CN106094154A - A kind of optoelectronic package window - Google Patents
A kind of optoelectronic package window Download PDFInfo
- Publication number
- CN106094154A CN106094154A CN201610416397.1A CN201610416397A CN106094154A CN 106094154 A CN106094154 A CN 106094154A CN 201610416397 A CN201610416397 A CN 201610416397A CN 106094154 A CN106094154 A CN 106094154A
- Authority
- CN
- China
- Prior art keywords
- substrate
- lens
- hole
- support
- hemispherical lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
Abstract
The invention discloses a kind of optoelectronic package window.It includes support, substrate, through hole is left in the middle of described support, it is provided with substrate below through hole, described substrate width is more than through-hole diameter and is less than shelf inner diameter, passing through sealing-in solder connection between substrate and support, described substrate upper and lower surface is respectively arranged with two hemispherical lens, and lens above are symmetrical two-by-two with following lens, described hemispherical lens is semielliptical shape lens, and described substrate is one-body molded with hemispherical lens.Substrate bonding of the present invention is firm, is not likely to produce aberration, thus overall good to the laser propagation effect of light.
Description
Technical field
The present invention relates to field of photoelectric technology, specifically a kind of optoelectronic package window.
Background technology
Photoelectric technology is based on photoelectronics, comprehensive utilization optics, precision optical machinery, electronics and computer technology solution
The certainly technology-oriented discipline of various engineer applied problems, as information carrier is just expanded to optical band by electromagnetic wave band, so that photoelectricity
Science and light mechanical and electrical integration concentrate on optical information obtain, transmission, process, record, storage, the photoelectricity of display and sensing etc.
In information industry.Current photoelectric device application is more and more extensive, and photovoltaic industry is at optical communication, laser, photoelectric display, optics, too
It is obvious that the fields such as sun energy photovoltaic, electronic engineering, logistics net are developed, and gradually incorporates wider array of space.With sending out of technology
Exhibition, photoelectric device species also gets more and more, and the encapsulation of photoelectric device is also a part critically important in field of photoelectric technology, and
Package window therein is most important, and its light transmission is very big to the function effect of whole electrooptical device, and its material using is not
With the effect of generation also differs, but its material is it has been determined that your translucent effect also just determines, and therefore light transmission is not sometimes
The demand of reality can be met.
Content of the invention
It is an object of the invention to provide a kind of optoelectronic package window, its substrate bonding is firm, is not likely to produce aberration, thus whole
Body is good to the laser propagation effect of light.
It is an object of the invention to be achieved through the following technical solutions: it includes support, substrate, leaves in the middle of described support
Through hole, is provided with substrate below through hole, and described substrate width is more than through-hole diameter and is less than shelf inner diameter, substrate and support it
Between pass through sealing-in solder connection, described substrate upper and lower surface is respectively arranged with two hemispherical lens, and lens above with under
The lens in face are symmetrical two-by-two, and described hemispherical lens is semielliptical shape lens, and described substrate is one-body molded with hemispherical lens.
It is an advantage of the current invention that: substrate bonding of the present invention is firm, is not likely to produce aberration, so the overall transmission effect to light
Really good.
Brief description
Fig. 1 is the structural representation of the present invention；
Fig. 2 is the structural representation of substrate of the present invention.
Detailed description of the invention
See Fig. 1-2, a kind of optoelectronic package window, it includes leaving through hole 3 in the middle of support the 1st, 2, base, described support 1,
Being provided with substrate 2 below through hole 3, described substrate 2 width is more than through hole 3 diameter and is less than support 1 internal diameter, substrate 2 and support 1
Between connected by sealing-in solder 4, described substrate 2 upper and lower surface is respectively arranged with two hemispherical lens 5, and lens above
Symmetrical two-by-two with following lens, described hemispherical lens is semielliptical shape lens, described substrate 2 and hemispherical lens 5 one
Shaping.
It is bonding with support that substrate is passed through solder below through hole by the present invention, and arranges substrate width straight more than through hole
Footpath and be less than shelf inner diameter, so after bonding, solder both will not overflow, and filling effect is best, and bonding is firm, additionally will
Substrate is one-body molded with hemispherical lens, and so overall material is identical, will not form intersection, the conduction effects effect one to light
Causing, the additionally hemispherical lens in substrate symmetry setting up and down, light thus being made to inject and penetrate symmetry, effect is mutually rectified
Just, and hemispherical lens is arranged in semielliptical shape, be therefore not likely to produce aberration, so overall good to the laser propagation effect of light.
Embodiment described above is the one preferably scheme of the present invention, not makees the present invention any pro forma
Limit, on the premise of without departing from technical scheme described in claim, also have other variant and remodeling.
Claims (1)
1. an optoelectronic package window, it is characterised in that it includes support, substrate, leaves through hole, at through hole in the middle of described support
Lower section is provided with substrate, and described substrate width is more than through-hole diameter and is less than shelf inner diameter, passes through sealing-in between substrate and support
Solder connection, described substrate upper and lower surface is respectively arranged with two hemispherical lens, and lens above and following lens two
Two is symmetrical, and described hemispherical lens is semielliptical shape lens, and described substrate is one-body molded with hemispherical lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610416397.1A CN106094154A (en) | 2016-06-13 | 2016-06-13 | A kind of optoelectronic package window |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610416397.1A CN106094154A (en) | 2016-06-13 | 2016-06-13 | A kind of optoelectronic package window |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106094154A true CN106094154A (en) | 2016-11-09 |
Family
ID=57846132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610416397.1A Pending CN106094154A (en) | 2016-06-13 | 2016-06-13 | A kind of optoelectronic package window |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106094154A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009245975A (en) * | 2008-03-28 | 2009-10-22 | Nippon Electric Glass Co Ltd | Optical cap component |
| US20100172037A1 (en) * | 2009-01-06 | 2010-07-08 | Hitachi Cable, Ltd. | Optical module |
| CN103066080A (en) * | 2011-10-21 | 2013-04-24 | 奇景光电股份有限公司 | Manufacture method of optical sensing module |
| CN203337901U (en) * | 2013-05-03 | 2013-12-11 | 张永昇 | Optical element and cover body of the optical element |
| TW201447387A (en) * | 2013-04-12 | 2014-12-16 | Heptagon Micro Optics Pte Ltd | Lens array packages and image capturing devices incorporating the same |
-
2016
- 2016-06-13 CN CN201610416397.1A patent/CN106094154A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009245975A (en) * | 2008-03-28 | 2009-10-22 | Nippon Electric Glass Co Ltd | Optical cap component |
| US20100172037A1 (en) * | 2009-01-06 | 2010-07-08 | Hitachi Cable, Ltd. | Optical module |
| CN103066080A (en) * | 2011-10-21 | 2013-04-24 | 奇景光电股份有限公司 | Manufacture method of optical sensing module |
| TW201447387A (en) * | 2013-04-12 | 2014-12-16 | Heptagon Micro Optics Pte Ltd | Lens array packages and image capturing devices incorporating the same |
| CN203337901U (en) * | 2013-05-03 | 2013-12-11 | 张永昇 | Optical element and cover body of the optical element |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20161109 |