CN106024770A - 一种无引线led封装结构 - Google Patents
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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Abstract
本发明提供了一种无引线LED封装结构,包括封装本体,控制模块,多个LED芯片,其中封装本体呈圆台状,其具有上下底面和侧面,所述上底面的面积小于下底面的面积,所述多个LED芯片均匀分布在封装本体的侧面上,并通过侧面上的电路图案将多个LED芯片进行串联和/或并联,形成灯串,并将灯串两端的端子通过封装本体的内部导电层电连接至控制模块;所述封装本体的上底面具有盲孔,所述控制模块与盲孔的形状互补并能够嵌入至该盲孔中。
Description
技术领域
本发明涉及固态照明材料领域,具体涉及一种无引线LED封装结构。
背景技术
目前所使用的半导体发光元件主要为LED(发光二极管),LED是一种固态的半导体器件,它可以直接把电能转化为光能。与传统的白炽灯、荧光灯相比,白光LED具有耗电小、发光效率高、使用寿命长、节能环保等优点,因此其不仅可以在日常照明领域得到广泛的应用,而且可以进入显示设备领域。
目前的LED封装主要是COB(chip on board)封装结构,即将LED通过打线固定在基板(平面基板)上,再利用荧光胶脂进行封装,但是其具有以下缺点:1)平面发光,不利于光的发射角度的拓展,LED芯片分布较密集;2)打线较为繁琐且易产生电连接不良的情况;3)控制芯片的连接单一,不易更换和维修。
发明内容
基于解决上述封装中的问题,本发明提供了一种无引线LED封装结构,包括封装本体,控制模块,多个LED芯片,其中封装本体呈圆台状,其具有上下底面和侧面,所述上底面的面积小于下底面的面积,所述多个LED芯片均匀分布在封装本体的的侧面上,并通过侧面上的电路图案将多个LED芯片进行串联和/或并联,形成灯串,并将灯串两端的端子通过封装本体的内部导电层电连接至控制模块;所述封装本体的上底面具有盲孔,所述控制模块与盲孔的形状互补并能够嵌入至该盲孔中。
其中,所述所述盲孔呈圆柱形,控制模块的形状与盲孔互补,也呈圆柱形。
其中,该盲孔的底部暴露出内部导电层的部分。
其中,所述封装本体是散热性较好的陶瓷材料。
其中,所述封装本体的侧面与下底面呈30-75度的夹角。
其中,所述控制模块为圆柱形,其包括控制芯片,通孔,导电端子以及树脂模塑体,其中所述控制芯片被所述树脂模塑体包围,且在树脂模塑料的底部露出控制芯片的端子。
其中,所述控制芯片上面具有电连接所述控制芯片和导电端子的通孔,所述通孔设置在所述树脂模塑料中。
其中,所述多个LED芯片是倒装芯片。
其中,所述树脂模塑料在顶面具有凹槽,所述凹槽露出导电端子。
其中,该凹槽可以容置电池,也可以插入其他外接电源或其他功能的零部件。
本发明的优点如下:
(1)利用圆台的倾斜面进行更宽范围的发光,提高发光效率;
(2)无引线封装结构,无需打线的繁琐步骤;
(3)利用抽插的控制模块,方便更换和维修。
附图说明
图1为本发明的无引线LED封装结构的剖视图和俯视图。
具体实施方式
参见图1,本发明首先提供了一种无引线LED封装结构,包括封装本体1,控制模块3,多个LED芯片2,其中封装本体1呈圆台状,其具有上下底面和侧面,所述上底面的面积小于下底面的面积,所述多个LED芯片2均匀分布在封装本体1的的侧面上,并通过侧面上的电路图案9将多个LED芯片2进行串联和/或并联,形成灯串,并将灯串两端的端子通过封装本体1的内部导电层4电连接至控制模块3。
所述封装本体1的上底面具有盲孔,所述盲孔呈圆柱形,控制模块3的形状与盲孔互补,正好嵌入该盲孔中,且该盲孔的底部暴露出部分的内部导电层4;所述封装本体是散热性较好的陶瓷材料,通过一体成型工艺制造而成,所述导电图案通过电镀、光刻等工艺在所述侧面形成。所述封装本体1的侧面与下底面呈一定的角度,该角度的范围在30-75度之间。
所述内部导电层4电连接至所述导电图案9,并通过导电图案9电连接至灯串,在所述本体1的盲孔的底部露出内部导电层4的部分;所述内部导电层4形成方式为:通过在本体1的内部打孔,并注入导电物质固化。
所述控制模块3为圆柱形,其包括控制芯片5,通孔6,导电端子8以及树脂模塑体。所述控制芯片5被所述树脂模塑体包围,且在树脂模塑料的底部露出控制芯片5的端子,所述端子连接至盲孔底部的内部导电层4;所述控制芯片3上面具有电连接所述控制芯片3和导电端子8的通孔6,所述通孔6设置在所述树脂模塑料中。所述树脂模塑料在顶面具有凹槽7,所述凹槽7露出导电端子8,该凹槽7可以容置电池,也可以插入其他外接电源或其他功能(除控制功能的)的零部件。该控制模块是插拔式的,可以随时拔掉或插入,方便更换和维修。
所述多个LED芯片是倒装芯片,可以是多个发射相同颜色光的LED芯片,也可以是发射不同颜色光的LED芯片,其排布在所述侧面上,且间隔距离相等。该排布使得光发射均匀。
最后应说明的是:显然,上述实施例仅仅是为清楚地说明本发明所作的举例,而并非对实施方式的限定。对于所属领域的普通技术人员来说,在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。而由此所引申出的显而易见的变化或变动仍处于本发明的保护范围之中。
Claims (10)
1.一种无引线LED封装结构,包括封装本体,控制模块,多个LED芯片,其中封装本体呈圆台状,其具有上下底面和侧面,所述上底面的面积小于下底面的面积,所述多个LED芯片均匀分布在封装本体的的侧面上,并通过侧面上的电路图案将多个LED芯片进行串联和/或并联,形成灯串,并将灯串两端的端子通过封装本体的内部导电层电连接至控制模块;所述封装本体的上底面具有盲孔,所述控制模块与盲孔的形状互补并能够嵌入至该盲孔中。
2.根据权利要求1所述的无引线LED封装结构,其特征在于:所述所述盲孔呈圆柱形,控制模块的形状与盲孔互补,也呈圆柱形。
3.根据权利要求1所述的无引线LED封装结构,其特征在于:该盲孔的底部暴露出内部导电层的部分。
4.根据权利要求1所述的无引线LED封装结构,其特征在于:所述封装本体是散热性较好的陶瓷材料。
5.根据权利要求1所述的无引线LED封装结构,其特征在于:所述封装本体的侧面与下底面呈30-75度的夹角。
6.根据权利要求1所述的无引线LED封装结构,其特征在于:所述控制模块为圆柱形,其包括控制芯片,通孔,导电端子以及树脂模塑体,其中所述控制芯片被所述树脂模塑体包围,且在树脂模塑料的底部露出控制芯片的端子。
7.根据权利要求1所述的无引线LED封装结构,其特征在于:所述控制芯片上面具有电连接所述控制芯片和导电端子的通孔,所述通孔设置在所述树脂模塑料中。
8.根据权利要求1所述的无引线LED封装结构,其特征在于:所述多个LED芯片是倒装芯片。
9.根据权利要求1所述的无引线LED封装结构,其特征在于:所述树脂模塑料在顶面具有凹槽,所述凹槽露出导电端子。
10.根据权利要求1所述的无引线LED封装结构,其特征在于:该凹槽可以容置电池,也可以插入其他外接电源或其他功能的零部件。
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Citations (2)
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CN101144594A (zh) * | 2007-10-25 | 2008-03-19 | 翁金荣 | 一种坡面led支架及led光源 |
US20130213697A1 (en) * | 2010-11-03 | 2013-08-22 | 3M Innovative Properties Company | Flexible led device with wire bond free die |
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CN101144594A (zh) * | 2007-10-25 | 2008-03-19 | 翁金荣 | 一种坡面led支架及led光源 |
US20130213697A1 (en) * | 2010-11-03 | 2013-08-22 | 3M Innovative Properties Company | Flexible led device with wire bond free die |
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