CN106125215B - A kind of parallel optical assembly - Google Patents
A kind of parallel optical assembly Download PDFInfo
- Publication number
- CN106125215B CN106125215B CN201610764690.7A CN201610764690A CN106125215B CN 106125215 B CN106125215 B CN 106125215B CN 201610764690 A CN201610764690 A CN 201610764690A CN 106125215 B CN106125215 B CN 106125215B
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- CN
- China
- Prior art keywords
- flexible pcb
- optical assembly
- sealing cover
- parallel optical
- plate portion
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
- G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/25—Arrangements specific to fibre transmission
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses a kind of parallel optical assembly, the pcb board of parallel optical assembly, which includes rigid pcb board portion and flexible PCB plate portion, flexible PCB plate portion, to be folding or bending over；Optical connector is arranged on the metal reinforcement plate being connected with flexible PCB plate portion, in encapsulation process, optical connector and metal reinforcement plate can be bent or fold with flexible PCB plate portion so that the optical connector of optical port encapsulation part can reach angle of assembling and the position of most convenient, realize quick assembling；And be conducive to reduce package dimension, the high density distribution of component is advantageously formed, adaptive capacity to environment can be enhanced.The overlapping that parallel optical assembly can utilize the flexural property of flexible PCB plate portion to realize parallel optical assembly is installed, ensure the assembly precision of optical connector and electric connector, so that the parallel optical assembly of the present invention is compact-sized, package dimension is small, is conducive to the application of the High Density Integration communication system of the parallel optical assembly of the present invention.
Description
Technical field
The present invention relates to technical field of optical fiber communication, relate in particular to a kind of parallel optical assembly.
Background technology
With higher and higher to the requirement of communication bandwidth in fiber optic communication field, the transmission of multidiameter delay optical fiber or parallel light are mutual
Application even is more and more extensive, and in order to realize multidiameter delay light network, generally use multidiameter delay optical transceiver module carries out multichannel
Parallel optical interconnecting.
Parallel modules require higher density of components compared with single channel module, smaller package dimension and weight, lower
Energy consumption, while to thermal design, electromagnetic interference shield design, packaging technology design, photoelectric coupling design and circuit design have compared with
High requirement.The direct decision module Performance And Reliability of the perfect structural design scheme of parallel optical module.Therefore, in parallel modules
Optical assembly it is more demanding to the alignment precision of the components such as each chip, lens, error is small, so as to ensure optocoupler as high as possible
Close efficiency.
Existing parallel optical module multidiameter delay optical transceiver module of the prior art is using the encapsulation for meeting international standard
Form, including QSFP MSA, SNAP12 MSA agreements etc., some packing forms are to realize its own certain specific function, past
It is larger toward the package dimension made, such as SFF (49.56mm X 13.59mm X 9.8mm), SFP (56.5mm X
13.4mm X 8.5mm) etc., mostly it is to occupy that size is larger and structure design between all parts since its internal structure constructs
Caused by not being quite reasonable.It is in particular in, is mostly often using rigid electric as system board structure common in encapsulation
Road plate cannot occur to be bent accordingly for straight panel shape, and corresponding component on circuit board can be damaged if bending；In addition, light group
The light component assembling structure of part is not compact enough, will also result in package dimension increasing.These encapsulation optical modules are because of its package dimension
It is relatively low compared with environmental suitability is made greatly, if run in relatively adverse circumstances, since its resistance to shock is low, it may occur that damage
Or it can not work normally, and its corresponding reliability far can not also meet high reliability during operation in highly-reliable system
System requirements.
Invention content
The purpose of the present invention is to provide a kind of parallel optical assemblies, and work is coupled existing for existing parallel optical assembly to overcome
The defects of skill is complicated, efficiency of assembling is low, package dimension is big, the assembly precision of electric connector and optical connector is poor.
For this purpose, the present invention provides a kind of parallel optical assembly, including pcb board, the electric connector on the pcb board
And optical connector, the optical connector include FA optical-fiber array assemblies, VCSEL lasers or PD detectors and driving chip, institute
It states pcb board and includes rigid pcb board portion and flexible PCB plate portion, the electric connector is arranged in the rigid pcb board portion；It is described
The lower section of flexible PCB plate portion is equipped with the metal reinforcement plate parallel with the flexible PCB plate portion, and the metal reinforcement plate is equipped with two
A FA fixing lug boss parallel to each other, VCSEL lasers or PD probe positions tag slot and driving chip positioning tag slot, institute
It is adjacent to state VCSEL lasers or PD probe positions tag slot and driving chip positioning tag slot；The VCSEL lasers
Or PD detectors are pasted onto by high-precision slicer in the VCSEL lasers or PD probe positions tag slot, the drive
Dynamic chip is pasted onto the driving chip by high-precision slicer and positions in tag slot；The FA optical-fiber array assemblies include light
Fibre array and MT lock pins, the fiber array are carried out by way of active coupling with the VCSEL lasers or PD detectors
Alignment coupling, described two FA fixing lug boss of the fiber array and the metal reinforcement plate are connected.
Parallel optical assembly as described above, sets that there are two sealing cover location holes on the metal reinforcement plate, described two close
It is adjacent with described two FA fixing lug boss respectively to cover location hole.
Parallel optical assembly as described above, the flexible PCB plate portion are equipped with described two FA optical assemblies fixing lug boss,
The VCSEL lasers or PD probe positions tag slot, the driving chip positioning tag slot and the sealing cover location hole
The adagio location hole of exposing；The shape of the adagio location hole and described two FA optical assemblies fixing lug boss, the VCSEL laser
The shape of device or PD probe positions tag slot, the driving chip positioning tag slot and the sealing cover location hole is adapted.
Parallel optical assembly as described above, the parallel optical assembly further include sealing cover, and the sealing cover is equipped with sealing
Lid positioning column；The sealing cover positioning column of the sealing cover is arranged on the sealing cover location hole of the metal reinforcement plate
In, the lower section of the sealing cover is connected in by structure glue in the flexible PCB plate portion.
Parallel optical assembly as described above, the metal reinforcement plate and the flexible PCB plate portion hot pressing are press-fitted together as one.
Parallel optical assembly as described above, described two FA fixing lug boss of the fiber array and the metal reinforcement plate
It is fixed together by structure glue.
Parallel optical assembly as described above, the flexible PCB plate portion and the metal reinforcement plate are equipped with multiple flexible PCBs
Plate through-hole, the flexible PCB through-hole are ellipse.
Parallel optical assembly as described above, the rigidity pcb board portion are equipped with multiple rigid pcb board location holes and multiple rigidity
PCB plate through hole.
Compared with prior art, the advantages and positive effects of the present invention are：The present invention provides a kind of parallel optical assembly, and
The pcb board of row optical assembly, which includes rigid pcb board portion and flexible PCB plate portion, flexible PCB plate portion, to be folding or bending over；Light connects
Device is arranged on the metal reinforcement plate being connected with flexible PCB plate portion, and in encapsulation process, optical connector and metal reinforcement plate can be with
It is bent or folds with flexible PCB plate portion so that the optical connector of optical port encapsulation part can reach angle of assembling and the position of most convenient
It puts, realizes quick assembling, improve efficiency of assembling and assembly precision.The parallel optical assembly of the present embodiment utilizes flexible PCB plate portion
Flexural property realizes the overlapping installation of parallel optical assembly, it is ensured that the assembly precision of optical connector and electric connector, so as to
So that the parallel optical assembly of the present embodiment is compact-sized, the package dimension for reducing parallel optical assembly is small, advantageously forms member
The high density distribution of device, can enhance adaptive capacity to environment, be conducive to the High Density Integration of the parallel optical assembly of the present embodiment
The application of communication system.Metal reinforcement plate can make up the shortcomings that flexible PCB plate portion intensity is weaker, thereby may be ensured that pcb board
Integral strength；And the similar thermal expansion coefficient of metal reinforcement plate and driving chip, i.e. the two are thermally matched functional, so as to have
It installs, can be damaged due to the effect of expanding with heat and contract with cold or extruding to avoid driving chip conducive to the bare die of driving chip.It is arranged on gold
VCSEL lasers or PD probe positions tag slot and driving chip the positioning tag slot belonged on stiffening plate can accelerate VCSEL
Laser or the operation of the patch of PD detectors and driving chip, improve patch efficiency, can be to VCSEL lasers or PD detectors
Fixed with driving chip carries out high accuracy positioning, and then can be in order to VCSEL lasers or PD detectors and FA optical fiber arrays
The fixed of row component carries out precision positioning, can be with so as to realize high-accuracy active alignment and direct-coupling therebetween
Simplify coupling technique, improve production efficiency, it is ensured that the assembly precision of optical connector and electric connector.
After the specific embodiment of the present invention is read in conjunction with the figure, the other features and advantages of the invention will become more clear
Chu.
Description of the drawings
Fig. 1 is a kind of structure diagram of embodiment of the parallel optical assembly of parallel optical assembly of the invention；
Fig. 2 is the pcb board of parallel optical assembly of the invention and a kind of structure diagram of embodiment of electric connector；
Fig. 3 is a kind of a kind of structure diagram at visual angle of embodiment of the metal reinforcement plate of parallel optical assembly of the invention；
Fig. 4 is a kind of structural representation at another visual angle of embodiment of the metal reinforcement plate of parallel optical assembly of the invention
Figure；
In Fig. 1-Fig. 4, reference numeral and its corresponding component names are as follows：
1.PCB plates；11. rigid pcb board portion；12. flexible PCB plate portion；13. adagio location hole；14. rigid pcb board positioning
Hole；15. rigid PCB plate through hole；16. flexible PCB through-hole；2. electric connector；3. optical connector；31.FA optical-fiber array assemblies；
32.VCSEL lasers or PD detectors；33. driving chip；34. fiber array；35.MT lock pins；4. metal reinforcement plate；41.FA
Fixing lug boss；42.VCSEL lasers or PD probe positions tag slot；43. driving chip positions tag slot；44. sealing cover is determined
Position hole；5. sealing cover；51. sealing cover positioning column.
Specific embodiment
The specific embodiment of the present invention is described in detail below, it should be appreciated that described herein specific
Embodiment is merely to illustrate and explain the present invention, and is not intended to restrict the invention.
As Figure 1-Figure 4, the parallel optical assembly of the present embodiment includes pcb board 1, the electric connector on pcb board 1
2 and optical connector 3, optical connector 3 includes FA optical-fiber array assemblies 31, VCSEL lasers or PD detectors 32 and driving chip
33, pcb board 1 includes rigid pcb board portion 11 and flexible PCB plate portion 12, electric connector 2 are arranged in rigid pcb board portion 11；It is flexible
The lower section in pcb board portion 12 is equipped with the metal reinforcement plate 4 parallel with flexible PCB plate portion 12, sets that there are two mutually on metal reinforcement plate 4
Parallel FA fixing lug boss 41, VCSEL lasers or PD probe positions tag slot 42 and driving chip positioning tag slot 43,
VCSEL lasers or PD probe positions tag slot 42 and driving chip positioning tag slot 43 are adjacent；VCSEL lasers or PD are visited
It surveys device 32 to be pasted onto in VCSEL lasers or PD probe positions tag slot 42 by high-precision slicer, driving chip 33 is logical
High-precision slicer is crossed to be pasted onto in driving chip positioning tag slot 43；FA optical-fiber array assemblies 31 include fiber array 34 and MT
Lock pin 35, fiber array 34 carry out alignment with VCSEL lasers or PD detectors 32 by way of active coupling and couple, optical fiber
Array 34 and two FA fixing lug boss 41 of metal reinforcement plate 4 are connected.
The pcb board 1 of the parallel optical assembly of the present embodiment includes rigid pcb board portion 11 and flexible PCB plate portion 12, flexible PCB
Plate portion 12 can be folding or bending over；Optical connector 3 is arranged on the metal reinforcement plate 4 being connected with flexible PCB plate portion 12, is being encapsulated
In the process, optical connector 3 and metal reinforcement plate 4 can be bent or fold with flexible PCB plate portion 12 so that the light of optical port encapsulation part
Connector 3 can reach angle of assembling and the position of most convenient, realize quick assembling, improve efficiency of assembling and assembly precision.This
The parallel optical assembly of embodiment realizes that the overlapping of parallel optical assembly is installed using the flexural property of flexible PCB plate portion 12, Ke Yibao
The assembly precision of optical connector 3 and electric connector 2 is demonstrate,proved, so that the parallel optical assembly of the present embodiment is compact-sized,
The package dimension for reducing parallel optical assembly is small, advantageously forms the high density distribution of component, can enhance adaptive capacity to environment,
Be conducive to the application of the High Density Integration communication system of the parallel optical assembly of the present embodiment.
Metal reinforcement plate 4 can make up the shortcomings that 12 intensity of flexible PCB plate portion is weaker, thereby may be ensured that the whole of pcb board 1
Body intensity；And the similar thermal expansion coefficient of metal reinforcement plate 4 and driving chip 33, i.e. the two are thermally matched functional, so as to have
It installs, can be damaged due to the effect of expanding with heat and contract with cold or extruding to avoid driving chip 33 conducive to the bare die of driving chip 33.
As preferred embodiment, tungsten copper clad metal sheet etc. can be selected in metal reinforcement plate 4.
The VCSEL lasers being arranged on metal reinforcement plate 4 or PD probe positions tag slot 42 and driving chip positioning
Tag slot 43 can accelerate VCSEL lasers or the operation of the patch of PD detectors 32 and driving chip 33, improve patch efficiency, can
To carry out high accuracy positioning, and then can be in order to right to VCSEL lasers or the fixed of PD detectors 32 and driving chip 33
VCSEL lasers or PD detectors 132 carry out precision positioning with the fixed of FA optical-fiber array assemblies 31, so as to realize the two
Between high-accuracy active alignment and direct-coupling, can simplify coupling technique, improve production efficiency, it is ensured that optical connector
3 and the assembly precision of electric connector 2.
The heat source of parallel optical assembly includes VCSEL lasers or PD detectors 32 and driving chip 33.
It is set on metal reinforcement plate 4 there are two sealing cover location hole 44, two sealing cover location holes are fixed respectively with two FA
Boss 41 is adjacent.
Flexible PCB plate portion 12 is equipped with two FA fixing lug boss 41, VCSEL lasers or PD probe positions tag slot
42nd, the adagio location hole 13 that driving chip positioning tag slot 43 and sealing cover location hole 44 expose；The shape of adagio location hole 13
With two FA fixing lug boss 41, VCSEL lasers or PD probe positions tag slot 42, driving chip positioning tag slot 43 and close
The shape of capping location hole 44 is adapted.Adagio location hole 13 can cause the metal for being arranged on 12 lower section of flexible PCB plate portion to mend
Two FA fixing lug boss 41, VCSEL lasers or PD probe positions tag slot 42, the driving chip positioning tag slot of strong plate 4
43 and sealing cover location hole 44 expose, so as to realize being accurately positioned in flexible PCB plate portion 12 of optical connector 3 and fill
Match.
Parallel optical assembly further includes sealing cover 5, and sealing cover 5 is equipped with sealing cover positioning column 51；The sealing cover of sealing cover 5 is determined
Position column 51 is arranged in the sealing cover location hole 44 of metal reinforcement plate 4, and the lower section of sealing cover 5 is connected in flexibility by structure glue
In pcb board portion 12.Sealing cover 5 can be by the fiber array 34, VCSEL lasers or PD detectors 32 of FA optical-fiber array assemblies 31
Sealing installation is realized with driving chip 33.
Metal reinforcement plate 4 and 12 hot pressing of flexible PCB plate portion are press-fitted together as one.
Fiber array 34 and two FA fixing lug boss 41 of metal reinforcement plate 4 are fixed together by structure glue.
Flexible PCB plate portion 12 and metal reinforcement plate 4 are equipped with multiple flexible PCB through-holes 16, and flexible PCB through-hole 16 is
Ellipse.By multiple flexible PCB through-holes 16, flexible PCB plate portion 12 can be mounted on parallel optical module shell, it can be with
Realize the assembling of flexible PCB plate portion 12, metal reinforcement plate 4 and optical connector 3 and parallel optical module shell.Flexible PCB through-hole
16 be ellipse, the link position of flexible PCB through-hole 16 and parallel optical module shell can be adjusted, so as to make up FA light
The position of related features of 33 patch of length tolerance and chip of fibre array component 31, it can also be ensured that the accurate positionin of MT lock pins 35, into
And can ensure the assembly precision of optical connector 3, realize being accurately positioned and assembling for optical connector 3.
Rigid pcb board portion 11 is equipped with multiple rigid pcb board location holes 14 and multiple rigid PCB plate through hole 15, by multiple
Rigid pcb board portion 11, can be mounted on outside parallel optical module by rigid pcb board location hole 14 and multiple rigid PCB plate through hole 15
On shell, so as to realize the assembling of rigid pcb board portion 11 and electric connector 2 and parallel optical module shell.
32 in Fig. 1 can be VCSEL lasers or PD detectors, and 42 in Fig. 3 correspond to the positioning of VCSEL lasers
Tag slot or PD probe positions tag slot.
The above embodiments are merely illustrative of the technical solutions of the present invention rather than is limited；Although with reference to aforementioned reality
Example is applied the present invention is described in detail, it for those of ordinary skill in the art, still can be to aforementioned implementation
Technical solution recorded in example modifies or carries out equivalent replacement to which part technical characteristic；And these are changed or replace
It changes, the spirit and scope for claimed technical solution of the invention that it does not separate the essence of the corresponding technical solution.
Claims (6)
1. a kind of parallel optical assembly, including pcb board, electric connector and optical connector on the pcb board, the light connect
It connects device and includes FA optical-fiber array assemblies, VCSEL lasers or PD detectors and driving chip, the pcb board includes rigid pcb board
Portion and flexible PCB plate portion, the electric connector are arranged in the rigid pcb board portion；It is characterized in that,
The lower section of the flexible PCB plate portion is equipped with the metal reinforcement plate parallel with the flexible PCB plate portion, the metal reinforcement plate
On set that there are two FA fixing lug boss parallel to each other, VCSEL lasers or PD probe positions tag slot and driving chips to position
Tag slot, the VCSEL lasers or PD probe positions tag slot and driving chip positioning tag slot are adjacent；
The VCSEL lasers or PD detectors are pasted onto the VCSEL lasers or PD detectors by high-precision slicer
It positions in tag slot, the driving chip is pasted onto the driving chip by high-precision slicer and positions in tag slot；
The FA optical-fiber array assemblies include fiber array and MT lock pins, and the fiber array is by way of active coupling and institute
It states VCSEL lasers or PD detectors carries out alignment coupling, described two FA of the fiber array and the metal reinforcement plate
Fixing lug boss is connected；
Set on the metal reinforcement plate there are two sealing cover location hole, described two sealing cover location holes respectively with described two FA
Fixing lug boss is adjacent；
The flexible PCB plate portion is equipped with described two FA fixing lug boss, the VCSEL lasers or PD probe position marks
Know area, the adagio location hole that the driving chip positioning tag slot and the sealing cover location hole expose；
The shape of the adagio location hole and described two FA fixing lug boss, the VCSEL lasers or PD probe position marks
Know area, the driving chip positions tag slot and the shape of the sealing cover location hole is adapted.
2. parallel optical assembly as described in claim 1, which is characterized in that
The parallel optical assembly further includes sealing cover, and the sealing cover is equipped with sealing cover positioning column；
The sealing cover positioning column of the sealing cover is arranged in the sealing cover location hole of the metal reinforcement plate, described
The lower section of sealing cover is connected in by structure glue in the flexible PCB plate portion.
3. parallel optical assembly as described in claim 1, which is characterized in that
The metal reinforcement plate and the flexible PCB plate portion hot pressing are press-fitted together as one.
4. parallel optical assembly as described in claim 1, which is characterized in that
Described two FA fixing lug boss of the fiber array and the metal reinforcement plate are fixed together by structure glue.
5. parallel optical assembly as described in claim 1, which is characterized in that
The flexible PCB plate portion and the metal reinforcement plate are equipped with multiple flexible PCB through-holes, the flexible PCB through-hole
For ellipse.
6. parallel optical assembly as described in claim 1, which is characterized in that
The rigidity pcb board portion is equipped with multiple rigid pcb board location holes and multiple rigid PCB plate through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610764690.7A CN106125215B (en) | 2016-08-31 | 2016-08-31 | A kind of parallel optical assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610764690.7A CN106125215B (en) | 2016-08-31 | 2016-08-31 | A kind of parallel optical assembly |
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| Publication Number | Publication Date |
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| CN106125215A CN106125215A (en) | 2016-11-16 |
| CN106125215B true CN106125215B (en) | 2018-06-08 |
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| CN201610764690.7A Active CN106125215B (en) | 2016-08-31 | 2016-08-31 | A kind of parallel optical assembly |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106950657B (en) * | 2017-04-24 | 2019-02-26 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN106970445B (en) * | 2017-04-26 | 2019-08-16 | 中航海信光电技术有限公司 | Parallel optical transceiver module |
| CN106908917B (en) * | 2017-04-26 | 2019-01-01 | 中航海信光电技术有限公司 | Parallel light receiving and transmitting assembly |
| CN107390331A (en) * | 2017-09-12 | 2017-11-24 | 中航海信光电技术有限公司 | A kind of parallel light transceiving module |
| CN110391846B (en) * | 2018-04-23 | 2021-01-12 | 海思光电子有限公司 | Tunable laser assembly |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010067652A (en) * | 2008-09-09 | 2010-03-25 | Nec Corp | Optical communication apparatus, optical transceiver, and manufacturing method for optical communication apparatus |
| CN203241580U (en) * | 2013-05-29 | 2013-10-16 | 青岛海信宽带多媒体技术有限公司 | Photoelectric module with silicon-based optical base |
| JP2015090417A (en) * | 2013-11-06 | 2015-05-11 | 株式会社村田製作所 | Receptacle |
| CN104503041B (en) * | 2014-12-31 | 2016-04-06 | 中航海信光电技术有限公司 | Parallel optical assembly |
| CN104503043B (en) * | 2014-12-31 | 2016-04-20 | 中航海信光电技术有限公司 | Multi-path parallel optical assembly |
| CN205958803U (en) * | 2016-08-31 | 2017-02-15 | 中航海信光电技术有限公司 | Parallel optical component |
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2016
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Address after: 266100 Songling Road, Laoshan District, Qingdao, Shandong Province, No. 399 Patentee after: Qingdao Xinghang Photoelectric Technology Co.,Ltd. Address before: 266104 in the investment service center of Beizhai sub district office, beizhaike community, Laoshan District, Qingdao City, Shandong Province Patentee before: HISENSE & JONHON OPTICAL-ELECTRICAL TECHNOLOGIES Co.,Ltd. |