CN106123935A - Small-sized low temperature oven - Google Patents
Small-sized low temperature oven Download PDFInfo
- Publication number
- CN106123935A CN106123935A CN201610427620.2A CN201610427620A CN106123935A CN 106123935 A CN106123935 A CN 106123935A CN 201610427620 A CN201610427620 A CN 201610427620A CN 106123935 A CN106123935 A CN 106123935A
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- CN
- China
- Prior art keywords
- temperature
- cooling module
- low temperature
- small
- sized low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The present invention relates to a kind of small-sized low temperature oven, it is characterised in that include cooling module, this cooling module includes the temperature difference 90 of stacked on top of one another～the multi-lager semiconductor cooling piece of 110 DEG C；Using the fiber clamp that Heat Conduction Material is made, fibre clip platform is positioned over the top of cooling module；Power supply, for powering to cooling module；Temperature sensor, for gathering the temperature of fiber clamp；High precision temperature controller, receives the enforcement temperature data of temperature sensor, the temperature pre-set in conjunction with user, controls the power-on time of power supply, thus control the cooling temperature of cooling module.The present invention uses multi-lager semiconductor cooling piece to freeze, and while strengthening area of dissipation and heat radiation power, reduces greenhouse area, when identical refrigerating capacity, improves rate of temperature fall, add the temperature difference, make low temperature can reach less than 30 DEG C.
Description
Technical field
The present invention relates to a kind of Fibre Optical Sensor test in for carrying out the low temperature oven of low temperature environment simulation.
Background technology
The insulation of existing low temperature oven uses rock cotton board, and heating element heater resistance wire or siliconit etc., its temperature is all higher than ring
Border temperature, should belong to high temperature furnace and middle high temperature furnace strictly, and temperature can not be dropped in subzero by it, it is impossible to meets test optical fiber
The requirement of required subzero 30 degrees Celsius.The most existing temperature furnace volume is huge, it is impossible to be placed on optical table, for light
The real-time measurement of fine sensing.
Summary of the invention
It is an object of the invention to provide a kind of temperature stove that disclosure satisfy that optical fiber real-time testing needs.
In order to achieve the above object, the technical scheme is that and provide a kind of small-sized low temperature oven, it is characterised in that bag
Include:
Cooling module, this cooling module includes the multi-lager semiconductor cooling piece that maximum temperature difference is 102 DEG C of stacked on top of one another；
Using the fiber clamp that Heat Conduction Material is made, fibre clip platform is positioned over the top of cooling module；
Power supply, for powering to cooling module；
Temperature sensor, for gathering the temperature of fiber clamp；
High precision temperature controller, the enforcement temperature data of reception temperature sensor, the temperature pre-set in conjunction with user,
Control the power-on time of power supply, thus control the cooling temperature of cooling module.
Preferably, also include fixed plate of dispelling the heat, the one side of heat radiation fixed plate is formed with fixing groove, described cooling module
It is located in fixing groove, and the bottom surface of described cooling module contacts with described heat radiation fixed plate.
Preferably, also including thermal component, thermal component is located at the another side of described heat radiation fixed plate, and thermal component with
Described heat radiation fixed plate contacts.
Preferably, described fiber clamp uses aluminium alloy to make；Described thermal component is made of copper.
Preferably, the surface area of every layer of semiconductor chilling plate the most successively successively decreases.
Preferably, described semiconductor chilling plate be shaped as rectangle.
Preferably, fiber clamp includes that lower floor's folder platform and upper strata Jia Tai, lower floor Jia Tai are placed on described cooling module, upper
An optical fiber clip slot is radially had on layer folder platform.
Preferably, the diameter of described lower floor folder platform is more than the diameter of described upper strata folder platform.
The present invention uses multi-lager semiconductor cooling piece to freeze, and while strengthening area of dissipation and heat radiation power, subtracts
Little greenhouse area, when identical refrigerating capacity, improves rate of temperature fall, adds the temperature difference, make low temperature can reach less than-30 DEG C.
Accompanying drawing explanation
A kind of low temperature oven refrigerating part structure chart that Fig. 1 provides for the present invention.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is expanded on further.Should be understood that these embodiments are merely to illustrate the present invention
Rather than restriction the scope of the present invention.In addition, it is to be understood that after having read the content that the present invention lectures, people in the art
The present invention can be made various changes or modifications by member, and these equivalent form of values fall within the application appended claims equally and limited
Scope.
As it is shown in figure 1, the small-sized low temperature oven of one that the present invention provides uses semiconductor refrigerating technology, by the temperature difference 102 DEG C
Multi-lager semiconductor cooling piece 1 makees core coolant element.Every layer of semiconductor chilling plate 1 is rectangle, and its surface area is from the bottom to top
Successively successively decrease.Semiconductor refrigerating mainly deficiency is used to be that refrigerating capacity is little, it addition, after temperature reaches minus 20 degrees, cooling
Speed is slack-off.In order to overcome drawbacks described above, present invention employs the multi-lager semiconductor cooling piece 1 that the temperature difference is big, increase cooling model
While enclosing, decrease greenhouse volume, improve rate of temperature fall.
Fiber clamp is placed on the top of cooling module, uses for applicable test optical fiber, in the present embodiment, and fiber clamp
Use aluminium alloy fiber clamp 3, optical fiber can be fixed, also can be as the heat transfer element of refrigeration.Under aluminium alloy fiber clamp 3 includes
Layer folder platform and upper strata Jia Tai, the diameter of lower floor's folder platform is more than the diameter of upper strata folder platform.Lower floor Jia Tai is placed on cooling module, upper
An optical fiber clip slot 4 is radially had on layer folder platform.In the present embodiment, the degree of depth of optical fiber clip slot 4 is 0.25mm, and width is
1mm, the height of aluminium alloy fiber clamp 3 is 7mm.
One side in heat radiation fixed plate 2 is formed with rectangular channel, and cooling module is placed in this rectangular channel.In heat radiation fixed plate
2 another sides are fixed with heat radiation copper billet 5.
Cooling module uses outside 220V power supply to power, and is converted into 12V through internal electric source and powers.Use high-precision temperature
The temperature of aluminium alloy fiber clamp 3 monitored in real time by controller, and high precision temperature controller accepts the real time temperature of temperature sensor
Data, the temperature pre-set in conjunction with user, control the power-on time of power supply, thus control the cooling temperature of cooling module.
The adjustable temperature range of the present invention is room temperature extremely-30 DEG C, degree of regulation 1 DEG C, Overall Power Consumption about 60W.The present invention
Machine volume is little, low in energy consumption, can be placed directly within optical table, and be conveniently used for the Fibre Optical Sensors such as fiber grating monitors reality in real time
Test.
Claims (8)
1. a small-sized low temperature oven, it is characterised in that including:
Cooling module, this cooling module includes that the temperature difference of stacked on top of one another reaches the multi-lager semiconductor cooling piece of 102 DEG C；
Using the fiber clamp that Heat Conduction Material is made, fibre clip platform is positioned over the top of cooling module；
Power supply, for powering to cooling module；
Temperature sensor, for gathering the temperature of fiber clamp；
High precision temperature controller, receives the enforcement temperature data of temperature sensor, the temperature pre-set in conjunction with user, controls
The power-on time of power supply, thus control the cooling temperature of cooling module.
A kind of small-sized low temperature oven the most as claimed in claim 1, it is characterised in that also include fixed plate of dispelling the heat, fixing in heat radiation
Being formed with fixing groove in the one side of plate, described cooling module is located in fixing groove, and the bottom surface of described cooling module dissipates with described
Heat fixation plate contacts.
A kind of small-sized low temperature oven the most as claimed in claim 2, it is characterised in that also including thermal component, thermal component is located at
The another side of described heat radiation fixed plate, and thermal component contacts with described heat radiation fixed plate.
A kind of small-sized low temperature oven the most as claimed in claim 3, it is characterised in that described fiber clamp uses aluminium alloy to make；
Described thermal component is made of copper.
A kind of small-sized low temperature oven the most as claimed in claim 1, it is characterised in that the surface area of every layer of semiconductor chilling plate by under
Supreme successively successively decrease.
A kind of small-sized low temperature oven the most as claimed in claim 5, it is characterised in that described semiconductor chilling plate be shaped as square
Shape.
A kind of small-sized low temperature oven the most as claimed in claim 1, it is characterised in that fiber clamp includes lower floor's folder platform and upper strata folder
Platform, lower floor Jia Tai is placed on described cooling module, radially has an optical fiber clip slot on the folder platform of upper strata.
A kind of small-sized low temperature oven the most as claimed in claim 7, it is characterised in that the diameter of described lower floor folder platform is more than on described
The diameter of layer folder platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610427620.2A CN106123935A (en) | 2016-06-16 | 2016-06-16 | Small-sized low temperature oven |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610427620.2A CN106123935A (en) | 2016-06-16 | 2016-06-16 | Small-sized low temperature oven |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106123935A true CN106123935A (en) | 2016-11-16 |
Family
ID=57469559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610427620.2A Pending CN106123935A (en) | 2016-06-16 | 2016-06-16 | Small-sized low temperature oven |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106123935A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050249509A1 (en) * | 2004-04-15 | 2005-11-10 | Infinera Corporation | Coolerless photonic integrated circuits (PICs) for WDM transmission networks and PICs operable with a floating signal channel grid changing with temperature but with fixed channel spacing in the floating grid |
| CN101285722A (en) * | 2008-05-26 | 2008-10-15 | 浙江大学 | Optical fiber sensor temperature performance test device |
| CN101800607A (en) * | 2010-01-12 | 2010-08-11 | 浙江大学 | High-order dynamic adjustable dispersion compensation equipment and dispersion compensation method thereof |
| CN102185246A (en) * | 2011-03-29 | 2011-09-14 | 华南理工大学 | Single-frequency optical fiber laser resonant cavity |
| CN102331800A (en) * | 2011-05-18 | 2012-01-25 | 东南大学 | Multi-heat-source temperature touch representing device |
| CN102927716A (en) * | 2012-11-01 | 2013-02-13 | 西北大学 | Automatic temperature control ultralow temperature semiconductor refrigerator and automatic temperature control method thereof |
| CN203350486U (en) * | 2013-06-28 | 2013-12-18 | 安徽量子通信技术有限公司 | Convenient-dismounting-and-mounting sealed refrigeration box and fiber through-hole sealing connector |
| CN204680893U (en) * | 2015-06-08 | 2015-09-30 | 武汉新烽光电科技有限公司 | The coaxial laser that a kind of band by built-in thermistor freezes |
-
2016
- 2016-06-16 CN CN201610427620.2A patent/CN106123935A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050249509A1 (en) * | 2004-04-15 | 2005-11-10 | Infinera Corporation | Coolerless photonic integrated circuits (PICs) for WDM transmission networks and PICs operable with a floating signal channel grid changing with temperature but with fixed channel spacing in the floating grid |
| CN101285722A (en) * | 2008-05-26 | 2008-10-15 | 浙江大学 | Optical fiber sensor temperature performance test device |
| CN101800607A (en) * | 2010-01-12 | 2010-08-11 | 浙江大学 | High-order dynamic adjustable dispersion compensation equipment and dispersion compensation method thereof |
| CN102185246A (en) * | 2011-03-29 | 2011-09-14 | 华南理工大学 | Single-frequency optical fiber laser resonant cavity |
| CN102331800A (en) * | 2011-05-18 | 2012-01-25 | 东南大学 | Multi-heat-source temperature touch representing device |
| CN102927716A (en) * | 2012-11-01 | 2013-02-13 | 西北大学 | Automatic temperature control ultralow temperature semiconductor refrigerator and automatic temperature control method thereof |
| CN203350486U (en) * | 2013-06-28 | 2013-12-18 | 安徽量子通信技术有限公司 | Convenient-dismounting-and-mounting sealed refrigeration box and fiber through-hole sealing connector |
| CN204680893U (en) * | 2015-06-08 | 2015-09-30 | 武汉新烽光电科技有限公司 | The coaxial laser that a kind of band by built-in thermistor freezes |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161116 |
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| RJ01 | Rejection of invention patent application after publication |