CN106105409A - 用于网络设备热管理的系统和装置 - Google Patents
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Abstract
实施例一般地涉及高容量网络设备的热管理的网络系统和装置。更具体地,公开了提供通过改进的空气循环来改进网络设备的散热的系统和装置,包括PCB(104)和连接器保持架(102),PCB(104)具有至少一个狭槽(108、110、112),连接器保持架(102)被安装在印刷电路板(104)上,连接器保持架(102)与PCB(104)中的至少一个狭槽(108、110、112)处于一定的距离之内。
Description
相关申请
本申请要求于2013年11月6号提交的序列号为61/900,991、题为“Method andapparatus for improving cooling across QSFP connector cage(用于改进整个QSFP连接器保持架的冷却的方法和装置)”的美国临时申请的权益,该临时申请的公开出于所有目的通过引用以其整体合并于此。
技术领域
实施例一般地涉及高容量网络设备的热管理的网络系统和装置。更具体地,公开了提供通过改进的空气循环来改进网络设备的散热的系统和装置。
背景技术
网络基础设施(包括服务器、交换机、和路由器)作为现代信息技术系统的支柱变得越来越重要。具体地,随着云计算的兴起,高能量和高吞吐量网络设备的需求持续增长。
高能量和高吞吐量设备的空间限制导致设备更小和安装密度更大。小、密集、高功率设备的一个后果是增加了热量产生和保留。因此,这些设备的热管理变得重要起来。
例如,各种类型的可插拔模块(也称为“收发器”)在网络设备中是高度活跃的并且是发热组件。可插拔模块将交换机、路由器、或类似设备的印刷电路板(PCB)连接至外部设备(例如,光纤线)。安装在PCB上的连接器保持架通常被用来将可插拔模块以电子和机械的方式连接至PCB。因为可插拔模块要求一定范围的温度来正常地工作,所以可插拔模块的热管理针对网络操作是很重要的。例如,当可插拔模块的核心温度达到一定水平时,模块可能降低功能或甚至丧失功能。
此外,因为光模块的激光组件要求低温度情况(例如,低于70℃)以维持它正常的功能,所以对于光可插拔模块热管理是关键的。光可插拔模块包括QSFP、SFP+、SFF、XFP、CXP、CFP、CFP2、和CFP4等等。
由于空间约束和制造成本,当前散热技术在高吞吐量网络设备中具有有限的应用。当前散热技术的示例包括集成散热片或骑散热片、和折流板等等。
因此,需要通过有成本效益的、高效的、和紧凑的方法来改进高容量网络设备(特别是可插拔模块)的热管理。
附图说明
下面的详细描述和附图中公开了本技术的各种实施例或示例(“示例”):
图1是根据一些实施例的定制的PCB连接器保持架组合的示例的透视图;
图2是根据一些实施例的如图1所示出的底部定制的PCB连接器保持架组合的示例的透视图;
图3是根据一些实施例的包括定制的PCB连接器保持架组合的网络设备的示例的特写透视图。
具体实施方式
下面详细讨论了本公开的各种实施例。虽然讨论了具体实现方式,但是应当理解的是,这仅出于说明的目的。本领域的技术人员将认识到,在不偏离本公开的精神和范围的情况下可以使用其他组件和配置。
概述
根据一些实施例,本技术包括定制的PCB,该定制的PCB在一个或多个选择的位置被故意地开槽,以促进安装在PCB上的一个或多个连接器保持架周围的侧到侧(side-to-side)空气流。在一些实施例中,狭槽位于一个或多个连接器保持架之间。在一些实施例中,狭槽位于PCB板的边缘。在一些实施例中,狭槽被放置在离一个或多个连接器保持架一定距离之内,从而使得空气流能够高效地散去由(连接器保持架中的)可插拔模块产生的热。
此外,由于狭槽可以在PCB设计期间被预先确定,或狭槽可以被放置于不干扰嵌入PCB中的电路的区域(例如,狭槽位于PCB的电路自由边缘之内),PCB的功能保持完好。
根据一些实施例,本技术可以使能安装在PCB上的连接器保持架的局部突出侧。在一些实施例中,与连接器保持架相关联的插脚中的至少一个插脚不是通过压入式配套被压入PCB的。剩余的压入插脚可以提供足够的力量将连接器保持架耦合至PCB。
根据一些实施例,本技术可以针对各种类型的可插拔模块(包括诸如QSFP、SFP+、SFF、XFP、CXP、CFP、CFP2、和CFP4之类的各种光可插拔模块)提供有效的和有成本效益的散热设计。此外,可插拔模块可以是基于光纤的模块或基于铜线的模块中的至少一个。
此外,虽然本讨论使用了QSFP作为适用的可插拔模块的示例,但是本技术概念性地适用于安装在网络设备之内的基板上的任何热生成组件。
本公开的附加特征和优点将在下面的描述中被阐述,并且通过描述其中的部分将是明显的,或可以通过实践本文所公开的原理来学习。本公开的特征和优点可以用所附权利要求中具体指出的工具和组合的装置来实现或获得。本公开的这些或其他特征将从下面的描述和权利要求中变得更充分明显,或可以通过实践本文所阐述的原理来学习。
在PCB连接器保持架组合中,这些高度活跃的可插拔模块的紧凑布置可以在网络设备中产生散热问题。具体地,PCB通常具有墙到墙(wall-to-wall)设计,该墙到墙设计阻止对流空气循环,并限制可插拔模块的散热。此外,由于并行连接器保持架互相靠近,通过连接器保持架的侧的热损失是最小的。此外,由于空气流动的低空气速度和小体积,可插拔模块的外侧部分的自然对流冷却也相对较小。
本技术公开了定制的PCB连接器保持架组合,该定制的PCB连接器保持架组合通过PCB中的一个或多个狭槽来促进对流空气冷却,因此提升了网络设备中的热余裕。
图1是根据一些实施例的定制的PCB连接器保持架组合的示例的透视图。如图1所示,定制的PCB连接器保持架组合包括一个或多个连接器保持架(例如,102)、和PCB 104。PCB 104包括位于电路自由边缘的一个或多个狭槽(例如,108、110、和112)。一个或多个狭槽可以允许每个连接器保持架以及可插拔模块(未示出)周围的对流空气循环的侧到侧空气流。
如图1所示,狭槽是由电路板的边缘限定的在印刷电路板中形成的凹槽。具体地,凹槽在电路板的边缘130和132的两侧被形成。这些边缘在支持连接器保持架102的印刷电路板中的凸部134的两侧形成。如图1所示,凸部134可以比连接器保持架102更窄,以便连接器保持架102突出凸部。狭槽的深度由电路板的后边缘134界定。
根据一些实施例,狭槽108、110、和112可以是任意形状,包括方形、椭圆形、圆形、或多边形,只要它们可以在网络设备中创建有效的空气路径。在一些实施例中,狭槽108、110、和112可以是U形。
狭槽的位置和尺寸可以基于多个因素(包括到热生成组件距离、PCB上可用的电路自由空间等等)通过热计算和/或实验来被决定。例如,狭槽可以位于PCB 104的内部区域,只要它们可以提供有效的空气路径并且不干扰PCB功能。在一些实施例中,狭槽的位置和尺寸可以在PCB设计期间被决定。在一些实施例中,狭槽可以被置于PCB的电路自由边缘区域之内,如图1所示出的。
根据一些实施例,位于连接器保持架102的底部的插脚114和116可以突出PCB104,而不是被压入PCB 104。剩余的压入插脚可以通过压入式配套来提供足够的力量将连接器保持架102附着至PCB 104。在一些实施例中,突出插脚114和116可以通过固定PCB 104的伸出部分来限制PCB 104的水平运动,如图1所示出的。此外,各种类型的附着机制(例如,钩、锚、导轨)可以被利用来将连接器保持架安装至PCB 104。
此外,LED指示器122可以位于连接器保持架102的下面。LED指示器122可以指示相应的可插拔模块的工作状态,例如绿色或红色。
仍然参照图1,可插拔模块(未示出)可以单独地插入模块端口118和120,并且通过连接器保持架102的接口连接器(未示出)与PCB 104相连接。可插拔模块的一个示例是QSFP(四通道小型可插拔,也是QSFP+)。QSFP是被用于数据通信应用的紧凑的、热可插拔收发器。QSFP可以允许4×10Gbit/s或甚至更高的数据速率。如图1所示,例如,多个QSFP 8、16、32、或44可以通过多个连接器保持架被置于PCB 104上从而生成兆兆位吞吐量,其也在网络设备中产生大量的热。
此外,连接器保持架102可以包括一个或多个接口连接器(未示出),该一个或多个接口连接器以机械和电子的方式连接至PCB 104。因此,当可插拔模块被插入连接器保持架(例如,102)时,可插拔模块可以与接口连接器相匹配,由此以电子的方式连接至PCB 104。
图2是根据一些实施例的如图1所示出的定制的PCB连接器保持架组合的示例的三面透视图。在定制的PCB连接器保持架组合200中,多个保持架连接器(例如,202)通过压入式配套(未示出)被置于PCB 204上。例如,在图2中,在PCB板204上有六个并行的连接器保持架,它们中的每一个都可以托管两个可插拔模块。如图2所示,PCB板上的有边狭槽206、208、210、212、和214可以创建对流空气循环从而促进一个或多个连接器保持架以及它们相应的可插拔模块周围的侧到侧空气流。此外,插脚216和218可以被暴露在所述有边狭槽中,并且可以突出PCB 104,如本文所描述的。
图3是根据一些实施例的包括定制的PCB连接器保持架组合的网络设备的示例的透视图。在一些实施例中,网络设备300(例如,刀片式交换机)包括多个连接器保持架(例如,308),该多个连接器保持架可以被用来通过模块端口(例如,306)接收多个可插拔模块(未示出)。连接器保持架通过附着机制(例如,压入式配套)被附着至定制的PCB(未示出)。多个连接器保持架和定制的PCB可以被安装进包括底板302和面板304的设备壳体。PCB可以达到面板304的背面(“墙到墙”设计)并且形成用于安装在PCB上的任意组件(包括可插拔模块和连接器保持架)的封闭空间,因此阻止这些组件周围的空气循环。
如图3所描述的,网络设备的两个垂直侧(底板302和面板304)在它们的结合处可以留出空气间隙,该空气间隙可以使得空气能够进入设备壳体。此外,定制的PCB中的多个狭槽(例如,312和314)可以提供通风孔,以使得空气通过底板302进一步进入传统上的封闭空间(由于狭槽现在是相对开放的空间)。因此,这些狭槽可以促进网络壳体之内的增加的对流空气循环,并且降低网络设备304的内部温度。
此外,网络设备300可以在面板304上包括手柄310从而在堆叠网络系统中方便安装和维护。
虽然为了清楚理解的目的已经详细描述了前述示例,但是上述发明技术不限于所提供的细节。存在实现上述技术的许多替代方式。所公开的示例时说明性的并且不是限制性的。
Claims (15)
1.一种用于改进网络设备中的散热的系统,包括:
印刷电路板,所述印刷电路板包括在所述印刷电路板的多个凸部的边缘之间形成的至少一个狭槽;以及
连接器保持架,所述连接器保持架通过使用与所述连接器保持架相关联的多个插脚中的一个或多个插脚被安装在所述印刷电路板的多个凸部中的至少一个凸部上,其中所述至少一个狭槽被配置为通过使能所述印刷电路板的多个凸部之间的空气循环来改进所述网络设备中的散热。
2.如权利要求1所述的系统,还包括:
可插拔模块,所述可插拔模块通过与所述连接器保持架相关联端口被耦合至所述连接器保持架。
3.如权利要求2所述的系统,其中,所述可插拔模块是QSFP、SFP+、SFF、XFP、CXP、CFP、CFP2、或CFP4中的一个。
4.如权利要求1至3中任一个所述的系统,其中,所述多个插脚中的至少一个插脚突出所述印刷电路板的至少一个凸部。
5.一种用于改进网络设备中的散热的系统,包括:
基板,所述基板包括一个或多个狭槽,所述一个或多个狭槽被配置为通过使能空气循环来改进所述网络设备中的散热;以及
多个连接器保持架,所述多个连接器保持架通过使用至少一个附着机制被安装在所述基板上,所述多个连接器保持架中的每一个连接器保持架与所述一个或多个狭槽中的每一个狭槽处于一定的距离之内。
6.如权利要求5所述的系统,其中,所述基板是印刷电路。
7.如权利要求5至6中任一个所述的系统,其中,所述一个或多个狭槽位于所述印刷电路的边缘,其中所述一个或多个狭槽不干扰所述印刷电路的功能。
8.如权利要求5至6中任一个所述的系统,其中,所述一个或多个狭槽中的至少一个狭槽位于所述基板的中间,并且所述一个或多个狭槽不干扰所述基板的功能。
9.如权利要求5至6中任一个所述的系统,其中,所述至少一个附着机制包括使用与所述多个连接器保持架中的每一个连接器保持架相关联的一个或多个插脚的压入式配套。
10.如权利要求5至6中任一个所述的系统,还包括:
一个或多个可插拔模块,所述一个或多个可插拔模块通过与所述多个连接器保持架相关联的一个或多个端口被耦合至所述多个连接器保持架。
11.如权利要求5至6中任一个所述的系统,还包括:
壳体,所述壳体被配置为包括所述基板和所述多个连接器保持架,所述壳体在所述壳体的底板中具有空气间隙。
12.一种用于改进网络设备中的散热的装置,包括:
印刷电路板,所述印刷电路板包括与所述印刷电路板中的至少一个第一位置相关联的至少一个开口,所述印刷电路板被配置为:
通过至少一个附着机制与与所述印刷电路板中的第二位置相关联的连接器保持架相耦合,以及
通过所述连接器保持架与可插拔模块相连接,
其中所述至少一个第一位置与所述第二位置处于一定距离之内,以便所述至少一个开口可以使能所述印刷电路板附近的空气循环。
13.如权利要求12所述的装置,其中,所述连接器保持架包括被配置为与所述印刷电路板相匹配的多个插脚。
14.如权利要求12至13中任一个所述的装置,其中,所述可插拔模块是基于光纤模块或基于铜线模块中的至少一个。
15.如权利要求12至14中任一个所述的装置,其中,所述至少一个开口使能所述连接器保持架周围的侧到侧空气流。
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