (S15) again, make the pollutant such as carbon slag come off or become loose structure, this corona system
Journey has further included one and has bled operation, to remove ozone and pollutant, and a medicine liquid spray processing procedure (S16), sub-in order to spray polyamides
Amine film, can be water cutter or jet pipe sprinkling, to be removed by pollutant.
By above clean method, the polyimides Membrane cleaning that Laser Processing can complete prebored hole effectively completes, with
It is easy to subsequent metallisation processing procedure (such as chemical nickel plating and electro-coppering).
Following form shows, can the quality of lifting nickel operation through corona and wet process.
Particular embodiments described above, has been carried out the purpose of the present invention, technical scheme and beneficial effect the most in detail
Describe in detail bright it should be understood that the foregoing is only the specific embodiment of the present invention, be not limited to the present invention, all
Within the spirit and principles in the present invention, any modification, equivalent substitution and improvement etc. done, should be included in the protection of the present invention
Within the scope of.
Claims (5)
1. a polyimide film clean method with prebored hole, it is characterised in that it includes the following step:
One polyimide film is provided；
Carry out this polyimide film laser machining processing procedure so that it is there is multiple prebored hole；
Carrying out a face cleaning processing procedure, it includes a corona and a wet process, and this corona processing procedure includes one and bleeds operation,
This wet process is that chemical liquid soaks and ultrasonic wave concussion, and wherein, this chemical immersion processing procedure is that acid liquid medicine soaks, ultrasound wave
Concussion is put in chemical liquid, shakes from lower to upper；And
One medicine liquid spray processing procedure, in order to spray this polyimide film.
Method the most according to claim 1, it is characterised in that wherein, carries out face cleaning system utilizing this acidity liquid medicine
Carry out one before journey and stick dirt processing procedure.
Method the most according to claim 1, it is characterised in that wherein, this acidity liquid medicine be sodium peroxydisulfate, SODIUM PERCARBONATE or
Sulphuric acid.
Method the most according to claim 1, it is characterised in that wherein, this face cleaning processing procedure is first corona rewetting formula system
Journey, or first wet process corona processing procedure again.
Method the most according to claim 1, it is characterised in that wherein, this medicine liquid spray processing procedure is water cutter or jet pipe sprinkling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610403380.2A CN106132105A (en) | 2016-06-08 | 2016-06-08 | There is the polyimide film clean method of prebored hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610403380.2A CN106132105A (en) | 2016-06-08 | 2016-06-08 | There is the polyimide film clean method of prebored hole |
Publications (1)
| Publication Number | Publication Date |
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| CN106132105A true CN106132105A (en) | 2016-11-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610403380.2A Pending CN106132105A (en) | 2016-06-08 | 2016-06-08 | There is the polyimide film clean method of prebored hole |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101754593A (en) * | 2008-12-02 | 2010-06-23 | 北京华兴太极信息科技有限责任公司 | Pretreatment technology of flex-rigid multiple-layer printed board hole metallization |
| CN102543686A (en) * | 2012-02-10 | 2012-07-04 | 上海先进半导体制造股份有限公司 | Process for photoetching polyimide on semiconductor substrate |
| CN102711394A (en) * | 2012-06-25 | 2012-10-03 | 广州美维电子有限公司 | Electroplating interconnecting processing technology for circuit board |
| CN103153002A (en) * | 2013-02-21 | 2013-06-12 | 广州兴森快捷电路科技有限公司 | Manufacture method of printed-circuit board with three-side packed and clamped pore copper structure |
| CN105170576A (en) * | 2015-05-11 | 2015-12-23 | 柏弥兰金属化研究股份有限公司 | Cleaning method and system for a reel-to-reel polyimide film |
-
2016
- 2016-06-08 CN CN201610403380.2A patent/CN106132105A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101754593A (en) * | 2008-12-02 | 2010-06-23 | 北京华兴太极信息科技有限责任公司 | Pretreatment technology of flex-rigid multiple-layer printed board hole metallization |
| CN102543686A (en) * | 2012-02-10 | 2012-07-04 | 上海先进半导体制造股份有限公司 | Process for photoetching polyimide on semiconductor substrate |
| CN102711394A (en) * | 2012-06-25 | 2012-10-03 | 广州美维电子有限公司 | Electroplating interconnecting processing technology for circuit board |
| CN103153002A (en) * | 2013-02-21 | 2013-06-12 | 广州兴森快捷电路科技有限公司 | Manufacture method of printed-circuit board with three-side packed and clamped pore copper structure |
| CN105170576A (en) * | 2015-05-11 | 2015-12-23 | 柏弥兰金属化研究股份有限公司 | Cleaning method and system for a reel-to-reel polyimide film |
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Application publication date: 20161116 |
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