CN106097701A - A kind of infrared chip test platform based on FPGA - Google Patents

A kind of infrared chip test platform based on FPGA Download PDF

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Publication number
CN106097701A
CN106097701A CN201610612094.7A CN201610612094A CN106097701A CN 106097701 A CN106097701 A CN 106097701A CN 201610612094 A CN201610612094 A CN 201610612094A CN 106097701 A CN106097701 A CN 106097701A
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CN
China
Prior art keywords
module
fpga
infrared
chip
platform based
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Pending
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CN201610612094.7A
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Chinese (zh)
Inventor
孙继炜
蒋超
魏昊
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STEADICHIPS Inc
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STEADICHIPS Inc
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Priority to CN201610612094.7A priority Critical patent/CN106097701A/en
Publication of CN106097701A publication Critical patent/CN106097701A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G08SIGNALLING
    • G08CTRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C25/00Arrangements for preventing or correcting errors; Monitoring arrangements
    • GPHYSICS
    • G08SIGNALLING
    • G08CTRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C23/00Non-electrical signal transmission systems, e.g. optical systems
    • G08C23/04Non-electrical signal transmission systems, e.g. optical systems using light waves, e.g. infrared

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

The present invention relates to Analogous Integrated Electronic Circuits field tests, it is specially a kind of infrared chip test platform based on FPGA, its simple in construction, ensure that test effect, easy to use, it includes FPGA module and the I/O module being connected with described FPGA module, filter circuit, power module, radiating circuit, crystal oscillator module, LED display module, described FPGA module is for changing protocol mode and the infrared signal decoding of data, described I/O module includes the I/O interface being connected with infrared chip and the I/O interface connected with PC end, described radiating circuit launches power for analog transmissions and the distance of reception by changing, described display module includes the bit error rate for display, noise and pulsewidth are in interior information.

Description

A kind of infrared chip test platform based on FPGA
Technical field
The present invention relates to Analogous Integrated Electronic Circuits field tests, a kind of infrared chip test platform based on FPGA.
Background technology
Long-distance infrared remote-controlled is a kind of wireless, non-contact control technology, have that capacity of resisting disturbance is strong, information transmission is reliable, The remarkable advantages such as low in energy consumption, low cost, easy realization, widely used by many electronic equipments particularly household electrical appliance, and increasingly Many is applied in computer system.
In infrared remote controller, like product uses identical remote control frequency or coding.And may before different products Have different remote control frequencies or coding.Will not interfere with each other before so can making different remote controllers.But this is to infrared Receive chip testing and propose the highest requirement.Need to test different frequencies and different coded systems.
The most common method of testing, is all to test infrared receiver chip by single-chip microcomputer.But it is relative to FPGA, single The application under high velocity environment of the sheet machine is the most limited.
FPGA manipulation level is lower, can the bigger chip of design freedom, be converted to after FPGA is programmed in compiling Circuit connection netlist within FPGA, is equivalent to provide the basic numbers such as substantial amounts of NAND gate, nor gate, trigger inside FPGA Word circuit devcie, programming determines how many devices to be used to and annexation between them, as long as FPGA scale is enough big, These digital devices can form all digital display circuits in theory, including single-chip microcomputer even CPU, FPGA in anti-interference and speed Have great advantage.
FPGA is owing to being hardware circuit, and the speed of service directly depends on crystal oscillator speed, system stability, is particularly suitable for connecing at a high speed Mouthful circuit, it realizes principle: FPGA major part is that hardware HDL language is parallel;Single-chip microcomputer owing to being single-threaded, Program statement needs to wait that the single-chip microcomputer cycle could perform, and it realizes principle: scm software programmed order Perform.
Although FPGA has above-mentioned benefit, but currently without the survey well using FPGA that infrared remote control is tested Examination platform, common is all to need two pieces of circuit boards to realize, and one is used for launching signal, and one is used for receiving signal, structure More complicated, also need to separate relatively large distance during use and could realize signal transmitting reception, very inconvenient.
Summary of the invention
In order to solve the problems referred to above, the invention provides a kind of infrared chip test platform based on FPGA, its structure letter Single, it is possible to ensure test effect, easy to use.
Its technical scheme is such that a kind of infrared module test platform based on FPGA, it is characterised in that it includes FPGA module and the I/O module being connected with described FPGA module, filter circuit, power module, radiating circuit, crystal oscillator module, LED Display module and infrared receiving terminal, described FPGA module is for changing protocol mode and infrared signal decoding, the described IO of data Module includes the I/O interface being connected with infrared chip and the I/O interface connected with PC end, and described radiating circuit launches merit by changing Rate is used for analog transmissions and the distance of reception, and described display module is for showing the letter including the bit error rate, noise and pulsewidth Breath.
It is further characterized by, and described I/O module also includes PC communication interface and wafer test interface;
Described LED display module includes multiple LED light;
Described radiating circuit includes the DAC chip that I2C controls, being connected by I2C bus of described DA chip, institute with FPGA module The outfan stating DA chip connects infrared emission head and the colelctor electrode of audion, and the base stage of described audion connects institute by resistance State fpga chip;
Described infrared receiving terminal and described radiating circuit are respectively provided with four.
After using the test platform of the present invention, infrared receiving terminal can receive infrared signal, after being decoded by FPGA module Being sent to PC, PC can carry out the operations such as comparing calculation after collecting data, it is achieved multiple encoded test, the bit error rate are surveyed The operations such as examination, noise and pulsewidth test, and it is provided with radiating circuit, only need a FPGA module can realize launching and receiving Function, simple in construction, easy to use;Can realize wafer test after being provided with wafer interface, spare interface can continue to increase Add type of coding and the parameter of test of needs test, be further ensured that test effect, and infrared receiving terminal and radiating circuit are equal After arranging four, four drive test examinations can be realized simultaneously, improve testing efficiency.
Accompanying drawing explanation
Fig. 1 is principle of the invention schematic diagram;
Fig. 2 is FPGA module circuit theory diagrams of the present invention;
Fig. 3 is power module circuitry schematic diagram of the present invention;
Fig. 4 is filter circuit schematic diagram of the present invention;
Fig. 5 is LDO modular circuit schematic diagram of the present invention;
Fig. 6 is radiating circuit schematic diagram of the present invention;
Fig. 7 is crystal oscillator module circuit theory diagrams of the present invention;
Fig. 8 is LED display module circuit theory diagrams of the present invention.
Detailed description of the invention
Such as Fig. 1, shown in Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6, Fig. 7, Fig. 8, a kind of infrared chip test platform based on FPGA, It includes FPGA module and the I/O module being connected with described FPGA module, filter circuit, power module, radiating circuit, crystal oscillator mould Block, LED display module, FPGA module is for changing protocol mode and the infrared signal decoding of data, and in accompanying drawing 3, I/O module includes I/O interface, reserved PC communication interface P10, wafer test interface P20, radiating circuit is used for simulating by changing transmitting power Launch and receive distance, radiating circuit has four, each radiating circuit include the chip U2 in a DA chip, i.e. accompanying drawing 6, Chip U3, chip U4, chip U5, the input of DA chip connects FPGA module, and the outfan of DA chip connects infrared emission head LED1 and the colelctor electrode of 9014 audions, the base stage of 9014 audions connects fpga chip by resistance, by I2C universal serial bus Control the electric current of DA chip, change emission current, thus the far and near of simulated range changes.Multiple LED instruction in LED display module Lamp plays indicative function.
FPGA module all uses AlterFPGA and crystal oscillator module to use 100MHz crystal oscillator, and sample rate is fast, can be as accurate as Ns rank, and single-chip microcomputer may be only accurate to microsecond rank.Degree of accuracy has the gap of about 100 times.
Two kind actual test patterns are set forth below:
The most kinds of coding protocol tests, error rate test scheme: data are issued by I/O interface by PC according to a definite sequence FPGA module, the data received are converted to corresponding protocol form by FPGA module again, simultaneously by data back to PC.FPGA The data solved are issued PC by serial ports by the infrared signal decoding that module can also will receive.Send the good institute received Information is had all to be collected by PC, the data being sent by contrast and receiving, calculate the corresponding bit error rate.
2. noise and pulsewidth test: IR remote controller launches infrared signal, and this infrared signal is sampled by FPGA module, Measuring the major parameter such as noise, pulsewidth simultaneously, and be sent to PC by serial communication, data collected by PC, simultaneously at PC On can demonstrate the information such as the bit error rate, noise and pulsewidth.
FPGA is the hardware circuit write by HDL language, can be with executed in parallel, and the function of single-chip microcomputer is to pass through software Realize, be that single-threaded execution, accuracy and speed all do not have the outstanding code of FPGA to write according to standard agreement during execution, it is ensured that survey Test result standard, reliable, such as NEC agreement Plays is 560us, and some equipment is to process data according to 500us;PC with Launch and in the middle of FPGA, use remote " wireless transparent transmission " to communicate, do not interfere with mutually with infrared signal, be suitable for distance Test, will not be restricted by cable;The data of all tests all can upload to PC, it is simple to carries out the finishing analysis of data; Reserve some interfaces in a program, function can have been increased as required, expand range.

Claims (5)

1. an infrared module test platform based on FPGA, it is characterised in that it include FPGA module and with described FPGA mould I/O module, filter circuit, power module, radiating circuit, crystal oscillator module, LED display module and the infrared receiving terminal that block is connected, institute Stating FPGA module for changing the protocol mode of data and infrared signal decoding, described I/O module includes being connected with infrared chip The I/O interface that I/O interface and I connect with PC end, described radiating circuit launches power for analog transmissions and reception by changing Distance, described display module is for showing the information including the bit error rate, noise and pulsewidth.
A kind of infrared module test platform based on FPGA the most according to claim 1, it is characterised in that described I/O module Also include PC communication interface and wafer test interface.
A kind of infrared module test platform based on FPGA the most according to claim 1, it is characterised in that described LED shows Show that module includes multiple LED light.
A kind of infrared module test platform based on FPGA the most according to claim 1, it is characterised in that described transmitting electricity Road includes the DAC chip that I2C controls, being connected by I2C bus of described DA chip, the output of described DA chip with FPGA module End connects infrared emission head and the colelctor electrode of audion, and the base stage of described audion connects described fpga chip by resistance.
A kind of infrared module test platform based on FPGA the most according to claim 1, it is characterised in that described infrared connect Receive head and be respectively provided with four with described radiating circuit.
CN201610612094.7A 2016-07-29 2016-07-29 A kind of infrared chip test platform based on FPGA Pending CN106097701A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610612094.7A CN106097701A (en) 2016-07-29 2016-07-29 A kind of infrared chip test platform based on FPGA

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610612094.7A CN106097701A (en) 2016-07-29 2016-07-29 A kind of infrared chip test platform based on FPGA

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110764075A (en) * 2019-07-29 2020-02-07 南京芯视界微电子科技有限公司 Laser radar receiving chip test system
CN116846488A (en) * 2023-08-29 2023-10-03 深圳市美矽微半导体有限公司 Performance comprehensive test method and system for infrared emission chip

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Publication number Priority date Publication date Assignee Title
CN101136139A (en) * 2007-09-06 2008-03-05 中兴通讯股份有限公司 Automatization test system and method simulating infrared remote-controller
CN101452643A (en) * 2007-11-30 2009-06-10 无锡华润矽科微电子有限公司 Learning type infrared remote-controller
CN101887636A (en) * 2009-05-13 2010-11-17 深圳市汇川信息技术有限公司 Infrared signal transmission circuit of remote controller
CN201716854U (en) * 2010-07-19 2011-01-19 王志良 Learning transponder and remote controller and integrated control system provided with same
CN102339528A (en) * 2010-07-19 2012-02-01 厦门哈隆电子有限公司 Multifunctional infrared testing instrument
CN102682589A (en) * 2012-01-09 2012-09-19 西安智意能电子科技有限公司 System for distant control of controlled device
CN104680771A (en) * 2015-03-20 2015-06-03 蒋海兵 Device and method for testing infrared remote controller
CN105809948A (en) * 2014-12-29 2016-07-27 西安Tcl软件开发有限公司 Automatic testing method and system for infrared control equipment
CN206431814U (en) * 2016-07-29 2017-08-22 无锡思泰迪半导体有限公司 Infrared chip test platform based on FPGA

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101136139A (en) * 2007-09-06 2008-03-05 中兴通讯股份有限公司 Automatization test system and method simulating infrared remote-controller
CN101452643A (en) * 2007-11-30 2009-06-10 无锡华润矽科微电子有限公司 Learning type infrared remote-controller
CN101887636A (en) * 2009-05-13 2010-11-17 深圳市汇川信息技术有限公司 Infrared signal transmission circuit of remote controller
CN201716854U (en) * 2010-07-19 2011-01-19 王志良 Learning transponder and remote controller and integrated control system provided with same
CN102339528A (en) * 2010-07-19 2012-02-01 厦门哈隆电子有限公司 Multifunctional infrared testing instrument
CN102682589A (en) * 2012-01-09 2012-09-19 西安智意能电子科技有限公司 System for distant control of controlled device
CN105809948A (en) * 2014-12-29 2016-07-27 西安Tcl软件开发有限公司 Automatic testing method and system for infrared control equipment
CN104680771A (en) * 2015-03-20 2015-06-03 蒋海兵 Device and method for testing infrared remote controller
CN206431814U (en) * 2016-07-29 2017-08-22 无锡思泰迪半导体有限公司 Infrared chip test platform based on FPGA

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110764075A (en) * 2019-07-29 2020-02-07 南京芯视界微电子科技有限公司 Laser radar receiving chip test system
CN110764075B (en) * 2019-07-29 2020-04-17 南京芯视界微电子科技有限公司 Laser radar receiving chip test system
CN116846488A (en) * 2023-08-29 2023-10-03 深圳市美矽微半导体有限公司 Performance comprehensive test method and system for infrared emission chip
CN116846488B (en) * 2023-08-29 2023-11-14 深圳市美矽微半导体有限公司 Performance comprehensive test method and system for infrared emission chip

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Application publication date: 20161109

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