CN106118328A - A kind of polyether-ether-ketone wire enamel and preparation method thereof - Google Patents

A kind of polyether-ether-ketone wire enamel and preparation method thereof Download PDF

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CN106118328A
CN106118328A CN201610510328.7A CN201610510328A CN106118328A CN 106118328 A CN106118328 A CN 106118328A CN 201610510328 A CN201610510328 A CN 201610510328A CN 106118328 A CN106118328 A CN 106118328A
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polyether
ketone
wire enamel
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李康
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/02—Condensation polymers of aldehydes or ketones with phenols only of ketones
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D151/00—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers
    • C09D151/08—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/18—Fireproof paints including high temperature resistant paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/63—Additives non-macromolecular organic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/202—Applications use in electrical or conductive gadgets use in electrical wires or wirecoating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
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  • Life Sciences & Earth Sciences (AREA)
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  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
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Abstract

The invention provides a kind of polyether-ether-ketone wire enamel and preparation method thereof, wire enamel raw material includes: 4,4 ' difluoro benzophenones, hexafluoro bisphenol-a, hydroquinone, potassium carbonate, sulfolane, styrene, Hydroxypropyl acrylate, epoxy resin, tributyl phosphate, ethylene glycol, ethylene-vinyl acetate copolymer, dimethylformamide, Ludox, adipic acid, neopentyl glycol, sodium pyrophosphate, oleic acid, Polyethylene Glycol, lecithin, citric acid and "Antifungin"..Its preparation method is first to prepare fluorochemical polyether ether ketone, then remaining component is mixed.The enameled wire coat that the present invention prepares has outstanding high-temperature stability, cut through temperature, breakdown voltage, and paint film is uniform, and pliability is good.

Description

A kind of polyether-ether-ketone wire enamel and preparation method thereof
Technical field
The invention belongs to wire enamel technology field, be specifically related to a kind of polyether-ether-ketone wire enamel and preparation method thereof.
Background technology
Enamel-covered wire coats polymer insulation according to specific production technology exactly on the tinsels such as copper, aluminum, manganin Paint is prepared from, and this specific insullac is exactly wire enamel.Enamel-covered wire is mainly used as winding coil, and its effect is exactly in unit During device work, it is achieved " electric "-" magnetic " energy is changed, so enamel-covered wire is also electromagnetic wire.
Effect of enamelled wire insulated paint is to make to produce between wire and wire in winding a good insulating barrier, to stop electricity The circulation of stream.Wire enamel belongs to electric insulation paint, as electric insulation paint, except requiring to have good dielectricity, chemistry Outside performance, it is necessary to there is excellent mechanical performance and hot property.Therefore for wire enamel, do not require nothing more than paint film and there is excellence Mechanical strength, scratch resistance and have good tack with conductor, must also have good elasticity and pliability so that it is can be through By in the course of processing and electrical equipment and electrical running various complicated mechanical stress (as rubbed, bend, stretch, compressing, Impact etc.) and the effect of physical factor；And paint film must also be able to bear heat, electromechanical stress synergy (as softened Breakdown test).Owing to using the conditions such as the electromagnetic wire specification of wire enamel, model, use environment different, also require that paint film simultaneously There is the performances such as higher mechanics, electric, heat-resisting and chemical-resistant resistance.
Along with developing rapidly of industrial electrical equipment, household electrical appliance, telecommunication, electronic product etc., the enamel-covered wire market demand in recent years Amount drastically expands.Chinese lacquer envelope curve volume of production within nearly twenties years, with per year over 10% speed increase.China paints Envelope curve is in high speed development state, has broken through 600,000 tons of high pointes, accounts for whole world total output more than 30%, is in the whole world Production of Enamel Wires, sale first.This brings broader application and market to enamel-covered wire, but the thing followed simultaneously Being to have higher requirement enamel-covered wire, the aero dynamo as having requires to work more than 200 DEG C for a long time, and moment uses temperature Degree up to about 420 DEG C.The polyamide that at present enamelled wire surface is widely used, the refractory coating such as polyimides can not meet need Ask.Therefore, the research developing the high wire enamel of new temperature classification is the most meaningful.
Summary of the invention
It is an object of the invention to overcome the deficiencies in the prior art to provide a kind of polyether-ether-ketone wire enamel and preparation side thereof Method, gained enameled wire coat has outstanding high-temperature stability, cut through temperature, breakdown voltage, and paint film is uniform, pliability Good.
A kind of polyether-ether-ketone wire enamel, raw material includes in parts by weight: 4,4 '-difluoro benzophenone 3～8 parts, hexafluoro Bisphenol-A 1～5 parts, hydroquinone 4～9 parts, potassium carbonate 1～5 parts, sulfolane 2～6 parts, styrene 3～7 parts, acrylic acid hydroxypropyl Ester 1～5 parts, epoxy resin 2～6 parts, tributyl phosphate 3～5 parts, ethylene glycol 2～7 parts, ethene-vinyl acetate copolymerization Thing 1～6 parts, dimethylformamide 3～6 parts, Ludox 1～5 parts, adipic acid 3～7 parts, neopentyl glycol 2～6 parts, sodium pyrophosphate 1～5 part, oleic acid 3～8 parts, Polyethylene Glycol 6～12 parts, lecithin 1～5 parts, citric acid 3～7 parts, "Antifungin". 2～5 parts.
Further, described Polyethylene Glycol is polyethylene glycol 200, Liquid Macrogol or PEG400.
The preparation method of described polyether-ether-ketone wire enamel, comprises the following steps:
Step 1, mixes 4,4 '-difluoro benzophenone, hexafluoro bisphenol-a, hydroquinone, potassium carbonate and sulfolane, 120～140 DEG C reaction 2～4h, dropping styrene and the mixture of Hydroxypropyl acrylate, it is warming up to 230 DEG C of reactions 2～4h, reactant is added To water, stirring, gained precipitates dried ground machine and grinds, obtains fluorochemical polyether ether ketone；
Step 2, by epoxy resin, tributyl phosphate, ethylene glycol, ethylene-vinyl acetate copolymer, dimethylformamide Mixing, adds Ludox, adipic acid, neopentyl glycol, sodium pyrophosphate and oleic acid under agitation, dispersion, obtains mixture；
Step 3, mixes fluorochemical polyether ether ketone, Polyethylene Glycol, lecithin, citric acid, "Antifungin". with mixture, to obtain final product.
Further, in step 1, rate of addition is 2～5mL/min.
Further, in step 1, the temperature of water is at 0～4 DEG C, and mixing speed is 400～700rpm.
Further, in step 2, mixing speed is 300～500rpm.
Further, in step 2, dispersion condition is 1000～1500rpm, 10～15min.
Further, in step 3, mixing condition is 1000～1500rpm, 20～30min.
The enameled wire coat that the present invention prepares has outstanding high-temperature stability, cut through temperature, breakdown voltage, paint film Uniformly, pliability is good.
Detailed description of the invention
Embodiment 1
A kind of polyether-ether-ketone wire enamel, raw material includes in parts by weight: 4,4 '-difluoro benzophenone 3 parts, hexafluoro bisphenol-a 1 Part, hydroquinone 4 parts, potassium carbonate 1 part, sulfolane 2 parts, styrene 3 parts, Hydroxypropyl acrylate 1 part, epoxy resin 2 parts, phosphoric acid Tributyl 3 parts, ethylene glycol 2 parts, ethylene-vinyl acetate copolymer 1 part, dimethylformamide 3 parts, Ludox 1 part, oneself Diacid 3 parts, neopentyl glycol 2 parts, sodium pyrophosphate 1 part, oleic acid 3 parts, polyethylene glycol 200 6 parts, 1 part of lecithin, citric acid 3 parts, "Antifungin". 2 parts.
The preparation method of described polyether-ether-ketone wire enamel, comprises the following steps:
Step 1, mixes 4,4 '-difluoro benzophenone, hexafluoro bisphenol-a, hydroquinone, potassium carbonate and sulfolane, 120 DEG C of reactions 4h, dropping styrene and the mixture of Hydroxypropyl acrylate, it is warming up to 230 DEG C of reaction 2h, reactant is added in water, stirring, Gained precipitates dried ground machine and grinds, and obtains fluorochemical polyether ether ketone；
Step 2, by epoxy resin, tributyl phosphate, ethylene glycol, ethylene-vinyl acetate copolymer, dimethylformamide Mixing, adds Ludox, adipic acid, neopentyl glycol, sodium pyrophosphate and oleic acid under agitation, dispersion, obtains mixture；
Step 3, mixes fluorochemical polyether ether ketone, Polyethylene Glycol, lecithin, citric acid, "Antifungin". with mixture, to obtain final product.
Wherein, in step 1, rate of addition is 2mL/min, and the temperature of water is at 0～4 DEG C, and mixing speed is 400rpm；Step 2 Middle mixing speed is 300rpm, and dispersion condition is 1000rpm, 15min；In step 3, mixing condition is 1000rpm, 30min.
Embodiment 2
A kind of polyether-ether-ketone wire enamel, raw material includes in parts by weight: 4,4 '-difluoro benzophenone 5 parts, hexafluoro bisphenol-a 2 Part, hydroquinone 7 parts, potassium carbonate 3 parts, sulfolane 5 parts, styrene 4 parts, Hydroxypropyl acrylate 2 parts, epoxy resin 5 parts, phosphoric acid Tributyl 4 parts, ethylene glycol 6 parts, ethylene-vinyl acetate copolymer 3 parts, dimethylformamide 5 parts, Ludox 4 parts, oneself Diacid 6 parts, neopentyl glycol 3 parts, sodium pyrophosphate 2 parts, oleic acid 7 parts, Liquid Macrogol 9 parts, 3 parts of lecithin, citric acid 5 parts, "Antifungin". 4 parts.
The preparation method of described polyether-ether-ketone wire enamel, comprises the following steps:
Step 1, mixes 4,4 '-difluoro benzophenone, hexafluoro bisphenol-a, hydroquinone, potassium carbonate and sulfolane, 140 DEG C of reactions 3h, dropping styrene and the mixture of Hydroxypropyl acrylate, it is warming up to 230 DEG C of reaction 3h, reactant is added in water, stirring, Gained precipitates dried ground machine and grinds, and obtains fluorochemical polyether ether ketone；
Step 2, by epoxy resin, tributyl phosphate, ethylene glycol, ethylene-vinyl acetate copolymer, dimethylformamide Mixing, adds Ludox, adipic acid, neopentyl glycol, sodium pyrophosphate and oleic acid under agitation, dispersion, obtains mixture；
Step 3, mixes fluorochemical polyether ether ketone, Polyethylene Glycol, lecithin, citric acid, "Antifungin". with mixture, to obtain final product.
Wherein, in step 1, rate of addition is 4mL/min, and the temperature of water is at 0～4 DEG C, and mixing speed is 600rpm；Step 2 Middle mixing speed is 400rpm, and dispersion condition is 1200rpm, 10min；In step 3, mixing condition is 1500rpm, 30min.
Embodiment 3
A kind of polyether-ether-ketone wire enamel, raw material includes in parts by weight: 4,4 '-difluoro benzophenone 7 parts, hexafluoro bisphenol-a 2 Part, hydroquinone 6 parts, potassium carbonate 3 parts, sulfolane 5 parts, styrene 5 parts, Hydroxypropyl acrylate 2 parts, epoxy resin 3 parts, phosphoric acid Tributyl 4 parts, ethylene glycol 6 parts, ethylene-vinyl acetate copolymer 2 parts, dimethylformamide 5 parts, Ludox 3 parts, oneself Diacid 5 parts, neopentyl glycol 5 parts, sodium pyrophosphate 4 parts, oleic acid 7 parts, PEG400 10 parts, 4 parts of lecithin, citric acid 5 parts, "Antifungin". 3 parts.
The preparation method of described polyether-ether-ketone wire enamel, comprises the following steps:
Step 1, mixes 4,4 '-difluoro benzophenone, hexafluoro bisphenol-a, hydroquinone, potassium carbonate and sulfolane, 120 DEG C of reactions 4h, dropping styrene and the mixture of Hydroxypropyl acrylate, it is warming up to 230 DEG C of reaction 2h, reactant is added in water, stirring, Gained precipitates dried ground machine and grinds, and obtains fluorochemical polyether ether ketone；
Step 2, by epoxy resin, tributyl phosphate, ethylene glycol, ethylene-vinyl acetate copolymer, dimethylformamide Mixing, adds Ludox, adipic acid, neopentyl glycol, sodium pyrophosphate and oleic acid under agitation, dispersion, obtains mixture；
Step 3, mixes fluorochemical polyether ether ketone, Polyethylene Glycol, lecithin, citric acid, "Antifungin". with mixture, to obtain final product.
Wherein, in step 1, rate of addition is 2mL/min, and the temperature of water is at 0～4 DEG C, and mixing speed is 400rpm；Step 2 Middle mixing speed is 300rpm, and dispersion condition is 1000rpm, 15min；In step 3, mixing condition is 1000rpm, 30min.
Embodiment 4
A kind of polyether-ether-ketone wire enamel, raw material includes in parts by weight: 4,4 '-difluoro benzophenone 8 parts, hexafluoro bisphenol-a 5 Part, hydroquinone 9 parts, potassium carbonate 5 parts, sulfolane 6 parts, styrene 7 parts, Hydroxypropyl acrylate 5 parts, epoxy resin 6 parts, phosphoric acid Tributyl 5 parts, ethylene glycol 7 parts, ethylene-vinyl acetate copolymer 6 parts, dimethylformamide 6 parts, Ludox 5 parts, oneself Diacid 7 parts, neopentyl glycol 6 parts, sodium pyrophosphate 5 parts, oleic acid 8 parts, polyethylene glycol 200 12 parts, 5 parts of lecithin, citric acid 7 parts, "Antifungin". 5 parts.
The preparation method of described polyether-ether-ketone wire enamel, comprises the following steps:
Step 1, mixes 4,4 '-difluoro benzophenone, hexafluoro bisphenol-a, hydroquinone, potassium carbonate and sulfolane, 140 DEG C of reactions 2h, dropping styrene and the mixture of Hydroxypropyl acrylate, it is warming up to 230 DEG C of reaction 4h, reactant is added in water, stirring, Gained precipitates dried ground machine and grinds, and obtains fluorochemical polyether ether ketone；
Step 2, by epoxy resin, tributyl phosphate, ethylene glycol, ethylene-vinyl acetate copolymer, dimethylformamide Mixing, adds Ludox, adipic acid, neopentyl glycol, sodium pyrophosphate and oleic acid under agitation, dispersion, obtains mixture；
Step 3, mixes fluorochemical polyether ether ketone, Polyethylene Glycol, lecithin, citric acid, "Antifungin". with mixture, to obtain final product.
Wherein, in step 1, rate of addition is 5mL/min, and the temperature of water is at 0～4 DEG C, and mixing speed is 700rpm；Step 2 Middle mixing speed is 500rpm, and dispersion condition is 1500rpm, 10min；In step 3, mixing condition is 1500rpm, 20min.
Embodiment 5
The present embodiment is with the difference of embodiment 3: do not contain Polyethylene Glycol in wire enamel raw material.
The copper round wire of nominal diameter 0.5mm is used to coat enamel-cover on horizontal enamelled wire machine by implementing 1 to 5 gained wire enamel Line, as follows to enameled wire performance test result according to GB/T 6109.22QY-1/240:
As seen from the above table, the enameled wire coat of the present invention has outstanding high-temperature stability, cut through temperature and breakdown voltage It is all remarkably higher than national standard.Owing to not adding Polyethylene Glycol in embodiment 5 so that fluorochemical polyether ether ketone dispersibility declines, group It is polymerized to block, causes the reduction of paint film cut through temperature, breakdown voltage to decline.

Claims (8)

1. a polyether-ether-ketone wire enamel, it is characterised in that: raw material includes in parts by weight: 4,4 '-difluoro benzophenone 3～ 8 parts, hexafluoro bisphenol-a 1～5 parts, hydroquinone 4～9 parts, potassium carbonate 1～5 parts, sulfolane 2～6 parts, styrene 3～7 parts, third Olefin(e) acid hydroxypropyl acrylate 1～5 parts, epoxy resin 2～6 parts, tributyl phosphate 3～5 parts, ethylene glycol 2～7 parts, ethyl vinyl acetate Ethylene copolymer 1～6 parts, dimethylformamide 3～6 parts, Ludox 1～5 parts, adipic acid 3～7 parts, neopentyl glycol 2～6 parts, Sodium pyrophosphate 1～5 parts, oleic acid 3～8 parts, Polyethylene Glycol 6～12 parts, lecithin 1～5 parts, citric acid 3～7 parts, "Antifungin". 2～ 5 parts.
Polyether-ether-ketone wire enamel the most according to claim 1, it is characterised in that: described Polyethylene Glycol is Polyethylene Glycol 200, Liquid Macrogol or PEG400.
3. the preparation method of the polyether-ether-ketone wire enamel described in claim 1, it is characterised in that: comprise the following steps:
Step 1, mixes 4,4 '-difluoro benzophenone, hexafluoro bisphenol-a, hydroquinone, potassium carbonate and sulfolane, 120～140 DEG C reaction 2～4h, dropping styrene and the mixture of Hydroxypropyl acrylate, it is warming up to 230 DEG C of reactions 2～4h, reactant is added To water, stirring, gained precipitates dried ground machine and grinds, obtains fluorochemical polyether ether ketone；
Step 2, by epoxy resin, tributyl phosphate, ethylene glycol, ethylene-vinyl acetate copolymer, dimethylformamide Mixing, adds Ludox, adipic acid, neopentyl glycol, sodium pyrophosphate and oleic acid under agitation, dispersion, obtains mixture；
Step 3, mixes fluorochemical polyether ether ketone, Polyethylene Glycol, lecithin, citric acid, "Antifungin". with mixture, to obtain final product.
The preparation method of polyether-ether-ketone wire enamel the most according to claim 3, it is characterised in that: dropping speed in step 1 Degree is 2～5mL/min.
The preparation method of polyether-ether-ketone wire enamel the most according to claim 3, it is characterised in that: the temperature of water in step 1 Degree is at 0～4 DEG C, and mixing speed is 400～700rpm.
The preparation method of polyether-ether-ketone wire enamel the most according to claim 3, it is characterised in that: stirring speed in step 2 Degree is 300～500rpm.
The preparation method of polyether-ether-ketone wire enamel the most according to claim 3, it is characterised in that: step 2 is disperseed bar Part is 1000～1500rpm, 10～15min.
The preparation method of polyether-ether-ketone wire enamel the most according to claim 3, it is characterised in that: blended sliver in step 3 Part is 1000～1500rpm, 20～30min.
CN201610510328.7A 2016-07-02 2016-07-02 A kind of polyether-ether-ketone wire enamel and preparation method thereof Pending CN106118328A (en)

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Publication number Priority date Publication date Assignee Title
CN108102502A (en) * 2017-12-05 2018-06-01 宜宾天原集团股份有限公司 A kind of preparation method of water-soluble poly ether ether ketone coating
CN114989416A (en) * 2022-06-14 2022-09-02 中国科学院长春应用化学研究所 Polyaryletherketone heat-shrinkable material and preparation method thereof
CN114989416B (en) * 2022-06-14 2023-10-10 中国科学院长春应用化学研究所 Polyaryletherketone heat-shrinkable material and preparation method thereof

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Application publication date: 20161116