CN106053593B - Flaw detection device and flaw detection method using flaw detection device - Google Patents
Flaw detection device and flaw detection method using flaw detection device Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
- G01N27/82—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws
- G01N27/83—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws by investigating stray magnetic fields
- G01N27/87—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws by investigating stray magnetic fields using probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
- G01N27/82—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws
- G01N27/83—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws by investigating stray magnetic fields
- G01N27/84—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws by investigating stray magnetic fields by applying magnetic powder or magnetic ink
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
- G01N27/74—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables of fluids
- G01N27/76—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables of fluids by investigating susceptibility
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/1717—Systems in which incident light is modified in accordance with the properties of the material investigated with a modulation of one or more physical properties of the sample during the optical investigation, e.g. electro-reflectance
- G01N2021/1727—Magnetomodulation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N2021/1765—Method using an image detector and processing of image signal
- G01N2021/177—Detector of the video camera type
- G01N2021/1776—Colour camera
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
Abstract
The invention provides a flaw detection device and a flaw detection method using the flaw detection device, which can prevent detection omission and overdetection of a flaw and improve the detection rate of the flaw. A magnetic particle inspection device (1) is provided with: an imaging device (16) that images the surface of the object (10); and a detection device (30) that processes an original image captured by the imaging device (16) and detects a flaw on the surface, wherein the detection device (30) comprises: a 1 st extraction unit (31) for performing binarization processing on the original image by using a 1 st threshold value to extract a 1 st injury candidate unit (40); an inspection area generation unit (32) that generates an inspection area (42) so as to include the 1 st injury candidate unit (40); a 2 nd extraction unit (33) that extracts a 2 nd lesion candidate unit (42) by performing binarization processing on the inspection area (41) using a 2 nd threshold value; and a flaw determination unit (34) that performs an expansion process on the 2 nd flaw candidate unit (42) to detect a flaw.
Description
Technical Field
The present invention relates to a flaw detection apparatus including an imaging device for imaging a surface of an object to be inspected and a detection device for processing an original image imaged by the imaging device to detect a flaw on the surface, and a flaw detection method using the flaw detection apparatus.
Background
Conventionally, flaw detection of the surface of an object to be inspected is performed by a magnetic particle flaw detection test, a penetration flaw detection test, or the like, which is one of nondestructive inspection methods. In the magnetic particle flaw detection test, a magnetic powder or a magnetic powder solution containing a magnetic powder is applied to the surface of an object to be inspected, and a magnetic field or the like is applied to the object to be inspected to magnetize the object. Since the magnetic flux is concentrated on the damaged portion of the surface of the object to be inspected, the magnetic powder is attracted by the magnetic flux to form an indication pattern by the magnetic powder. Then, the magnetic powder indicating pattern is observed to inspect the defect.
On the other hand, in the penetration test, first, a liquid-permeable material is applied to the surface of an object to be inspected, and the liquid-permeable material is caused to penetrate into minute defects such as cracks and pinholes which are open on the surface. Next, the remaining penetration liquid attached to the surface is removed, the developer powder is applied to the surface, and the penetration liquid penetrating into the defect is sucked out to the surface by capillary phenomenon. Then, the defect is inspected by observing the permeation indicating pattern by the absorbed permeation liquid.
These magnetic powder flaw detection tests and penetrant flaw detection tests are performed by a flaw detection apparatus that is automated and includes an imaging device that images the surface of an object to be inspected and a detection device that detects a flaw on the surface by processing an original image captured by the imaging device.
Patent document 1 discloses a magnetic particle inspection apparatus for inspecting surface defects of a material to be inspected by imaging a magnetic particle pattern generated on the surface of the material to be inspected by imaging means and inspecting the surface defects of the material from the imaged image, wherein a sum of an average of luminance in the image and a constant multiple of a standard deviation of the luminance is set to a 2-valued threshold value, and the image is 2-valued by using the threshold value to detect the surface defects.
Patent document 1: japanese patent laid-open publication No. 2011-13007
Disclosure of Invention
According to the configuration of patent document 1, even if variations in the luminance of the flaw detection image vary due to flaw detection conditions such as a rough surface of the material to be inspected and unevenness in the luminance of the light source, an appropriate 2-valued threshold value can be always determined, and it is possible to reduce erroneous detection and detect surface defects without omission.
Here, in the magnetic powder flaw detection test, a deep flaw and a wide flaw were imaged brightly. On the other hand, a shallow depth lesion or a narrow width lesion is imaged less brightly. This is because the leakage magnetic flux of deep and wide flaws is increased, and therefore, more magnetic powder is attracted. Similarly, in the penetration test, a deep flaw or a wide flaw is imaged brightly. On the other hand, a shallow depth lesion or a narrow width lesion is imaged less brightly. This is because a large amount of the infiltration liquid penetrates into a deep wound and a wide wound.
The size and depth of the flaw formed on the surface are various. In addition, the depth and width of 1 continuous wound, for example, a linearly extending wound are not constant. That is, in the magnetic particle flaw detection test and the penetration flaw detection test, 1 continuous flaw having a shallow depth portion and a deep depth portion and a wide width portion and a narrow width portion mixed is imaged as an image having different brightness for each portion.
Therefore, when determining whether or not the image is damaged based on the brightness of the image, the following may occur: even 1 continuous flaw is intermittent, and is not determined as a flaw but overlooked. On the other hand, if the luminance is easily determined as a flaw, that is, turned down as a reference, an unnecessary minute flaw, burr, dust, or the like is determined as a flaw, and the flaw is sometimes over-detected as a state in which the unnecessary flaw, dust, or the like is detected. In addition, although patent document 1 considers the prevention of erroneous detection due to the variation in the brightness of an image caused by the flaw detection conditions, it does not consider erroneous detection due to the variation in the brightness caused by the depth and width of a flaw at all.
Therefore, an object of the present invention is to provide a flaw detection device that prevents detection omission and overdetection of a flaw portion and improves a detection rate of the flaw portion, and a flaw portion detection method using the flaw detection device.
In order to solve the above problem, the present invention relates to a flaw detection device including: an imaging device that images a surface of an object to be inspected; and a detection device that processes an original image captured by the imaging device and detects a damaged portion on the surface, the detection device including: a 1 st extraction unit that extracts a 1 st candidate portion by performing binarization processing on the original image using a 1 st threshold value; an inspection area generating unit that generates an inspection area so as to include the 1 st flaw candidate unit; a 2 nd extraction unit that extracts a 2 nd lesion candidate unit by performing binarization processing on the inspection area using a 2 nd threshold value; and a flaw determination unit that performs an expansion process on the 2 nd flaw candidate unit and detects the flaw unit.
Further, in the flaw detection device according to the present invention, the 2 nd threshold is smaller than the 1 st threshold.
Further, in the flaw detection apparatus according to the present invention, the inspection area is an area surrounded by a rectangle obtained by enlarging a minimum rectangle including the 1 st flaw candidate portion by a predetermined width.
Further, in the flaw detection apparatus of the present invention, the expansion process is a process of expanding the 2 nd flaw candidate portions in the respective longitudinal directions.
Further, the present invention relates to a method for detecting a damaged portion using a flaw detector, in which an imaging device images a surface of an object to be inspected, and a detection device processes an original image imaged by the imaging device to detect a damaged portion on the surface, wherein the detection device binarizes the original image using a 1 st threshold value, extracts a 1 st damaged candidate portion, generates an inspection area including the 1 st damaged candidate portion, binarizes the inspection area using a 2 nd threshold value, extracts a 2 nd damaged candidate portion, and performs dilation processing on the 2 nd damaged candidate portion to detect the damaged portion.
Further, in the method for detecting a damaged portion by a flaw detector according to the present invention, the 2 nd threshold is smaller than the 1 st threshold.
Further, in the flaw detection method using the flaw detection apparatus according to the present invention, the inspection area is an area surrounded by a rectangle obtained by enlarging a minimum rectangle including the 1 st flaw candidate portion by a predetermined width.
Further, in the method for detecting a damaged part using a flaw detection apparatus according to the present invention, the expansion process is a process of expanding the 2 nd damaged candidate part in the longitudinal direction of each of the parts.
According to the present invention, a flaw detector includes: an imaging device that images a surface of an object to be inspected; and a detection device that processes an original image captured by the imaging device and detects a damaged portion on the surface, wherein the detection device includes: a 1 st extraction unit that extracts a 1 st candidate portion by performing binarization processing on the original image using a 1 st threshold value; an inspection area generating unit that generates an inspection area so as to include the 1 st flaw candidate unit; a 2 nd extraction unit that extracts a 2 nd lesion candidate unit by performing binarization processing on the inspection area using a 2 nd threshold value; and a flaw determination unit that performs an expansion process on the 2 nd flaw candidate unit to detect the flaw, and therefore, a flaw detection device that prevents detection omission and overdetection of the flaw and improves a detection rate of the flaw can be provided.
Further, according to the configuration in which the 2 nd threshold is smaller than the 1 st threshold, it is possible to provide a flaw detection device which prevents detection omission and overdetection of a damaged portion and improves a detection rate of the damaged portion.
Further, according to the configuration in which the inspection region is a region surrounded by a rectangle obtained by enlarging the smallest rectangle including the 1 st candidate part by a predetermined width, it is possible to prevent an increase in the amount of computation by the detection device.
Further, according to the configuration in which the expansion process is a process of expanding the 2 nd injury candidate portions in the respective longitudinal directions, it is possible to prevent detection omission of the injury portion with higher accuracy.
According to the present invention, in a method for detecting a damaged portion using a flaw detection apparatus, an imaging device images a surface of an object to be inspected, and a detection device processes an original image imaged by the imaging device to detect a damaged portion on the surface, wherein the detection device performs binarization processing on the original image using a 1 st threshold value, extracts a 1 st damaged candidate portion, generates an inspection area including the 1 st damaged candidate portion, performs binarization processing on the inspection area using a 2 nd threshold value, extracts a 2 nd damaged candidate portion, and performs dilation processing on the 2 nd damaged candidate portion to detect the damaged portion, it is possible to provide a method for detecting a damaged portion using a flaw detection apparatus that prevents omission and overdetection of the damaged portion and improves a detection rate of the damaged portion.
Further, according to the method in which the 2 nd threshold is smaller than the 1 st threshold, it is possible to provide a flaw portion detection method using a flaw detection device in which detection omission and overdetection of a flaw portion are prevented and a detection rate of the flaw portion is improved.
Further, according to the method in which the inspection region is a region surrounded by a rectangle obtained by enlarging the smallest rectangle including the 1 st candidate part by a predetermined width, it is possible to prevent an increase in the amount of computation by the detection device.
Further, according to the method in which the expansion process is a process of expanding the 2 nd injury candidate portions in the respective longitudinal directions, detection omission of the injury portion can be prevented with higher accuracy.
Drawings
Fig. 1 is a schematic diagram showing a configuration of a magnetic particle flaw detector as an example of a flaw detector of the present embodiment.
Fig. 2 is a block diagram of a control system of the magnetic particle inspection apparatus.
Fig. 3 is a flowchart for explaining an example of the detection operation of the detection device.
Fig. 4 is a schematic diagram showing an example of an image subjected to binarization processing by the 1 st extraction unit.
Fig. 5 is a schematic diagram of an image showing an example of the extracted 1 st injury candidate portion.
Fig. 6 is a schematic diagram of an image showing an example of the generated examination region.
Fig. 7 is a schematic diagram showing an example of an image subjected to binarization processing by the 2 nd extraction unit.
Fig. 8 is a schematic diagram of an image showing an example of the extracted 2 nd injury candidate portion.
Fig. 9 is a schematic diagram showing an image in which an example of the expansion process is performed on the 2 nd injury candidate unit.
Description of the symbols
1: a magnetic particle flaw detector (flaw detector); 10: an object to be inspected; 16: a camera device; 30: a detection device; 31: the 1 st extraction part; 32: an examination region generation unit; 33: a 2 nd extraction section; 34: a wound determination unit; 40: a 1 st wound candidate unit; 41: an examination region; 42: the 2 nd injury candidate part.
Detailed Description
The best mode for carrying out the present invention will be described in detail below with reference to the accompanying drawings. Fig. 1 is a schematic diagram showing a configuration of a magnetic particle flaw detector 1 as an example of a flaw detector of the present embodiment. The arrow in fig. 1 indicates the conveyance direction of the test object 10, and the test object 10 is conveyed from the right side toward the left side in fig. 1.
As shown in fig. 1, a magnetic particle flaw detector 1 is a flaw detector for detecting a flaw, which is a flaw, on a surface of an object 10 to be inspected, such as a long-sized prismatic steel material, by automatic control using magnetic particles. The magnetic particle inspection apparatus 1 includes a conveying device 11, a magnetic particle scattering device 12, a magnetizing device 13, an air blowing device 14, an ultraviolet inspection lamp 15, an imaging device 16, a marking (marking) device 17, and the like. The magnetic particle flaw detector 1 further includes a controller C, a detection device 30, and the like, which are not shown here.
The conveying device 11 conveys the test object 10. The conveying device 11 is a roller conveyor composed of a plurality of rollers and the like, and is configured to convey the test object 10 at a desired speed. In fig. 1, the test object 10 is conveyed from the right side where the magnetic powder scattering device 12 is located to the left side where the marking device 17 is located. The conveying device 11 includes a conveying distance measuring device 18, not shown here. The conveyance distance measuring device 18 measures the conveyance distance of the test object 10. As the transport distance measuring device 18, a measuring device configured by a rotary encoder or the like that measures the displacement of the rotation of the roller of the transport device 11 can be used. The configuration of the transport distance measuring device 18 is not particularly limited, and a measuring device using a non-contact method, for example, a laser surface velocity meter may be used, or a combination thereof may be used. The configuration of the conveying device 11 is also not particularly limited, and may be, for example, a belt conveyor or the like constituted by a belt or the like having no joint.
The magnetic powder scattering device 12 is a device that scatters magnetic powder inspection liquid on the surface of the object 10 to be inspected, and is disposed on the upstream side in the conveying direction. The magnetic powder scattering device 12 is constituted by a tank, a pump, a nozzle, and the like, which are not shown. The magnetic particle inspection liquid contained in the tank is pumped to the nozzle by a pump, and the magnetic particle inspection liquid is ejected from the nozzle. The magnetic powder inspection liquid is a solution containing magnetic powder, the surface of which is coated with a phosphor. The magnetic particle scattering device 12 is configured to continuously scatter a desired amount of magnetic particle inspection liquid onto the surface of the object 10 to be inspected. The structure of the magnetic powder scattering device 12 is not particularly limited.
The magnetizer 13 is a device for applying a magnetic field to the object 10, and is disposed adjacent to the magnetic powder scattering device 12 on the downstream side. The magnetizing device 13 includes two through- coils 19 and 20 arranged on the upstream side and the downstream side in the transport direction in an opposed manner, two inter-pole coils 21 and 22 arranged between the two through- coils 19 and 20 and in a row in the transport direction, and the like. The through- coils 19 and 20 are formed in an annular shape, and the object 10 is conveyed so as to penetrate the centers of the through- coils 19 and 20. On the other hand, the inter-pole coils 21 and 22 are formed in a U shape, and the object 10 is conveyed so as to pass through the gap between the inter-pole coils 21 and 22. The magnetizing apparatus 13 includes the two inter-pole coils 21 and 22, and can generate a uniform rotating magnetic field between the two through- coils 19 and 20.
More specifically, when a current flows through the through- coils 19, 20 and the inter-pole coils 21, 22, a magnetic field is generated in the through- coils 19, 20 in the conveyance direction of the object 10, and a magnetic field is generated in the inter-pole coils 21, 22 in a direction perpendicular to the conveyance direction of the object 10, which is the air gap direction. When an alternating current having a phase shifted by 90 degrees flows through the through- coils 19 and 20 and the inter-pole coils 21 and 22, a rotating magnetic field that rotates at a constant magnetic field strength is generated in a plane formed by the direction of the magnetic field generated by the through-coils 19 and 20 (the conveying direction) and the direction of the magnetic field generated by the inter-pole coils 21 and 22 (the direction orthogonal to the conveying direction).
The configuration of the magnetizing apparatus 13 is not particularly limited, and the number of the through- coils 19, 20 and the inter-pole coils 21, 22 can be appropriately designed. For example, the magnetizing apparatus 13 may have a plurality of inter-pole coils in addition to the inter-pole coils 21 and 22. The magnetizing device 13 may be constituted by 1 penetration coil 19 and 1 inter-pole coil 21.
The blowing device 14 blows air in a direction opposite to the gravity toward the object 10. The blower device 14 is provided between the two through- coils 19, 20, and is provided between the through-coil 19 and the inter-pole coil 21, between the two inter-pole coils 21, 22, and between the inter-pole coil 22 and the through-coil 20, respectively. The flow rate of the magnetic particle inspection liquid flowing over the surface of the object 10 to be inspected can be adjusted by the air blowing device 14. The structure of the blower 14 is not particularly limited.
The ultraviolet inspection lamp 15 irradiates the magnetic powder inspection liquid on the surface of the object 10 to be inspected with ultraviolet light between the two through coils 19 and 20. The ultraviolet flaw detection lamp 15 is disposed at a position away from the test object 10 by a predetermined distance, for example, about 600mm to 2000mm, in order to avoid the influence of the strong rotating magnetic field generated by the magnetizing device 13. The structure of the ultraviolet flaw detection lamp 15 is not particularly limited, and may be a structure in which a magnetic shield is applied, for example.
The imaging device 16 images the surface of the test object 10 irradiated with the ultraviolet rays by the ultraviolet ray inspection lamp 15. The imaging device 16 is configured to be able to take an image of the surface of the object 10 from the vertical direction. The imaging device 16 is disposed at a predetermined distance, for example, about 600mm to 2000mm, from the object 10 to be inspected, and is magnetically shielded, in order to avoid the influence of the strong rotating magnetic field generated by the magnetizing device 13. The imaging device 16 may be any device as long as it can image the surface of the test object 10 irradiated with the ultraviolet rays by the ultraviolet ray inspection lamp 15, and the imaging direction is not limited. However, from the viewpoint of detecting a damaged portion with high accuracy, the imaging device 16 is preferably configured to image the surface of the object 10 from the vertical direction. The imaging device 16 may be an area camera or a line camera, and is not particularly limited. For example, a CCD (Charge Coupled Device) camera can be used.
The marking device 17 visually marks a flaw, which is a defect, on the surface of the test object 10 detected by the detection device 30 described later. As the marking device 17, for example, a marking gun that performs marking by ejecting ink using air pressure can be used. The structure of the marker 17 is not particularly limited.
The detection device 30 reads an image signal (original image) captured by the imaging device 16 and performs predetermined processing on the original image to detect a damaged portion on the surface of the object 10, and the configuration and detection method thereof will be described later.
Next, a control system of the magnetic particle flaw detector 1 of the present embodiment will be described. Fig. 2 is a block diagram of a control system of the magnetic particle inspection apparatus 1. The magnetic particle inspection apparatus 1 includes a controller C, and is configured to control the conveying device 11, the conveying distance measuring device 18, the magnetic particle scattering device 12, the magnetizing device 13, the air blowing device 14, the ultraviolet inspection lamp 15, the imaging device 16, the marking device 17, and the like by the controller C, and to automatically detect a damaged portion on the surface of the inspection object 10.
The controller C is configured to read input signals such as various set values and detection values obtained by various sensors and output control signals, thereby controlling operations of various devices included in the magnetic particle flaw detector 1. The controller C includes a processing device that performs arithmetic processing and control processing, a main storage device that stores data, and the like. The controller C is a microcomputer including, for example, a CPU (Central Processing Unit) as a Processing device, a ROM (Read Only Memory) as a main storage device, a RAM (Random Access Memory), a timer, an input circuit, an output circuit, a power supply circuit, and the like. The main storage device stores a control program for executing the operation of the present embodiment, various data, and the like. Further, these various programs, data, and the like may be as follows: stored in a storage device provided separately from the controller C, and read by the controller C.
The conveying device 11, the conveying distance measuring device 18, the magnetic powder scattering device 12, the magnetizing device 13, the air blowing device 14, the ultraviolet inspection lamp 15, the imaging device 16, the marking device 17, and the detection device 30 are electrically connected to the controller C. Various sensors and the like other than the configuration shown in fig. 2 are electrically connected to the controller C.
The detection device 30 is configured by a processing device that performs arithmetic processing and control processing, a main storage device that stores data, and the like, as in the controller C, and is a microcomputer including a CPU, a main storage device, a timer, an input circuit, an output circuit, a power supply circuit, and the like, for example.
The detection device 30 has a 1 st extraction unit 31. The 1 st extraction unit 31 is constituted by, for example, a program. As will be described in detail later, the 1 st extraction unit 31 is configured to perform binarization processing on an image signal (original image) captured by the imaging device 16 using a predetermined 1 st threshold value, and extract a 1 st damage candidate unit. The original image captured by the imaging device 16 is input to the detection device 30 via the controller C.
The detection device 30 further includes an inspection area generation unit 32. The examination region generating unit 32 is also constituted by a program, for example. As will be described in detail later, the inspection area generating unit 32 is configured to generate the inspection area so as to include the 1 st flaw candidate unit extracted by the 1 st extracting unit 31.
The detection device 30 further includes a 2 nd extraction unit 33. The 2 nd extraction unit 33 is also constituted by a program, for example. As will be described in detail later, the 2 nd extraction unit 33 is configured to perform binarization processing on the inspection area generated by the inspection area generation unit 32 by using a predetermined 2 nd threshold value, and extract the 2 nd damage candidate unit.
The detection device 30 further includes a flaw determination unit 34. The damage determination unit 34 is also constituted by a program, for example. As will be described in detail later, the flaw determination unit 34 is configured to perform an expansion process on the 2 nd flaw candidate extracted by the 2 nd extraction unit 33 to detect a flaw. Then, the detection device 30 is configured to send the position data of the damaged portion detected by the damaged portion determination unit 34 to the controller C.
Next, the operation of the magnetic particle flaw detector 1 will be described. The magnetic particle flaw detector 1 is configured to sequentially convey the object 10 to be inspected to each apparatus by the conveying apparatus 11, and detect a flaw on the surface of the object 10 to be inspected. The object 10 to be inspected is first conveyed to the magnetic particle scattering device 12, and the magnetic particle inspection liquid is scattered on the surface. The object 10 with the magnetic powder inspection liquid spread on the surface is conveyed into the rotating magnetic field region formed by the magnetizing device 13.
At this time, if a damaged portion exists on the surface of the test object 10, a leakage magnetic field is generated due to the damaged portion, and the magnetic powder contained in the magnetic powder inspection liquid is attracted by the leakage magnetic field. Here, since the magnetic field formed by the magnetizer 13 rotates, a leakage magnetic field is generated regardless of the direction (shape) in which the wound portion extends, and the magnetic powder is attracted to the wound portion. Then, the magnetic particles are collected to the flaw, thereby forming a magnetic particle indicating pattern due to the flaw on the surface of the object 10 to be inspected.
In addition, the flow rate of the magnetic particle inspection liquid flowing on the surface of the object 10 to be inspected is appropriately adjusted by the air blowing device 14. In the magnetic powder indicating pattern is stably formed, the flow rate of the magnetic powder inspection liquid is preferably 5 to 100 mm/s. If the flow rate of the magnetic powder inspection liquid is faster than 100mm/s, the magnetic powder becomes hard to be attracted by the leakage magnetic field due to the wound portion, and the magnetic powder indication pattern becomes unstable. On the other hand, if the flow rate of the magnetic particle inspection liquid is slower than 5mm/s, formation of a stable magnetic particle indication pattern requires a large amount of time, involving a decrease in inspection efficiency.
The magnetic powder indicator pattern thus formed is irradiated with ultraviolet rays from an ultraviolet ray inspection lamp 15, whereby a phosphor coating the surface of the magnetic powder is excited, and an image is captured by an imaging device 16. The original image captured by the imaging device 16 is sent to the detection device 30. The detection device 30 performs predetermined processing on the original image, detects a damaged portion in the original image, and sends the position data to the controller C. Then, the controller C controls the operation of the marking device 17 based on the position data of the damaged portion and the measurement data of the transport distance measuring device 18, and marks the damaged portion on the surface of the test object 10.
Next, a method of detecting a damaged portion by the detection device 30 will be described. Fig. 3 is a flowchart for explaining an example of the detection operation of the detection device 30. The detection device 30 takes in the image signal (original image) captured by the imaging device 16 via the controller C (step S1). Here, the original image to be captured is composed of pixels of 960 vertical × 1280 horizontal, for example. The time when the image is captured by the image capture device 16 is associated with the original image.
Next, the detection device 30 performs, as preprocessing, emphasis processing using various filters on the captured original image by the 1 st extraction unit 31 (step S2). Here, the emphasis process may be a process of emphasizing a damaged portion in the original image, and may be, for example, a LUT (Look Up Table) conversion process, an expansion/contraction process, a shading (shading) process, or the like, or may be a process of combining these various processes.
Then, the 1 st extraction unit 31 performs binarization processing on the emphasized image using the 1 st threshold value (step S3). Fig. 4 is a schematic diagram showing an example of an image subjected to binarization processing by the 1 st extraction unit 31. The 1 st threshold is a preset value and is stored in a main storage device, not shown, of the detection device 30.
The 1 st extraction unit 31 performs labeling (labeling) processing on the binarized image (step S4). Here, the labeling process is a process of assigning the same label to consecutive pixels in the binarized image and dividing the pixels into regions.
Then, the 1 st extraction unit 31 calculates, for example, the area, the length, the width in the vertical direction, the width in the horizontal direction, and the like as determination values for each of the regions to which the label is applied, compares the calculated determination values with the 1 st determination reference value stored in advance, determines whether or not the region is the 1 st injury candidate portion, and extracts the region corresponding to the 1 st injury candidate portion (step S5).
Here, the 1 st injury candidate portion indicates a region assumed to be an injury portion. The 1 st extraction unit 31 calculates a determination value for all the regions to which the label is applied, compares the calculated determination value with the 1 st determination reference value, and determines whether or not the region is the 1 st damage candidate unit. Fig. 5 is a schematic diagram showing an image of an example of the extracted 1 st injury candidate unit 40. Fig. 5 shows a state in which the 1 st candidate part 40 is extracted using the length of the area as a determination value, and 41 st candidate parts 40a, 40b, 40c, and 40d are extracted.
The determination value is not limited to the above example, and may be a value that enables comparison of the characteristics of the regions, and may be set as appropriate. The determination as to whether or not the 1 st wound candidate portion 40 is present may be performed based on 1 type of determination value, or may be performed based on a plurality of types of determination values. In the case where it is determined whether or not the 1 st defect candidate unit 40 is present based on a plurality of types of determination values, the determination may be completed based on at least 1 type of determination value among the plurality of types of determination values. For example, the area may be determined as the 1 st injury candidate unit 40 when at least two of the 3 types of determination values satisfy the 1 st determination criterion.
The 1 st extraction unit 31 is not limited to the configuration in which step S5 is repeated for each region, and may be a configuration in which determination values are calculated for all regions, and then the comparison between the calculated determination values and the 1 st determination reference value and the determination as to whether or not the determination is the 1 st damage candidate unit are performed for each region.
Next, the detection device 30 generates the inspection area 41 including the 1 st lesion candidate unit 40 extracted by the 1 st extraction unit 31 by the inspection area generation unit 32 (step S6). Fig. 6 is a schematic diagram showing an image of an example of the generated inspection region 41. Fig. 6 shows a state in which inspection regions 41a, 41b, 41c, and 41d for the 41 st candidate parts 40a, 40b, 40c, and 40d are generated. The examination region 41 is a region surrounded by a rectangle extending in the longitudinal direction as well as the lateral direction. The inspection region 41 is a region surrounded by a rectangle whose area is minimized, which is enlarged by a predetermined width in the vertical and horizontal directions. Here, the shape, size, and the like of the inspection region 41 are not limited, and may be a region including the 1 st injury candidate unit 40. For example, the examination region 41 may be a region surrounded by a diamond shape, a trapezoid shape, a circle, an ellipse, or the like. The inspection region 41 may be an inclined region, for example, a rectangle extending in the long axis direction of the 1 st lesion candidate unit 40.
Next, the detection device 30 extracts an original image corresponding to the inspection area 41 by the 2 nd extraction unit 33 (step S7).
Then, the 2 nd extraction unit 33 performs the emphasis processing on the image from which the original image corresponding to the inspection region 41 is extracted, in the same manner as the 1 st extraction unit 31 (step S8). Further, the 2 nd extraction unit 33 performs binarization processing on the emphasized image using the 2 nd threshold (step S9). Fig. 7 is a schematic diagram showing an example of an image subjected to the binarization processing by the 2 nd extraction unit 33. The 2 nd threshold is a preset value and is stored in a main storage device, not shown, of the detection device 30. Also, the 2 nd threshold is smaller than the 1 st threshold. Here, in fig. 7, many smaller regions are formed as compared with fig. 4. In fig. 6, the region corresponding to the 1 st candidate part 40b and the region corresponding to the 1 st candidate part 40d are connected to form 1 region. This is because the 2 nd threshold is smaller than the 1 st threshold, and is a state including a region with a smaller luminance.
Here, the damaged portion is imaged in a state where a region with high luminance and a region with low luminance are present at random depending on the depth and width of the damaged portion. However, the region having a smaller luminance can be included in the 2 nd injury candidate portion described later by the step S9 of performing the binarization process using the 2 nd threshold value, and the region corresponding to the injured portion can be prevented from being intermittently injured.
In addition, the 2 nd extraction unit 33 performs labeling processing on the binarized image in the same manner as the 1 st extraction unit 31 (step S10). Then, the 2 nd extraction unit 33 calculates, for example, the area, the length, the width in the vertical direction, the width in the horizontal direction, and the like as determination values for each region to which a label is given, compares these calculated determination values with the 2 nd determination reference value stored in advance, determines whether or not the region is the 2 nd injury candidate portion, and extracts a region corresponding to the 2 nd injury candidate portion (step S11).
Here, the 2 nd injury candidate portion represents an area assumed to be an injury portion, as in the 1 st injury candidate portion. The 2 nd determination reference value in the 2 nd extraction unit 33 is different from the 1 st determination reference value in the 1 st extraction unit 31. The 2 nd determination reference value is set in a state in which the region is harder to extract than the 1 st determination reference value. The state in which extraction is difficult indicates, for example, a state in which a larger area or a longer area is extracted. On the other hand, the state in which extraction is easy indicates, for example, a state in which a smaller region or a shorter region is extracted. For example, the range of the 2 nd determination reference value is a range narrower than the range of the 1 st determination reference value with respect to the length of the region, and is set to a range included in the range of the 1 st determination reference value.
The 2 nd extraction unit 33 calculates a determination value for all the regions to which the label is given, compares the calculated determination value with the 2 nd determination reference value, and determines whether or not the region is the 2 nd damage candidate unit. Fig. 8 is a schematic diagram showing an image of an example of the extracted 2 nd injury candidate unit 42. Fig. 8 shows a state in which the 2 nd injury candidate portion 42 is extracted using the length of the region as a determination value, and shows a state in which two 2 nd injury candidate portions 42a and 42b are extracted. In fig. 8, the region corresponding to the 1 st injury candidate portion 40c in fig. 5 is not extracted. This is because the 2 nd determination reference value is set in a state in which it is difficult to extract a region than the 1 st determination reference value, and thus it is determined that the region corresponding to the 1 st injury candidate portion 40c is not a region assumed to be an injury portion.
The determination value is not limited to the above example, and may be a value that enables comparison of the characteristics of the regions, and may be set as appropriate. The determination as to whether or not the candidate 2 nd injury portion 42 is present may be performed based on 1 type of determination value, or may be performed based on a plurality of types of determination values. In the case where it is determined whether or not the 2 nd damage candidate unit 42 is present based on a plurality of types of determination values, the determination may be completed based on at least 1 type of determination value among the plurality of types of determination values. For example, the area may be determined as the 2 nd injury candidate unit 42 when at least two of the 3 types of determination values satisfy the determination criterion.
The 2 nd determination reference value is not limited to the above configuration, and may be set in a state in which the region is harder to extract than the 1 st determination reference value. For example, the 2 nd determination reference value and the 1 st determination reference value may be the same, and in such a case, the 2 nd extraction unit 33 is configured to determine whether or not the 2 nd injury candidate unit is based on the determination values of the types more than the 1 st extraction unit 31.
As in the case of the 1 st extraction unit 31, the 2 nd extraction unit 33 is not limited to the configuration in which step S11 is repeated for each region, and may be configured to calculate the determination value for all regions, and then compare the calculated determination value with the determination reference value and determine whether or not the determination value is the 1 st damage candidate unit for each region.
Next, the detection device 30 performs the expansion process on each of the 2 nd injury candidate portions 42 by the injury determination portion 34 (step S12). Here, the dilation processing is processing for expanding the 2 nd injury candidate portion 42. The flaw determination unit 34 calculates the direction as the long axis in each outline for each 2 nd flaw candidate unit 42, and enlarges the 2 nd flaw candidate unit 42 by a predetermined amount in the long axis direction. That is, the expansion process of the flaw determination unit 34 is a process of lengthening the 2 nd candidate unit 42. Fig. 9 is a schematic diagram showing an image obtained by performing an expansion process on the 2 nd injury candidate unit 42. Fig. 9 shows a state in which the swelling process is performed on the two 2 nd injury candidate portions 42a and 42b in fig. 8. The 2 nd injury candidate portion 42a and the 2 nd injury candidate portion 42b are connected by swelling, respectively, to form 1 region 43.
In addition, the flaw determination unit 34 performs a labeling process on the image obtained by performing the dilation process on the 2 nd flaw candidate unit 42, as in the 1 st extraction unit 31 and the 2 nd extraction unit 33 (step S13). Then, the flaw determination unit 34 calculates, for example, the area, the length, the width in the vertical direction, the width in the horizontal direction, and the like for each region to which a label is applied as determination values, compares these calculated determination values with a flaw determination reference value stored in advance, determines whether or not the region is a flaw, and detects the region corresponding to the flaw as the flaw (step S14).
Here, the standard value for wound determination in the wound determination unit 34 is different from the standard value for determination 2 in the extraction unit 33 2. The injury criterion value is set to a state in which the region is harder to extract than the 2 nd criterion value. For example, regarding the length of the region, the range of the damage criterion value is a range narrower than the range of the 2 nd criterion value, and is set as a range included in the range of the 2 nd criterion value.
The flaw determination unit 34 calculates a determination value for all the regions to which the label is applied, compares the calculated determination value with a flaw determination reference value, and determines whether or not the region is a flaw. For example, the flaw determination unit 34 detects 1 area 43 formed by connecting the expanded 2 nd flaw candidate 42a and 2 nd flaw candidate 42b in fig. 9 as 1 flaw. Then, the detection device 30 transmits the detected position data of the damaged portion to the controller C.
The determination value is not limited to the above example, and may be a value that enables comparison of the characteristics of the regions, and may be set as appropriate. The determination as to whether or not the damaged portion is present may be performed based on 1 type of determination value, or may be performed based on a plurality of types of determination values. In the case where the determination as to whether or not the damaged portion is determined based on the plurality of types of determination values, the determination may be completed based on at least 1 type of determination value among the plurality of types of determination values. For example, the region may be determined to be a damaged portion when at least two of the 3 types of determination values satisfy the determination criterion.
The damage determination reference value may be set in a state in which the region is less likely to be extracted than the 2 nd determination reference value, and is not limited to the above configuration. For example, the wound determination reference value may be the same as the 2 nd determination reference value, and in such a case, the wound determination unit 34 is configured to determine whether or not the wound is a wound based on the determination values of the types more than the 2 nd extraction unit 33.
Similarly to the 1 st and 2 nd extraction units 31 and 33, the flaw determination unit 34 is not limited to the configuration in which step S14 is repeated for each region, and may be a configuration in which determination values are calculated for all regions, and then the calculated determination values are compared with the determination reference value for each region, and whether or not the determination is made by the 1 st flaw candidate unit is performed.
The detection device 30 may be configured to appropriately store data such as an image obtained by extracting the 1 st injury candidate portion 40, an image obtained by extracting the generated inspection area 41 and the 2 nd injury candidate portion 42, an image obtained by performing expansion processing on the 2 nd injury candidate portion 42, an image in which an injury is detected, and a calculated determination value in the main storage portion.
The detection device 30 may be configured to store the image subjected to the emphasis processing in the main storage unit in step S2, extract the image subjected to the emphasis processing corresponding to the inspection area 41 in step S7, and perform the binarization processing on the image subjected to the emphasis processing corresponding to the inspection area 41 by using the 2 nd threshold. With such a configuration, step S8 of performing the emphasis process can be omitted, and the amount of calculation by the detection device 30 can be reduced.
In this way, in the present embodiment, the detection device 30 performs binarization processing on the original image by the 1 st threshold value by the 1 st extraction unit 31, extracts the 1 st scratch candidate unit 40, generates the inspection area 41 by the inspection area generation unit 32, performs binarization processing on the inspection area 41 by the 2 nd threshold value by the 2 nd extraction unit 33, extracts the 2 nd scratch candidate unit 42, and performs dilation processing on the 2 nd scratch candidate unit 42 by the scratch determination unit 34 to detect a scratch. According to this method, it is possible to provide a flaw detection method using a flaw detection device, in which detection omission and overdetection of a flaw portion are prevented and the detection rate of the flaw portion is improved.
Here, the 2 nd threshold in step S9 is smaller than the 1 st threshold in step S3. That is, step S9 also extracts pixels with lower luminance than step S3. Further, step S9 is a process for the inspection region 41 as the defined region. Then, the detection device 30 first extracts the 1 st injury candidate portion 40 as a region assumed to be an injury portion, and newly extracts the 2 nd injury candidate portion 42 including a portion with lower brightness as a region assumed to be an injury portion within a limited region including the 1 st injury candidate portion 40. Therefore, the detection device 30 does not extract the flaw candidate portion including the portion with low luminance for all the areas of the original image, and therefore can prevent detection of a minute flaw, burr, dust, or the like as the flaw portion (over-detection). In addition, since step S9 is a binarization process of the inspection region 41 which is a limited region, the amount of computation by the detection device 30 is prevented from increasing.
Further, since the flaw determination unit 34 performs the expansion process on the 2 nd flaw candidate unit 42 to detect the flaw, it is possible to prevent the 1 consecutive flaw from being determined as an intermittent flaw rather than a flaw, and to prevent detection omission of the flaw. Further, since the flaw determination unit 34 performs the dilation process on the 2 nd flaw candidate unit 42 extracted from the binarization process using the 2 nd threshold value having a luminance smaller than the 1 st threshold value, detection omission of the flaw portion can be more effectively prevented.
The expansion process performed by the flaw determination unit 34 is a process of expanding the 2 nd flaw candidate unit 42 in the longitudinal direction, that is, in the case of 1 continuous flaw unit, in a direction assumed to be the direction in which the flaw candidate unit extends. Therefore, the flaw determination unit 34 can more reliably prevent the region determined to correspond to the flaw from being intermittently scratched rather than the flaw, and can more accurately prevent detection omission of the flaw.
Further, by appropriately setting the 1 st threshold, the 2 nd threshold, the 1 st criterion, the 2 nd criterion, and the flaw criterion, the detection device 30 can appropriately change the size of the flaw detected as the flaw, can appropriately adjust the inspection accuracy of the flaw, and is excellent in usability.
As described above, in the present embodiment, in the method for detecting a damaged portion of the magnetic particle flaw detector 1 in which the imaging device 16 images the surface of the object 10, the detection device 30 processes the original image imaged by the imaging device 16, and the damaged portion is detected, the detection device 30 binarizes the original image using the 1 st threshold value, extracts the 1 st damaged candidate portion 40, generates the inspection region 41 including the 1 st damaged candidate portion 40, binarizes the inspection region 41 using the 2 nd threshold value, extracts the 2 nd damaged candidate portion 42, and performs the expansion process on the 2 nd damaged candidate portion 42 to detect the damaged portion.
Therefore, according to the present embodiment, it is possible to provide a damaged portion detection method using a flaw detection device that prevents detection omission and overdetection of a damaged portion and improves the detection rate of the damaged portion.
Further, the magnetic powder flaw detector 1 includes: an imaging device 16 that images the surface of the object 10; and a detection device 30 that processes an original image captured by the imaging device 16 and detects a damaged portion on a surface, wherein the detection device 30 includes: a 1 st extraction unit 31 for performing binarization processing on the original image by using a 1 st threshold value to extract a 1 st injury candidate unit 40; an inspection area generating unit 32 that generates an inspection area 41 including the 1 st candidate part 40; a 2 nd extraction unit 33 for performing binarization processing on the inspection region 41 by using a 2 nd threshold value to extract a 2 nd flaw candidate unit 42; and a flaw determination unit 34 that performs an expansion process on the 2 nd flaw candidate unit 42 to detect a flaw.
Further, according to the present embodiment, it is possible to provide the magnetic particle flaw detector 1 in which detection omission and overdetection of the damaged portion are prevented and the detection rate of the damaged portion is improved.
In addition, the magnetic particle flaw detector 1 as a flaw detector is not limited to the above configuration. For example, the controller C and the detection device 30 may be integrally configured. That is, the controller C may be configured to include the 1 st extraction unit 31, the inspection region generation unit 32, the 2 nd extraction unit 33, and the flaw determination unit 34. With such a configuration, the magnetic particle flaw detector 1 is simplified and reduced in size. The detection device 30 may be configured to include a monitor that displays data such as an image obtained by extracting the 1 st injury candidate unit 40, an image obtained by extracting the generated inspection area 41 and the 2 nd injury candidate unit 42, an image obtained by performing expansion processing on the 2 nd injury candidate unit 42, an image of the detected injury unit, and the calculated determination value. With this configuration, the detection result of the damaged portion can be appropriately checked, and the usability is good.
The magnetic particle flaw detector 1 may further include another controller connected to the controller C. The other controller is a microcomputer including a processing device for performing arithmetic processing and control processing, a main storage device for storing data, and the like, and includes a CPU, a main storage device, a timer, an input circuit, an output circuit, a power supply circuit, and the like, as in the controller C. The controller C sends data such as an image obtained by extracting the 1 st injury candidate portion 40, an image obtained by extracting the generated inspection area 41 and the 2 nd injury candidate portion 42, an image obtained by performing an expansion process on the 2 nd injury candidate portion 42, an image of the detected injury portion, and the calculated determination value to another controller. On the other hand, the other controllers store the data sent from the controller C in the main storage device in association with data such as the size and material of the object 10 stored in advance.
With such a configuration, it is possible to create map data of the damaged portion of the test object 10 by another controller, and it is possible to easily perform production management of the test object 10. The controller C may be configured to receive data such as the size and material of the object 10 from another controller and create mapping data of the damaged portion of the object 10.
Industrial applicability
The flaw detection device of the present invention is not limited to the magnetic particle flaw detection device 1, and may be a penetration flaw detection device that detects a flaw on a surface of an object to be inspected using a penetration liquid, for example, and may be applied to any flaw detection device including an imaging device that images a surface of an object to be inspected and a detection device that processes an original image imaged by the imaging device to detect a flaw on the surface.
Claims (10)
1. A flaw detection device is provided with:
an imaging device that images a surface of an object to be inspected; and
a detection device for processing the original image picked up by the image pickup device to detect a damaged portion on the surface,
it is characterized in that the preparation method is characterized in that,
the detection device is provided with:
a 1 st extraction unit that extracts a 1 st candidate portion by performing binarization processing on the original image using a 1 st threshold value;
an inspection region generating unit that generates an inspection region surrounded by a pattern in which a pattern having a smallest area is enlarged by a predetermined width in each of a vertical direction and a horizontal direction so as to include the 1 st candidate portion;
a 2 nd extraction unit that performs binarization processing on the inspection region using a 2 nd threshold value, and extracts a 2 nd damage candidate unit based on a 2 nd determination reference value that is a state in which it is difficult to extract a region than the 1 st determination reference value; and
and a flaw determination unit that performs an expansion process on the 2 nd flaw candidate unit to detect the flaw.
2. The flaw detection apparatus according to claim 1,
the 2 nd threshold is less than the 1 st threshold.
3. The flaw detection apparatus according to claim 1 or 2,
the inspection area is an area surrounded by a rectangle obtained by enlarging a minimum rectangle including the 1 st candidate part by a predetermined width.
4. The flaw detection apparatus according to claim 1 or 2,
the expansion process is a process of expanding the 2 nd injury candidate portions in the respective longitudinal directions.
5. The flaw detection apparatus according to claim 3,
the expansion process is a process of expanding the 2 nd injury candidate portions in the respective longitudinal directions.
6. A method for detecting a damaged part by using a flaw detector,
in the above-mentioned method for detecting a damaged portion,
the image pickup device picks up an image of the surface of the object,
the detection device processes the original image picked up by the image pickup device to detect a damaged portion on the surface,
the method for detecting a damaged portion is characterized in that,
the detection device performs binarization processing on the original image by using a 1 st threshold value, extracts a 1 st damage candidate portion, generates an inspection region including the 1 st damage candidate portion, the inspection region being a region surrounded by a figure whose area is minimized and which is enlarged by a predetermined width in each of a vertical direction and a horizontal direction, performs binarization processing on the inspection region by using a 2 nd threshold value, extracts a 2 nd damage candidate portion based on a 2 nd determination reference value which is a state in which it is difficult to extract a region than the 1 st determination reference value, and performs dilation processing on the 2 nd damage candidate portion to detect the damaged portion.
7. The method of detecting a damaged part using a flaw detector according to claim 6,
the 2 nd threshold is less than the 1 st threshold.
8. The method of detecting a damaged part using a flaw detector according to claim 6 or 7,
the inspection area is an area surrounded by a rectangle obtained by enlarging a minimum rectangle including the 1 st candidate part by a predetermined width.
9. The method of detecting a damaged part using a flaw detector according to claim 6 or 7,
the expansion process is a process of expanding the 2 nd injury candidate portions in the respective longitudinal directions.
10. The method of detecting a damaged part using a flaw detector according to claim 8,
the expansion process is a process of expanding the 2 nd injury candidate portions in the respective longitudinal directions.
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| JP6697302B2 (en) * | 2016-03-25 | 2020-05-20 | マークテック株式会社 | Flaw detection device and defect detection method using flaw detection device |
| CN110892255B (en) * | 2017-07-07 | 2024-03-01 | 佳能株式会社 | Image processing apparatus, method and storage medium for detecting defect from image |
| CN108844965A (en) * | 2018-07-04 | 2018-11-20 | 武汉黎赛科技有限责任公司 | Defect image acquires display system, method, apparatus, computer and storage medium |
| CN109799240A (en) * | 2019-02-01 | 2019-05-24 | 信阳舜宇光学有限公司 | A kind of detection method of surface flaw |
| CN111562273A (en) * | 2020-06-05 | 2020-08-21 | 大连工业大学 | Hyperspectrum-based fish water jet descaling slight damage visualization method |
| CN115082431B (en) * | 2022-07-20 | 2023-01-06 | 惠州威尔高电子有限公司 | PCB surface defect detection method |
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| JP6596188B2 (en) | 2019-10-23 |
| KR102518378B1 (en) | 2023-04-04 |
| CN106053593A (en) | 2016-10-26 |
| JP2016197033A (en) | 2016-11-24 |
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