CN106025457A - Novel dielectric ceramic frequency device and molding method of resonant cavity hole with controllable size - Google Patents
Novel dielectric ceramic frequency device and molding method of resonant cavity hole with controllable size Download PDFInfo
- Publication number
- CN106025457A CN106025457A CN201610442750.3A CN201610442750A CN106025457A CN 106025457 A CN106025457 A CN 106025457A CN 201610442750 A CN201610442750 A CN 201610442750A CN 106025457 A CN106025457 A CN 106025457A
- Authority
- CN
- China
- Prior art keywords
- plate
- frequency device
- thickness
- novel medium
- pottery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/2002—Dielectric waveguide filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/207—Hollow waveguide filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/007—Manufacturing frequency-selective devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/008—Manufacturing resonators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P7/00—Resonators of the waveguide type
- H01P7/06—Cavity resonators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P7/00—Resonators of the waveguide type
- H01P7/10—Dielectric resonators
Abstract
The invention relates to a novel dielectric ceramic frequency device and a molding method of a resonant cavity hole with a controllable size. The novel dielectric ceramic frequency device comprises a plate I (1) and a plate II (2), wherein a plurality of notches (11) are arranged in one surface, facing the plate II (2), of the plate I (1); one surface, facing the plate I (1), of the plate II (2) is a plane; and the contact surfaces of the plate I (1) and the plate II (2) are bonded to form a whole. By the novel dielectric ceramic frequency device and the molding method, the problems that the resonant cavity hole of an existing microwave dielectric ceramic frequency device product is prepared by molding a green body once, cannot be adjusted according to the requirements and is easy to bend are solved. The invention provides a novel resonant cavity hole molding technology. The length and the width of a rectangular hole of the microwave dielectric ceramic frequency device product can be freely adjusted according to the requirements; the straightness of the hole is high; bending deformation is avoided; and the electrical property requirements of customers on different products are met.
Description
Technical field
The present invention relates to a kind of Novel microwave dielectric ceramic wave filter, resonator and the forming method of resonator holes thereof, especially
It is, hole shape relatively small to aperture be non-circular dielectric ceramic filter resonator.
Background technology
At present, all of dielectric ceramic filter is used disposably to be suppressed by mould when idiosome molding and forms,
Its size cannot be adjusted when post-production, and this forming method is only capable of producing circular port, and is making rectangular opening
Time due to during high temperature sintering the inside and outside portion of matrix be heated uneven, be easily caused and ftractureed by the effect of stress in right angle.And by
In the restriction of moulding process, the diameter of its endoporus can not be made the least, otherwise the most carefully causes endoporus flexible due to core bar.
The aperture that summary of the invention brings to solve existing lumen pore one-shot forming technique is non-adjustable, flexible not
Foot, patent of the present invention uses two panels substrate combined process, first uses the cutting of different in width on slab according to bore dia demand
Blade cuts a plurality of groove, then is combined with slab by thin plate with proprietary material, burns till, and cutting forms multiple wave filter the most again.
For this technical solution used in the present invention be: the present invention includes plate one (1) and plate two (2), described plate one (1) towards
The one side of plate two (2) offers some notches (11), and described plate two (2) is plane towards the one side of plate one (1), described plate one
(1), the contact surface bonding of plate two (2) forms an entirety.
The thickness of described plate one (1) is more than the thickness of plate two (2).
Notch (11) on described plate one (1) is evenly arranged along plate one (1) longitudinal direction.
The contact surface size of described plate one (1) and plate two (2) is equal, shape when described plate one (1) contacts with plate two (2)
Become seamless link.
Described plate one (1) thickness is 1.2-2.5 times of plate two (2) thickness.
Described notch (11) is rectangular opening.
The forming method that the resonator holes size of a kind of novel medium pottery frequency device is controlled, enters according to following steps
OK:
1) make plate one (1) and the plate two (2) of respective thickness, and become microwave-medium to make pottery with plate two (2) high temperature sintering plate one (1)
Porcelain substrate；
2) plate one (1) and plate two (2) are machined to respective thickness；
3) determine in the upper width slotted of plate one (1) and the degree of depth, and carry out fluting processing；
4) on plate one (1) and plate two (2), make corresponding electrode pattern respectively and burn till；
5) plate one (1) of printed electrode and plate two (2) it is combined with binding agent and burns till formation substrate；
6) substrate after combining longitudinal and transverse cuts into several final finished.
Described 1), in step, dry-pressing formed or film rolling forming process making plate one (1) and plate two (2) are used.
Described 2), 3) in step, first plate one (1) and plate two (2) are ground to respective thickness with grinder；Then electricity consumption
Brain simulation software carries out Preliminary design, determines in the upper width slotted of plate one (1) and the degree of depth；Finally select the cutting of respective width
Blade, the fluting at the enterprising andante of cutting machine one (1) is processed.
The present invention solves existing microwave-medium ceramics frequency device product resonator holes and is made up of idiosome one-shot forming, nothing
Method is adjusted and the flexible deficiency of lumen pore according to demand.Patent of the present invention provides a kind of novel resonator holes molding work
Skill, this technique is possible not only to the most arbitrarily adjust the length and width of microwave-medium ceramics frequency device product rectangular opening, Er Qiekong
Linearity high, without flexural deformation, meet client's requirement on electric performance to different products.
Resonator holes molding of the present invention is simple, size is controlled, linearity is high, simple in construction.
Accompanying drawing explanation
Fig. 1 is the structural representation of patent of the present invention.
Fig. 2 is the schematic diagram being combined with plate dual-purpose binding agent by plate one.
Fig. 3 is the schematic diagram that conventional products uses one-shot forming technique processing resonator holes.
In figure 1 be plate one, 2 be notch for plate two, 11.
Detailed description of the invention
The present invention includes plate 1 and plate 22, and described plate 1 offers some notches 11 towards the one side of plate 22, described
Plate 22 is plane towards the one side of plate 1, and described plate 1, the contact surface bonding of plate 22 form an entirety.
The thickness of described plate 1 is more than the thickness of plate 22.
Notch 11 on described plate 1 is evenly arranged along plate 1 longitudinal direction.
The contact surface size of described plate 1 and plate 22 is equal, and described plate 1 forms seamless company when contacting with plate 22
Connect.
Described plate 1 thickness is 1.2-2.5 times of plate 22 thickness.
Described notch 11 is rectangular opening.
The present invention: 1) first use the dry-pressing formed or plate 1 of film rolling forming process making respective thickness and plate 22, and warp
High temperature sintering becomes microwave medium ceramic substrate；
2) according to different client's electrical property demands to product, respectively plate 1 and plate 22 grinder are ground to corresponding thickness
Degree；
3) carry out Preliminary design with computer simulation software, determine width and the degree of depth of fluting on plate 1；
4) cutting blade of respective width is selected, in the fluting processing of cutting machine enterprising andante 1；
5) on plate 1, plate 22, print corresponding silver electrode figure respectively and burn till；
6) plate 1 of printed electrode and plate 22 it is combined with binding agent and burns till formation substrate；
7) substrate after combining longitudinal and transverse cuts into several final finished.
Claims (9)
1. a novel medium pottery frequency device, it is characterised in that include plate one (1) and plate two (2), described plate one (1) face
One side to plate two (2) offers some notches (11), and described plate two (2) is plane towards the one side of plate one (1), described plate one
(1), the contact surface bonding of plate two (2) forms an entirety.
A kind of novel medium pottery frequency device the most according to claim 1, it is characterised in that the thickness of described plate one (1)
Degree is more than the thickness of plate two (2).
A kind of novel medium pottery frequency device the most according to claim 1, it is characterised in that on described plate one (1)
Notch (11) is evenly arranged along plate one (1) longitudinal direction.
A kind of novel medium pottery frequency device the most according to claim 1, it is characterised in that described plate one (1) and plate
The contact surface size of two (2) is equal, forms seamless link with plate two (2) when described plate one (1) contacts.
A kind of novel medium pottery frequency device the most according to claim 1, it is characterised in that described plate one (1) thickness
For plate two (2) thickness 1.2-2.5 times.
A kind of novel medium pottery frequency device the most according to claim 1, it is characterised in that described notch (11) is square
Shape hole.
7. the forming method that the resonator holes size of a novel medium pottery frequency device is controlled, it is characterised in that according to
Lower step is carried out:
1) make plate one (1) and the plate two (2) of respective thickness, and become microwave-medium to make pottery with plate two (2) high temperature sintering plate one (1)
Porcelain substrate；
2) plate one (1) and plate two (2) are machined to respective thickness；
3) determine in the upper width slotted of plate one (1) and the degree of depth, and carry out fluting processing；
4) on plate one (1) and plate two (2), make corresponding electrode pattern respectively and burn till；
5) plate one (1) of printed electrode and plate two (2) it is combined with binding agent and burns till formation substrate；
6) substrate after combining longitudinal and transverse cuts into several final finished.
The molding side that the resonator holes size of a kind of novel medium pottery frequency device the most according to claim 7 is controlled
Method, it is characterised in that described 1) in step, use dry-pressing formed or film rolling forming process to make plate one (1) and plate two (2).
The molding side that the resonator holes size of a kind of novel medium pottery frequency device the most according to claim 7 is controlled
Method, it is characterised in that described 2), 3) in step, first plate one (1) and plate two (2) are ground to respective thickness with grinder；So
Carry out Preliminary design with computer simulation software afterwards, determine in the upper width slotted of plate one (1) and the degree of depth；Finally select respective width
Cutting blade, the enterprising andante of cutting machine one (1) fluting process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610442750.3A CN106025457A (en) | 2016-06-21 | 2016-06-21 | Novel dielectric ceramic frequency device and molding method of resonant cavity hole with controllable size |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610442750.3A CN106025457A (en) | 2016-06-21 | 2016-06-21 | Novel dielectric ceramic frequency device and molding method of resonant cavity hole with controllable size |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106025457A true CN106025457A (en) | 2016-10-12 |
Family
ID=57088892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610442750.3A Pending CN106025457A (en) | 2016-06-21 | 2016-06-21 | Novel dielectric ceramic frequency device and molding method of resonant cavity hole with controllable size |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106025457A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946708A (en) * | 2017-11-15 | 2018-04-20 | 张家港保税区灿勤科技有限公司 | The wave filter and production method of bonded structure |
| CN108515601A (en) * | 2018-04-23 | 2018-09-11 | 苏州市协诚五金制品有限公司 | A kind of adjustable ceramic resonator of frequency and its preparation process |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2081153U (en) * | 1990-05-13 | 1991-07-17 | 国营第九九九厂 | Dielectric filter |
| CN101830695A (en) * | 2010-04-27 | 2010-09-15 | 江苏江佳电子股份有限公司 | Microwave medium ceramic material suitable for medium resonant cavity and preparation method thereof |
| CN102509820A (en) * | 2011-11-04 | 2012-06-20 | 浙江嘉康电子股份有限公司 | Transverse electromagnetic (TEM)-mode coaxial dielectric ceramic filter and manufacturing method for same |
| CN105280994A (en) * | 2014-06-27 | 2016-01-27 | 摩比天线技术（深圳）有限公司 | TM mode dielectric filter and multiplexer |
-
2016
- 2016-06-21 CN CN201610442750.3A patent/CN106025457A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2081153U (en) * | 1990-05-13 | 1991-07-17 | 国营第九九九厂 | Dielectric filter |
| CN101830695A (en) * | 2010-04-27 | 2010-09-15 | 江苏江佳电子股份有限公司 | Microwave medium ceramic material suitable for medium resonant cavity and preparation method thereof |
| CN102509820A (en) * | 2011-11-04 | 2012-06-20 | 浙江嘉康电子股份有限公司 | Transverse electromagnetic (TEM)-mode coaxial dielectric ceramic filter and manufacturing method for same |
| CN105280994A (en) * | 2014-06-27 | 2016-01-27 | 摩比天线技术（深圳）有限公司 | TM mode dielectric filter and multiplexer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946708A (en) * | 2017-11-15 | 2018-04-20 | 张家港保税区灿勤科技有限公司 | The wave filter and production method of bonded structure |
| CN108515601A (en) * | 2018-04-23 | 2018-09-11 | 苏州市协诚五金制品有限公司 | A kind of adjustable ceramic resonator of frequency and its preparation process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101276381B1 (en) | Method of making a waveguide | |
| CN110165345B (en) | Capacitive coupling structure and preparation method thereof | |
| CN106025457A (en) | Novel dielectric ceramic frequency device and molding method of resonant cavity hole with controllable size | |
| CN201898192U (en) | TEM (transverse electric and magnetic) mode coaxial dielectric ceramic resonator | |
| WO2015129340A1 (en) | Ceramic substrate and method for manufacturing module product | |
| KR100932705B1 (en) | Dielectric waveguide filter and manufacturing method thereof | |
| CN109940740A (en) | Waveguide filter idiosome molding die and its technique | |
| CN104218296B (en) | A kind of waveguide based on multi-sheet printed technology and preparation method thereof | |
| CN102509820A (en) | Transverse electromagnetic (TEM)-mode coaxial dielectric ceramic filter and manufacturing method for same | |
| TWI447760B (en) | A manufacturing method of a laminated inductor element, and a laminated inductor element | |
| JP4674397B2 (en) | Manufacturing method of ceramic body | |
| CN204884759U (en) | Preform for magnetic core inductor | |
| CN106298207B (en) | Mass production method of passive element with terminal electrode | |
| CN202308231U (en) | TEM die coaxial medium ceramic filter | |
| CN106298206B (en) | Preform of passive element and its mass production method | |
| CN111816960B (en) | Dielectric filter with novel combined structure | |
| JP2004009681A (en) | Manufacturing process for layered product, die used for it, and manufacturing process for the die | |
| CN212517457U (en) | Dielectric filter with novel combined structure | |
| CN218182452U (en) | Sectional type combination low frequency ceramic syntonizer, wave filter | |
| JPS6454720A (en) | Manufacture of laminated type ceramic chip capacitor | |
| CN215377657U (en) | Port coupling structure and filter | |
| CN103402314B (en) | The manufacture method of pcb board and obtained pcb board | |
| CN106103025B (en) | Dust collecter and sheet material processing apparatus | |
| JPH0195588A (en) | Manufacture of circuit substrate | |
| CN102689355A (en) | Assembled type building block molding mould core |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20180929 Address after: 225261 No. 88, Gan Tang Road, Shabo Town, Jiangdu District, Yangzhou, Jiangsu Applicant after: Jiangsu Jiangjia Electronics Co., Ltd. Applicant after: Yangzhou Jiangjia Technology Co., Ltd. Address before: 225200 No. 88, Gan Tang Road, Shabo Town, Jiangdu District, Yangzhou, Jiangsu Applicant before: Jiangsu Jiangjia Electronics Co., Ltd. |
|
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |