CN106125214B - Parallel optical module - Google Patents

Parallel optical module Download PDF

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Publication number
CN106125214B
CN106125214B CN201610763449.2A CN201610763449A CN106125214B CN 106125214 B CN106125214 B CN 106125214B CN 201610763449 A CN201610763449 A CN 201610763449A CN 106125214 B CN106125214 B CN 106125214B
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CN
China
Prior art keywords
parallel optical
base
optical module
pcb board
upper lid
Prior art date
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Active
Application number
CN201610763449.2A
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Chinese (zh)
Other versions
CN106125214A (en
Inventor
孙阳辉
王永才
姜瑜斐
庄荣华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qingdao Xinghang Photoelectric Technology Co ltd
Original Assignee
Hisense & Jonhon Optical Electrical Technologies Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Hisense & Jonhon Optical Electrical Technologies Co ltd filed Critical Hisense & Jonhon Optical Electrical Technologies Co ltd
Priority to CN201610763449.2A priority Critical patent/CN106125214B/en
Publication of CN106125214A publication Critical patent/CN106125214A/en
Application granted granted Critical
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Active legal-status Critical Current
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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4296Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4266Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268Cooling
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4274Electrical aspects
    • G02B6/428Electrical aspects containing printed circuit boards [PCB]
    • G02B6/4281Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4274Electrical aspects
    • G02B6/4284Electrical aspects of optical modules with disconnectable electrical connectors
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4285Optical modules characterised by a connectorised pigtail
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4286Optical modules with optical power monitoring

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

The invention discloses a parallel optical module which comprises a parallel optical assembly, an upper cover, a base and an MPO adapter inner core. The parallel optical assembly utilizes the bending characteristic of the flexible PCB plate part to enable the rigid PCB plate part and the electric connector to be arranged below the base, so that the metal reinforcing plate and the optical connector are arranged above the base, overlapping installation of the parallel optical assembly on the base is achieved, and assembly accuracy of the optical connector and the electric connector is guaranteed. The parallel optical module, the upper cover, the base and the MPO adapter inner core can be accurately positioned and assembled, so that the parallel optical module has a compact structure and a small packaging size, and the application of a high-density integrated communication system of the parallel optical module is facilitated. The heat source of the parallel optical assembly is directly contacted with the base, so that the parallel optical module has good heat dissipation channels and heat dissipation characteristics, and the improvement of the heat dissipation effect is facilitated.

Description

A kind of parallel optical module
Technical field
The present invention relates to technical field of optical fiber communication, relates in particular to a kind of parallel optical module.
Background technology
With the requirement more and more higher in fiber optic communication field to communication bandwidth, the transmission of multidiameter delay optical fiber or parallel light are mutual Application even is more and more extensive, and in order to realize multidiameter delay light network, generally use multidiameter delay optical transceiver module carries out multichannel Parallel optical interconnecting.
Parallel modules require higher density of components compared with single channel module, smaller package dimension and weight, lower Energy consumption, while to thermal design, electromagnetic interference shield design, packaging technology design, photoelectric coupling design and circuit design have compared with High requirement.The direct decision module Performance And Reliability of the perfect structural design scheme of parallel optical module.Therefore, in parallel modules Optical module structure higher is required to the alignment precisions of the parts such as each chip, lens, error is small, as high as possible so as to ensure Coupling efficiency.
Multidiameter delay optical transceiver module of the prior art is using the packing forms for meeting international standard, including QSFP MSA, SNAP12 MSA agreements etc., some packing forms are to realize its own some specific function, the encapsulation chi often made It is very little larger, such as SFF (49.56mm X 13.59mm X 9.8mm), SFP (56.5mm X 13.4mm X 8.5mm) etc., Mostly it is due to caused by its internal structure construction takes that size is larger and structure design is not quite reasonable between all parts.Tool Body surface is present, is mostly often to use rigid circuit board as the system board structure commonly used in encapsulation, can not be sent out for straight panel shape Raw corresponding bending, corresponding component on circuit board can be damaged if bending;In addition, the light part assembling structure of optical assembly is not It is enough compact, it will also result in package dimension increasing.These encapsulation optical modules are relatively low compared with environmental suitability is made greatly because of its package dimension, If run in relatively adverse circumstances, because its resistance to shock is low, it may occur that damage or can not normal work, and Its corresponding reliability far can not also meet highly-reliable system requirement when being run in highly-reliable system.
The content of the invention
It is an object of the invention to provide a kind of parallel optical module, is imitated with overcoming to assemble existing for existing parallel optical module The defects of rate is low, package dimension is big, radiating effect is poor, the assembly precision difference of electric connector and optical connector.
Therefore, the invention provides a kind of parallel optical module, including parallel optical assembly, the parallel optical assembly includes PCB Plate, electric connector and optical connector on the pcb board, the optical connector include FA optical-fiber array assemblies, VCSEL Laser or PD detectors and driving chip, the pcb board include rigid pcb board portion and flexible PCB plate portion, the electric connector It is arranged in the rigid pcb board portion;The lower section of the flexible PCB plate portion is provided with the metal parallel with the flexible PCB plate portion Stiffening plate, the metal reinforcement plate are provided with two FA fixing lug boss parallel to each other, VCSEL lasers or PD probe positions Tag slot and driving chip positioning tag slot, the VCSEL lasers or PD probe positions tag slot and the driving chip It is adjacent to position tag slot;The VCSEL lasers or PD detectors are pasted onto the VCSEL lasers by high-precision slicer Or in PD probe positions tag slot, the driving chip is pasted onto the driving chip positioning mark by high-precision slicer Qu Zhong;The FA optical-fiber array assemblies include fiber array and MT lock pins, the fiber array by way of active coupling with The VCSEL lasers or PD detectors carry out alignment coupling, and the fiber array is described two with the metal reinforcement plate FA fixing lug boss is fixed together by structure glue;The parallel optical module also include upper lid, base, MPO adapters inner core and Protection plug;The parallel optical assembly passes through the bending rigid pcb board portion of the flexible PCB plate portion and the electrical connection Device is arranged on below the base so that the metal reinforcement plate and the optical connector are arranged on above the base;It is described Upper lid is arranged on above the base, and one end of the MPO adapters inner core and the MT of the FA optical-fiber array assemblies are inserted Core is connected, and the other end of the MPO adapters inner core is arranged in the protection plug.
Parallel optical module as described above, the rigid pcb board portion are provided with multiple rigid pcb board positioning holes and multiple rigidity Position is kept away in PCB plate through hole, the base lower section provided with multiple rigid pcb board portion locating dowels, multiple first screws and rigid pcb board portion Groove;The multiple rigid pcb board portion locating dowel below the base is arranged on the multiple rigidity in the rigid pcb board portion In pcb board positioning hole, the multiple rigid PCB plate through hole in the multiple first screw and the rigid pcb board portion passes through spiral shell Nail connection;The rigid pcb board portion bit-avoiding slot is used to the rigid pcb board portion is carried out keeping away position.
Parallel optical module as described above, the flexible PCB plate portion and the metal reinforcement plate are provided with multiple flexible PCBs Plate through hole, the flexible PCB through hole are ellipse, and multiple second screws are provided with above the base;Above the base The multiple second screw and the multiple flexible PCB through hole of the flexible PCB plate portion are connected by screw;The base Top is sequentially provided with mounting surface, the first MT grooves and the first MPO grooves, and the multiple second screw is arranged on the mounting surface On;The metal reinforcement plate is arranged on the mounting surface;The shape and the shape phase of the MT lock pins of the first MT grooves Adaptation, the MT lock pins are arranged in the first MT grooves;In the shape of the first MPO grooves and the MPO adapters The shape of core is adapted, and the MPO adapters inner core is arranged in the first MPO grooves.
Parallel optical module as described above, lid bit-avoiding slot, MT fixing lug boss, second are sequentially provided with below the upper lid MT grooves and the 2nd MPO grooves, the upper lid bit-avoiding slot are used to detect the fiber array, the VCSEL lasers or PD Device and the driving chip carry out keeping away position;The MT fixing lug boss and the 2nd MT grooves are respectively used to enter the MT lock pins Row is fixed and keeps away position;The 2nd MPO grooves are used to the MPO adapters inner core is carried out keeping away position.
Parallel optical module as described above, the lower section of the upper lid are provided with multiple internal threaded columns, and the base is provided with multiple Threaded post through hole;The multiple internal threaded column of the upper lid is arranged in the multiple threaded post through hole of the base, institute State and screw is provided with internal threaded column so that the upper lid connects with the base.
Parallel optical module as described above, the top of the upper lid are provided with multiple radiating bosses, and one end of the upper lid is set There is upper lid positioning boss, one end of the base is provided with upper lid detent;The upper lid positioning boss of the upper lid is set The base it is described in lid detent.
Parallel optical module as described above, the parallel optical module also include protection cap, and the protection cap is arranged on described Outside electric connector;The parallel optical module also includes label, and the label is arranged on the top of the upper lid.
Parallel optical module as described above, the metal reinforcement plate is provided with two closure positioning holes, described two close It is adjacent with described two FA fixing lug boss respectively to cover positioning hole;The metal reinforcement plate and the flexible PCB plate portion hot pressing pressure It is integrated.
Parallel optical module as described above, the parallel optical assembly also include closure, and the closure is provided with sealing Lid locating dowel;The closure locating dowel of the closure is arranged on the closure positioning hole of the metal reinforcement plate In, the lower section of the closure is connected in the flexible PCB plate portion by structure glue.
Parallel optical module as described above, the flexible PCB plate portion are provided with described two FA fixing lug boss, described VCSEL lasers or PD probe positions tag slot, the driving chip positioning tag slot and closure positioning hole expose Adagio positioning hole;The shape of the adagio positioning hole detects with described two FA fixing lug boss, the VCSEL lasers or PD The shape of device positioning tag slot, driving chip positioning tag slot and the closure positioning hole is adapted.
Compared with prior art, the advantages and positive effects of the present invention are:The invention provides a kind of parallel optical module, bag Include parallel optical assembly, upper lid, base and MPO adapter inner cores.The pcb board of parallel optical assembly includes rigid pcb board portion and flexibility Pcb board portion, flexible PCB plate portion can be folding or bending over, and optical connector is arranged on the metal reinforcement plate being connected with flexible PCB plate portion On, in encapsulation process, optical connector and metal reinforcement plate can bend or fold with flexible PCB plate portion so that optical port encapsulates The optical connector in portion can reach angle of assembling and the position of most convenient, realize quick assembling, improve efficiency of assembling and assembling essence Degree;And be advantageous to reduce package dimension, the high density distribution of component is advantageously formed, adaptive capacity to environment can be strengthened.This The parallel optical assembly of invention causes rigid pcb board portion and electric connector to be arranged on base using the flexural property of flexible PCB plate portion Lower section so that metal reinforcement plate and optical connector are arranged on above base, so as to realize that parallel optical assembly is overlapping on base Installation, it is ensured that the assembly precision of optical connector and electric connector.The parallel optical assembly of the present invention, upper lid, base and MPO are fitted Accurately positioning assembling can be realized between orchestration inner core, so that the parallel optical module of the present invention is compact-sized, Package dimension is small, can be improved production efficiency with simplification of flowsheet, is realized component high density layouts, be advantageous to the present invention's The application of the High Density Integration communication system of parallel optical module.The thermal source of parallel optical assembly directly and base contacts so that The parallel optical module of the present invention has good heat dissipation channel and heat dissipation characteristics, is advantageous to improve radiating effect, and then cause this The parallel optical module of invention works suitable for wide warm area.The upper lid of the present invention can increase the area of dissipation of parallel optical module, from And the radiating effect of parallel optical module can be improved.
After the embodiment of the present invention is read in conjunction with the figure, the other features and advantages of the invention will become more clear Chu.
Brief description of the drawings
Fig. 1 is a kind of structural representation of embodiment of parallel optical module of the present invention;
Fig. 2 is a kind of structure decomposition figure of embodiment of parallel optical module of the present invention;
Fig. 3 is a kind of a kind of structural representation at visual angle of embodiment of the base of parallel optical module of the present invention;
Fig. 4 is a kind of structural representation at another visual angle of embodiment of the base of parallel optical module of the present invention;
Fig. 5 is a kind of a kind of structural representation at visual angle of embodiment of the upper lid of parallel optical module of the present invention;
Fig. 6 is a kind of structural representation at another visual angle of embodiment of the upper lid of parallel optical module of the present invention;
Fig. 7 is a kind of structural representation of embodiment of the parallel optical assembly of parallel optical module of the present invention;
Fig. 8 be parallel optical module of the present invention pcb board and electric connector a kind of embodiment structural representation;
Fig. 9 is a kind of a kind of structural representation at visual angle of embodiment of the metal reinforcement plate of parallel optical module of the present invention;
Figure 10 is a kind of structural representation at another visual angle of embodiment of the metal reinforcement plate of parallel optical module of the present invention Figure;
In Fig. 1-Figure 10, reference and its corresponding component names are as follows:
1. parallel optical assembly;11.PCB plates;111. rigid pcb board portion;112. flexible PCB plate portion;113. adagio positioning hole; 114. rigid pcb board positioning hole;115. rigid PCB plate through hole;116. flexible PCB through hole;12. electric connector;13. light connects Device;131.FA optical-fiber array assembly;132.VCSEL lasers or PD detectors;133. driving chip;134. fiber array; 135.MT lock pin;14. metal reinforcement plate;141.FA fixing lug boss;142.VCSEL lasers or PD probe positions tag slot; 143. driving chips position tag slot;144. closure positioning holes;15. closure;151. closure locating dowels;2. base;21. Rigid pcb board portion locating dowel;22. the first screw;23. rigid pcb board portion bit-avoiding slot;24. the second screw;25. mounting surface;26. First MT grooves;27. the first MPO grooves;28. threaded post through hole;Covered on 3.;Lid bit-avoiding slot on 31.;32.MT fixing lug boss; 33. the 2nd MT grooves;34. the 2nd MPO grooves;35. internal threaded column;36. radiating boss;Lid positioning boss on 37.;4.MPO is fitted Orchestration inner core;5. protection plug;6. protection cap;7. label.
Embodiment
The embodiment of the present invention is described in detail below, it should be appreciated that described herein specific Embodiment is merely to illustrate and explain the present invention, and is not intended to limit the invention.
As shown in Fig. 1-Figure 10, the parallel optical module of the present embodiment includes parallel optical assembly 1, and parallel optical assembly 1 includes PCB Plate 11, electric connector 12 and optical connector 13 on pcb board 11, optical connector 13 include FA optical-fiber array assemblies 131, VCSEL lasers or PD detectors 132 and driving chip 133, pcb board 11 include rigid pcb board portion 111 and flexible PCB plate portion 112, electric connector 12 is arranged in rigid pcb board portion 111;The lower section of flexible PCB plate portion 112 is provided with and flexible PCB plate portion 112 Parallel metal reinforcement plate 14, metal reinforcement plate 14 are provided with two FA fixing lug boss 141 parallel to each other, VCSEL lasers Or PD probe positions tag slot 142 and driving chip positioning tag slot 143, VCSEL lasers or PD probe positions mark Area 142 and driving chip positioning tag slot 143 are adjacent;VCSEL lasers or PD detectors 132 are pasted by high-precision slicer In VCSEL lasers or PD probe positions tag slot 142, driving chip 133 is pasted onto driving by high-precision slicer In chip positioning tag slot 143;FA optical-fiber array assemblies 131 include fiber array 134 and MT lock pins 135, and fiber array 134 is logical The mode for crossing active coupling carries out alignment with VCSEL lasers or PD detectors 132 and coupled, fiber array 134 and metal reinforcement Two FA fixing lug boss 141 of plate 14 are fixed together by structure glue;Parallel optical module also includes upper lid 3, base 2, MPO and fitted Orchestration inner core 4 and protection plug 5;Parallel optical assembly 1 passes through the rigid pcb board portion 111 of bending of flexible PCB plate portion 112 and electricity Connector 12 is arranged on the lower section of base 2 so that metal reinforcement plate 14 and optical connector 13 are arranged on the top of base 2;Upper lid 3 is set Above base 2, one end of MPO adapters inner core 4 is connected with the MT lock pins 135 of FA optical-fiber array assemblies 131, MPO adapters The other end of inner core 4 is arranged in protection plug 5.
The pcb board 11 of the parallel optical assembly 1 of the present embodiment includes rigid pcb board portion 111 and flexible PCB plate portion 112, flexible Pcb board portion 112 can be folding or bending over;Optical connector 13 is arranged on the metal reinforcement plate 14 being connected with flexible PCB plate portion 112 On, in encapsulation process, optical connector 13 and metal reinforcement plate 14 can be bent or fold with flexible PCB plate portion 112 so that light The optical connector 13 of mouth encapsulation part can reach angle of assembling and the position of most convenient, realize quick assembling, improve efficiency of assembling And assembly precision.The parallel optical assembly 1 of the present embodiment realizes parallel optical assembly 1 using the flexural property of flexible PCB plate portion 112 Overlapping installation, it is ensured that the assembly precision of optical connector 13 and electric connector 12, so that the present embodiment is parallel Optical assembly 1 it is compact-sized, reduce that the package dimension of parallel optical assembly 1 is small, advantageously form the high density distribution of component, can To strengthen adaptive capacity to environment, be advantageous to the application of the High Density Integration communication system of the parallel optical assembly 1 of the present embodiment.
Metal reinforcement plate 14 can make up the shortcomings that intensity of flexible PCB plate portion 112 is weaker, thereby may be ensured that pcb board 11 Bulk strength;And the similar thermal expansion coefficient of metal reinforcement plate 14 and driving chip 133, i.e., both it is thermally matched functional, So as to be advantageous to the installation of the nude film of driving chip 133, driving chip 133 can be avoided to be damaged due to the effect of expanding with heat and contract with cold or extruding It is bad.
As preferred embodiment, tungsten copper clad metal sheet etc. can be selected in metal reinforcement plate 14.
The VCSEL lasers being arranged on metal reinforcement plate 14 or PD probe positions tag slot 142 and driving chip are determined Bit identification area 143 can accelerate VCSEL lasers or the operation of the paster of PD detectors 132 and driving chip 133, improve paster effect Rate, high accuracy positioning can be carried out to the fixed of VCSEL lasers or PD detectors 132 and driving chip 133, and then can be so as to In carrying out precision positioning with the fixed of FA optical-fiber array assemblies 131 to VCSEL lasers or PD detectors 132, so as to reality Now high-accuracy active alignment therebetween and direct-coupling, coupling technique can be simplified, improve production efficiency, it is ensured that light The assembly precision of connector 13 and electric connector 12.
The parallel optical assembly 1 of the present embodiment causes the rigid He of pcb board portion 111 using the flexural property of flexible PCB plate portion 112 Electric connector 12 is arranged on the lower section of base 2 so that metal reinforcement plate 14 and optical connector 13 are arranged on the top of base 2, so as to real Now overlapping installation of the parallel optical assembly 1 on base 2, it is ensured that the assembly precision of optical connector 13 and electric connector 12.This Accurately positioning assembling can be realized between the parallel optical assembly 1 of embodiment, upper lid 3, base 2 and MPO adapters inner core 4, from And the compact-sized of the parallel optical module of the present embodiment can be caused, package dimension is small, is advantageous to the parallel optical mode of the present embodiment The application of the High Density Integration communication system of block.The thermal source of parallel optical assembly 1 directly contacts with base 2, so that this implementation The parallel optical module of example has good heat dissipation channel and heat dissipation characteristics, is advantageous to improve radiating effect, and then cause this implementation The parallel optical module of example works suitable for wide warm area.The upper lid 3 of the present embodiment can increase the area of dissipation of parallel optical module, from And the radiating effect of parallel optical module can be improved.
As preferred embodiment, upper lid 3, base 2 and protection plug 5 are made of metal material, can cause this The parallel optical module of embodiment has the ability of good heat dispersion, shielding properties and electromagnetism interference.
The thermal source of parallel optical assembly 1 includes VCSEL lasers or PD detectors 132 and driving chip 133.
Protect plug 5 can so that MPO adapters inner core 4 from damaging and polluting.
Rigid pcb board portion 111 is provided with multiple rigid pcb board positioning holes 114 and multiple rigid PCB plate through hole 115, base 2 Lower section is provided with multiple rigid pcb board portion locating dowels 21, multiple first screws 22 and rigid pcb board portion bit-avoiding slot 23, the lower section of base 2 Multiple rigid pcb board portion locating dowels 21 be arranged in multiple rigid pcb board positioning holes 114 in rigid pcb board portion 111, base 2 Multiple first screws 22 of lower section and multiple rigid PCB plate through hole 115 in rigid pcb board portion 111 are connected by screw;Rigidity Pcb board portion bit-avoiding slot 23 is used to rigid pcb board portion 111 is carried out keeping away position, for avoiding single product machine in rigid pcb board portion 111 Deng component.
Flexible PCB plate portion 112 and metal reinforcement plate 14 are provided with multiple flexible PCB through holes 116, flexible PCB through hole 116 be ellipse, and the top of base 2 is provided with multiple second screws 24;Multiple second screws 24 and flexible PCB of the top of base 2 Multiple flexible PCB through holes 116 in portion 112 are connected by screw;The top of base 2 is sequentially provided with mounting surface 25, the first MT grooves 26 and the first MPO groove 27, multiple second screws 24 be arranged on mounting surface 25;Metal reinforcement plate 14 is arranged on mounting surface 25 On;The shape of first MT grooves 26 is adapted with the shape of MT lock pins 135, and MT lock pins 135 are arranged in the first MT grooves 26;The The shape of one MPO grooves 27 is adapted with the shape of MPO adapters inner core 4, and it is recessed that MPO adapters inner core 4 is arranged on the first MPO In groove 27.
In the present embodiment, parallel optical assembly 1 is arranged on base 2, utilizes the flexible PCB plate portion 112 of parallel optical assembly 1 Flexural property so that parallel optical assembly 1 is bent so that rigid pcb board portion 111 and electric connector 12 are arranged on the lower section of base 2, So that metal reinforcement plate 14 and optical connector 13 are arranged on the top of base 2.Rigid pcb board portion 111 and electric connector 12 are installed When below base 2, multiple rigid pcb board portion locating dowels 21 of the lower section of base 2 are arranged on the multiple firm of rigid pcb board portion 111 Property pcb board positioning hole 114 in, multiple first screws 22 of the lower section of base 2 and multiple rigid pcb boards in rigid pcb board portion 111 lead to Hole 115 is connected by screw, and the rigid pcb board portion bit-avoiding slot 23 of the lower section of base 2 is used to rigid pcb board portion 111 is carried out keeping away position, So that rigid pcb board portion 111 and electric connector 12 are arranged on the lower section of base 2, it is possible to achieve the accurate of electric connector 12 is determined Position and assembling.When metal reinforcement plate 14 and optical connector 13 are arranged on into 2 top of base, metal reinforcement plate 14 is arranged on mounting surface On 25, MT lock pins 135 are arranged in the first MT grooves 26, multiple second screws 24 and flexible PCB plate portion 112 of the top of base 2 Multiple flexible PCB through holes 116 be connected by screw so that metal reinforcement plate 14 and optical connector 13 are arranged on The top of base 2.Flexible PCB through hole 116 is ellipse, can adjust the connection of the screw 24 of flexible PCB through hole 116 and second Position, so as to make up the position of related features of the length tolerance of FA optical-fiber array assemblies 131 and the paster of chip 133, it can also protect Card MT lock pins 135 are accurately positioned, and then can ensure the assembly precision of optical connector 13, realize the accurate fixed of optical connector 13 Position and assembling.Assembling can be accurately positioned between parallel optical assembly 1 and base 2 when above packaged type can ensure to encapsulate, together When can facilitate the installation and fixation of parallel optical assembly 1.
In the present embodiment, rigid pcb board positioning hole 114 and rigid pcb board portion locating dowel 21 are corresponding, and rigid pcb board is determined The quantity of position hole 114 and rigid pcb board portion locating dowel 21 is 2;The rigid screw 22 of PCB plate through hole 115 and first is corresponding, The quantity of the rigid screw 22 of PCB plate through hole 115 and first is 2;The screw 24 of flexible PCB through hole 116 and second is corresponding, The quantity of the screw 24 of flexible PCB through hole 116 and second is 2.
It is recessed that the lower section of upper lid 3 is sequentially provided with lid bit-avoiding slot 31, MT fixing lug boss 32, the 2nd MT grooves 33 and the 2nd MPO Groove 34, bit-avoiding slot 31 are used to fiber array 134, VCSEL lasers or PD detectors 132 and driving chip 133 are carried out keeping away position, The MT grooves 33 of MT fixing lug boss 32 and the 2nd are respectively used to MT lock pins 135 are fixed and kept away position, and the 2nd MPO grooves 34 are used for MPO adapters inner core 4 is carried out keeping away position, so that what upper lid 3 assembled with parallel optical assembly 1 and MPO adapters inner core 4 More firm fitting, it is also prevented from damaging parallel optical assembly 1 and MPO adapters inner core 4 by pressure after the encapsulation of lid 3 is fixed.
The lower section of upper lid 3 is provided with internal threaded column 35, and base 2 is provided with multiple threaded post through holes 28;Multiple internal threads of upper lid 3 Post 35 is arranged in multiple threaded post through holes 28 of base 2, and screw is provided with internal threaded column 35, so that upper lid 3 and base 2 Assembling is fixed.
Partial shape of the threaded post through hole 28 below base 2 is circle, and the partial shape above base 2 is ellipse Shape.As preferred embodiment, the quantity of internal threaded column 35 and threaded post through hole 28 is 2.
The top of upper lid 3 is provided with multiple radiating bosses 36, and one end of upper lid 3 is provided with upper lid positioning boss 37, and the one of base 2 End is provided with upper lid detent 29;The upper lid positioning boss 37 of upper lid 3 is arranged in the upper lid detent 29 of base 2, can be with The positioning assembling of lid 3 and base 2 in realization.
During installation, first by multiple threaded post through holes 28 of the top of 35 inserted base of multiple internal threaded columns 2 of upper lid 3, Multiple threaded post through holes 28 of the top of base 2 are ellipses, can cause spiral shell of the internal threaded column 35 of lid 3 above base 2 Moved in line post through hole 28, so that upper lid 3 moves in multiple threaded post through holes 28 above base 2.Pass through shifting The upper lid positioning boss 37 of upper lid 3, can be buckled in the upper lid detent 29 of base 2 by dynamic upper lid 3, and cause upper lid 3 The lower section of internal threaded column 35 and base 2 threaded post through hole 28 it is corresponding, screw is inserted from the threaded post through hole 28 of the lower section of base 2 Enter into the internal threaded column 35 of upper lid 3, so as to which upper lid 3 and base 2 are assembled together.Above packaged type can ensure It is upper during encapsulation that assembling can be accurately positioned between lid 3 and base 2, while can the conveniently above installation and fixation of lid 3.
Multiple radiating bosses 36 can increase the upper surface area of upper lid 3, and then can increase the radiating of parallel optical module Area, so as to improve the radiating effect of parallel optical module.
Parallel optical module also includes protection cap 6, and protection cap 6 is arranged on outside electric connector 12, and protection cap 6 can cause electricity Connector 12 is from damage.Parallel optical module also includes label 7, and label 7 is arranged on the top of lid 3, and label 7 can be to parallel Explanation is marked in optical module.
Metal reinforcement plate 14 is provided with two closure positioning holes 144, and two closure positioning holes are consolidated with two FA respectively It is adjacent to determine boss 141;Metal reinforcement plate 14 and the hot pressing of flexible PCB plate portion 112 pressing are integrated.
Parallel optical assembly 1 also includes closure 15, and closure 15 is provided with closure locating dowel 151;Closure 15 it is close Capping locating dowel 151 is arranged in the closure positioning hole 144 of metal reinforcement plate 14, and the lower section of closure 15 is consolidated by structure glue It is connected in flexible PCB plate portion 112.Closure 15 can be by the fiber array 134 of FA optical-fiber array assemblies 131, VCSEL lasers Or PD detectors 132 and driving chip 133 realize sealing installation.
Flexible PCB plate portion 112, which is provided with, identifies two FA fixing lug boss 141, VCSEL lasers or PD probe positions The adagio positioning hole 113 that area 142, driving chip positioning tag slot 143 and closure positioning hole 144 expose;Adagio positioning hole 113 Shape and two FA fixing lug boss 141, VCSEL lasers or PD probe positions tag slot 142, driving chip positioning identifies The shape of area 143 and closure positioning hole 144 is adapted.Adagio positioning hole 113 can be arranged on flexible PCB plate portion 112 Two FA fixing lug boss 141, VCSEL lasers or the PD probe positions tag slot 142 of the metal reinforcement plate 14 of lower section, driving Chip positioning tag slot 143 and closure positioning hole 144 expose, so as to realize optical connector 13 in flexible PCB plate portion 112 On be accurately positioned and assemble.
132 in Fig. 7 can be VCSEL lasers or PD detectors, and 142 in Fig. 9 correspond to the positioning of VCSEL lasers Tag slot or PD probe positions tag slot.
The above embodiments are merely illustrative of the technical solutions of the present invention, rather than is limited;Although with reference to foregoing reality Example is applied the present invention is described in detail, for the person of ordinary skill of the art, still can be to foregoing implementation Technical scheme described in example is modified, or carries out equivalent substitution to which part technical characteristic;And these are changed or replaced Change, the essence of appropriate technical solution is departed from the spirit and scope of claimed technical solution of the invention.

Claims (10)

1. a kind of parallel optical module, including parallel optical assembly, the parallel optical assembly includes pcb board, on the pcb board Electric connector and optical connector, the optical connector includes FA optical-fiber array assemblies, VCSEL lasers or PD detectors and drive Dynamic chip, the pcb board include rigid pcb board portion and flexible PCB plate portion, and the electric connector is arranged on the rigid pcb board In portion;Characterized in that,
The lower section of the flexible PCB plate portion is provided with the metal reinforcement plate parallel with the flexible PCB plate portion, the metal reinforcement plate It is provided with two FA fixing lug boss parallel to each other, VCSEL lasers or PD probe positions tag slot and driving chip positions Tag slot, the VCSEL lasers or PD probe positions tag slot and driving chip positioning tag slot are adjacent;
The VCSEL lasers or PD detectors are pasted onto the VCSEL lasers or PD detectors by high-precision slicer Position in tag slot, the driving chip is pasted onto the driving chip by high-precision slicer and positioned in tag slot;
The FA optical-fiber array assemblies include fiber array and MT lock pins, and the fiber array is by way of active coupling and institute State VCSEL lasers or PD detectors carry out alignment coupling, described two FA of the fiber array and the metal reinforcement plate Fixing lug boss is fixed together by structure glue;
The parallel optical module also includes upper lid, base, MPO adapters inner core and protection plug;
The parallel optical assembly passes through the bending rigid pcb board portion of the flexible PCB plate portion and the electric connector It is arranged on below the base so that the metal reinforcement plate and the optical connector are arranged on above the base;
The upper lid is arranged on above the base, one end of the MPO adapters inner core and the FA optical-fiber array assemblies The MT lock pins are connected, and the other end of the MPO adapters inner core is arranged in the protection plug.
2. parallel optical module as claimed in claim 1, it is characterised in that
The rigid pcb board portion is provided with multiple rigid pcb board positioning holes and multiple rigid PCB plate through hole,
Multiple rigid pcb board portion locating dowels, multiple first screws and rigid pcb board portion bit-avoiding slot are provided with below the base;
The multiple rigid pcb board portion locating dowel below the base is arranged on the multiple firm of the rigid pcb board portion In property pcb board positioning hole, the multiple rigid PCB plate through hole in the multiple first screw and the rigid pcb board portion passes through Mode connects for screw;
The rigid pcb board portion bit-avoiding slot is used to the rigid pcb board portion is carried out keeping away position.
3. parallel optical module as claimed in claim 1, it is characterised in that
The flexible PCB plate portion and the metal reinforcement plate are provided with multiple flexible PCB through holes, the flexible PCB through hole For ellipse, the base top is provided with multiple second screws;
The multiple flexible PCB through hole of the multiple second screw and the flexible PCB plate portion above the base leads to Cross mode connects for screw;
Mounting surface, the first MT grooves and the first MPO grooves are sequentially provided with above the base, the multiple second screw is arranged on On the mounting surface;
The metal reinforcement plate is arranged on the mounting surface;The shape and the shape phase of the MT lock pins of the first MT grooves Adaptation, the MT lock pins are arranged in the first MT grooves;
The shape of the first MPO grooves is adapted with the shape of the MPO adapters inner core, and the MPO adapters inner core is set Put in the first MPO grooves.
4. parallel optical module as claimed in claim 1, it is characterised in that
Lid bit-avoiding slot, MT fixing lug boss, the 2nd MT grooves and the 2nd MPO grooves are sequentially provided with below the upper lid,
The upper lid bit-avoiding slot is used for the fiber array, the VCSEL lasers or PD detectors and the driving chip Carry out keeping away position;
The MT fixing lug boss and the 2nd MT grooves are respectively used to be fixed and keep away position to the MT lock pins;
The 2nd MPO grooves are used to the MPO adapters inner core is carried out keeping away position.
5. parallel optical module as claimed in claim 1, it is characterised in that
The lower section of the upper lid is provided with multiple internal threaded columns, and the base is provided with multiple threaded post through holes;
The multiple internal threaded column of the upper lid is arranged in the multiple threaded post through hole of the base, the internal thread Screw is provided with post so that the upper lid connects with the base.
6. parallel optical module as claimed in claim 1, it is characterised in that
The top of the upper lid is provided with multiple radiating bosses, and one end of the upper lid is provided with upper lid positioning boss, the base One end is provided with upper lid detent;The upper lid positioning that the upper lid positioning boss of the upper lid is arranged on the base is recessed In groove.
7. parallel optical module as claimed in claim 1, it is characterised in that
The parallel optical module also includes protection cap, and the protection cap is arranged on outside the electric connector;
The parallel optical module also includes label, and the label is arranged on the top of the upper lid.
8. parallel optical module as claimed in claim 1, it is characterised in that
The metal reinforcement plate is provided with two closure positioning holes, described two closure positioning holes respectively with described two FA Fixing lug boss is adjacent;
The metal reinforcement plate and flexible PCB plate portion hot pressing pressing are integrated.
9. parallel optical module as claimed in claim 8, it is characterised in that
The parallel optical assembly also includes closure, and the closure is provided with closure locating dowel;
The closure locating dowel of the closure is arranged in the closure positioning hole of the metal reinforcement plate, described The lower section of closure is connected in the flexible PCB plate portion by structure glue.
10. parallel optical module as claimed in claim 8, it is characterised in that
The flexible PCB plate portion is provided with described two FA fixing lug boss, the VCSEL lasers or PD probe position marks Know the adagio positioning hole that area, driving chip positioning tag slot and the closure positioning hole expose;
The shape of the adagio positioning hole and described two FA fixing lug boss, the VCSEL lasers or PD probe position marks The shape for knowing area, driving chip positioning tag slot and the closure positioning hole is adapted.
CN201610763449.2A 2016-08-31 2016-08-31 Parallel optical module Active CN106125214B (en)

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Publication number Priority date Publication date Assignee Title
CN106970445B (en) * 2017-04-26 2019-08-16 中航海信光电技术有限公司 Parallel optical transceiver module
CN106908917B (en) * 2017-04-26 2019-01-01 中航海信光电技术有限公司 Parallel light receiving and transmitting assembly
CN110391846B (en) * 2018-04-23 2021-01-12 海思光电子有限公司 Tunable laser assembly
CN113871933B (en) * 2021-08-31 2024-02-06 武汉华工正源光子技术有限公司 Power connector, lower box body and compound optical module

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JP2015090417A (en) * 2013-11-06 2015-05-11 株式会社村田製作所 Receptacle
CN205941991U (en) * 2016-08-31 2017-02-08 中航海信光电技术有限公司 Parallel optical module

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CN203241580U (en) * 2013-05-29 2013-10-16 青岛海信宽带多媒体技术有限公司 Photoelectric module with silicon-based optical base
JP2015090417A (en) * 2013-11-06 2015-05-11 株式会社村田製作所 Receptacle
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Patentee after: Qingdao Xinghang Photoelectric Technology Co.,Ltd.

Address before: 266104 in the investment service center of Beizhai sub district office, beizhaike community, Laoshan District, Qingdao City, Shandong Province

Patentee before: HISENSE & JONHON OPTICAL-ELECTRICAL TECHNOLOGIES Co.,Ltd.