FI20031796A - A method of constructing an EMI shield around a component to be embedded in a circuit board - Google Patents

A method of constructing an EMI shield around a component to be embedded in a circuit board Download PDF

Info

Publication number
FI20031796A
FI20031796A FI20031796A FI20031796A FI20031796A FI 20031796 A FI20031796 A FI 20031796A FI 20031796 A FI20031796 A FI 20031796A FI 20031796 A FI20031796 A FI 20031796A FI 20031796 A FI20031796 A FI 20031796A
Authority
FI
Finland
Prior art keywords
constructing
embedded
component
circuit board
emi shield
Prior art date
Application number
FI20031796A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI20031796A0 (en
Inventor
Esa Muukkonen
Original Assignee
Asperation Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asperation Oy filed Critical Asperation Oy
Priority to FI20031796A priority Critical patent/FI20031796A/en
Publication of FI20031796A0 publication Critical patent/FI20031796A0/en
Priority to CN 200480036607 priority patent/CN1891023A/en
Priority to EP04805147A priority patent/EP1692926A1/en
Priority to JP2006543565A priority patent/JP2007514309A/en
Priority to PCT/FI2004/000752 priority patent/WO2005057999A1/en
Publication of FI20031796A publication Critical patent/FI20031796A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
FI20031796A 2003-12-09 2003-12-09 A method of constructing an EMI shield around a component to be embedded in a circuit board FI20031796A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FI20031796A FI20031796A (en) 2003-12-09 2003-12-09 A method of constructing an EMI shield around a component to be embedded in a circuit board
CN 200480036607 CN1891023A (en) 2003-12-09 2004-12-09 Method for constructing emi shielding around a component embedded in a circuit board
EP04805147A EP1692926A1 (en) 2003-12-09 2004-12-09 Method for constructing emi shielding around a component embedded in a circuit board
JP2006543565A JP2007514309A (en) 2003-12-09 2004-12-09 Method for building an EMI shield around a component embedded in a circuit board
PCT/FI2004/000752 WO2005057999A1 (en) 2003-12-09 2004-12-09 Method for constructing emi shielding around a component embedded in a circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20031796A FI20031796A (en) 2003-12-09 2003-12-09 A method of constructing an EMI shield around a component to be embedded in a circuit board

Publications (2)

Publication Number Publication Date
FI20031796A0 FI20031796A0 (en) 2003-12-09
FI20031796A true FI20031796A (en) 2005-06-10

Family

ID=29763494

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20031796A FI20031796A (en) 2003-12-09 2003-12-09 A method of constructing an EMI shield around a component to be embedded in a circuit board

Country Status (5)

Country Link
EP (1) EP1692926A1 (en)
JP (1) JP2007514309A (en)
CN (1) CN1891023A (en)
FI (1) FI20031796A (en)
WO (1) WO2005057999A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101562951B (en) * 2008-04-18 2011-05-11 欣兴电子股份有限公司 Circuit board and manufacture method thereof
JP5139156B2 (en) * 2008-05-30 2013-02-06 タツタ電線株式会社 Electromagnetic shielding material and printed wiring board
FI20095110A0 (en) 2009-02-06 2009-02-06 Imbera Electronics Oy Electronic module with EMI protection
FR2952428B1 (en) * 2009-11-12 2011-12-16 Sagem Defense Securite INERTIAL SENSOR
CN101795524B (en) * 2009-12-31 2013-06-19 浙江阳光照明电器集团股份有限公司 Compact bracket lamp
CN102378464A (en) * 2010-08-12 2012-03-14 环鸿科技股份有限公司 Circuit board module
CN102740608A (en) * 2011-04-15 2012-10-17 常熟东南相互电子有限公司 Combined-type circuit board and manufacturing method thereof
JP5931547B2 (en) * 2012-03-30 2016-06-08 イビデン株式会社 Wiring board and manufacturing method thereof
CN104066273A (en) * 2013-03-20 2014-09-24 深南电路有限公司 Package substrate and manufacturing method thereof, and substrate assembly
CN104080280B (en) * 2013-03-26 2017-08-08 深南电路有限公司 A kind of package substrate unit and preparation method thereof and board unit
CN104080274B (en) * 2013-03-29 2016-12-28 深南电路有限公司 A kind of base plate for packaging and preparation method thereof and board unit
DE102014219792A1 (en) * 2014-09-30 2016-03-31 Technische Universität Berlin Optoelectronic component
US10321569B1 (en) 2015-04-29 2019-06-11 Vpt, Inc. Electronic module and method of making same
CN107613641B (en) * 2016-06-28 2019-07-19 Oppo广东移动通信有限公司 Pcb board component and mobile terminal with it
CN106535472B (en) * 2017-01-12 2019-08-02 郑州云海信息技术有限公司 A kind of PCB and signal transmission system
CN110300492B (en) * 2019-07-25 2021-03-30 生益电子股份有限公司 PCB manufacturing method and PCB

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6131269A (en) * 1998-05-18 2000-10-17 Trw Inc. Circuit isolation technique for RF and millimeter-wave modules
US6916122B2 (en) * 2002-03-05 2005-07-12 Jds Uniphase Corporation Modular heat sinks
EP1510844A1 (en) * 2003-08-28 2005-03-02 Siemens Aktiengesellschaft An optical fibre connector with electromagnetic shielding

Also Published As

Publication number Publication date
EP1692926A1 (en) 2006-08-23
FI20031796A0 (en) 2003-12-09
WO2005057999A1 (en) 2005-06-23
CN1891023A (en) 2007-01-03
JP2007514309A (en) 2007-05-31

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Legal Events

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Owner name: ASPOCOMP TECHNOLOGY OY

Free format text: ASPOCOMP TECHNOLOGY OY

MA Patent expired