CN106047206A - 一种高导电性胶带 - Google Patents

一种高导电性胶带 Download PDF

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CN106047206A
CN106047206A CN201610568176.6A CN201610568176A CN106047206A CN 106047206 A CN106047206 A CN 106047206A CN 201610568176 A CN201610568176 A CN 201610568176A CN 106047206 A CN106047206 A CN 106047206A
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conductive adhesive
adhesive tape
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张剑萍
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CHANGSHU CHANGJIANG ADHESIVE TAPE Co Ltd
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    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
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    • C09J7/00—Adhesives in the form of films or foils
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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Abstract

本发明公开了一种高导电性胶带，包括：基材层，所述基材层的两个表面分别涂覆导电胶层，其中一个所述导电胶层的表面贴附铝箔层，另一个所述导电胶层的表面粘贴离型纸层。本发明一种高导电性胶带，结构简单，设计合理，其通过基材层、导电胶层和铝箔层的设计，一方面提高了胶带的结构强度，另一方面赋予胶带优异的导电性能，所得胶带各层均具有良好的导电性能，市场前景广阔。

Description

一种高导电性胶带
技术领域
本发明涉及胶带领域，特别是涉及一种高导电性胶带。
背景技术
导电胶带在液晶电视、手机、摄像头、医疗设备等电子产品中已经有成熟的应用经验。随着电子产品的功能越来越多，体型越来越轻薄，与此对应的产品电路设计也越来越复杂，电路设计的复杂又带来电磁兼容设计的复杂化。有时候需要在电子产品内部一狭小的空间里面对某个部位同时实现局部绝缘和局部屏蔽，或是通过重新修改电路设计，增加电容、电感配置来实现电路的优化。但是通过修改电路来满足电磁兼容，会导致成本高，用时长，线路中可能还会使用大量电子元件，使得电子产品的体积较大。为保证微型化的电子产品或设备正常运行，通过导电胶使各部件导通起到非常必要的作用。现有的导电胶存在导电效果差及粘结性不足等缺陷，不能满足微型化电子产品设计的需求。
发明内容
本发明主要解决的技术问题是提供一种高导电性胶带，能够解决现有导电胶带在微型化电子产品使用中存在的不足之处。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种高导电性胶带，包括：基材层，所述基材层的两个表面分别涂覆导电胶层，其中一个所述导电胶层的表面贴附铝箔层，另一个所述导电胶层的表面粘贴离型纸层。
在本发明一个较佳实施例中，所述基材层为金属纤维基材层或导电布层。
在本发明一个较佳实施例中，所述导电胶层为内含导电粒子的溶剂型无酸丙烯酸酯系压敏胶层。
在本发明一个较佳实施例中，所述导电粒子为炭黑颗粒或导电金属颗粒。
在本发明一个较佳实施例中，所述导电粒子在导电胶层中的填充量为50～70%。
本发明的有益效果是：本发明一种高导电性胶带，结构简单，设计合理，其通过基材层、导电胶层和铝箔层的设计，一方面提高了胶带的结构强度，另一方面赋予胶带优异的导电性能，所得胶带各层均具有良好的导电性能，市场前景广阔。
附图说明
图1是本发明一种高导电性胶带一较佳实施例的立体结构示意图；
附图中各部件的标记如下：1.基材层，2.导电胶层，3.铝箔层，4.离型纸层，5.导电颗粒。
具体实施方式
下面结合附图对本发明的较佳实施例进行详细阐述，以使本发明的优点和特征能更易于被本领域技术人员理解，从而对本发明的保护范围做出更为清楚明确的界定。
请参阅图1，本发明实施例包括：
实施例1
一种高导电性胶带，包括基材层1，导电胶层2、铝箔层3和离型纸层4；所述导电胶层2贴附在所述基材层1的两个表面上，其中一个导电胶层2与基材层1相对的表面上帖附铝箔层3，另一个导电胶层2与基材层1相对的表面上帖附离型纸层4。
其中，基材层1为金属纤维基材层。
导电胶层2为内含50%填充量的导电粒子5的溶剂型无酸丙烯酸酯系压敏胶层，厚度为50～100μm。其中，导电粒子5为炭黑颗粒或导电金属铜颗粒。
实施例2
一种高导电性胶带，包括基材层1，导电胶层2、铝箔层3和离型纸层4；所述导电胶层2贴附在所述基材层1的两个表面上，其中一个导电胶层2与基材层1相对的表面上帖附铝箔层3，另一个导电胶层2与基材层1相对的表面上帖附离型纸层4。
其中，基材层1为导电布层；导电胶层2为内含70%填充量的导电粒子5的溶剂型无酸丙烯酸酯系压敏胶层，厚度为50～100μm。其中，导电粒子5为炭黑颗粒和导电金属铜颗粒以任意比例混合的混合颗粒。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (5)

1.一种高导电性胶带，其特征在于，包括：基材层，所述基材层的两个表面分别涂覆导电胶层，其中一个所述导电胶层的表面贴附铝箔层，另一个所述导电胶层的表面粘贴离型纸层。
2.根据权利要求1所述的高导电性胶带，其特征在于，所述基材层为金属纤维基材层或导电布层。
3.根据权利要求1所述的高导电性胶带，其特征在于，所述导电胶层为内含导电粒子的溶剂型无酸丙烯酸酯系压敏胶层。
4.根据权利要求3所述的高导电性胶带，其特征在于，所述导电粒子为炭黑颗粒或导电金属颗粒。
5.根据权利要求4所述的高导电性胶带，其特征在于，所述导电粒子在导电胶层中的填充量为50～70%。
CN201610568176.6A 2016-07-19 2016-07-19 一种高导电性胶带 Pending CN106047206A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107946113A (zh) * 2017-12-20 2018-04-20 苏州佳值电子工业有限公司 一种用于键盘组件的铝箔基材

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2512777Y (zh) * 2001-12-06 2002-09-25 惠达 导电铝箔胶带
CN101654601A (zh) * 2009-09-03 2010-02-24 友达光电股份有限公司 一种用于背光模块的胶带及其制造方法
CN102399513A (zh) * 2011-11-18 2012-04-04 常熟市富邦胶带有限责任公司 导电布胶带
CN104388003A (zh) * 2014-11-25 2015-03-04 常熟市长江胶带有限公司 一种高强力导电泡棉胶带
CN204918466U (zh) * 2015-08-26 2015-12-30 东莞市粤辉实业有限公司 导电胶带

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2512777Y (zh) * 2001-12-06 2002-09-25 惠达 导电铝箔胶带
CN101654601A (zh) * 2009-09-03 2010-02-24 友达光电股份有限公司 一种用于背光模块的胶带及其制造方法
CN102399513A (zh) * 2011-11-18 2012-04-04 常熟市富邦胶带有限责任公司 导电布胶带
CN104388003A (zh) * 2014-11-25 2015-03-04 常熟市长江胶带有限公司 一种高强力导电泡棉胶带
CN204918466U (zh) * 2015-08-26 2015-12-30 东莞市粤辉实业有限公司 导电胶带

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107946113A (zh) * 2017-12-20 2018-04-20 苏州佳值电子工业有限公司 一种用于键盘组件的铝箔基材

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Application publication date: 20161026