CN106102307B - Pcb board component and the mobile terminal with it - Google Patents
Pcb board component and the mobile terminal with it Download PDFInfo
- Publication number
- CN106102307B CN106102307B CN201610507604.4A CN201610507604A CN106102307B CN 106102307 B CN106102307 B CN 106102307B CN 201610507604 A CN201610507604 A CN 201610507604A CN 106102307 B CN106102307 B CN 106102307B
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- CN
- China
- Prior art keywords
- chip
- conductive layer
- pcb board
- board component
- groove
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
Abstract
The invention discloses a kind of pcb board component and the mobile terminal with it, wherein, pcb board component includes：Chip；Plate body, plate body is provided with earth point and includes the conductive layer of multilayer laminated placement, and plurality of conductive layers includes the first conductive layer and second conductive layer adjacent with the first conductive layer, and chip is located on the first conductive layer, groove, the conductive layer of groove insertion first are provided with first conductive layer at the position of chip；Electric-conductor, electric-conductor is laid on the second conductive layer and is oppositely arranged with groove, and electric-conductor is electrically connected with earth point.It according to the pcb board component of the present invention, can not only avoid the cabling on plate body from disturbing the work of chip internal, so as to ensure the reliability of the sensitive circuit part work of chip internal, it can also be ensured that the normal work of chip, improve the reliability of pcb board component operation.
Description
Technical field
The present invention relates to technical field of mobile terminals, more particularly, to a kind of pcb board component and the mobile terminal with it.
Background technology
In correlation technique, chip internal has complicated circuit structure, has different circuits in the different place of chip
There is crucial sensitive circuit part in structure, some places, can not notice the cabling on PCB herein when wiring, hold
Easily cause the work that the cabling on PCB interferes with chip internal.
The content of the invention
It is contemplated that at least solving one of technical problem in correlation technique to a certain extent.Therefore, the present invention is carried
Go out a kind of pcb board component, the pcb board component has the advantages that to disturb small to chip.
The present invention also proposes a kind of mobile terminal, and the mobile terminal includes above-mentioned pcb board component.
Pcb board component according to embodiments of the present invention, including：Chip；Plate body, the plate body provided with earth point and including
The conductive layer of multilayer laminated placement, plurality of conductive layers includes the first conductive layer and second conduction adjacent with first conductive layer
Layer, the chip is located on first conductive layer, is provided with groove on first conductive layer at the position of the chip,
First conductive layer described in the groove insertion；Electric-conductor, the electric-conductor be laid on second conductive layer and with it is described recessed
Groove is oppositely arranged, and the electric-conductor is electrically connected with the earth point.
Pcb board component according to embodiments of the present invention, it is conductive by first of the plate body by pcb board component is located on chip
On layer, and groove, the position relative with groove on the second conductive layer are set at the position of close chip on the first conductive layer
Electric-conductor is set and electric-conductor is electrically connected with earth point, can not only avoid the cabling on plate body from disturbing the work of chip internal
Make, so as to ensure the reliability of the sensitive circuit part work of chip internal, it can also be ensured that the normal work of chip, improve
The reliability of pcb board component operation.
According to some embodiments of the present invention, the groove is located at the underface of the chip.
According to some embodiments of the present invention, the groove is multiple and is spaced apart along the circumferential direction of the chip.
According to some embodiments of the present invention, the groove is one and extended along the circumferential direction of the chip.
According to some embodiments of the present invention, the groove is square groove.
According to some embodiments of the present invention, the electric-conductor is copper sheet.
According to some embodiments of the present invention, the sensitive circuit of the chip, which is located at close described the first of the chip, leads
At the position of electric layer.
Mobile terminal according to embodiments of the present invention, including above-mentioned pcb board component.
Mobile terminal according to embodiments of the present invention, by setting above-mentioned pcb board component, can improve mobile terminal work
Reliability.
Brief description of the drawings
Fig. 1 is the structural representation of pcb board component according to embodiments of the present invention；
Fig. 2 is the structural representation of pcb board component according to embodiments of the present invention；
Fig. 3 is the structural representation of pcb board component according to embodiments of the present invention.
Reference：
Pcb board component 100,
Chip 1,
Plate body 2, the first conductive layer 21, the second conductive layer 22, groove 23,
Electric-conductor 3.
Embodiment
Embodiments of the invention are described below in detail, the example of the embodiment is shown in the drawings.Below with reference to
The embodiment of accompanying drawing description is exemplary, it is intended to for explaining the present invention, and be not considered as limiting the invention.
Pcb board component 100 according to embodiments of the present invention is described below with reference to Fig. 1-Fig. 3.
As shown in Figure 1-Figure 3, pcb board component 100 according to embodiments of the present invention, including chip 1, plate body 2 and electric-conductor
3。
Specifically, plate body 2 is provided with earth point and includes the conductive layer of multilayer laminated placement, and plurality of conductive layers includes first
Conductive layer 21 and second conductive layer 22 adjacent with the first conductive layer 21, chip 1 are located on the first conductive layer 21, the first conductive layer
Groove 23, the first conductive layer of insertion 21 of groove 23 are provided with 21 at the position of chip 1.Thus, it is possible to avoid on plate body 2
Cabling on one conductive layer 21 interferes with the work inside chip 1, so as to ensure the sensitive circuit part work inside chip 1
Reliability.Electric-conductor 3 is laid on the second conductive layer 22 and is oppositely arranged with groove 23, and electric-conductor 3 is electrically connected with earth point.By
This can ensure the normal work of chip 1.
Pcb board component 100 according to embodiments of the present invention, passes through the plate body 2 by pcb board component 100 is located on chip 1
On first conductive layer 21, and groove 23 is set at the position of chip 1 on the first conductive layer 21, on the second conductive layer 22
The position relative with groove 23 sets electric-conductor 3 and electric-conductor 3 is electrically connected with earth point, can not only avoid on plate body 2
Work inside cabling interference chip 1, so as to ensure the reliability of the sensitive circuit part work inside chip 1, can also be protected
The normal work of chip 1 is demonstrate,proved, the reliability of the work of pcb board component 100 is improved.
In some embodiments of the invention, as shown in figure 1, groove 23 is located at the underface of chip 1.Thus, not only may be used
To avoid the cabling on plate body 2 from disturbing the work inside chip 1, so as to ensure the sensitive circuit part work inside chip 1
Reliability, it can also be ensured that the normal work of chip 1, improves the reliability of the work of pcb board component 100.Meanwhile, plate can be simplified
The structure of body 2.
In some embodiments of the invention, as shown in Fig. 2 groove 23 is multiple and along chip 1 circumferential direction intervals
Distribution.Thus, the cabling on plate body 2 can be not only avoided to disturb the work inside chip 1, so as to ensure quick inside chip 1
The reliability of inductive circuit part work, it can also be ensured that the normal work of chip 1, improves the reliable of the work of pcb board component 100
Property.Meanwhile, the structure of plate body 2 can be simplified.
In some embodiments of the invention, as shown in figure 3, groove 23 is one and extended along the circumferential direction of chip 1.
Thus, the cabling on plate body 2 can be not only avoided to disturb the work inside chip 1, so as to ensure the sensitive circuit inside chip 1
The reliability of part work, it can also be ensured that the normal work of chip 1, improves the reliability of the work of pcb board component 100.Meanwhile,
The structure of plate body 2 can be simplified.
Alternatively, as shown in Figure 1-Figure 3, groove 23 is square groove, thus, is easy to the processing of groove 23, is conducive to improving
Production efficiency.Preferably, electric-conductor 3 is copper sheet, and copper sheet electric conductivity and thermal conductivity are preferable, are not only easy to the normal work of chip 1
Make, and be easy to the radiating of chip 1.
In some embodiments of the invention, the sensitive circuit of chip 1 is located at the position close to the first conductive layer 21 of chip 1
Put place.Thus, it is possible to which by setting groove 23 on the first conductive layer 21 of plate body 2, the first conductive layer of plate body 2 can be avoided
The cabling interference internal work of chip 1 on 21, so as to ensure the reliability of the sensitive circuit part work inside chip 1.
The pcb board component 100 according to three specific embodiments of the invention, described below are described below with reference to Fig. 1-Fig. 3
It is exemplary, it is intended to for explaining the present invention, and be not considered as limiting the invention.
Embodiment one
As shown in figure 1, pcb board component 100 according to embodiments of the present invention, including chip 1, plate body 2 and electric-conductor 3.
Wherein, plate body 2 is provided with earth point and includes the conductive layer of multilayer laminated placement, and plurality of conductive layers is led including first
Electric layer 21 and second conductive layer 22 adjacent with the first conductive layer 21, chip 1 are located on the first conductive layer 21, the sensitivity of chip 1
Circuit is located at the position of the first conductive layer 21, is located on the first conductive layer 21 at the location directly below of chip 1 provided with side
The groove 23 of shape, the first conductive layer of insertion 21 of groove 23, electric-conductor 3 be copper sheet, electric-conductor 3 be laid on the second conductive layer 22 and
It is oppositely arranged with groove 23, electric-conductor 3 is electrically connected with earth point.
Thus, the cabling on plate body 2 can be not only avoided to disturb the work inside chip 1, so as to ensure inside chip 1
The reliability of sensitive circuit part work, it can also be ensured that the normal work of chip 1, improves the reliable of the work of pcb board component 100
Property.
Embodiment two
As shown in Fig. 2 the present embodiment is roughly the same with the structure of embodiment one, wherein identical part is attached using identical
Icon is remembered, the difference is that only that groove 23 is multiple and is spaced apart along the circumferential direction of chip 1.
Embodiment three
As shown in figure 3, the present embodiment is roughly the same with the structure of embodiment one, wherein identical part is attached using identical
Icon is remembered, the difference is that only that groove 23 extends for one and along the circumferential direction of chip 1.
Mobile terminal according to embodiments of the present invention, including above-mentioned pcb board component 100, by setting above-mentioned pcb board component
100, the reliability of mobile terminal work can be improved.
In some embodiments of the invention, mobile terminal can make mobile phone, notebook computer or put down this computer etc..Work as hand
Machine etc. can improve the reliability of its work using after above-mentioned pcb board component 100.
In the description of the invention, it is to be understood that the term " orientation or position relationship of the instruction such as " center ", " circumference "
For based on orientation shown in the drawings or position relationship, be for only for ease of description the present invention and simplify description, rather than indicate or
Specific orientation must be had, with specific azimuth configuration and operation by implying the device or element of meaning, therefore it is not intended that
Limitation of the present invention.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that indicating or implying relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or
Implicitly include at least one this feature.In the description of the invention, " multiple " are meant that at least two, such as two, three
It is individual etc., unless otherwise specifically defined.
In the present invention, unless otherwise clearly defined and limited, term " installation ", " connected ", " connection ", " fixation " etc.
Term should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integrally；Can be that machinery connects
Connect or electrically connect or can communicate each other；Can be joined directly together, can also be indirectly connected to by intermediary, can be with
It is connection or the interaction relationship of two elements of two element internals, unless otherwise clear and definite restriction.For this area
For those of ordinary skill, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means to combine specific features, structure, material or the spy that the embodiment or example are described
Point is contained at least one embodiment of the present invention or example.In this manual, to the schematic representation of above-mentioned term not
Identical embodiment or example must be directed to.Moreover, specific features, structure, material or the feature of description can be with office
Combined in an appropriate manner in one or more embodiments or example.In addition, in the case of not conflicting, the skill of this area
Art personnel can be tied the not be the same as Example or the feature of example and non-be the same as Example or example described in this specification
Close and combine.
Although embodiments of the invention have been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, one of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changed, replacing and modification.
Claims (7)
1. a kind of pcb board component, it is characterised in that including：
Chip；
Plate body, the plate body is provided with earth point and includes the conductive layer of multilayer laminated placement, and plurality of conductive layers is led including first
Electric layer and second conductive layer adjacent with first conductive layer, the chip are located on first conductive layer, and described first
Groove, the first conductive layer described in the groove insertion are provided with conductive layer at the position of the chip；
Electric-conductor, the electric-conductor is copper sheet, and the electric-conductor is laid on second conductive layer and relative with the groove
Set, the electric-conductor is electrically connected with the earth point.
2. pcb board component according to claim 1, it is characterised in that the groove is located at the underface of the chip.
3. pcb board component according to claim 1, it is characterised in that the groove is multiple and along the week of the chip
It is spaced apart to direction.
4. pcb board component according to claim 1, it is characterised in that the groove is one and along the week of the chip
Extend to direction.
5. pcb board component according to claim 1, it is characterised in that the groove is square groove.
6. pcb board component according to claim 1, it is characterised in that the sensitive circuit of the chip is located at the chip
Close first conductive layer position at.
7. a kind of mobile terminal, it is characterised in that including the pcb board component according to any one of claim 1-6.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710714198.3A CN107613641B (en) | 2016-06-28 | 2016-06-28 | Pcb board component and mobile terminal with it |
| CN201610507604.4A CN106102307B (en) | 2016-06-28 | 2016-06-28 | Pcb board component and the mobile terminal with it |
| PCT/CN2017/080959 WO2018000916A1 (en) | 2016-06-28 | 2017-04-18 | Pcb assembly and mobile terminal having same pcb assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610507604.4A CN106102307B (en) | 2016-06-28 | 2016-06-28 | Pcb board component and the mobile terminal with it |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710714198.3A Division CN107613641B (en) | 2016-06-28 | 2016-06-28 | Pcb board component and mobile terminal with it |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106102307A CN106102307A (en) | 2016-11-09 |
| CN106102307B true CN106102307B (en) | 2017-09-19 |
Family
ID=57215368
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710714198.3A Active CN107613641B (en) | 2016-06-28 | 2016-06-28 | Pcb board component and mobile terminal with it |
| CN201610507604.4A Active CN106102307B (en) | 2016-06-28 | 2016-06-28 | Pcb board component and the mobile terminal with it |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710714198.3A Active CN107613641B (en) | 2016-06-28 | 2016-06-28 | Pcb board component and mobile terminal with it |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN107613641B (en) |
| WO (1) | WO2018000916A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107613641B (en) * | 2016-06-28 | 2019-07-19 | Oppo广东移动通信有限公司 | Pcb board component and mobile terminal with it |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102833947A (en) * | 2012-08-14 | 2012-12-19 | 惠州Tcl移动通信有限公司 | Mobile communication terminal, embedded PCB (printed circuit board) structure and processing method of embedded PCB structure |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01255255A (en) * | 1988-04-05 | 1989-10-12 | Seiko Epson Corp | Package for semiconductor integrated circuit |
| JP2806897B2 (en) * | 1996-07-05 | 1998-09-30 | 埼玉日本電気株式会社 | Multilayer printed circuit board shield structure |
| JP4215495B2 (en) * | 2002-01-10 | 2009-01-28 | 三洋電機株式会社 | WIRING STRUCTURE, ITS MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE AND WIRING BOARD HAVING WIRING STRUCTURE |
| FI20031796A (en) * | 2003-12-09 | 2005-06-10 | Asperation Oy | A method of constructing an EMI shield around a component to be embedded in a circuit board |
| CN203353037U (en) * | 2012-12-28 | 2013-12-18 | 中怡(苏州)科技有限公司 | Wireless module |
| CN103137609B (en) * | 2013-03-04 | 2015-12-09 | 华进半导体封装先导技术研发中心有限公司 | With the integrated circuit package structure of electromagnetic armouring structure |
| CN104144598B (en) * | 2013-05-08 | 2018-02-02 | 鸿富锦精密工业（深圳）有限公司 | Radome and circuit board fixation structure |
| CN204721711U (en) * | 2015-05-07 | 2015-10-21 | 深圳市星之光实业发展有限公司 | A kind of multilayer circuit board |
| CN107613641B (en) * | 2016-06-28 | 2019-07-19 | Oppo广东移动通信有限公司 | Pcb board component and mobile terminal with it |
-
2016
- 2016-06-28 CN CN201710714198.3A patent/CN107613641B/en active Active
- 2016-06-28 CN CN201610507604.4A patent/CN106102307B/en active Active
-
2017
- 2017-04-18 WO PCT/CN2017/080959 patent/WO2018000916A1/en active Application Filing
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102833947A (en) * | 2012-08-14 | 2012-12-19 | 惠州Tcl移动通信有限公司 | Mobile communication terminal, embedded PCB (printed circuit board) structure and processing method of embedded PCB structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107613641B (en) | 2019-07-19 |
| WO2018000916A1 (en) | 2018-01-04 |
| CN106102307A (en) | 2016-11-09 |
| CN107613641A (en) | 2018-01-19 |
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| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523859 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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