CN102121088B - Formula of flux for hot tinning of copper wire and preparation method thereof - Google Patents
Formula of flux for hot tinning of copper wire and preparation method thereof Download PDFInfo
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- CN102121088B CN102121088B CN2011100435601A CN201110043560A CN102121088B CN 102121088 B CN102121088 B CN 102121088B CN 2011100435601 A CN2011100435601 A CN 2011100435601A CN 201110043560 A CN201110043560 A CN 201110043560A CN 102121088 B CN102121088 B CN 102121088B
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- deionized water
- copper wire
- whole dissolvings
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Abstract
The invention relates to a formula of a flux for hot tinning of a copper wire and a preparation method thereof. The formula is used for tight tinning on the surface of the hot tinned copper wire and characterized by comprising the following components in percentage by mass: 0.5 to 1.5 percent of ammonium chloride, 2.0 to 5.0 percent of zinc chloride, 0.2 to 5.0 percent of triethanolamine, 0.1 to 2.0 percent of OP-10 emulsifying agent, 5.0 to 7.0 percent of hydrochloric acid and the balance of deionized water. Through the flux, the tinned copper wire has uniform coating, tight structure and excellent performance, and environmental pollution and resource waste are not caused.
Description
Technical field
The invention belongs to hot tinning Technology field, relate to a kind of formulations of solder flux and compound method thereof of copper wire with hot-dipped tin technology.
Background technology
The lead-in wire of products such as electronic circuit board, diode, microelectronics wire needs good welding property and antioxidant property, the hot tinning copper cash that adopt in industry more.Since common copper cash exposed with the air ingress of air in contain a large amount of oxygen molecules, copper and oxygen molecule react and are easy to cause at short notice copper corrosion.Plate one deck tin on the copper surface and can make it can rapid welding on electronic circuit board, and can prevent the copper cash oxidation, so WTC be used very extensive in electron trade.When copper wire tin-plating, must use soldering flux to play auxiliary welding effect.
The hot tinning arts demand uses soldering flux to improve welding quality, and the effect of soldering flux is to be main with chemistry with physical reaction, plays quick zinc-plated effect in second at 1-2.The corresponding chemical thing must and can generate the compound that is dissolved in soldering flux with the burning film reaction in the soldering flux, and anti-simultaneously oxidation, the surface tension that reduces, raising tin liquor surfactant property, increase scolding tin are for the matrix surface lubricity.
Have in the prior art to use and contain the method that slicker solder carries out copper wire tin-plating; Use contains slicker solder tin furnace temperature about 255 ℃ of needs only when zinc-plated; Plumbous existence makes that the low oxide on surface of tin liquor fusing point is few; But RoHS environmental protection system has strict restriction for the content of heavy metals such as lead, does not allow in scolding tin, to add any leaded heavy metal and environmentally harmful pollution class material of waiting.Present most producer uses no slicker solder to carry out copper wire tin-plating.
Many common soldering fluxs can both be suitable for no slicker solder and carry out copper wire tin-plating; But zinc-plated poor effect; Can not reach scolding tin gloss, rounding, tightness height fully; Its finished surface has pit, stain, dew copper, the coarse untight defective of crystallization, be prone to produce more not full bad of point, soldering-tin layer of drawing, and tin liquor oxide on surface, oxidation sludge, white and black greasy dirt phenomenon are all many in the scolding tin process.The zinc-plated back of the common soldering flux finished product quality guaranteed period is short, is prone to oxidation, jaundice, variable color, obfuscation, and does not reach predetermined effect during, superfine wire fine to producing, and tin liquor flowability and surfactant property are not good, occur phenomenons such as stifled mould, broken string easily.Using " Hydrazine Hydrate 80 " and materials such as " hydrazines "; As reducing atmosphere in the hot tinning and protective atmosphere; But " Hydrazine Hydrate 80 " itself has carinogenicity, and when formulation operations, all need carry out the pickling reaction with hydrochloric acid, and many common soldering fluxs all add this type chemical reagent; Environment there is pollution, can not satisfies the requirement of RoHS environmental protection system.
Summary of the invention
The object of the invention is to provide a kind of copper wire with hot-dipped tin to use formulations of solder flux exactly; It is not enough to be used to overcome above-mentioned existing soldering flux; Provide that a kind of chemically reactive is excellent, the good soldering flux of oilness surfactivity, can reduce the tin liquor temperature of fusion, control reduces the tin liquor oxide on surface and increases phenomenon.This hot tinning soldering flux can make benefit and the ratio defective product of process for plating copper wire with tin and product performance improve greatly, and prepares easy, simple to operate, easy to use, stay in grade, meets in the world the requirement to RoHS environmental protection system.
The object of the invention can be realized through following technical scheme:
Soldering flux comprises ammonium chloride, zinc chloride, trolamine, OP-10 emulsifying agent and hydrochloric acid; Each moity accounts for the total mass percentage content of soldering flux: ammonium chloride 0.5 ~ 1.5%; Zinc chloride 2.0 ~ 5.0%, trolamine 0.2 ~ 5.0%, OP-10 emulsifying agent 0.1 ~ 2.0%; Hydrochloric acid 5.0 ~ 7.0%, surplus are deionized water.
Another object of the present invention provides the compound method of above-mentioned soldering flux, and said hot tinning may further comprise the steps with the soldering flux compound method:
a
.By mass percentage the example 79.5
~92.2% prepares deionized water;
b
.Example is added 0.5 ~ 1.5% ammonium chloride by mass percentage in above-mentioned deionized water, fully stirs up to whole dissolvings;
C. the zinc chloride of example interpolation by mass percentage 2.0 ~ 5.0% in the solution that back obtains fully stirs up to whole dissolvings;
D. go on foot 0.2 ~ 5.0% trolamine of example interpolation by mass percentage in the solution that obtains last one, fully stir up to whole dissolvings;
E. go on foot the 0.1 ~ 2.0%OP-10 of example interpolation by mass percentage emulsifying agent in the solution that obtains last one, fully stir up to whole dissolvings;
f
.Go on foot 5.0 ~ 7.0% hydrochloric acid of example interpolation by mass percentage in the solution that obtains last one
,Stir.
Embodiment:
1-4 is described further the present invention below in conjunction with specific embodiment.
Embodiment 1
The composition mass percent
Ammonium chloride 1.5%
Zinc chloride 5.0%
Trolamine 5.0%
OP-10 emulsifying agent 2.0%
Hydrochloric acid 7.0%
Surplus is a deionized water.
Above-mentioned hot tinning may further comprise the steps with the soldering flux preparation:
a
.Example 79.5% is prepared deionized water by mass percentage;
b
.Example is added 1.5% ammonium chloride by mass percentage in deionized water, fully stirs up to whole dissolvings;
C. the zinc chloride of example interpolation by mass percentage 5.0% in the solution that back obtains fully stirs up to whole dissolvings;
D. go on foot 5.0% trolamine of example interpolation by mass percentage in the solution that obtains last one, fully stir up to whole dissolvings;
E. go on foot the 2.0%OP-10 of example interpolation by mass percentage emulsifying agent in the solution that obtains last one, fully stir up to whole dissolvings;
f
.Go on foot 7.0% hydrochloric acid of example interpolation by mass percentage in the solution that obtains last one
,Stir.
Embodiment 2
The composition mass percent
Ammonium chloride 0.5 %
Zinc chloride 2.0%
Trolamine 0.2%
OP-10 emulsifying agent 0.1 %
Hydrochloric acid 5. 0 %
Surplus is a deionized water.
Above-mentioned hot tinning may further comprise the steps with the soldering flux preparation:
a
.Example 92.2% is prepared deionized water by mass percentage;
b
.Example is added 0.5% ammonium chloride by mass percentage in deionized water, fully stirs up to whole dissolvings;
C. the zinc chloride of example interpolation by mass percentage 2.0% in the solution that back obtains fully stirs up to whole dissolvings;
D. go on foot 0.2% trolamine of example interpolation by mass percentage in the solution that obtains last one, fully stir up to whole dissolvings;
E. go on foot the 0.1%OP-10 of example interpolation by mass percentage emulsifying agent in the solution that obtains last one, fully stir up to whole dissolvings;
f
.Go on foot 5.0% hydrochloric acid of example interpolation by mass percentage in the solution that obtains last one
,Stir.
Embodiment 3
The composition mass percent
Ammonium chloride 1.0 %
Zinc chloride 3.0%
Trolamine 0.5%
OP-10 emulsifying agent 0.5 %
Hydrochloric acid 5.0 %
Surplus is a deionized water.
Above-mentioned hot tinning may further comprise the steps with the soldering flux preparation:
a
.Example 90.0% is prepared deionized water by mass percentage;
b
.Example is added 1.0% ammonium chloride by mass percentage in deionized water, fully stirs up to whole dissolvings;
C. the zinc chloride of example interpolation by mass percentage 3.0% in the solution that back obtains fully stirs up to whole dissolvings;
D. go on foot 0.5% trolamine of example interpolation by mass percentage in the solution that obtains last one, fully stir up to whole dissolvings;
E. go on foot the 0.5%OP-10 of example interpolation by mass percentage emulsifying agent in the solution that obtains last one, fully stir up to whole dissolvings;
f
.Go on foot 5.0% hydrochloric acid of example interpolation by mass percentage in the solution that obtains last one
,Stir.
Embodiment 4
The composition mass percent
Ammonium chloride 1.0 %
Zinc chloride 4.0%
Trolamine 2.5%
OP-10 emulsifying agent 1.5 %
Hydrochloric acid 6.0 %
Surplus is a deionized water.
Above-mentioned hot tinning may further comprise the steps with the soldering flux preparation:
a
.Example 85.0% is prepared deionized water by mass percentage;
b
.Example is added 1.0% ammonium chloride by mass percentage in deionized water, fully stirs up to whole dissolvings;
C. the zinc chloride of example interpolation by mass percentage 4.0% in the solution that back obtains fully stirs up to whole dissolvings;
D. go on foot 2.5% trolamine of example interpolation by mass percentage in the solution that obtains last one, fully stir up to whole dissolvings;
E. go on foot the 1.5%OP-10 of example interpolation by mass percentage emulsifying agent in the solution that obtains last one, fully stir up to whole dissolvings;
f
.Go on foot 6.0% hydrochloric acid of example interpolation by mass percentage in the solution that obtains last one
,Stir.
Compared with prior art, formula solution acid-basicity balance of the present invention is more stable, and the atmosphere of its decomposition can play effective provide protection to copper cash and solder surface when high-temperature soldering; Prevent copper line surface oxidation corrosion; After matching with tin, cupric ion complex compound simultaneously, remove copper line surface sull ability and strengthen, the chemically reactive activation rate is than higher; Make and help wlding material oxide compound complexing action to reach best; The compound that forms all can fully volatilize under welding temperature, and volatile matter can not cause noxious air, can not cause the change of composition to the soldering tin material before zinc-plated; In addition, the present invention fills a prescription has increased tensio-active agent, can reduce the surface tension of tin liquor when zinc-plated, reduces resistance, increases active.This soldering flux can fully satisfy each item technical requirements of unleaded hot tinning.
Claims (2)
1. a copper wire with hot-dipped tin is used formulations of solder flux; Comprise deionized water, ammonium chloride, zinc chloride, trolamine, OP-10 emulsifying agent and hydrochloric acid, it is characterized in that: each moity accounts for the total mass percentage content of soldering flux and is: ammonium chloride 0.5 ~ 1.5%, zinc chloride 2.0 ~ 5.0%; Trolamine 0.2 ~ 5.0%; OP-10 emulsifying agent 0.1 ~ 2.0%, hydrochloric acid 5.0 ~ 7.0%, surplus is a deionized water.
2. according to the compound method of the said copper wire with hot-dipped tin of claim 1, it is characterized in that may further comprise the steps with soldering flux:
a
.By mass percentage the example 79.5
~92.2% prepares deionized water;
b
.Example is added 0.5 ~ 1.5% ammonium chloride by mass percentage in above-mentioned deionized water, fully stirs up to whole dissolvings;
C. the zinc chloride of example interpolation by mass percentage 2.0 ~ 5.0% in the solution that back obtains fully stirs up to whole dissolvings;
D. go on foot routine by mass percentage 0.2 ~ 5.0% the trolamine that adds in the solution that obtains last one, fully stir up to whole dissolvings;
E. go on foot routine by mass percentage 0.1 ~ 2.0% the OP-10 emulsifying agent that adds in the solution that obtains last one, fully stir up to whole dissolvings;
f
.Go on foot routine by mass percentage 5.0 ~ 7.0% the hydrochloric acid that adds in the solution that obtains last one
,Stir.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100435601A CN102121088B (en) | 2011-02-23 | 2011-02-23 | Formula of flux for hot tinning of copper wire and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100435601A CN102121088B (en) | 2011-02-23 | 2011-02-23 | Formula of flux for hot tinning of copper wire and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102121088A CN102121088A (en) | 2011-07-13 |
| CN102121088B true CN102121088B (en) | 2012-02-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011100435601A Expired - Fee Related CN102121088B (en) | 2011-02-23 | 2011-02-23 | Formula of flux for hot tinning of copper wire and preparation method thereof |
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102371472B (en) * | 2011-08-31 | 2016-03-02 | 吴江市精工铝字制造厂 | A kind of manufacturing process of copper word |
| CN102873470B (en) * | 2012-08-02 | 2014-07-09 | 新兴铸管（浙江）铜业有限公司 | Flux for tinned copper wires and preparation method for flux |
| CN103325439A (en) * | 2013-05-14 | 2013-09-25 | 安徽旺达铜业发展有限公司 | Tin-plated copper-coated brass wire and production method thereof and tin plating device |
| CN104060207A (en) * | 2014-06-13 | 2014-09-24 | 安徽省宁国天成电工有限公司 | Soldering flux for copper wire hot tinning |
| CN104087883A (en) * | 2014-06-17 | 2014-10-08 | 宁国新博能电子有限公司 | Hot-dip fluxing agent for copper wire for electronic component lead wires and preparation method thereof |
| CN104646867A (en) * | 2015-01-30 | 2015-05-27 | 铜陵新鑫焊材有限公司 | Copper gas welding solvent and preparation method thereof |
| CN105728985A (en) * | 2016-05-04 | 2016-07-06 | 惠州市联镒铜线有限公司 | Soldering flux |
| CN106008285B (en) * | 2016-05-30 | 2018-01-09 | 柳州百韧特先进材料有限公司 | A kind of protection processing method of stannous methanesulfonate solid |
| CN107322188A (en) * | 2017-07-10 | 2017-11-07 | 苏州龙腾万里化工科技有限公司 | A kind of photovoltaic welding scaling powder |
| CN108251777A (en) * | 2018-01-18 | 2018-07-06 | 河南科技大学 | A kind of copper alloy plate strip surface hot-dip tinning technique |
| CN111482733B (en) * | 2020-04-21 | 2022-04-01 | 浙江力强科技有限公司 | Anti-oxidation soldering flux for tinned copper strip coating and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5491035A (en) * | 1992-03-27 | 1996-02-13 | The Louis Berkman Company | Coated metal strip |
| CN1536060A (en) * | 2003-04-07 | 2004-10-13 | 章志伟 | Multifunctonal degreasing rust-removing cleaning agent and its preparaton method |
| CN1546727A (en) * | 2003-12-11 | 2004-11-17 | 南京大学 | Chemical plating nickel conductive film on polymer thin film surface and method for preparing the same |
| CN101240141A (en) * | 2008-03-20 | 2008-08-13 | 焦占付 | Water-based antirust agent |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3480357B2 (en) * | 1999-03-03 | 2003-12-15 | Ｊｆｅスチール株式会社 | Method for producing high strength galvanized steel sheet containing Si and high strength galvannealed steel sheet |
-
2011
- 2011-02-23 CN CN2011100435601A patent/CN102121088B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5491035A (en) * | 1992-03-27 | 1996-02-13 | The Louis Berkman Company | Coated metal strip |
| CN1536060A (en) * | 2003-04-07 | 2004-10-13 | 章志伟 | Multifunctonal degreasing rust-removing cleaning agent and its preparaton method |
| CN1546727A (en) * | 2003-12-11 | 2004-11-17 | 南京大学 | Chemical plating nickel conductive film on polymer thin film surface and method for preparing the same |
| CN101240141A (en) * | 2008-03-20 | 2008-08-13 | 焦占付 | Water-based antirust agent |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2000-248346A 2000.09.12 |
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| CN102121088A (en) | 2011-07-13 |
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