CN106025039A - 一种led封装结构 - Google Patents

一种led封装结构 Download PDF

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Publication number
CN106025039A
CN106025039A CN201610491010.9A CN201610491010A CN106025039A CN 106025039 A CN106025039 A CN 106025039A CN 201610491010 A CN201610491010 A CN 201610491010A CN 106025039 A CN106025039 A CN 106025039A
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China
Prior art keywords
led
heat
heat dissipation
led chip
radiating substrate
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CN201610491010.9A
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English (en)
Inventor
储世昌
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Individual
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Individual
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Priority to CN201610491010.9A priority Critical patent/CN106025039A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

本发明公开了一种LED封装结构，包括LED芯片和散热基板，其特征在于：所述散热基板上左右两边分别设有电极，所述两电极间设有LED芯片，所述LED芯片底面与散热基板顶面相连，所述LED芯片左右两端分别通过LED电极与所对应电极相连，所述散热基板通过铝材料浇铸成形，所述散热基板表面渡有绝缘膜。本发明结构简单合理、生产成本低、使用寿命长、散热性能强。

Description

一种LED封装结构
技术领域
本发明涉及一种LED封装结构。
背景技术
最近几年，发光二极管(Light-Emitting Diode，LED)的应用随着其功率和光效的提高迅速普及，而随着芯片功率的不断提高，大功率LED所面临的散热问题也越发严重，如果器件热管理方面的设计不当，LED芯片结温过高，则有可能使荧光粉效率降低，从而降低光效并影响LED色温，甚至导致器件寿命减短或永久性不可逆损坏，因此，LED散热问题已经成为大功率LED照明发展的一大瓶颈，对于良好的LED热管理设计的需要已迫在眉睫，常规的封装方式多采用直插式，但其空间利用率大，封装过程复杂，且散热性能低，使得温度过高从而对芯片造成危害，导致其寿命减少，需对其进行改进。
发明内容
本发明所要解决的技术问题在于提供一种结构简单合理、生产成本低、使用寿命长、散热性能强的LED封装结构。
一种LED封装结构，包括LED芯片和散热基板，其特征在于：所述散热基板上左右两边分别设有电极，所述两电极间设有LED芯片，所述LED芯片底面与散热基板顶面相连，所述LED芯片左右两端分别通过LED电极与所对应电极相连。
所述散热基板通过铝材料浇铸成形。
所述散热基板表面渡有绝缘膜。
本发明的有益效果：结构简单合理、生产成本低、使用寿命长、散热性能强。
附图说明
图1为本发明结构示意图。
具体实施方式
为了使本发明实现的技术手段、创作特征、达成目的与功效易于明白了解，下面结合具体实施例，进一步阐述本发明。
如图1所示，一种LED封装结构，包括LED芯片1和散热基板2，散热基板2上左右两边分别设有电极3，两电极3间设有LED芯片1，LED芯片1底面与散热基板2顶面相连，LED芯片1左右两端分别通过LED电极4与所对应电极3相连。
散热基板2通过铝材料浇铸成形。
散热基板2表面渡有绝缘膜。
以上显示和描述了本发明的基本原理和主要特征和本发明的优点。本行业的技术人员应该了解，本发明不受上述实施例的限制，上述实施例和说明书中描述的只是说明本发明的原理，在不脱离本发明精神和范围的前提下，本发明还会有各种变化和改进，这些变化和改进都落入要求保护的本发明范围内。本发明要求保护范围由所附的权利要求书及其等效物界定。

Claims (3)

1.一种LED封装结构，包括LED芯片和散热基板，其特征在于：所述散热基板上左右两边分别设有电极，所述两电极间设有LED芯片，所述LED芯片底面与散热基板顶面相连，所述LED芯片左右两端分别通过LED电极与所对应电极相连。
2.根据权利要求1所述一种LED封装结构，其特征在于：所述散热基板通过铝材料浇铸成形。
3.根据权利要求1所述一种LED封装结构，其特征在于：所述散热基板表面渡有绝缘膜。
CN201610491010.9A 2016-06-28 2016-06-28 一种led封装结构 Pending CN106025039A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610491010.9A CN106025039A (zh) 2016-06-28 2016-06-28 一种led封装结构

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610491010.9A CN106025039A (zh) 2016-06-28 2016-06-28 一种led封装结构

Publications (1)

Publication Number Publication Date
CN106025039A true CN106025039A (zh) 2016-10-12

Family

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Country Status (1)

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CN (1) CN106025039A (zh)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101030613A (zh) * 2006-03-03 2007-09-05 广镓光电股份有限公司 覆晶式发光二极管封装结构及其封装方法
CN200956685Y (zh) * 2006-09-26 2007-10-03 蔡勇 电子元器件封装铝基板
CN101079461A (zh) * 2006-05-23 2007-11-28 台达电子工业股份有限公司 发光装置
CN101079460A (zh) * 2006-05-23 2007-11-28 台达电子工业股份有限公司 发光装置
CN203288645U (zh) * 2013-05-29 2013-11-13 深圳市晶台光电有限公司 一种圆形mcob封装结构
CN203871360U (zh) * 2014-07-10 2014-10-08 深圳市晶台股份有限公司 一种抛光铝基板cob封装结构
CN204045633U (zh) * 2014-09-01 2014-12-24 厦门光莆电子股份有限公司 发光二极管板上芯片封装结构

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101030613A (zh) * 2006-03-03 2007-09-05 广镓光电股份有限公司 覆晶式发光二极管封装结构及其封装方法
CN101079461A (zh) * 2006-05-23 2007-11-28 台达电子工业股份有限公司 发光装置
CN101079460A (zh) * 2006-05-23 2007-11-28 台达电子工业股份有限公司 发光装置
CN200956685Y (zh) * 2006-09-26 2007-10-03 蔡勇 电子元器件封装铝基板
CN203288645U (zh) * 2013-05-29 2013-11-13 深圳市晶台光电有限公司 一种圆形mcob封装结构
CN203871360U (zh) * 2014-07-10 2014-10-08 深圳市晶台股份有限公司 一种抛光铝基板cob封装结构
CN204045633U (zh) * 2014-09-01 2014-12-24 厦门光莆电子股份有限公司 发光二极管板上芯片封装结构

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