CN106119755A - A kind of antioxidation tin plating electrolyte based on indium gallium phosphorus - Google Patents

A kind of antioxidation tin plating electrolyte based on indium gallium phosphorus Download PDF

Info

Publication number
CN106119755A
CN106119755A CN201610789854.1A CN201610789854A CN106119755A CN 106119755 A CN106119755 A CN 106119755A CN 201610789854 A CN201610789854 A CN 201610789854A CN 106119755 A CN106119755 A CN 106119755A
Authority
CN
China
Prior art keywords
tin plating
phosphorus
plating electrolyte
indium
gallium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610789854.1A
Other languages
Chinese (zh)
Other versions
CN106119755B (en
Inventor
张辉
陈庆谊
年有权
孟瑜
李少萌
成佳佳
刘艳洁
孔伊莎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xi'an Tai Lisong New Material Co Ltd By Shares
Original Assignee
Xi'an Tai Lisong New Material Co Ltd By Shares
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xi'an Tai Lisong New Material Co Ltd By Shares filed Critical Xi'an Tai Lisong New Material Co Ltd By Shares
Priority to CN201610789854.1A priority Critical patent/CN106119755B/en
Publication of CN106119755A publication Critical patent/CN106119755A/en
Application granted granted Critical
Publication of CN106119755B publication Critical patent/CN106119755B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08Tin or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

The invention belongs to metal oxidation resistance resist technology field, specifically disclose a kind of antioxidation tin plating electrolyte, comprise following component: indium, gallium, phosphorus, stannum.Wherein, on the basis of the weight of described stannum, the percentage by weight of described indium is 0.005% 0.04%, and the percentage by weight of described gallium is 0.005% 0.06%, and the percentage by weight of described phosphorus is 0.01% 0.05%.The present invention adds indium, gallium, phosphorus in tin liquor, can effectively suppress the oxidation of tin plating electrolyte, reduces the generation of scruff, has significant effect for improving stannum product lumber recovery, raising hot tinning production rate etc.;The wettability of tin plating electrolyte is slightly promoted simultaneously, the fusing point of tin-plated product is slightly reduced, and do not affect other physical and mechanical properties of tin-plated product;The antioxidation tin plating electrolyte low cost of the present invention, does not change existing production technology, does not affect existing equipment regular maintenance and maintenance, meet environmental requirement, do not affect the working environment of Workplace.

Description

A kind of antioxidation tin plating electrolyte based on indium gallium phosphorus
Technical field
The present invention relates to metal oxidation resistance resist technology field, be specifically related to a kind of antioxidation based on indium gallium phosphorus tin plating Liquid, is mainly used in photovoltaic welding belt.
Background technology
Along with the fast development of electron trade, fusing point is low, good corrosion resistance is combined with metallic matrix because having for kamash alloy Property the advantage such as good, be widely used in the field such as photovoltaic welding belt, Electronic Packaging.But, the liquid tin alloy pole under molten condition Oxidizable formation scruff, block tin, wherein contain a large amount of unoxidized stannum, cause raw material to utilize insufficient, produces waste, increases Production cost, also can affect the quality of product.Additionally, in the production process of photovoltaic welding belt, in stannum stove, the oxidation of ashbury metal is also Aberration can be produced on welding surface, affect outward appearance, and easily form black speck during the transport and storage in later stage, cause producing Product are scrapped.In order to ensure the reliability of welding, need to improve the antioxygenic property of kamash alloy.
The oxidation measure solving melt stannum at present mainly has melt cladding process, protective atmosphere method and melt modification method.Melt Coverture in cladding process easily remains, and readily volatilized, the carbonization of being heated, smolders, pollutes environment, additionally, general coverture For inorganic salts, easily production equipment is caused heavy corrosion, affect the production order.Atmosphere protection method processing equipment is huge, raw Product cost is high.Melt modification rule only need to be on the premise of ensureing scolding tin self wettability, brazing property, by adding alloy Element is to stannum melt modification, to improve its antioxygenic property, has that production operation is simple, input cost is low, not by external environment The advantages such as impact.
But existing antioxidant is relatively costly on market, specific aim is relatively strong, and antioxidative effect is not satisfactory, and main Will can bring the problem such as devil liquor recovery, environmental pollution based on organic solvent, the method added by inorganic elements improves stannum The antioxygenic property of melt seldom has actually used case.
Summary of the invention
For problems of the prior art, it is an object of the invention to provide the base that a kind of low cost, the suitability are strong In the antioxidation tin plating electrolyte of indium gallium phosphorus, its antioxygenic property is high, is effectively reduced the generation amount of scruff/block tin, improves the profit of stannum By rate, it is mainly used in photovoltaic welding belt.
In order to achieve the above object, the present invention is achieved by the following technical solutions.
A kind of antioxidation tin plating electrolyte based on indium gallium phosphorus, it is characterised in that comprise following component: indium, gallium, phosphorus, stannum.
Preferably, on the basis of the weight of described stannum, the percentage by weight of described indium is 0.005%-0.04%, described gallium Percentage by weight be 0.005%-0.06%, the percentage by weight of described phosphorus is 0.01%-0.05%.
Preferably, the percentage by weight of described indium is 0.01%-0.04%.
Preferably, the percentage by weight of described gallium is 0.01%-0.06%.
Preferably, the percentage by weight of described phosphorus is 0.02%-0.04%.
Owing to the industrial temperature of tin liquor is relatively low, when adding anti-oxidizing elements indium, gallium, phosphorus, these elements all can not be quick Melt, and can not merge uniformly with tin liquor, accordingly, it would be desirable to be configured to the kamash alloy of certain content.
Preferably, described indium is tin plating with the form described antioxidation based on indium gallium phosphorus of fusing preparation of indium-stannum intermediate alloy Liquid.
Preferably, described gallium is tin plating with the form described antioxidation based on indium gallium phosphorus of fusing preparation of gallium-stannum intermediate alloy Liquid.
Preferably, described phosphorus is tin plating with the form described antioxidation based on indium gallium phosphorus of fusing preparation of phosphorus-stannum intermediate alloy Liquid.
Preferably, in described indium-stannum intermediate alloy, the content of indium is the 5% of described indium-stannum intermediate alloy quality.
Preferably, in described gallium-stannum intermediate alloy, the content of gallium is the 5% of described gallium-stannum intermediate alloy quality.
Preferably, in described phosphorus-stannum intermediate alloy, the content of phosphorus is the 5% of described phosphorus-stannum intermediate alloy quality.
Compared with prior art, the invention have the benefit that
The present invention adds indium, gallium, phosphorus in tin liquor, can effectively suppress the oxidation of tin plating electrolyte, reduces the generation of scruff, for Improve stannum product lumber recovery, raising hot tinning production rate etc. and also there is significant effect;Wettability to tin plating electrolyte simultaneously Slightly promote, the fusing point of tin-plated product is slightly reduced, and do not affect other physical and mechanical properties of tin-plated product;The present invention Antioxidation tin plating electrolyte low cost, do not change existing production technology, do not affect existing equipment regular maintenance and maintenance;Meet ring Guaranteed request, does not affect the working environment of Workplace.
Detailed description of the invention
Below in conjunction with embodiment, embodiment of the present invention are described in detail, but those skilled in the art will It will be appreciated that the following example is merely to illustrate the present invention, and it is not construed as limiting the scope of the present invention.
The invention provides a kind of antioxidation tin plating electrolyte, comprise following component: indium, gallium, phosphorus, stannum.Wherein, with the weight of stannum On the basis of, the percentage by weight of indium is 0.005%-0.04%, and the percentage by weight of gallium is 0.005%-0.06%, the weight of phosphorus Percentage ratio is 0.01%-0.05%.
Embodiment 1
Take 100g tin plating electrolyte two parts, be designated as 1#, 2# respectively, under conditions of temperature 230 DEG C, add in 1# tin plating electrolyte simultaneously Enter indium, gallium, phosphorus;Wherein, on the basis of tin plating electrolyte weight, the indium that added, gallium, the percentage by weight of phosphorus be respectively 0.01%, 0.06%, 0.02%, indium adds with the form of indium-stannum intermediate alloy, and indium content is described indium-stannum intermediate alloy quality 5%;Gallium adds with the form of gallium-stannum intermediate alloy, and 5% that gallium content is described gallium-stannum intermediate alloy quality;Phosphorus with phosphorus- The form of stannum intermediate alloy adds, and 5% that phosphorus content is described phosphorus-stannum intermediate alloy quality.
2# tin plating electrolyte is blank group, and 1#, 2# tin plating electrolyte aoxidizes 5 hours respectively, and (oxidizing condition is: room temperature is heated to 230 DEG C, constant temperature after 5 hours air cooling to room temperature) after, test the weight of 1#, 2# tin plating electrolyte respectively, and the weightening finish before and after being aoxidized Amount, characterizes its antioxygenic property with gain in weight, and result of the test is as shown in table 1, as shown in Table 1, add in tin plating electrolyte indium, Gallium, phosphorus, can be obviously improved the antioxygenic property of tin liquor.
Table 1
Tin plating electrolyte is numbered 1# 2#
Gain in weight (g) after oxidation 0.170 0.350
Sprawl relative area (%) 118 100
Yield strength (MPa) 66 65
Tensile strength (MPa) 206 190
Fusing point (DEG C) 181 183
Above-mentioned 1# and 2# tin plating electrolyte is detected in copper wettability of the surface, with tin plating electrolyte the paving of anaerobic red copper surface Developable surface amasss and characterizes, and method of testing is: the red copper sheet sand papering of annealing is gone removing oxide layer, and cleans with ethanol, take 10g tin plating electrolyte is placed on red copper sheet, covers with Colophonium or other scaling powders, is warming up to 230 DEG C, takes out, treat cold after insulation 60s But measuring spreading area (use camera to take pictures, and utilize Imge-Pro plus computed in software area) to room temperature, 1# and 2# plates The wettability test of tin liquor respectively does 3 groups, and spreading area takes its meansigma methods, with the wetting areas of 2# blank group is The moistening relative area of 100% conversion 1# tin plating electrolyte, result of the test is shown in Table 1.As shown in Table 1, the wettability of 1# tin plating electrolyte with The wettability of blank group tin plating electrolyte has been compared and has been promoted by a small margin, it is seen that after adding indium, gallium, phosphorus in tin liquor simultaneously, indium, Gallium, phosphorus can work in coordination with generation effect, improve the wettability of tin plating electrolyte.
Testing the fusing point of above-mentioned 1# and 2# tin plating electrolyte test specimen, fusing point uses differential scanning calorimeter (DSC) to carry out Test, test result is shown in Table 1.As shown in Table 1, tin liquor is added indium, gallium, phosphorus simultaneously, the fusing point of tin plating electrolyte test specimen is slightly dropped Low.
Yield strength and tensile strength to above-mentioned 1# and 2# tin plating electrolyte test specimen are tested, and method of testing is routine side Method, test result is shown in Table 1.As shown in Table 1, after tin liquor adds indium, gallium, phosphorus simultaneously, to the yield strength of tin plating electrolyte test specimen and Tensile strength does not the most produce impact.
Comparative example 1
Take 100g tin plating electrolyte five parts, numbered 1#, 2#, 3#, 4#, and under conditions of temperature 230 DEG C, in 1# tin plating electrolyte Add the indium of tin plating electrolyte weight 0.01%, in 2# tin plating electrolyte, add the gallium of tin plating electrolyte weight 0.06%, add in 3# tin plating electrolyte Enter the phosphorus of tin plating electrolyte weight 0.02%, without any element in 4# tin plating electrolyte, as blank group, aoxidize (oxidation in 5 hours Condition is: be heated to 230 DEG C, is incubated 5h, and air cooling is to room temperature) after test the weight of 1#, 2#, 3#, 4# tin plating electrolyte respectively, with each group Rate of body weight gain before and after tin plating electrolyte oxidation characterizes its antioxygenic property, and result of the test is as shown in table 2.
Above-mentioned 1#, 2#, 3#, 4# tin plating electrolyte is detected in copper wettability of the surface, with tin plating electrolyte at anaerobic red copper table The spreading area in face characterizes, and method of testing is with embodiment 1, and test result is shown in Table 2.To above-mentioned 1#, 2#, 3#, 4# tin plating electrolyte Test specimen fusing point, yield strength and tensile strength are tested, and method of testing is with embodiment 1, and test result is shown in Table 2.
Table 2
Tin plating electrolyte is numbered 1# 2# 3# 4#
Gain in weight (g) after oxidation 0.235 0.221 0.272 0.244
Sprawl relative area (%) 111 93 102 100
Yield strength (MPa) 65 65 65 65
Tensile strength (MPa) 190 190 190 190
As shown in Table 2, tin plating electrolyte adds indium or gallium or phosphorus, all antioxygenic property to tin plating electrolyte have carrying by a small margin Rise.The oxidation test result of comparative example 1 understands, the antioxygenic property of the antioxidation tin plating electrolyte based on indium gallium phosphorus of the application It is substantially better than and is individually added into the antioxygenic property of tin plating electrolyte after indium, gallium, phosphorus.
As shown in Table 2, the wettability of tin plating electrolyte is slightly reduced by the membership that adds of gallium, the addition of the indium wettability to tin plating electrolyte Slightly promote, and the addition of phosphorus on tin plating electrolyte wettability almost without impact.Can with the wettability test Comparative result of embodiment 1 Know, be simultaneously introduced in tin plating electrolyte indium, gallium, phosphorus kamash alloy than the wettability of kamash alloy being individually added into indium, gallium, phosphorus Excellence, this explanation indium, gallium, three kinds of kamash alloys of phosphorus produce synergism in tin plating electrolyte, and it is with the use of the profit to tin plating electrolyte Wet performance promotes has good effect.
Meanwhile, from Table 2, it can be seen that tin plating electrolyte adds indium, gallium, phosphorus, all fusing point and the physical force to tin plating test specimen Learn performance no impact.But compare with embodiment 1, it is found that in tin plating electrolyte, be simultaneously introduced the tinbase conjunction of indium, gallium, phosphorus Gold can obviously reduce the fusing point of tin plating test specimen, but does not affect yield strength and the tensile strength of tin plating test specimen, and this is for by this Shen The application on photovoltaic welding belt of the antioxidation tin plating electrolyte based on indium gallium phosphorus please is significant.
Embodiment 2
The present embodiment, as a example by industry tin-coated copper production line, fills the stannum melt of 80kg in the stannum stove of tin-coated copper production line, Temperature is 225-240 DEG C, when stirring starts, adds 5% indium-stannum intermediate alloy in the stannum stove filling 80kg stannum melt 0.16kg-0.64kg, 5% gallium-stannum intermediate alloy 0.16kg-0.96kg, 5% phosphorus-stannum intermediate alloy 0.32kg-0.64kg, i.e. Obtain antioxidation tin plating electrolyte;Then with 80-120m/min speed, anaerobic copper belt is carried out hot tinning.
Comparative example 2
The present embodiment, as a example by industry tin-coated copper production line, fills the stannum melt of 80kg in the stannum stove of tin-coated copper production line, Temperature is 225-240 DEG C, directly to anaerobic copper belt, stannum melt is carried out hot tinning with 80-120m/min speed.This production line Within four months, the accumulative scruff that produces of all-in-one amounts to 2891kg, scruff accounting rate about 0.63%, and semiautomatic loading mechanism is accumulative produces block tin altogether Meter 13902kg, block tin accounting rate 17.99%.
Embodiment 2 is compared with this comparative example 2, and scruff accounting rate maximum can drop to about 0.3%, and block tin accounting rate is About 12% can be dropped to greatly, substantially increase the utilization rate of stannum and improve the lumber recovery of tinned wird, decreasing life simultaneously " dragging for slag " operation during product, improves productivity ratio.
The sample of embodiment 2 and comparative example 2 is carried out salt spray test, and the condition of salt spray test is as follows: temperature 35 DEG C, humidity More than 90%, concentration is the NaCl solution of 10%, and test period is 48 hours.The corrosion condition of each test specimen after observation accelerated corrosion Understanding, the test specimen of comparative example, under salt mist environment, occurs oxidation black speck successively, and the test specimen of embodiment 2 is little 72 after 48 hours A small amount of stain only occurred time after.
To sum up, in the present invention, adding indium, gallium, three kinds of elements of phosphorus in tin liquor, these three element can be at tin liquor Surface Creation The oxide-film of a kind of densification, hinders oxygen atom to tin liquor diffusion inside, prevents the continuation of tin liquor from aoxidizing, thus be effectively improved tin plating The antioxygenic property of liquid, slightly promotes the wettability of tin plating electrolyte meanwhile, decreases the fusing point of tin-plated product, and not Affect other physical and mechanical properties of tin-plated product.
Although, in this specification, the present invention is described in detail the most with a general description of the specific embodiments, But on the basis of the present invention, can make some modifications or improvements it, this will be apparent to those skilled in the art. Therefore, these modifications or improvements without departing from theon the basis of the spirit of the present invention, belong to claimed model Enclose.

Claims (8)

1. an antioxidation tin plating electrolyte based on indium gallium phosphorus, it is characterised in that comprise following component: indium, gallium, phosphorus, stannum.
Antioxidation tin plating electrolyte based on indium gallium phosphorus the most according to claim 1, it is characterised in that be with the weight of described stannum Benchmark, the percentage by weight of described indium is 0.005%-0.04%, and the percentage by weight of described gallium is 0.005%-0.06%, institute The percentage by weight stating phosphorus is 0.01%-0.05%.
Antioxidation tin plating electrolyte based on indium gallium phosphorus the most according to claim 2, it is characterised in that the weight percent of described indium Ratio is 0.01%-0.04%.
Antioxidation tin plating electrolyte based on indium gallium phosphorus the most according to claim 2, it is characterised in that the weight percent of described gallium Ratio is 0.01%-0.06%.
Antioxidation tin plating electrolyte based on indium gallium phosphorus the most according to claim 2, it is characterised in that the weight percent of described phosphorus Ratio is 0.02%-0.04%.
Antioxidation tin plating electrolyte based on indium gallium phosphorus the most according to claim 1, it is characterised in that described indium is with in indium-stannum Between the form fusing described antioxidation tin plating electrolyte based on indium gallium phosphorus of preparation of alloy.
Antioxidation tin plating electrolyte based on indium gallium phosphorus the most according to claim 1, it is characterised in that described gallium is with in gallium-stannum Between the form fusing described antioxidation tin plating electrolyte based on indium gallium phosphorus of preparation of alloy.
Antioxidation tin plating electrolyte based on indium gallium phosphorus the most according to claim 1, it is characterised in that described phosphorus is with in phosphorus-stannum Between the form fusing described antioxidation tin plating electrolyte based on indium gallium phosphorus of preparation of alloy.
CN201610789854.1A 2016-08-31 2016-08-31 A kind of anti-oxidant tin plating electrolyte based on indium gallium phosphorus Active CN106119755B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610789854.1A CN106119755B (en) 2016-08-31 2016-08-31 A kind of anti-oxidant tin plating electrolyte based on indium gallium phosphorus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610789854.1A CN106119755B (en) 2016-08-31 2016-08-31 A kind of anti-oxidant tin plating electrolyte based on indium gallium phosphorus

Publications (2)

Publication Number Publication Date
CN106119755A true CN106119755A (en) 2016-11-16
CN106119755B CN106119755B (en) 2019-05-17

Family

ID=57273493

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610789854.1A Active CN106119755B (en) 2016-08-31 2016-08-31 A kind of anti-oxidant tin plating electrolyte based on indium gallium phosphorus

Country Status (1)

Country Link
CN (1) CN106119755B (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1947920A (en) * 2006-11-23 2007-04-18 太仓市南仓金属材料有限公司 Lead-free anti-oxidation alloy of lead-free soldering flux, prepn. method and use thereof
CN1995422A (en) * 2006-01-06 2007-07-11 罗应飞 Environment-friendly type high temperature oxidation-resistance stannum alloy

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1995422A (en) * 2006-01-06 2007-07-11 罗应飞 Environment-friendly type high temperature oxidation-resistance stannum alloy
CN1947920A (en) * 2006-11-23 2007-04-18 太仓市南仓金属材料有限公司 Lead-free anti-oxidation alloy of lead-free soldering flux, prepn. method and use thereof

Also Published As

Publication number Publication date
CN106119755B (en) 2019-05-17

Similar Documents

Publication Publication Date Title
CN103221581B (en) The manufacture method of the hot press parts of hot pressing steel plate and use hot pressing steel plate
CN102121088B (en) Formula of flux for hot tinning of copper wire and preparation method thereof
CN110273121B (en) Zinc-aluminum-magnesium coated steel strip and preparation method thereof
CN103160765B (en) A kind of transmission line of electricity steel beam column hot dip galvanized zinc alloy coating and preparation technology thereof
CN108018591A (en) A kind of aluminium and aluminium alloy anode oxide film are without nickel free-floride sealer
WO2015129282A1 (en) Galvanized steel sheet and method for manufacturing the same
CN101935815A (en) Transmission line fastening piece alloy coating and preparation process thereof
CN105369173A (en) Compound plating aid for hot-dip tinning of copper alloy and preparation method of compound plating aid
CN105970138A (en) Long-lasting corrosion prevention method of transmission line tower
Wang et al. Electrodeposited chromate-free organic passive film on the rolled copper foil
CN103000761A (en) Manufacture method of tinned copper tape for solar cells
CN113263052B (en) Magnesium-aluminum alloy composite material and preparation process thereof
JP2008223084A (en) Al PLATED STEEL SHEET FOR HOT PRESSING
CN106119755A (en) A kind of antioxidation tin plating electrolyte based on indium gallium phosphorus
CN105907208A (en) Water-based metal anticorrosion thermal insulation compound paint and preparation method thereof
CN107803633A (en) A kind of electrode composite plate and manufacture method
CN104087727A (en) Spray quenching medium
CN106282880A (en) A kind of antioxidation tin plating electrolyte based on yttrium bismuth phosphorus
CN108441796A (en) A kind of galvanizing almag steel plate and its production technology
CN104439752A (en) Zinc-based soft solder suitable for hot-drip galvanizing repair
CN114107971A (en) Polyaniline type normal-temperature blackening agent and preparation method and application thereof
CN113502444A (en) High-efficiency, leak-proof and high-aluminum-resistant additive for plating assistant solution for hot galvanizing and preparation method thereof
CN102417745A (en) Corrosion-resistant coating and preparation method and application method thereof
CN108505025B (en) Manganese phosphating solution and application thereof
CN102399457A (en) Corrosion-resistant coating and preparation method and using method thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant