CN106102302A - Pcb board and there is its mobile terminal - Google Patents
Pcb board and there is its mobile terminal Download PDFInfo
- Publication number
- CN106102302A CN106102302A CN201610505735.9A CN201610505735A CN106102302A CN 106102302 A CN106102302 A CN 106102302A CN 201610505735 A CN201610505735 A CN 201610505735A CN 106102302 A CN106102302 A CN 106102302A
- Authority
- CN
- China
- Prior art keywords
- wiring route
- conductive layer
- pcb board
- signal
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
Abstract
The invention discloses a kind of pcb board and there is its mobile terminal, wherein pcb board includes the conductive layer of multilayer laminated placement, plurality of conductive layers includes the first conductive layer and second conductive layer adjacent with the first conductive layer, the first wiring route it is equipped with on first conductive layer, second conductive layer is provided with the second wiring route, the area of the first wiring route is S, and it is S ', S and S that the second wiring route projects the area overlapping with the first wiring route on the first conductive layer ' meet: 1/4≤S '/S≤3/5.Pcb board according to the present invention, by making the projection on the first conductive layer of second wiring route and overlapping area S of the first wiring route ' and the area S of the first wiring route meet 1/4≤S '/S≤3/5, interfering of signal between the first conductive layer and the second conductive layer can be reduced, improve the first wiring route and the performance of the second wiring route signal transmission, improve the reliability of pcb board work.
Description
Technical field
The present invention relates to technical field of mobile terminals, especially relate to a kind of pcb board and there is its mobile terminal.
Background technology
Along with the fast development of electronic product, the fuselage of product increasingly trend towards thin, lightly change, the space of interiors of products
Layout also can be more and more compacter.In correlation technique, the PCB layout of adjacent layer is easy to bring interfering between signal, from
And affect the normal work of pcb board.
Summary of the invention
It is contemplated that one of technical problem solved the most to a certain extent in correlation technique.To this end, the present invention carries
Going out a kind of pcb board, described pcb board has the advantage that neighboring layer lines signal disturbing is little.
The present invention also proposes a kind of mobile terminal, and described mobile terminal includes above-mentioned pcb board.
Pcb board according to embodiments of the present invention, including the conductive layer of multilayer laminated placement, conductive layer described in multilamellar includes
One conductive layer and second conductive layer adjacent with described first conductive layer, described first conductive layer is equipped with the first wiring line
Road, described second conductive layer is provided with the second wiring route, and the area of described first wiring route is S, described second wiring line
It is S ' that road projects the area overlapping with described first wiring route on described first conductive layer, and described S and described S ' meets: 1/
4≤S’/S≤3/5。
Pcb board according to embodiments of the present invention, by making second wiring route projection on the first conductive layer and first
Overlapping area S of wiring route ' and the area S of the first wiring route meet 1/4≤S '/S≤3/5, the first conduction can be reduced
The interfering of signal between layer and the second conductive layer, improves the first wiring route and the property of the second wiring route signal transmission
Can, improve the reliability of pcb board work.
According to some embodiments of the present invention, described S and described S ' meets: 1/3≤S '/S≤3/5.
According to some embodiments of the present invention, described S and described S ' meets: 1/4≤S '/S≤1/2.
According to some embodiments of the present invention, described S and described S ' meets: 1/3≤S '/S≤1/2.
According to some embodiments of the present invention, the bearing of trend of described first wiring route prolongs with described second wiring route
Stretch direction identical.
According to some embodiments of the present invention, the bearing of trend of described first wiring route prolongs with described second wiring route
Stretching the angle between direction is α, and described α meets: 0 ＜ α≤80 °.
According to some embodiments of the present invention, the bearing of trend of described first wiring route prolongs with described second wiring route
Stretching the angle between direction is α, and described α meets: α=90 °.
Mobile terminal according to embodiments of the present invention, including above-mentioned pcb board.
Mobile terminal according to embodiments of the present invention, by arranging above-mentioned pcb board, can reduce the first conductive layer and second
The interfering of signal between conductive layer, improves the first wiring route and the quality of the second wiring route signal transmission, improves and move
The performance of dynamic terminal.
According to some embodiments of the present invention, described mobile terminal is mobile phone, panel computer or notebook computer.
Accompanying drawing explanation
Fig. 1 is the wire structures schematic diagram of pcb board according to embodiments of the present invention；
Fig. 2 is the wire structures schematic diagram of pcb board according to embodiments of the present invention.
Reference:
Pcb board 100,
First wiring route 1, the second wiring route 2, insulate PP sheet 3.
Detailed description of the invention
Embodiments of the invention are described below in detail, and the example of described embodiment is shown in the drawings.Below with reference to
The embodiment that accompanying drawing describes is exemplary, it is intended to is used for explaining the present invention, and is not considered as limiting the invention.
Below with reference to Fig. 1 and Fig. 2, pcb board 100 according to embodiments of the present invention is described.
As depicted in figs. 1 and 2, pcb board 100 according to embodiments of the present invention is including the conductive layer of multilayer laminated placement, many
Layer conductive layer includes the first conductive layer and second conductive layer adjacent with the first conductive layer, and the first conductive layer is equipped with the first cloth
Line circuit 1, the second conductive layer is provided with the second wiring route 2, and the area of the first wiring route 1 is S, and the second wiring route 2 exists
Projecting the area overlapping with the first wiring route 1 on first conductive layer is S ', S and S ' meet: 1/4≤S '/S≤3/5.Thus,
Interfering of signal between the first wiring route 1 and the second wiring route 2 can be reduced, improve the first wiring route 1 He
The performance of the second wiring route 2 signal transmission, improves the reliability of pcb board 100 work.
As it is shown in figure 1, the first wiring route 1 and the second wiring route 2 interlaced arrangement, the second wiring route 2 is led first
Projection in electric layer is only the first wiring route 1 and the second wiring route 2 intersection with the overlapping area of the first wiring route 1
Area, the interference of the first conductive layer and the second electrically conductive signal layer also only occurs in the first wiring route 1 and the second wiring route 2
The position in cross point, significantly reduce the signal disturbing between the first conductive layer and the second conductive layer, improve signal
The quality of transmission, improves the performance of product.
As in figure 2 it is shown, the first wiring route 1 and the second wiring route 2 extend the most in the same direction, the second wiring route
2 projections on the first conductive layer are only positioned at the side of the first wiring route 1, the first conductive layer and the interference of the second electrically conductive signal layer
Occur in the side of the first wiring route 1, significantly reduce the signal disturbing between the first conductive layer and the second conductive layer, carry
The high quality of signal transmission, improves the performance of product.
Pcb board 100 according to embodiments of the present invention, by make the projection on the first conductive layer of second wiring route 2 with
Overlapping area S of the first wiring route 1 ' and the area S of the first wiring route 1 meet 1/4≤S '/S≤3/5, can be reduced
The interfering of signal between one conductive layer and the second conductive layer, improves the first wiring route 1 and the second wiring route 2 signal
The performance of transmission, improves the reliability of pcb board 100 work.
In some embodiments of the invention, S and S ' meets: 1/3≤S '/S≤3/5.Thus, it is possible to reduce further
The interfering of signal between one conductive layer and the second conductive layer, improves the first wiring route 1 and the second wiring route 2 signal
The performance of transmission, improves the reliability of pcb board 100 work.
In some embodiments of the invention, S and S ' meets: 1/4≤S '/S≤1/2.Thus, it is possible to reduce further
The interfering of signal between one conductive layer and the second conductive layer, improves the first wiring route 1 and the second wiring route 2 signal
The performance of transmission, improves the reliability of pcb board 100 work.
In some embodiments of the invention, S and S ' meets: 1/3≤S '/S≤1/2.Thus, it is possible to reduce further
The interfering of signal between one conductive layer and the second conductive layer, improves the first wiring route 1 and the second wiring route 2 signal
The performance of transmission, improves the reliability of pcb board 100 work.
In some embodiments of the invention, as in figure 2 it is shown, the bearing of trend of the first wiring route 1 and second connects up line
Road 2 bearing of trend is identical.The projection on the first conductive layer of second wiring route 2 is positioned at the side of the first wiring route 1, and first
Conductive layer and the interference of the second electrically conductive signal layer only occur in the side of the first wiring route 1, significantly reduce the first conductive layer
And the signal disturbing that second between conductive layer, improve the quality of signal transmission, improve the performance of product.So pressing
Conjunction adds man-hour, and the first conductive layer and the second conductive layer circuit will not shape bigger offset, it is ensured that during PCB pressing processing and fabricating not
The thin layer insulation PP sheet 3 between the first conductive layer and the second conductive layer can be cut off, improve PCB and make yield, it is ensured that semiotic function.
In correlation technique, the bearing of trend of the first wiring route and the second wiring route is identical, and the first wiring route and
Second wiring route is crisscross arranged, and the projection on the first conductive layer of second wiring route and the first wiring route are non-overlapping, by
This can reduce the signal disturbing between the first wiring route and the second wiring route, but due to pcb board between layers exhausted
Edge PP sheet is the thinnest, and the first wiring route and the second wiring route signal interlock tangent cabling, form the biggest offset, at pcb board
When carrying out pressing processing and fabricating.The tangent pressing of levels circuit can be cut off thin layer insulation PP sheet, thus causes levels circuit
Contact with each other, cause the risk of signal shorts, cause pcb board to make bad.
In some embodiments of the invention, the bearing of trend of the first wiring route 1 and the second wiring route 2 bearing of trend
Between angle be α, α meet: 0 ＜ α≤80 °.The projection on the first conductive layer of second wiring route 2 and the first wiring route
The overlapping area of 1 is only the first wiring route 1 and area of the second wiring route 2 intersection, and the first conductive layer and second is led
The interference of electric layer signal also only occurs in the position in the cross point of the first wiring route 1 and the second wiring route 2, greatly drops
Low signal disturbing between first conductive layer and the second conductive layer, improves the quality of signal transmission, improves the property of product
Energy.
In some embodiments of the invention, as it is shown in figure 1, the bearing of trend of the first wiring route 1 and second connects up line
Angle between the bearing of trend of road 2 is that α, α meet: α=90 °.The projection and first on the first conductive layer of second wiring route 2
The overlapping area of wiring route 1 is only the first wiring route 1 and the area of the second wiring route 2 intersection, the first conductive layer
Interference with the second electrically conductive signal layer also only occurs in the position in the cross point of the first wiring route 1 and the second wiring route 2,
Significantly reduce the signal disturbing between the first conductive layer and the second conductive layer, improve the quality of signal transmission, improve
The performance of product.Simultaneously, it is simple to pcb board 100 connects up.
Describe according to the pcb board 100 of two specific embodiments of the present invention below with reference to Fig. 1 and Fig. 2, described below simply show
Example, it is intended to be used for explaining the present invention, and be not considered as limiting the invention.
Embodiment one
As it is shown in figure 1, pcb board 100 according to embodiments of the present invention, including the conductive layer of multilayer laminated placement, multilamellar is led
Electric layer includes the first conductive layer and second conductive layer adjacent with the first conductive layer, and the first conductive layer is equipped with the first wiring line
Road 1, the second conductive layer is provided with the second wiring route 2, and the area of the first wiring route 1 is S, and the second wiring route 2 is first
Projecting the area overlapping with the first wiring route 1 on conductive layer is S ', S and S ' meet: 1/4≤S '/S≤3/5.
Angle between bearing of trend and the bearing of trend of the second wiring route 2 of the first wiring route 1 is α, α=90 °,
I.e. first wiring route 1 and the second wiring route 2 are vertically arranged.First wiring route 1 is horizontally extending, the second wiring line
Road 2 vertically extends, the second wiring route 2 projecting and the overlapping area of the first wiring route 1 on the first conductive layer
It is only the dry of the first wiring route 1 and the area of the second wiring route 2 intersection, the first conductive layer and the second electrically conductive signal layer
Disturb the position in the cross point also only occurring in the first wiring route 1 and the second wiring route 2, significantly reduce the first conduction
Signal disturbing between layer and the second conductive layer, improves the quality of signal transmission, improves the performance of product.
Embodiment two
As in figure 2 it is shown, the present embodiment is roughly the same with the structure of embodiment one, the difference is that only the first wiring route
The bearing of trend of 1 and the bearing of trend of the second wiring route 2 are identical, second wiring route 2 projection position on the first conductive layer
In the side of the first wiring route 1, the first conductive layer and the interference of the second electrically conductive signal layer only occur in the one of the first wiring route 1
Side, significantly reduces the signal disturbing between the first conductive layer and the second conductive layer, improves the quality of signal transmission, improves
The performance of product.
Meanwhile, adding man-hour carrying out pressing, the first conductive layer and the second conductive layer circuit will not shape bigger offset, really
The thin layer insulation PP sheet 3 between the first conductive layer and the second conductive layer will not be cut off when protecting PCB pressing processing and fabricating, improve PCB
Make yield, it is ensured that semiotic function.
Mobile terminal according to embodiments of the present invention, including above-mentioned pcb board 100, by arranging above-mentioned pcb board 100, permissible
Reduce interfering of signal between the first conductive layer and the second conductive layer, improve the first wiring route 1 and the second wiring route 2
The quality of signal transmission, improves the performance of mobile terminal.
In some embodiments of the invention, mobile terminal is mobile phone, panel computer or notebook computer.When mobile phone, put down
After plate computer or notebook computer use above-mentioned pcb board 100, its performance can be improved.
In describing the invention, it is to be understood that term " on ", D score, " vertically ", the orientation of the instruction such as " level "
Or position relationship is based on orientation shown in the drawings or position relationship, it is for only for ease of the description present invention and simplifies description, and
It not to indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore
It is not considered as limiting the invention.
Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or
Implicitly include at least one this feature.In describing the invention, " multiple " are meant that at least two, such as two, three
Individual etc., unless otherwise expressly limited specifically.
In the present invention, unless otherwise clearly defined and limited, term " install ", " being connected ", " connection ", " fixing " etc.
Term should be interpreted broadly, and connects for example, it may be fixing, it is also possible to be to removably connect, or integral；Can be that machinery connects
Connect, it is also possible to be electrical connection or each other can communication；Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary, permissible
It is connection or the interaction relationship of two elements of two element internals, unless otherwise clear and definite restriction.For this area
For those of ordinary skill, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
In the description of this specification, reference term " embodiment ", " some embodiments ", " example ", " specifically show
Example " or the description of " some examples " etc. means to combine this embodiment or example describes specific features, structure, material or spy
Point is contained at least one embodiment or the example of the present invention.In this manual, to the schematic representation of above-mentioned term not
Identical embodiment or example must be directed to.And, the specific features of description, structure, material or feature can be in office
One or more embodiments or example combine in an appropriate manner.Additionally, in the case of the most conflicting, the skill of this area
The feature of the different embodiments described in this specification or example and different embodiment or example can be tied by art personnel
Close and combination.
Although above it has been shown and described that embodiments of the invention, it is to be understood that above-described embodiment is example
Property, it is impossible to being interpreted as limitation of the present invention, those of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, revises, replaces and modification.
Claims (9)
1. a pcb board, it is characterised in that include the conductive layer of multilayer laminated placement, conductive layer described in multilamellar includes that first leads
Electric layer and second conductive layer adjacent with described first conductive layer, described first conductive layer is equipped with the first wiring route, institute
Stating the second conductive layer and be provided with the second wiring route, the area of described first wiring route is S, and described second wiring route is in institute
Stating and projecting the area overlapping with described first wiring route on the first conductive layer is S ', and described S and described S ' meets: 1/4≤S '/
S≤3/5。
Pcb board the most according to claim 1, it is characterised in that described S and described S ' meets: 1/3≤S '/S≤3/5.
Pcb board the most according to claim 1, it is characterised in that described S and described S ' meets: 1/4≤S '/S≤1/2.
Pcb board the most according to claim 1, it is characterised in that described S and described S ' meets: 1/3≤S '/S≤1/2.
Pcb board the most according to claim 1, it is characterised in that the bearing of trend of described first wiring route and described the
Two wiring route bearing of trends are identical.
Pcb board the most according to claim 1, it is characterised in that the bearing of trend of described first wiring route and described the
Angle between two wiring route bearing of trends is α, and described α meets: 0 ＜ α≤80 °.
Pcb board the most according to claim 1, it is characterised in that the bearing of trend of described first wiring route and described the
Angle between two wiring route bearing of trends is α, and described α meets: α=90 °.
8. a mobile terminal, it is characterised in that include according to the pcb board according to any one of claim 1-7.
Mobile terminal the most according to claim 8, it is characterised in that described mobile terminal is mobile phone, panel computer or pen
Remember this computer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610505735.9A CN106102302B (en) | 2016-06-28 | 2016-06-28 | Pcb board and there is its mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610505735.9A CN106102302B (en) | 2016-06-28 | 2016-06-28 | Pcb board and there is its mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106102302A true CN106102302A (en) | 2016-11-09 |
| CN106102302B CN106102302B (en) | 2018-02-27 |
Family
ID=57214391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610505735.9A Active CN106102302B (en) | 2016-06-28 | 2016-06-28 | Pcb board and there is its mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106102302B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2731907Y (en) * | 2004-08-24 | 2005-10-05 | 华为技术有限公司 | Multilayer printed circuit board |
| US20100200281A1 (en) * | 2009-02-06 | 2010-08-12 | Tatung Company | Circuit board structure |
| CN203608194U (en) * | 2013-10-15 | 2014-05-21 | 深圳市冠旭电子有限公司 | Circuit board with antenna and USB interface, and wireless receiving and transmitting device |
-
2016
- 2016-06-28 CN CN201610505735.9A patent/CN106102302B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2731907Y (en) * | 2004-08-24 | 2005-10-05 | 华为技术有限公司 | Multilayer printed circuit board |
| US20100200281A1 (en) * | 2009-02-06 | 2010-08-12 | Tatung Company | Circuit board structure |
| CN203608194U (en) * | 2013-10-15 | 2014-05-21 | 深圳市冠旭电子有限公司 | Circuit board with antenna and USB interface, and wireless receiving and transmitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106102302B (en) | 2018-02-27 |
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| PB01 | Publication | ||
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| CP03 | Change of name, title or address |
Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Patentee after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: 523859 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Patentee before: Guangdong OPPO Mobile Communications Co., Ltd. |