CN106001819A - SMD LED lamp reflow soldering method capable of preventing workpiece from being prone to damage - Google Patents

SMD LED lamp reflow soldering method capable of preventing workpiece from being prone to damage Download PDF

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Publication number
CN106001819A
CN106001819A CN201610410001.2A CN201610410001A CN106001819A CN 106001819 A CN106001819 A CN 106001819A CN 201610410001 A CN201610410001 A CN 201610410001A CN 106001819 A CN106001819 A CN 106001819A
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temperature
seconds
less
slope
reflow soldering
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不公告发明人
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Priority to CN201610410001.2A priority Critical patent/CN106001819A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste

Abstract

The invention discloses an SMD LED lamp reflow soldering method capable of preventing a workpiece from being prone to damage. Heating is stopped when the temperature is increased by 80-90 DEG C in the temperature increase process of a preheating zone, the temperature is kept for 8-10 seconds, and then the temperature is increased to 150-200 DEG C at the slope of 4 DEG C/second; the temperature of the preheating zone is controlled to be increased at the slope of 4 DEG C/second or below, and the temperature is increased to 150-200 DEG C; the workpiece is fully preheated at the temperature, heat impact in the heating process is alleviated, redundant heat is effectively used, preheating efficiency is improved, and meanwhile energy is saved; and after the peak temperature +/- 5 DEG C is kept for less than 10 seconds in the reflow soldering process of a reflow soldering zone, the temperature is decreased to be 25-35 DEG C lower than the peak temperature and is kept for 10-20 seconds, and thus damage caused by long-time continuous high temperature to the workpiece is avoided, and meanwhile effective welding can be realized.

Description

The reflow soldering method of workpiece non-damageable paster LED lamp
Technical field
The invention belongs to LED application, be specifically related to the reflow soldering method of a kind of surface mount elements.
Background technology
The general specification of thermal reflow profile and principal mode:
The general specification of each link of thermal reflow profile: it is said that in general, thermal reflow profile can be divided into three phases: Warm-up phase, refluxing stage, cooling stage.
1. warm-up phase: preheating refer to make stannum water activation for the purpose of and the highest in order to avoid carrying out during wicking Temperature add thermally-induced component do not have be combined into that purpose carried out add thermal behavior.Preheating temperature: push away according to the kind and manufacturer using tin cream The condition recommended sets.Its slowly heat up (best curve) is made in the range of being typically set in 80～160 DEG C;And it is permanent for conventional curvature Warm area, between 140～160 DEG C, notices that temperature height then oxidation rate can be accelerated a lot (can linearly increase in high-temperature region, at 150 DEG C At a temperature of the preheating of left and right, oxidation rate is the several times under room temperature, and the relation of copper plate temperature and oxidation rate is shown in accompanying drawing) preheating temperature Spend the lowest then flux activityization insufficient.Regard the component of thermal capacity maximum on pcb board preheating time, PCB surface is amassed, PCB thickness And depending on tin cream performance used.Typically in 80～160 DEG C of preheating sections, the time is 60～120sec, the most effectively removes soldering paste In volatile solvent, reduce thermal shock to element, make scaling powder fully activate simultaneously, and make temperature difference become less.
Preheating section specific temperature rise: for heating up the stage, the rising that temperature range is slow between room temperature and molten some temperature Rate is expected to reduce most defect.The slow climbing with 0.5～1 DEG C/sec is recommended, to conventional curvature for best curve For require to carry out heating up preferably at 3～4 DEG C/below sec.
2. refluxing stage: the peak temperature of rework profile is typically by melting temperature, assembling substrates and the element of scolding tin Heat resisting temperature determines.General minimum peak temperature about more than scolding tin fusing point about 30 DEG C (current Sn63-pb is welded Stannum, 183 DEG C of fusion points, then minimum peak temperature about about 210 DEG C).Peak temperature is too low is just easily generated cold junction and moistening not Enough, melted not enough and cause raw about 235 DEG C of half field, typically up to temperature, too high then epoxy resin base plate and plastic portions coking and Delamination easily occurs, furthermore the common boundary metallic compound exceeded the quata will be formed, and causes crisp pad (weld strength impact).Exceed The time that the molten point of scolding tin is above: due to common boundary metallic compound formation rate, the factor such as resolution ratio of scolding tin inner salt Base Metal, it produces Give birth to and leach and be not only directly proportional to temperature, and be directly proportional to the time exceeding more than molten some temperature of scolding tin, for reducing boundary's metal altogether The generation of compound and leaching, the time exceeding more than melting temperature must reduce, and is typically set between 45～90 seconds, this Time restriction needs to use a rapid warm raising rate, is climbed to peak temperature from melting temperature, considers that element bears simultaneously Thermal stress factor, climbing must be between 2.5～3.5 DEG C/see, and maximum rate of change may not exceed 4 DEG C/sec.
3. cooling stage: excess boundary's metal compound produce altogether will be caused higher than slow cool down rate more than scolding tin melting temperature Raw, and at pad, easily there is big grainiess, making pad intensity step-down, this phenomenon typically occurs in melting temperature With less than melting temperature a little within the temperature range of.Quickly cooling will cause thermograde the highest between element and substrate, produces Not mating of thermal expansion, cause pad and the division of pad and the deformation of substrate, the most permissible maximum cooling Rate is to be determined the tolerance of thermal shock by element.
Application No. 201310010849.2, a kind of reflux technique welding side disclosed in filing date on 01 11st, 2013 Method, comprises the following steps: step one, by steel mesh printing by tin cream print be placed on base plate, the size of described tin cream is with to be welded Workpiece equivalently-sized；Step 2, the base plate that print is equipped with tin cream carry out reflow soldering, form alloy weld layer on base plate, With the scaling powder separated out in tin cream on described backplate surface；Step 3, cleaning base plate, remove what tin cream on backplate surface separated out Scaling powder；Step 4, at the surface-coated scaling powder of alloy weld layer, workpiece to be welded is placed in the conjunction being coated with scaling powder On gold weld layer；Step 5, again carry out reflow soldering；Wherein, temperature N DEG C on the basis of the melting temperature of described tin cream.With existing Having technology to compare, this invented technology method more convenient operation, cost is less expensive, and avoids scaling powder in reflux course and cause Pollution, be particularly suited for the surface soldered with bump contact face.
In prior art, the method for reflow soldering all includes three sections or four sections, and preheating zone heating is laser heating to setting Fixed stable, the method for this laser heating can be rapidly achieved predetermined temperature, but, this method easily causes temperature Quick washing, laser heating make major part heat be not fully used, waste the energy, meanwhile, backflow welding zone protect Hold too high-temperature and be easily damaged workpiece.
Summary of the invention
The technical problem to be solved is: provides the reflow soldering method of a kind of paster LED lamp, solves existing In technology, in solder reflow process, laser heating causes non-uniform temperature, backflow welding zone to produce time high temperature and easily cause workpiece damage Problem that is bad, that simultaneously cause energy waste.
The present invention solves above-mentioned technical problem by the following technical solutions:
The reflow soldering method of a kind of surface mount elements, comprises the steps:
Heating up in step 1, preheating zone, the temperature controlling preheating zone increases with the slope less than or equal to 4 DEG C/sec, and temperature increases to 150 DEG C～200 DEG C；
Step 2, flat-temperature zone soldering paste are moistening, maintain the temperature between 150 DEG C～200 DEG C 60～100 seconds, until soldering paste all melts Change；
Step 3, the reflow soldering of reflow district, control temperature and be increased to peak temperature between 25～30 seconds, keep peak temperature ± 5 DEG C time less than 10 seconds；
Step 4, cooling zone cooling, control temperature with less than or equal to 6 DEG C/sec slope reduce, until temperature be decreased to 30 DEG C～ 45 DEG C, stop cooling；
Stop heating between temperature increases by 80 DEG C～90 DEG C in described step 1, keep 8 seconds～10 seconds, then proceed to 4 DEG C/sec Slope increase to 150 DEG C～200 DEG C；
After the time keeping peak temperature ± 5 DEG C in described step 3 is less than 10 seconds, cool the temperature to less than peak temperature 25 DEG C ～between 35 DEG C, persistent period 10～20 seconds.
In described step 1, the preheating time of preheating zone is less than or equal to 100 seconds.
In described step 3, the temperature time more than or equal to 217 DEG C was less than 60 seconds.
The slope controlling temperature rising in described step 3 is 2.5 DEG C/sec～3 DEG C/sec.
The cooling zone outlet of described step 4 arranges fan, uses water-cooled or air cooling way to cool down simultaneously.
The slope controlling temperature reduction in described step 4 is 6 DEG C/sec.
Compared with prior art, the method have the advantages that
1, when temperature in the warm of preheating zone is risen to the intermediate value of temperature range, stop heating a period of time, keep This interim temperature value so that workpiece is fully warmed-up at such a temperature, slows down the heat impact in heating process, by unnecessary heat Effectively utilize, improve the pre-thermal efficiency, saved the energy simultaneously.
2, backflow welding zone is after keeping peak temperature a period of time, between less than peak temperature 25 DEG C～35 DEG C, continues Time 10～20 seconds, it is to avoid cause workpiece damage long lasting for high temperature, meanwhile, it is capable to accomplish effectively to weld, reduce The spoilage of workpiece.
3, the backflow welding zone temperature time more than or equal to 217 DEG C was less than 60 seconds so that workpiece can effectively weld, with Time, it is to avoid defective work piece.
4, cooling zone arranges fan, strengthens cooling, and meanwhile, the slope controlling temperature reduction is 6 DEG C/sec so that cooling temperature Degree quickly reduces, and accelerates cooling effectiveness.
Accompanying drawing explanation
Fig. 1 is the temperature profile of the present invention.
Detailed description of the invention
Below in conjunction with the accompanying drawings the work process of the present invention is described further.
As it is shown in figure 1, the reflow soldering method of a kind of surface mount elements, comprise the steps:
Heating up in step 1, preheating zone, the temperature controlling preheating zone increases with the slope less than or equal to 4 DEG C/sec, and temperature increases to 150 DEG C～200 DEG C；
Step 2, flat-temperature zone soldering paste are moistening, maintain the temperature between 150 DEG C～200 DEG C 60～100 seconds, until soldering paste all melts Change；
Step 3, the reflow soldering of reflow district, control temperature and be increased to temperature peak between 25～30 seconds, keep peak temperature ± 5 DEG C time less than 10 seconds；
Step 4, cooling zone cooling, control temperature with less than or equal to 6 DEG C/sec slope reduce, until temperature be decreased to 30 DEG C～ 45 DEG C, stop cooling；
Stop heating between temperature increases by 80 DEG C～90 DEG C in described step 1, keep 8 seconds～10 seconds, then proceed to 4 DEG C/sec Slope increase to 150 DEG C～200 DEG C；
When temperature in the warm of preheating zone rises to the intermediate value of temperature range, stopping heating a period of time, keeping should Interim temperature value so that workpiece is fully warmed-up at such a temperature, slows down the heat impact in heating process, is had by unnecessary heat Effect utilizes, and improves the pre-thermal efficiency, has saved the energy simultaneously.
After the time keeping peak temperature ± 5 DEG C in described step 3 is less than 10 seconds, cool the temperature to less than peak temperature Between 25 DEG C～35 DEG C, persistent period 10～20 seconds.
Backflow welding zone is after keeping peak temperature a period of time, between less than peak temperature 25 DEG C～35 DEG C, when continuing Between 10～20 seconds, it is to avoid cause workpiece damage long lasting for high temperature, meanwhile, it is capable to accomplish effectively to weld, reduce work The spoilage of part.
In described step 1, the preheating time of preheating zone is less than or equal to 100 seconds.
In described step 3, the temperature time more than or equal to 217 DEG C was less than 60 seconds.Workpiece can effectively be welded, Simultaneously, it is to avoid defective work piece.
The slope controlling temperature rising in described step 3 is 2.5 DEG C/sec～3 DEG C/sec.
The cooling zone outlet of described step 4 arranges fan, uses water-cooled or air cooling way to cool down simultaneously.
The slope controlling temperature reduction in described step 4 is 6 DEG C/sec.Cooling zone arranges fan, strengthens cooling, meanwhile, control The slope that temperature processed reduces is 6 DEG C/sec so that chilling temperature quickly reduces, and accelerates cooling effectiveness.
Those skilled in the art of the present technique it is understood that the present invention had discussed various operations, method, flow process In step, measure, scheme can be replaced, changed, combined or deleted.Further, have in the present invention and discussed Various operations, method, other steps in flow process, measure, scheme can also be replaced, change, reset, decompose, combine or Delete.Further, of the prior art have with the step in the various operations disclosed in the present invention, method, flow process, arrange Execute, scheme can also be replaced, changed, reset, decomposed, combined or deleted.
The above is only the some embodiments of the present invention, it is noted that for the ordinary skill people of the art For Yuan, under the premise without departing from the principles of the invention, it is also possible to make some improvements and modifications, these improvements and modifications also should It is considered as protection scope of the present invention.

Claims (1)

1. a reflow soldering method for surface mount elements, comprises the steps:
Heating up in step 1, preheating zone, the temperature controlling preheating zone increases with the slope less than or equal to 4 DEG C/sec, and temperature increases to 150 DEG C～200 DEG C；
Step 2, flat-temperature zone soldering paste are moistening, maintain the temperature between 150 DEG C～200 DEG C 60～100 seconds, until soldering paste all melts Change；
Step 3, the reflow soldering of reflow district, control temperature and be increased to peak temperature between 25～30 seconds, keep peak temperature ± 5 DEG C time less than 10 seconds；
Step 4, cooling zone cooling, control temperature with less than or equal to 6 DEG C/sec slope reduce, until temperature be decreased to 30 DEG C～ 45 DEG C, stop cooling；
It is characterized in that: stop heating between temperature increases by 80 DEG C～90 DEG C in described step 1, keep 8 seconds～10 seconds, then continue Continue and increase to 150 DEG C～200 DEG C with the slope of 4 DEG C/sec；
After the time keeping peak temperature ± 5 DEG C in described step 3 is less than 10 seconds, cool the temperature to less than peak temperature 25 DEG C ～between 35 DEG C, persistent period 10～20 seconds；
In described step 3, the temperature time more than or equal to 217 DEG C was less than 60 seconds；
The cooling zone outlet of described step 4 arranges fan, uses air cooling way to cool down simultaneously, controls the slope that temperature reduces It it is 6 DEG C/sec.
CN201610410001.2A 2014-10-24 2014-10-24 SMD LED lamp reflow soldering method capable of preventing workpiece from being prone to damage Withdrawn CN106001819A (en)

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CN201410572729.6A CN104325205B (en) 2014-10-24 2014-10-24 A kind of reflow soldering method of surface mount elements
CN201610410001.2A CN106001819A (en) 2014-10-24 2014-10-24 SMD LED lamp reflow soldering method capable of preventing workpiece from being prone to damage

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CN201610407098.1A Withdrawn CN105960108A (en) 2014-10-24 2014-10-24 Reflow soldering method for patch LED lamp capable of lowering damage rate
CN201610408535.1A Withdrawn CN105873379A (en) 2014-10-24 2014-10-24 Reflow soldering method for SMD (Surface Mounted Device) LED (Light-Emitting Diode) lamp
CN201610410596.1A Withdrawn CN105960109A (en) 2014-10-24 2014-10-24 Reflow welding method of patch LED lamp for reducing workpiece damage rate
CN201610410002.7A Withdrawn CN105921837A (en) 2014-10-24 2014-10-24 Reflow soldering method for chip LED lamp
CN201610410001.2A Withdrawn CN106001819A (en) 2014-10-24 2014-10-24 SMD LED lamp reflow soldering method capable of preventing workpiece from being prone to damage
CN201410572729.6A Expired - Fee Related CN104325205B (en) 2014-10-24 2014-10-24 A kind of reflow soldering method of surface mount elements
CN201610409827.7A Withdrawn CN105921836A (en) 2014-10-24 2014-10-24 Reflow soldering method of surface mount device type LED lamp reducing damage rate

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CN201610407098.1A Withdrawn CN105960108A (en) 2014-10-24 2014-10-24 Reflow soldering method for patch LED lamp capable of lowering damage rate
CN201610408535.1A Withdrawn CN105873379A (en) 2014-10-24 2014-10-24 Reflow soldering method for SMD (Surface Mounted Device) LED (Light-Emitting Diode) lamp
CN201610410596.1A Withdrawn CN105960109A (en) 2014-10-24 2014-10-24 Reflow welding method of patch LED lamp for reducing workpiece damage rate
CN201610410002.7A Withdrawn CN105921837A (en) 2014-10-24 2014-10-24 Reflow soldering method for chip LED lamp

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CN201610409827.7A Withdrawn CN105921836A (en) 2014-10-24 2014-10-24 Reflow soldering method of surface mount device type LED lamp reducing damage rate

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CN104325205B (en) 2016-09-14
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CN105921836A (en) 2016-09-07
CN105921837A (en) 2016-09-07
CN105960109A (en) 2016-09-21
CN105960108A (en) 2016-09-21

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Application publication date: 20161012