CN106010338A - Adhesive tape used as shielding cover and application of adhesive tape - Google Patents
Adhesive tape used as shielding cover and application of adhesive tape Download PDFInfo
- Publication number
- CN106010338A CN106010338A CN201610531718.2A CN201610531718A CN106010338A CN 106010338 A CN106010338 A CN 106010338A CN 201610531718 A CN201610531718 A CN 201610531718A CN 106010338 A CN106010338 A CN 106010338A
- Authority
- CN
- China
- Prior art keywords
- layer
- adhesive tape
- conductive
- radome
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/21—Paper; Textile fabrics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0862—Nickel
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/26—Presence of textile or fabric
- C09J2400/263—Presence of textile or fabric in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
Abstract
The invention discloses adhesive tape used as a shielding cover and application of the adhesive tape. When used as the shielding cover, the adhesive tape is excellent in shielding effect, thin and light. The adhesive tape comprises a release layer, a conductive adhesive layer, a fiber layer, a conductive adhesive layer, a conductive base body layer and an anti-oxidization conductive coating which are sequentially connected. The thickness of the adhesive tape is 0.03-0.3 mm. The conductive base body layer is a copper foil layer, an aluminum foil layer, a conductive fabric layer or a stainless steel layer. The thickness of the conductive base body layer is 0.005-0.25 mm. The adhesive tape can achieve electricity conductivity, shielding, grounding, anti-oxidization, heat conductivity and the like at the same time.
Description
Technical field
The present invention relates to radome and manufacture field, particularly relate to adhesive tape as radome and application thereof.
Background technology
At present, radome traditional on market includes: the radome of zinc-tin nickel alloy, and this cost of alloy is low；Ocean copper-nickel alloy shielding
Cover, this material capability is good and easily processes；Rustless steel radome, this material can only be done lid and use.Additionally, above-mentioned shielding
Cover also needs to coordinate support to be used together, and timbering material selects zinc-tin nickel alloy or ocean copper-nickel alloy.The installation of above-mentioned support need through
Cross bending, punching, then the working procedure processing such as installation completes.
By above-mentioned analysis, existing radome has problems with when using: thickness is thicker, heavier-weight, and processing is multiple
Miscellaneous, expend more manpower and materials, inconvenience etc. of doing over again.
Summary of the invention
Present invention solves the technical problem that and be to provide a kind of adhesive tape used as radome, to overcome deficiency of the prior art.
The technical solution adopted for the present invention to solve the technical problems is: as the adhesive tape of radome, release including be sequentially connected
Layer, conductive adhesive layer, fibrous layer, conductive adhesive layer, conducting base layer and antioxidation conductive coating.
Described conductive adhesive layer can use acrylic pressure sensitive glue, and it includes acrylic resin 60-95 part according to mass fraction, solidification
Agent 0.5-5 part, conductive particle 4-35 part, agitated coating forms.Wherein conductive particle can be: copper powder, nikel powder, argentum powder etc.
Metal dust.
Described conductive fiber layer is polyester fiber, can be conductive fabric, conductive non-woven fabrics, conduction grenadine etc..
Further: the thickness of described adhesive tape is 0.03-0.3mm.
Further: described conducting base layer is copper foil layer, aluminium foil layer, conduction layer of cloth or stainless steel layer, conducting base layer
Thickness is 0.005-0.25mm.Above-mentioned conducting base is that the material with some strength and toughness is constituted.
Present invention also offers the purposes of above-mentioned adhesive tape, particularly as follows: be attached on target object as radome by described adhesive tape.
The invention has the beneficial effects as follows:
Antioxidation conductive coating can be black, and conduction antioxidation, sheet resistance can be less than 0.2ohms/inch2.
When conducting base layer is metal material, the effect of heat radiation can be played, there is extraordinary shielding and conductive effect simultaneously.
Conducting base layer side is the conducting resinl product of fiber base material, has well pasting property, and because being to have base material conducting resinl,
The resistance of product is the lowest, and XY is smaller than 0.06ohms/inch2 to resistance, and Z-direction resistance is smaller than 0.1ohms/inch2.
The adhesive tape of the present invention, surface thermal radiation rate can be 0.95.
Owing to being provided with antioxidation conductive coating, surface oxidation-resistant ability can ensure the most not oxidized.
The adhesive tape of the present invention, can realize conduction, shielding, ground connection, antioxidation, heat conduction etc. simultaneously.
The adhesive tape of the present invention, its shield effectiveness more superior than existing radome 1/3.
The adhesive tape of the present invention, light at least 7 times of its weight ratio conventional shields (as a example by conventional 0.2mm ocean copper-nickel alloy), it is thick
Degree can be the 1/4 of conventional shields (as a example by conventional 0.2mm ocean copper-nickel alloy).
The adhesive tape of the present invention uses as radome, it is not necessary to the installation wasted time and energy as conventional shields, it is not required that as
Conventional shields reprocesses difficulty like that.The adhesive tape of the present invention itself has autohension, shape according to demand can carry out cross cutting,
After cross cutting, the viscosity because of himself can be directly adhered to desired area, when if desired doing over again, the most directly tears off.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the adhesive tape as radome of the present invention；
Figure is labeled as: release layer 5, conductive adhesive layer 3, conductive fiber layer 4, conducting base layer 2, antioxidation conductive coating 1.
Detailed description of the invention
The present invention is further described with detailed description of the invention below in conjunction with the accompanying drawings.
As it is shown in figure 1, the adhesive tape as radome of the present invention, including the release layer 5 being sequentially connected, conductive adhesive layer 3, conduction
Fibrous layer 4, conductive adhesive layer 3, conducting base layer 2 and antioxidation conductive coating 1.The thickness of described adhesive tape is 0.03-0.3mm,
Can be 0.04mm, 0.05mm, 0.07mm, 0.1mm, 0.2mm etc..Described conducting base layer is copper foil layer, aluminium foil layer, conductive fabric
Layer or stainless steel layer, the thickness of conducting base layer is 0.005-0.25mm, Ke Yishi
0.006mm, 0.02mm, 0.09mm, 0.1mm, 0.2mm etc..Described conductive adhesive layer includes according to mass fraction: acrylic resin
60-95 part, firming agent 0.5-5 part, conductive particle 4-35 part.Described conductive particle is copper powder, nikel powder or argentum powder.Described lead
Electricity fibrous layer is conductive fabric or conductive non-woven fabrics or the grenadine that conducts electricity.
The adhesive tape of the present invention can use following methods to make:
By coating process, antioxidation electrically-conducting paint is coated in conducting base layer 2 surface, thus forms antioxidation conductive coating 1,
After being then passed through scraper and curing oven, rolling rewinding is the first semi-finished product.
With fiber as base, conducting resinl is adhered to coating method in two sides, forms the second semi-finished product.
First semi-finished product and the second semi-finished product are combined, form the adhesive tape of the present invention.
Below by way of specific embodiment, the present invention is further described.
Embodiment 1:
The adhesive tape as radome of the present invention, including the release layer 5 being sequentially connected, conductive adhesive layer 3, conductive fiber layer 4, leads
Electricity glue-line 3, conducting base layer 2 and antioxidation conductive coating 1.The thickness of described adhesive tape is 0.03mm.Described conducting base layer
For copper foil layer, the thickness of conducting base layer is 0.005mm.Described conductive adhesive layer includes according to mass fraction: acrylic resin 60
Part, 0.5 part of firming agent, conductive particle 4 parts.Described conductive particle is copper powder.Described conductive fiber layer is conductive fabric.
Embodiment 2:
The adhesive tape as radome of the present invention, including the release layer 5 being sequentially connected, conductive adhesive layer 3, conductive fiber layer 4, leads
Electricity glue-line 3, conducting base layer 2 and antioxidation conductive coating 1.The thickness of described adhesive tape is 0.1mm.Described conducting base layer is
Aluminium foil layer, the thickness of conducting base layer is 0.05mm.Described conductive adhesive layer includes according to mass fraction: acrylic resin 95 parts,
5 parts of firming agent, conductive particle 25 parts.Described conductive particle is argentum powder.Described conductive fiber layer is conductive non-woven fabrics.
Embodiment 3:
The adhesive tape as radome of the present invention, including the release layer 5 being sequentially connected, conductive adhesive layer 3, conductive fiber layer 4, leads
Electricity glue-line 3, conducting base layer 2 and antioxidation conductive coating 1.The thickness of described adhesive tape is 0.3mm.Described conducting base layer is
Conduction layer of cloth, the thickness of conducting base layer is 0.25mm.Described conductive adhesive layer includes according to mass fraction: acrylic resin 80
Part, 4 parts of firming agent, conductive particle 30 parts.Described conductive particle is nikel powder.Described conductive fiber layer is conduction grenadine.
Particular embodiments described above, is further described the purpose of the present invention, technical scheme and beneficial effect,
Be it should be understood that the specific embodiment that the foregoing is only the present invention, be not limited to the present invention, all in the present invention
Spirit and principle within, any modification, equivalent substitution and improvement etc. done, should be included in protection scope of the present invention it
In.
Claims (6)
1. be used as the adhesive tape of radome, it is characterised in that: the release layer that includes being sequentially connected, conductive adhesive layer, conductive fiber layer,
Conductive adhesive layer, conducting base layer and antioxidation conductive coating；
Described conductive adhesive layer includes according to mass fraction: acrylic resin 60-95 part, firming agent 0.5-5 part, conductive particle 4-35
Part.
2. the as claimed in claim 1 adhesive tape being used as radome, it is characterised in that: described conductive particle be copper powder, nikel powder or
Argentum powder.
3. the adhesive tape being used as radome as claimed in claim 1, it is characterised in that: described conductive fiber layer is conductive fabric or leads
Electricity non-woven fabrics or conduction grenadine.
4. the adhesive tape being used as radome as claimed in claim 1, it is characterised in that: the thickness of described adhesive tape is 0.03-0.3mm.
5. the adhesive tape being used as radome as claimed in claim 1, it is characterised in that: described conducting base layer is copper foil layer, aluminum
Layers of foil, conduction layer of cloth or stainless steel layer, the thickness of conducting base layer is 0.005-0.25mm.
6. the purposes of the adhesive tape as radome as described in any one in claim 1 to 5, it is characterised in that: by described
Adhesive tape is attached on target object as radome.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610531718.2A CN106010338A (en) | 2016-07-07 | 2016-07-07 | Adhesive tape used as shielding cover and application of adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610531718.2A CN106010338A (en) | 2016-07-07 | 2016-07-07 | Adhesive tape used as shielding cover and application of adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106010338A true CN106010338A (en) | 2016-10-12 |
Family
ID=57108248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610531718.2A Pending CN106010338A (en) | 2016-07-07 | 2016-07-07 | Adhesive tape used as shielding cover and application of adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106010338A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106566433A (en) * | 2016-10-20 | 2017-04-19 | 昆山汉品电子有限公司 | Electric-conduction shading radiating adhesive tape and manufacturing method |
| CN107018648A (en) * | 2017-06-02 | 2017-08-04 | 深圳天珑无线科技有限公司 | Radome and preparation method thereof, electronic installation |
| CN107151537A (en) * | 2017-04-26 | 2017-09-12 | 江苏斯瑞达新材料科技有限公司 | A kind of preparation method of flame retardant type shielding tape |
| CN107216826A (en) * | 2017-07-28 | 2017-09-29 | 青岛海信电器股份有限公司 | A kind of conductive fabric and preparation method thereof |
| CN110128962A (en) * | 2019-04-24 | 2019-08-16 | 湖南省普瑞达内装材料有限公司 | A kind of electricity conductive cloth tape |
| CN110586428A (en) * | 2019-09-18 | 2019-12-20 | 深圳嘉信源科技实业有限公司 | Processing technology of insulation shielding case |
| CN112373077A (en) * | 2020-10-22 | 2021-02-19 | 江苏南锦电子材料有限公司 | Assembling method of electromagnetic shielding heat-conducting adhesive tape |
| CN112574687A (en) * | 2021-01-15 | 2021-03-30 | 惠州市兆联电子科技有限公司 | High shielding efficiency copper foil adhesive tape and manufacturing method thereof |
| CN112672631A (en) * | 2021-01-12 | 2021-04-16 | 深圳市鑫诺诚科技有限公司 | 5G high-frequency special shielding efficiency composite material |
| CN114958227A (en) * | 2022-06-01 | 2022-08-30 | 江苏伊诺尔新材料科技有限公司 | Super-flexible efficient heat-dissipation electromagnetic shielding adhesive tape and manufacturing method thereof |
| CN115093802A (en) * | 2022-03-30 | 2022-09-23 | 安徽屹珹新材料科技有限公司 | Electromagnetic shielding composite material and preparation method thereof |
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| CN102140316A (en) * | 2011-05-06 | 2011-08-03 | 广州方邦电子有限公司 | Conductive adhesive film and preparation method thereof |
| CN103198882A (en) * | 2012-01-04 | 2013-07-10 | 扬州荣光电缆材料有限公司 | Oxidation-resistance tensile-resistance copper clad copper metal wire |
| CN204939377U (en) * | 2015-07-30 | 2016-01-06 | 深圳市摩码科技有限公司 | Conductive shield adhesive tape |
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2016
- 2016-07-07 CN CN201610531718.2A patent/CN106010338A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102140316A (en) * | 2011-05-06 | 2011-08-03 | 广州方邦电子有限公司 | Conductive adhesive film and preparation method thereof |
| CN103198882A (en) * | 2012-01-04 | 2013-07-10 | 扬州荣光电缆材料有限公司 | Oxidation-resistance tensile-resistance copper clad copper metal wire |
| CN204939377U (en) * | 2015-07-30 | 2016-01-06 | 深圳市摩码科技有限公司 | Conductive shield adhesive tape |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106566433A (en) * | 2016-10-20 | 2017-04-19 | 昆山汉品电子有限公司 | Electric-conduction shading radiating adhesive tape and manufacturing method |
| CN107151537A (en) * | 2017-04-26 | 2017-09-12 | 江苏斯瑞达新材料科技有限公司 | A kind of preparation method of flame retardant type shielding tape |
| CN107018648A (en) * | 2017-06-02 | 2017-08-04 | 深圳天珑无线科技有限公司 | Radome and preparation method thereof, electronic installation |
| CN107216826B (en) * | 2017-07-28 | 2020-10-30 | 海信视像科技股份有限公司 | Conductive cloth and manufacturing method thereof |
| CN107216826A (en) * | 2017-07-28 | 2017-09-29 | 青岛海信电器股份有限公司 | A kind of conductive fabric and preparation method thereof |
| CN110128962A (en) * | 2019-04-24 | 2019-08-16 | 湖南省普瑞达内装材料有限公司 | A kind of electricity conductive cloth tape |
| CN110586428A (en) * | 2019-09-18 | 2019-12-20 | 深圳嘉信源科技实业有限公司 | Processing technology of insulation shielding case |
| CN112373077A (en) * | 2020-10-22 | 2021-02-19 | 江苏南锦电子材料有限公司 | Assembling method of electromagnetic shielding heat-conducting adhesive tape |
| CN112373077B (en) * | 2020-10-22 | 2022-05-06 | 江苏南锦电子材料有限公司 | Assembling method of electromagnetic shielding heat-conducting adhesive tape |
| CN112672631A (en) * | 2021-01-12 | 2021-04-16 | 深圳市鑫诺诚科技有限公司 | 5G high-frequency special shielding efficiency composite material |
| CN112574687A (en) * | 2021-01-15 | 2021-03-30 | 惠州市兆联电子科技有限公司 | High shielding efficiency copper foil adhesive tape and manufacturing method thereof |
| CN115093802A (en) * | 2022-03-30 | 2022-09-23 | 安徽屹珹新材料科技有限公司 | Electromagnetic shielding composite material and preparation method thereof |
| CN114958227A (en) * | 2022-06-01 | 2022-08-30 | 江苏伊诺尔新材料科技有限公司 | Super-flexible efficient heat-dissipation electromagnetic shielding adhesive tape and manufacturing method thereof |
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Application publication date: 20161012 |