CN103725194A - H-level low-temperature soldered polyurethane wire enamel and preparation method thereof - Google Patents

H-level low-temperature soldered polyurethane wire enamel and preparation method thereof Download PDF

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Publication number
CN103725194A
CN103725194A CN201310598802.2A CN201310598802A CN103725194A CN 103725194 A CN103725194 A CN 103725194A CN 201310598802 A CN201310598802 A CN 201310598802A CN 103725194 A CN103725194 A CN 103725194A
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China
Prior art keywords
parts
acid
preparation
add
nylon
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Pending
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CN201310598802.2A
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Chinese (zh)
Inventor
张勇进
方小辉
章小虎
刘琛
胡强
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TONGLING TIANHE SPECIAL INSULATED WIRE Co Ltd
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TONGLING TIANHE SPECIAL INSULATED WIRE Co Ltd
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Application filed by TONGLING TIANHE SPECIAL INSULATED WIRE Co Ltd filed Critical TONGLING TIANHE SPECIAL INSULATED WIRE Co Ltd
Priority to CN201310598802.2A priority Critical patent/CN103725194A/en
Publication of CN103725194A publication Critical patent/CN103725194A/en
Pending legal-status Critical Current

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Abstract

The invention discloses H-level low-temperature soldered polyurethane wire enamel and a preparation method thereof. The H-level low-temperature soldered polyurethane wire enamel is characterized by being prepared by raw materials in parts by weight as follows: 30-35 parts of polyimide resin, 2-3 parts of zinc borate, 3-5 parts of lecithin, 6-9 parts of diaminodiphenylsulfone, 2-3 parts of terephthalic acid, 5-7 parts of neopentyl glycol, 10-12 parts of nylon 12, 9-10 parts of 2-methyl-1,3-propylene glycol, 2-3 parts of tris (2-hydroxyethyl) cyanuric acid, 10-12 parts of adipic acid, 8-10 parts of phthalic anhydride, 10-15 parts of polyester acrylate, 1-2 parts of triethanolamine, 3-4 parts of mica powder, 7-9 parts of auxiliaries, 80-90 parts of cresol and 100-110 parts of dimethylbenzene. The H-level low-temperature soldered polyurethane wire enamel is simple in technology, few in side reactions, stable in product performance and good in thermal shock resistance.

Description

A kind of H grade low-temp. beading and preparation method thereof
Technical field
The present invention relates to a kind of wire enamel, especially a kind of H grade low-temp. beading and preparation method thereof.
Background technology
Enameled wire is a kind of electrical material, and it is the high-strength insulating layer of processing thin layer a circular copper line surface, plays the effect with external insulation.By specification, can be processed into than also thin lousiness line of hair, as thick cotton covered wire as thumb.Enameled wire has good insulation effect and waterproof ability.Aspect electrical equipment application very extensive, as electric motor, generator, water pump, electro-magnet, welding machine, household electrical appliance, cableless communication, loud speaker, tg, transformer etc.Wire enamel is the necessary insulating material of producing enameled wire, wire enamel requires to have good tack, physical strength, insulating property, resistance toheat, wear resisting property, salt spray resistance and adverse environment resistant performance etc., but there is thermotolerance, wear no resistance in common wire enamel, insufficient strength, heat-resisting level be lower than the problems such as 120 ℃, is difficult to meet the requirement of varying environment.Need to improve the formula of wire enamel and production technique, further improve the performance of enamel-cover paint, reduce its production cost.
Summary of the invention
Object of the present invention is just to provide a kind of H grade low-temp. beading and preparation method thereof, to overcome the deficiencies in the prior art.
The object of the present invention is achieved like this:
A kind of H grade low-temp. beading, it is characterized in that, by following weight part (kilogram) raw material make: polyimide resin 30-35, zinc borate 2-3, Yelkin TTS 3-5, diamino diphenyl sulfone 6-9, terephthalic acid 2-3, neopentyl glycol 5-7, nylon 12 10-12,2-methyl isophthalic acid, ammediol 9-10, three (2-hydroxyethyl) isocyanuric acid ester 2-3, hexanodioic acid 10-12, Tetra hydro Phthalic anhydride 8-10, polyester acrylate 10-15, trolamine 1-2, mica powder 3-4, auxiliary agent 7-9, M-and P-cresols 100-110, dimethylbenzene 100-110;
Described auxiliary agent is made by following raw materials in part by weight: nano mica powder 0.2-0.3, Di(dioctylpyrophosphato) ethylene titanate 3-4, cobalt naphthenate 1-2, triethyl citrate 5-8, linking agent TAC1-2,1,6 hexanediyl ester 10-12, Tenox PG 3-4, coix seed oil 2-3; Its preparation method is by each mixing of materials, is heated to 60-70 ℃, and stirring reaction 30-40 minute, obtains.
The preparation method of described H grade low-temp. beading, is characterized in that comprising the following steps:
(1), take dimethylbenzene, M-and P-cresols drops in the reactor with agitator and is uniformly mixed, be heated to 35-45 ℃, add nylon 12, stir and be heated to 145-195 ℃, after dissolving completely to nylon 12, add again terephthalic acid, neopentyl glycol, 2-methyl isophthalic acid, ammediol, hexanodioic acid, Tetra hydro Phthalic anhydride, zinc borate, trolamine, insulation 5-6 hour;
(2), step (1) reaction mass is cooled to 55-85 ℃, add diamino diphenyl sulfone, three (2-hydroxyethyl) isocyanuric acid ester, polyester acrylate, auxiliary agent, keep temperature, stirring reaction 2-3 hour;
(3) add leftover materials, again, be warming up to 90-125 ℃, continue stirring reaction 2-3 hour;
(4), cooling material is to 50-60 ℃, is ground to 20-40 μ m slurry, filter and get final product.
The present invention has following beneficial effect: the performance of painting in wire enamel production process improves, and the use of terephthalic acid has effectively improved thermotolerance and the thermal shock resistance properties of enameled wire coat; Improved adherence, product performance are stable, thermal shock resistance is strong.
Embodiment
Described H grade low-temp. beading be by following weight part (kilogram) raw material make: polyimide resin 30, zinc borate 2, Yelkin TTS 5, diamino diphenyl sulfone 6, terephthalic acid 2, neopentyl glycol 5, nylon 12 10,2-methyl isophthalic acid, ammediol 9, three (2-hydroxyethyl) isocyanuric acid ester 2, hexanodioic acid 10, Tetra hydro Phthalic anhydride 8, polyester acrylate 10, trolamine 1, mica powder 4, auxiliary agent 7, M-and P-cresols 100, dimethylbenzene 100;
Described auxiliary agent by following weight part (kilogram) raw material makes: nano mica powder 0.2, Di(dioctylpyrophosphato) ethylene titanate 3, cobalt naphthenate 1, triethyl citrate 5, linking agent TAC2,1,6 hexanediyl ester 10, Tenox PG 4, coix seed oil 2; Its preparation method is by each mixing of materials, is heated to 60-70 ℃, and stirring reaction 30-40 minute, obtains.
Preparation method comprises the following steps:
(1), take dimethylbenzene, M-and P-cresols drops in the reactor with agitator and is uniformly mixed, be heated to 35-45 ℃, add nylon 12, stir and be heated to 145-195 ℃, after dissolving completely to nylon 12, add again terephthalic acid, neopentyl glycol, 2-methyl isophthalic acid, ammediol, hexanodioic acid, Tetra hydro Phthalic anhydride, zinc borate, trolamine, insulation 5-6 hour;
(2), step (1) reaction mass is cooled to 55-85 ℃, add diamino diphenyl sulfone, three (2-hydroxyethyl) isocyanuric acid ester, polyester acrylate, auxiliary agent, keep temperature, stirring reaction 2-3 hour;
(3) add leftover materials, again, be warming up to 90-125 ℃, continue stirring reaction 2-3 hour;
(4), cooling material is to 50-60 ℃, is ground to 20-40 μ m slurry, filter and get final product.
Use paint of the present invention wire rod main performance index processed as follows:
1, tack is good;
2, temperature classification >=185 ℃, thermal shocking reaches 200 ℃/30min paint film and does not ftracture;
3, scolding tin test :≤370 ℃ 5 seconds: qualified;
4,1200 hours/105 ℃ of transformer oil resistants, paint film is without damage.

Claims (3)

1. a H grade low-temp. beading, it is characterized in that, by following weight part (kilogram) raw material make: polyimide resin 30-35, zinc borate 2-3, Yelkin TTS 3-5, diamino diphenyl sulfone 6-9, terephthalic acid 2-3, neopentyl glycol 5-7, nylon 12 10-12,2-methyl isophthalic acid, ammediol 9-10, three (2-hydroxyethyl) isocyanuric acid ester 2-3, hexanodioic acid 10-12, Tetra hydro Phthalic anhydride 8-10, polyester acrylate 10-15, trolamine 1-2, mica powder 3-4, auxiliary agent 7-9, M-and P-cresols 100-110, dimethylbenzene 100-110.
2. auxiliary agent according to claim 1 is made by following raw materials in part by weight: nano mica powder 0.2-0.3, Di(dioctylpyrophosphato) ethylene titanate 3-4, cobalt naphthenate 1-2, triethyl citrate 5-8, linking agent TAC1-2,1,6 hexanediyl ester 10-12, Tenox PG 3-4, coix seed oil 2-3; Its preparation method is by each mixing of materials, is heated to 60-70 ℃, and stirring reaction 30-40 minute, obtains.
3. the preparation method of H grade low-temp. beading according to claim 1, is characterized in that comprising the following steps:
(1), take dimethylbenzene, M-and P-cresols drops in the reactor with agitator and is uniformly mixed, be heated to 35-45 ℃, add nylon 12, stir and be heated to 145-195 ℃, after dissolving completely to nylon 12, add again terephthalic acid, neopentyl glycol, 2-methyl isophthalic acid, ammediol, hexanodioic acid, Tetra hydro Phthalic anhydride, zinc borate, trolamine, insulation 5-6 hour;
(2), step (1) reaction mass is cooled to 55-85 ℃, add diamino diphenyl sulfone, three (2-hydroxyethyl) isocyanuric acid ester, polyester acrylate, auxiliary agent, keep temperature, stirring reaction 2-3 hour;
(3) add leftover materials, again, be warming up to 90-125 ℃, continue stirring reaction 2-3 hour;
(4), cooling material is to 50-60 ℃, is ground to 20-40 μ m slurry, filter and get final product.
CN201310598802.2A 2013-11-25 2013-11-25 H-level low-temperature soldered polyurethane wire enamel and preparation method thereof Pending CN103725194A (en)

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CN201310598802.2A CN103725194A (en) 2013-11-25 2013-11-25 H-level low-temperature soldered polyurethane wire enamel and preparation method thereof

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CN201310598802.2A CN103725194A (en) 2013-11-25 2013-11-25 H-level low-temperature soldered polyurethane wire enamel and preparation method thereof

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106118328A (en) * 2016-07-02 2016-11-16 李康 A kind of polyether-ether-ketone wire enamel and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09137118A (en) * 1995-11-14 1997-05-27 Showa Electric Wire & Cable Co Ltd Polyimide resin paint and insulated wire
CN1394926A (en) * 2002-07-16 2003-02-05 南京大学 H-grade low-temp. beading polyurethane paint wire-covering paint
CN1487035A (en) * 2002-08-07 2004-04-07 珠海东诚化工有限公司 Ultraviolet ray cured insulating paint
CN1597815A (en) * 2004-08-03 2005-03-23 中国化工建设总公司常州涂料化工研究院 Paint for H grade polyurethane enamelled wire with good saline water needle performace capable of directing welding at low temp.

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09137118A (en) * 1995-11-14 1997-05-27 Showa Electric Wire & Cable Co Ltd Polyimide resin paint and insulated wire
CN1394926A (en) * 2002-07-16 2003-02-05 南京大学 H-grade low-temp. beading polyurethane paint wire-covering paint
CN1487035A (en) * 2002-08-07 2004-04-07 珠海东诚化工有限公司 Ultraviolet ray cured insulating paint
CN1597815A (en) * 2004-08-03 2005-03-23 中国化工建设总公司常州涂料化工研究院 Paint for H grade polyurethane enamelled wire with good saline water needle performace capable of directing welding at low temp.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106118328A (en) * 2016-07-02 2016-11-16 李康 A kind of polyether-ether-ketone wire enamel and preparation method thereof

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Application publication date: 20140416

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