CN106082116A - Micro-nano technology equipment and process operation device thereof - Google Patents
Micro-nano technology equipment and process operation device thereof Download PDFInfo
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- CN106082116A CN106082116A CN201610718371.2A CN201610718371A CN106082116A CN 106082116 A CN106082116 A CN 106082116A CN 201610718371 A CN201610718371 A CN 201610718371A CN 106082116 A CN106082116 A CN 106082116A
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- flexible hinge
- process operation
- platform
- operation device
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
Abstract
The invention discloses the process operation device of a kind of micro-nano technology equipment, including pedestal platform, cutter be installed on described pedestal platform and for the driving means driving described cutter to move, including three described driving means, and the direction that three described driving means drive described cutter to move is for be mutually perpendicular to two-by-two.Multiple degrees of freedom and the requirement of big stroke in actual tests can be met, can be significantly improved in terms of machining accuracy again, it is possible to achieve the micro-nano technology of microminiature labyrinth.There is multiple degrees of freedom, big stroke and high manufacturing accuracy.The invention also discloses a kind of micro-nano technology equipment including above-mentioned process operation device.
Description
Technical field
The present invention relates to micro-nano technology field, particularly relate to the process operation device of a kind of micro-nano technology equipment.Additionally, this
Invention further relates to a kind of micro-nano technology equipment including above-mentioned process operation device.
Background technology
Micro-nano technology technology is increasingly by concern both domestic and external, along with the development of micro & nano technology, and many application necks
Territory proposes more requirement to micro/nano level micro-nano technology technology.And study at present and be concentrated mainly on the execution of one-dimensional micro-nano technology
Mechanism designs, and it is short and small generally to there is movement travel, and degree of freedom is single, it is impossible to realize the tool-path planning such as " non-parameter ", difficult
To realize the problem that complex surface pattern actively controls.
The location micro-nano technology operator often stroke that the most existing precision is high is little, it is impossible to more than meeting in actual tests certainly simultaneously
By degree and the requirement of big stroke；And be significantly improved in terms of machining accuracy, but it is difficult to the micro-of microminiature labyrinth
Receive processing.
Therefore, how providing a kind of process operation device with multiple degrees of freedom, big stroke and high manufacturing accuracy is this area
Technical staff is presently required and solves the technical problem that.
Summary of the invention
It is an object of the invention to provide the process operation device of a kind of micro-nano technology equipment, have multiple degrees of freedom, big stroke and
High manufacturing accuracy.It is a further object of the present invention to provide a kind of micro-nano technology equipment including above-mentioned process operation device, have many
Degree of freedom, big stroke and high manufacturing accuracy.
For solve above-mentioned technical problem, the present invention provides the process operation device of a kind of micro-nano technology equipment, including pedestal platform,
Cutter and be installed on described pedestal platform and for the driving means driving described cutter to move, including three described driving means,
And three described driving means drive direction that described cutter moves for be mutually perpendicular to two-by-two.
Preferably, described driving means includes piezoelectric ceramic actuator and flexible hinge amplifier, and described piezoelectric ceramics drives
One end of dynamic device is fixing connects described pedestal platform, and the other end of described piezoelectric ceramic actuator connects described flexible hinge amplifier
One end, the other end of described flexible hinge amplifier connects described cutter.
Preferably, described flexible hinge amplifier includes fixing seat and the first input platform, and is symmetricly set in described
Two second input platforms, two the first levers, two the second levers and two the 3rd levers, the institute at the first input platform two ends
Stating fixing seat and be fixedly installed in described pedestal platform, the middle part of described first input platform connects described piezoelectric ceramic actuator, institute
The one end stating the first input platform connects the middle part of described second input platform by the first flexible hinge；
Described second input platform passes through the second flexible hinge away from one end of the axis of symmetry of described flexible hinge amplifier
Connecting described first lever near one end of described axis of symmetry, the middle part of described first lever connects institute by the 3rd flexible hinge
State fixing seat；
Described second input platform connects described second lever near one end of described axis of symmetry by the 4th flexible hinge
Middle part, described second lever connects described fixing seat near one end of described axis of symmetry by the 5th flexible hinge, described the
The other end of two levers connects the middle part of described 3rd lever by the 6th flexible hinge；
Described 3rd lever connects outfan, described outfan near one end of described axis of symmetry by the 7th flexible hinge
Connecting described cutter by the 8th flexible hinge, the other end of described 3rd lever connects described first by the 9th flexible hinge
Lever is away from one end of described axis of symmetry.
Preferably, described first flexible hinge, described second flexible hinge, described 3rd flexible hinge, described 4th soft
Property hinge and described 5th flexible hinge are specially circular arc type flexible hinge, described 6th flexible hinge, the 7th flexible hinge and
8th flexible hinge is specially rounding straight beam type flexible hinge, and described 9th flexible hinge is specially straight beam type flexible hinge.
Preferably, described cutter includes moving platform and is installed on the cutter head of described moving platform, and described moving platform connects described
Flexible hinge amplifier.
Preferably, described piezoelectric ceramic actuator connects described pedestal platform by sleeve is fixing.
Preferably, described fixing seat is fixedly installed in baffle plate by countersunk head soket head cap screw, and described baffle plate is by fixing gear
Sheet and countersunk head soket head cap screw are installed on described pedestal platform.
Preferably, the direction that described flexible hinge amplifier drives described cutter to move is vertical direction, another two
The direction that described flexible hinge amplifier drives described cutter to move is horizontal direction and is mutually perpendicular to.
The present invention provides a kind of micro-nano technology equipment, including lathe and the process operation device that is installed on described lathe, institute
Stating process operation implement body is the process operation device described in above-mentioned any one.
Preferably, described micro-nano technology equipment is specially micro-structure surface diamond micro-nano cutting machine tool.
The process operation device that the present invention provides, including pedestal platform, cutter be installed on pedestal platform and for driving cutter to move
Dynamic driving means, including three driving means, and the direction that three driving means drive cutter to move is for be mutually perpendicular to two-by-two.
Owing to being provided with three driving means, cutter can be driven up in three the most orthogonal sides and move, make equipment have
Three processing degree of freedom, it is possible to realize the tool-path planning such as " non-parameter ", and be capable of the actively control of complex surface pattern
System.Multiple degrees of freedom and the requirement of big stroke in actual tests can be met, can be significantly improved in terms of machining accuracy again, permissible
Realize the micro-nano technology of microminiature labyrinth.There is multiple degrees of freedom, big stroke and high manufacturing accuracy.
The present invention also provides for a kind of micro-nano technology equipment including above-mentioned process operation device, due to above-mentioned process operation utensil
There are above-mentioned technique effect, above-mentioned micro-nano technology equipment also should have same technique effect, no longer be discussed in detail at this.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of detailed description of the invention of process operation device provided by the present invention；
Fig. 2 be process operation device provided by the present invention a kind of detailed description of the invention in the structure of flexible hinge amplifier
Schematic diagram.
Detailed description of the invention
The core of the present invention is to provide the process operation device of a kind of micro-nano technology equipment, have multiple degrees of freedom, big stroke and
High manufacturing accuracy.Another core of the present invention is to provide a kind of micro-nano technology equipment including above-mentioned process operation device, has many
Degree of freedom, big stroke and high manufacturing accuracy.
In order to make those skilled in the art be more fully understood that the present invention program, below in conjunction with the accompanying drawings and detailed description of the invention
The present invention is described in further detail.
Refer to the structure of a kind of detailed description of the invention that Fig. 1 and Fig. 2, Fig. 1 are process operation device provided by the present invention
Schematic diagram；Fig. 2 be process operation device provided by the present invention a kind of detailed description of the invention in the structure of flexible hinge amplifier
Schematic diagram.
The process operation device that the specific embodiment of the invention provides, including pedestal platform 1, cutter 3 and three driving means, three
Individual driving means is mounted on pedestal platform 1 and for driving cutter 3 to move, and the side that three driving means drive cutter 3 to move
To for being mutually perpendicular to two-by-two.Cutter 3 i.e. can be made to move up in tri-sides of xyz.
Specifically, driving means includes piezoelectric ceramic actuator 6 and flexible hinge amplifier 4, piezoelectric ceramic actuator 6
Linker seat stand 1 is fixed in one end, and the other end of piezoelectric ceramic actuator 6 connects one end of flexible hinge amplifier 4, flexible hinge
The other end of amplifier 4 connects cutter 3.In micro/nano level driver, piezoelectric ceramic actuator 6 is most widely used, although piezoelectricity
Ceramic driver 6 has higher positioning precision and resolution, but stroke only has micron order, and stroke is the highest, and precision is the highest, valency
Lattice are the most expensive.Therefore use flexible hinge amplifier 4 to be placed between piezoelectric ceramic actuator 6 and cutter 3, increase stroke, solve
Determine big stroke and high-precision contradiction, made mechanism obtain big stroke on the premise of having degree of precision.
Owing to being provided with three driving means, cutter can be driven up in three the most orthogonal sides and move, make
Equipment is provided with three processing degree of freedom, it is possible to realizes the tool-path planning such as " non-parameter ", and is capable of complex surface shape
Looks actively control.Multiple degrees of freedom and the requirement of big stroke in actual tests can be met, can have in terms of machining accuracy again substantially
Improve, it is possible to achieve the micro-nano technology of microminiature labyrinth.There is multiple degrees of freedom, big stroke and high manufacturing accuracy.
Flexible hinge amplifier 4 can have various ways, can include fixing seat 5 and the first input platform 9, and right
Claim two second input platform 14, two the second lever 15 and of 11, two the first levers being arranged at the first input platform 9 two ends
Two the 3rd levers 19.I.e. fixing seat 5 and be fixedly installed in pedestal platform 1, the middle part of the first input platform 9 connects Piezoelectric Ceramic
Device 6, one end of the first input platform 9 connects the middle part of the second input platform 11 by the first flexible hinge 10.Second input is flat
Platform 11 connects the first lever 14 near symmetrical away from one end of the axis of symmetry of flexible hinge amplifier 4 by the second flexible hinge 13
One end of axle, the 3rd flexible hinge 12 connection fixing base 5 is passed through at the middle part of the first lever 14.Second input platform 11 is near symmetrical
One end of axle connects the middle part of the second lever 15 by the 4th flexible hinge 16, and the second lever 15 passes through near one end of axis of symmetry
5th flexible hinge 20 connection fixing base 5, the other end of the second lever 15 connects the 3rd lever 19 by the 6th flexible hinge 18
Middle part.3rd lever 19 connects outfan near one end of axis of symmetry by the 7th flexible hinge 21, and outfan passes through the 8th
Flexible hinge 22 connects cutter 3, and the other end of the 3rd lever 19 connects the first lever 14 away from right by the 9th flexible hinge 17
Claim one end of axle.The other end of the first input platform 9 is symmetrical arranged above-mentioned parts simultaneously.
During work, piezoelectric ceramic actuator 6 connects power supply, extends at power supply effect lower piezoelectric ceramic driver 6, promotes the
One input platform 9 moves upward, and the first input platform 9 promotes the second input platform 11 to move upward by the first hinge 10, logical
Crossing the second hinge 13 makes the first lever 14 rotate clockwise around the 3rd hinge 12, while the second input platform 11 moves upward
Driving the second lever 15 to rotate counterclockwise around the 5th hinge 20 by the 4th hinge 16, the upper right side of the first lever 14 is transported downwards
Dynamic, drive the 9th flexible hinge 17 to move right, the second lever 15 upper end moves upward, and drives the 6th flexible hinge 18 to transport to the left
Dynamic, the 9th flexible hinge 17 and the 6th flexible hinge 18 act on the 3rd lever 19 jointly so that the 3rd lever is soft around the 6th
Property hinge 18 rotate clockwise, drive last outfan upwards to transport by the 7th flexible hinge 21 and the 8th flexible hinge 22 simultaneously
Dynamic, and then drive cutter 3 to move in that direction, after power-off, each parts direction of motion is contrary, it is achieved cutter 3 is return.Herein
Direction up and down be the relative direction in accompanying drawing, concrete condition needs according to the setting direction of flexible hinge amplifier 4
Fixed, the structure of three flexible hinge amplifiers 4 is identical with set-up mode simultaneously, and only relative direction is different.
Using differential type lever amplification principle to realize displacement equations, method and structure is simple, and bulk is little；This mechanism adopts
With symmetrical structure, having higher integral rigidity, input displacement can be transmitted to outfan by two, left and right amplifier chain,
Can be completely eliminated in theory, lateral additional displacement, efficiently reduce, the Longitudinal data displacement error of self；Integration knot
Structure is prone to processing, it is to avoid rigging error.Utilize piezoelectric ceramic actuator 6 to ensure kinematic accuracy, amplify in conjunction with setting flexible hinge
Device 4 amplifies movement travel, on the premise of ensureing nanometer-scale motions precision, it is achieved that the effect of millimetre-sized big movement travel.
The last outfan of hinge arranges lateral shaft and longitudinal axis, and the motion of both direction ensure that the motion solution of overall three-dimensional moving platform
Coupling.
The kinematic accuracy of circular arc type flexible hinge is higher, but slewing area is relatively small；Straight beam type flexible hinge has bigger
Slewing area, but kinematic accuracy is poor；And rounding angle-style flexible hinge takes into account kinematic accuracy and range of movement.Therefore at needs
The local of bigger slewing area selects straight beam type flexible hinge, selects circular arc type flexible hinge needing the local of higher motion precision
Chain, is needing to take into account the local flexible hinge selecting employing rounding angle-style of kinematic accuracy and range of movement.
Specifically, first flexible hinge the 10, second flexible hinge the 13, the 3rd flexible hinge the 12, the 4th flexible hinge 16 and
5th flexible hinge 20 is specially circular arc type flexible hinge, the 6th flexible hinge the 18, the 7th flexible hinge 21 and the 8th flexible hinge
Chain 22 is specially rounding straight beam type flexible hinge, and the 9th flexible hinge 17 is specially straight beam type flexible hinge.Also dependent on reality
Border situation arranges different types of flexible hinge, all within protection scope of the present invention.
In the process operation device that the specific embodiment of the invention provides, cutter 3 can include moving platform and be installed on dynamic flat
The cutter head of platform, moving platform connect flexible hinge amplifier 4, it is achieved cutter be fixed on location.Piezoelectric ceramic actuator 6 is by set
Linker seat stand 1 fixed by cylinder 7, certainly may be used without other connected modes.
In the process operation device that the specific embodiment of the invention provides, fixing seat 5 is fixed by countersunk head soket head cap screw
Being installed on baffle plate 2, baffle plate 2 is installed on pedestal platform 1 by fixing catch 8 and countersunk head soket head cap screw, it is simple to dismounting and change, it is possible to
Use other connected modes, such as clamping or welding, all within protection scope of the present invention.
In the process operation device that above-mentioned each detailed description of the invention provides, a flexible hinge amplifier 4 drives cutter 3 to move
Dynamic direction is vertical direction, and the direction that another two flexible hinge amplifier 4 drives cutter 3 to move is horizontal direction and the most vertical
Directly.The i.e. both direction of level is xy direction, and vertical direction is z direction, it is achieved multifreedom controlling, it is possible to use other to arrange
Mode, all within protection scope of the present invention.
Except above-mentioned process operation device, the detailed description of the invention of the present invention also provides for a kind of including above-mentioned process operation device
Micro-nano technology equipment, the structure of these micro-nano technology other each several parts of equipment refer to prior art, repeats no more herein.
Specifically, above-mentioned micro-nano technology equipment can be micro-structure surface diamond micro-nano cutting machine tool.
Above micro-nano technology equipment provided by the present invention and process operation device thereof are described in detail.Herein should
Being set forth principle and the embodiment of the present invention by specific case, the explanation of above example is only intended to help reason
Solve method and the core concept thereof of the present invention.It should be pointed out that, for those skilled in the art, without departing from
On the premise of the principle of the invention, it is also possible to the present invention is carried out some improvement and modification, these improve and modification also falls into this
In bright scope of the claims.
Claims (10)
1. a process operation device for micro-nano technology equipment, including pedestal platform (1), cutter (3) be installed on described pedestal platform (1)
And it is used for driving the driving means of described cutter (3) movement, it is characterised in that include three described driving means, and three institutes
Stating driving means drives the direction of described cutter (3) movement for be mutually perpendicular to two-by-two.
Process operation device the most according to claim 1, it is characterised in that described driving means includes piezoelectric ceramic actuator
(6) and flexible hinge amplifier (4), one end of described piezoelectric ceramic actuator (6) is fixing connects described pedestal platform (1), described
The other end of piezoelectric ceramic actuator (6) connects one end of described flexible hinge amplifier (4), described flexible hinge amplifier
(4) the other end connects described cutter (3).
Process operation device the most according to claim 2, it is characterised in that described flexible hinge amplifier (4) includes fixing
Seat (5) and the first input platform (9), and two second inputs being symmetricly set in described first input platform (9) two ends are flat
Platform (11), two the first levers (14), two the second levers (15) and two the 3rd levers (19), described fixing seat (5) is fixed
Being installed on described pedestal platform (1), the middle part of described first input platform (9) connects described piezoelectric ceramic actuator (6), and described the
One end of one input platform (9) connects the middle part of described second input platform (11) by the first flexible hinge (10)；
Described second input platform (11) passes through the second flexible hinge away from one end of the axis of symmetry of described flexible hinge amplifier (4)
Chain (13) connects described first lever (14) one end near described axis of symmetry, and the middle part of described first lever (14) passes through the 3rd
Flexible hinge (12) connects described fixing seat (5)；
Described second input platform (11) connects described second near one end of described axis of symmetry by the 4th flexible hinge (16)
The middle part of lever (15), described second lever (15) connects institute near one end of described axis of symmetry by the 5th flexible hinge (20)
Stating fixing seat (5), the other end of described second lever (15) connects described 3rd lever (19) by the 6th flexible hinge (18)
Middle part；
Described 3rd lever (19) connects outfan near one end of described axis of symmetry by the 7th flexible hinge (21), described defeated
Going out end and connect described cutter (3) by the 8th flexible hinge (22), the other end of described 3rd lever (19) is flexible by the 9th
Hinge (17) connects described first lever (14) one end away from described axis of symmetry.
Process operation device the most according to claim 3, it is characterised in that described first flexible hinge (10), described second
Flexible hinge (13), described 3rd flexible hinge (12), described 4th flexible hinge (16) and described 5th flexible hinge (20)
It is specially circular arc type flexible hinge, described 6th flexible hinge (18), the 7th flexible hinge (21) and the 8th flexible hinge (22)
Being specially rounding straight beam type flexible hinge, described 9th flexible hinge (17) is specially straight beam type flexible hinge.
Process operation device the most according to claim 4, it is characterised in that described cutter (3) includes moving platform and is installed on
The cutter head of described moving platform, described moving platform connects described flexible hinge amplifier (4).
Process operation device the most according to claim 5, it is characterised in that described piezoelectric ceramic actuator (6) passes through sleeve
(7) the described pedestal platform (1) of fixing connection.
Process operation device the most according to claim 6, it is characterised in that described fixing seat (5) is by hexagonal spiral shell in countersunk head
Nail is fixedly installed in baffle plate (2), and described baffle plate (2) is installed on described pedestal by fixing catch (8) and countersunk head soket head cap screw
Platform (1).
8. according to the process operation device described in claim 1 to 7 any one, it is characterised in that a described flexible hinge is put
The direction that big device (4) drives described cutter (3) movement is vertical direction, and flexible hinge amplifier (4) described in another two drives institute
The direction stating cutter (3) movement is horizontal direction and is mutually perpendicular to.
9. a micro-nano technology equipment, including lathe and the process operation device that is installed on described lathe, it is characterised in that described
Process operation implement body is the process operation device described in claim 1 to 8 any one.
Micro-nano technology equipment the most according to claim 9, it is characterised in that described micro-nano technology equipment is specially micro-knot
Structure surface diamond micro-nano cutting machine tool.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610718371.2A CN106082116A (en) | 2016-08-24 | 2016-08-24 | Micro-nano technology equipment and process operation device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610718371.2A CN106082116A (en) | 2016-08-24 | 2016-08-24 | Micro-nano technology equipment and process operation device thereof |
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| CN106082116A true CN106082116A (en) | 2016-11-09 |
Family
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| CN201610718371.2A Pending CN106082116A (en) | 2016-08-24 | 2016-08-24 | Micro-nano technology equipment and process operation device thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108453492A (en) * | 2018-03-30 | 2018-08-28 | 天津大学 | A kind of big stroke pressing mechanism for micro-nano delineation |
| CN109795981A (en) * | 2019-01-18 | 2019-05-24 | 宁波大学 | The parallel micromotion platform of multistage linking output |
| CN111037753A (en) * | 2019-12-19 | 2020-04-21 | 华侨大学 | Milling method for rough machining of special-shaped contour free-form surface by using circular saw |
| WO2024032053A1 (en) * | 2022-08-08 | 2024-02-15 | 深圳信息职业技术学院 | Nano micro-displacement workbench for laser ultra-precision polishing for highly hard and brittle material |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108453492A (en) * | 2018-03-30 | 2018-08-28 | 天津大学 | A kind of big stroke pressing mechanism for micro-nano delineation |
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| CN111037753B (en) * | 2019-12-19 | 2021-11-02 | 华侨大学 | Milling method for rough machining of special-shaped contour free-form surface by using circular saw |
| WO2024032053A1 (en) * | 2022-08-08 | 2024-02-15 | 深圳信息职业技术学院 | Nano micro-displacement workbench for laser ultra-precision polishing for highly hard and brittle material |
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Application publication date: 20161109 |