CN105990652A - 安装模块和天线装置 - Google Patents

安装模块和天线装置 Download PDF

Info

Publication number
CN105990652A
CN105990652A CN201610082316.9A CN201610082316A CN105990652A CN 105990652 A CN105990652 A CN 105990652A CN 201610082316 A CN201610082316 A CN 201610082316A CN 105990652 A CN105990652 A CN 105990652A
Authority
CN
China
Prior art keywords
antenna
substrate
radiant body
module
installation module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610082316.9A
Other languages
English (en)
Other versions
CN105990652B (zh
Inventor
陈世敏
金珉勋
金恩敬
张胜九
池亨根
张在显
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of CN105990652A publication Critical patent/CN105990652A/zh
Application granted granted Critical
Publication of CN105990652B publication Critical patent/CN105990652B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/50Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/52Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/526Electromagnetic shields
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • H01Q21/06Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061Two dimensional planar arrays
    • H01Q21/065Patch antenna array
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • H01Q21/28Combinations of substantially independent non-interacting antenna units or systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04Resonant antennas
    • H01Q9/06Details
    • H01Q9/065Microstrip dipole antennas
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04Resonant antennas
    • H01Q9/16Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
    • H01Q9/28Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines
    • H01Q9/285Planar dipole
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04Resonant antennas
    • H01Q9/30Resonant antennas with feed to end of elongated active element, e.g. unipole
    • H01Q9/40Element having extended radiating surface
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64Impedance arrangements
    • H01L2223/66High-frequency adaptations
    • H01L2223/6661High-frequency adaptations for passive devices
    • H01L2223/6677High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16235Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73203Bump and layer connectors
    • H01L2224/73204Bump and layer connectors the bump connector being embedded into the layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/153Connection portion
    • H01L2924/1531Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • H01Q21/0006Particular feeding systems
    • H01Q21/0075Stripline fed arrays

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Details Of Aerials (AREA)
  • Support Of Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)

Abstract

公开了一种安装模块和天线装置。所述安装模块包括基板、安装在基板的第一表面上的天线、安装在基板第二表面上的RF电路单元以及馈线,馈线用于通过基板电连接RF电路单元和天线,从而降低信号功率的损失。

Description

安装模块和天线装置
本申请要求于2015年3月18日向韩国知识产权局提交的韩国专利申请第10-2015-0037317号的优先权和利益,该韩国专利申请的全部公开内容出于所有目的而通过引用包含于此。
技术领域
下面的描述涉及一种安装模块、天线装置和制造安装模块的方法。
背景技术
具有大容量的安装模块已被微型化。因此,可在安装模块上安装高度集成的RF电路,以实现系统级封装(SiP,system in package)模块。经过RF电路处理的RF信号可通过天线发射或者接收。因此,RF电路需要以适当的方式连接到天线。
安装在现有安装模块上的RF电路可连接到外部天线。在这种配置中,RF电路和天线可通过RF电缆或者微带线(Micro strip line)互相连接。然而,这种连接方式会增加信号功率损耗并使反射特性恶化。
发明内容
提供本发明内容以简化的形式介绍构思的选择,并将在下面的具体实施方式中对所述构思进行进一步描述。本发明内容既不意在限定所要求保护的主题的主要特征或必要特征,也不意在帮助确定所要求保护的主题的范围。
一个总的方面,提供了一种安装模块,包括基板、安装在基板的第一表面上的天线、安装在基板的第二表面上的RF电路单元,以及通过基板电连接RF电路单元和天线的馈线。
天线可包括偶极天线、单极天线或者贴片天线中的至少一种。
贴片天线可比偶极天线和单极天线中至少一种天线更接近于第一表面中央。
安装模块可包括布置在基板内部的夹层天线(Interlayer antenna)。
安装模块可包括邻近基板侧表面布置的过孔天线(Via antenna)。
过孔天线可垂直于第一表面。
过孔天线可通过考虑频率、波长、或者印刷电路基板(PCB)的夹层厚度中至少一个因素而实现。
安装模块可包括布置在基板的第二表面上的框架,以封闭RF电路单元,由框架封闭的基板区域可填充环氧树脂模塑料(EMC)树脂。
另一个总的方面,提供一种天线装置,包括辐射体和馈线,所述辐射体布置在基板的第一表面以发射或接收RF信号,而所述馈线被构造成可通过基板的第二表面接收RF信号和向辐射体发送RF信号。
辐射体可包括布置在第一表面的中央部分的第一辐射体、布置在第一表面的边缘部分的第二辐射体、布置在基板的夹层的第三辐射体和邻近基板的侧表面布置的第四辐射体中至少两种辐射体。
第一辐射体、第二辐射体、第三辐射体和第四辐射体中至少两个辐射体可按预定间隔互相隔开,并可基于预定间隔确定辐射体的辐射模式方向。
馈线可包括至少一个过孔,用于将基板的夹层互相电连接。
天线馈线可由导电金属制成,所述导电金属包括铜(Cu)、镍(Ni)、铝(Al)、银(Ag)或金(Au)中任何一种或者其任意组合。
其他特征和方面将通过下述具体实施方式、附图和权利要求而体现出来。
附图说明
图1是示出安装模块的示例的示意图。
图2是示出安装模块的上表面的示例的示意图。
图3是示出包括在安装模块内部的框架的示例的示意图。
图4是示出安装模块的下表面的示例的示意图。
图5是示出天线设备的示例的示意图。
图6是示出安装模块的插入损耗的示例的示意图。
图7是示出制造安装模块的方法的示例的示意图。
在整个说明书附图和具体实施方式中,除非另有说明或者规定,否则相同的标号始终表示相同的元件、特征和结构。说明书附图可能未按比例绘制,并且为清晰、说明和方便之目的,可夸大附图中元件的相对尺寸、比例和描绘。
具体实施方式
提供下述具体实施方式,以帮助读者获得对在此所描述的方法、设备和/或系统的综合理解。然而,在此所描述的方法、设备和/或系统的各种变化、修改及其等同物对于本领域普通技术人员来说将是明显的。工艺步骤和/或工艺操作的过程作为示例予以描述;操作顺序不限于在此所述的操作顺序,而是除了必须按照特定顺序进行的操作外,可根据现有技术作出更改。同时,为更加清楚和简明,可省去本领域普通技术人员公知的功能和构造的描述。
在此所描述的特征可按照不同形式实施,且不应被解释为仅局限于在此所述的示例。更准确的说,提供在此所描述的示例的目的在于使本公开将是彻底的和完整的,并可向本领域普通技术人员传达本公开的全部范围。
图1是示出安装模块的示例的示意图。
参照图1,安装模块100可包括基板110、天线120、RF电路单元130和馈线140。
基板110可设有安装电极。基板110的两个表面可互相平行。在一个示例中,基板110可包括陶瓷基板、印刷电路板(PCB)、或柔性基板中的任何一种。
天线120可安装在基板110的一个表面上。基板110的一个表面不是仅指剖视图中基板110的上表面。在一个示例中,天线120可安装在基板110的上表面。在另一个示例中,天线120可安装在基板110的侧表面,并与侧表面平行。在又一个示例中,天线120可安装在基板110的侧表面,并与侧表面垂直。因此,安装模块100可基于天线120的安装情况在三个维度精确地控制RF信号的辐射模式方向。
天线120可包括夹层天线124,该夹层天线形成在基板110的内层。在一个示例中,在剖视图中观察时,夹层天线124可布置在基板110的侧表面,并与基板110平行。在剖视图中,由于基板侧表面的水平长度大于其垂直长度,所以夹层天线124可以偶极天线形式实现。
例如,天线120可包括过孔天线125,该过孔天线形成在邻近基板110的侧表面的基板内部区域。在一个示例中,在剖视图中观察时,过孔天线125设置在邻近基板110的侧表面的基板区域,并与基板110垂直。考虑到诸如频率、波长或者印刷电路板(PCB)的夹层厚度等标准,过孔天线125可以至少一个叠孔的形式实现。
在剖视图中观察时,基板侧表面的水平长度小于垂直长度,过孔天线125可以单极天线的形式实现。例如,如图1所示,过孔天线125可以单极天线的形式实现,其中,单极天线的两个过孔互相串联连接。
根据安装模块100的设计,天线120可在毫米波段辐射或者接收RF信号。由于在毫米波段的RF信号的波长短,所以天线120可微型化。
RF电路单元130可通过安装电极安装在基板110的另一表面上。RF电路单元130可安装在未布置天线120的基板表面上。例如,如图1所示,RF电路单元130安装在基板110的下表面。参照图3和图4,在下文对RF电路单元130的详细示例予以说明。
馈线140可通过基板110电连接到RF电路单元130和天线120。在一个示例中,馈线140可形成在基板110中,并可由诸如铜(Cu)、镍(Ni)、铝(Al)、银(Ag)和金(Au)等导电金属制成。
RF电路单元130和天线120之间的距离可小于现有RF电路单元和外部天线之间的距离。因此,安装模块100可降低由于天线120和RF电路单元130之间的连接所造成的信号功率损耗以及反射特性恶化。
图2是示出安装模块的上表面的示例的示意图。
参照图2,包括在安装模块内的天线可包括偶极天线121、单极天线122或者贴片天线123中的至少一种。
偶极天线121和单极天线122可接近于安装模块的上表面的边缘。偶极天线121和单极天线122可在安装模块的侧向上发射或者接收RF信号。
贴片天线123可接近于安装模块的上表面的中央部分。贴片天线123可在安装模块的朝上的方向上发射或者接收RF信号。贴片天线123可呈诸如多边形和圆形等形状。
例如,天线120可包括偶极天线121、单极天线122和贴片天线123中的至少一种。因此,天线120可在安装模块的朝上的方向上至横向的区间内以倾斜的方向发射或者接收RF信号。
在一个示例中,RF信号的辐射模式方向可根据偶极天线121、单极天线122和贴片天线123中至少一种天线之间的间隔进行控制。在另一个示例中,RF信号的辐射模式方向可根据偶极天线121、单极天线122的至少一种的数量与贴片天线123的数量的比率进行控制。在又一个示例中,RF信号的辐射模式方向可根据上述间隔和上述比率的组合进行控制。
例如,因为偶极天线121和单极天线122接近于贴片天线123,所以RF信号的辐射模式方向可靠近安装模块的朝上方向。
例如,当偶极天线121和电极天线122的总数大于贴片天线123的数量时,RF信号的辐射模式方向可靠近安装模块的横向。
进一步地,根据偶极天线121和单极天线122的位置或方向,可控制RF信号的辐射模式方向。也就是说,安装模块100可在三个维度内精确地控制RF信号的辐射模式方向。
图3是示出包括在安装模块中的框架的示例的示意图。图4是示出安装模块的下表面的示例的示意图。参照图3和图4,安装模块100还可包括框架150。框架150可布置在基板110的另一个表面上,以封闭RF电路单元130。由框架150所封闭的基板区域可填充环氧树脂模塑料(EMC)树脂160,用于屏蔽电磁波。
例如,RF电路单元130可包括诸如多工模拟元件(MAC,multiplexedanalog component)和基带信号处理电路等组件。为保护RF电路单元130免受物理损伤,框架150可布置在基板110的另一个表面上。框架150的高度可大于RF电路单元130的高度。
框架150的下端可设有多个焊料球180,以容易地将安装单元100安装到诸如移动终端、笔记本电脑和电视机等设备上。
图5是示出天线设备的示例的示意图。图5中所示的某些组件已经参照图1至图4进行了描述。图1至图4的上述描述也适用于图5,并且通过引用包含于此。因此,在此对上述描述不再重复。
参照图5,天线装置200可包括辐射体210和馈线220。
辐射体210可布置在基板的一个表面上,以发射或接收RF信号。例如,辐射体210可包括第一辐射体211至第四辐射体214中的至少两种。因此,天线装置200可在三个维度精确地控制RF信号的辐射模式方向。
第一辐射体211可布置在包括基板的一个表面的中央部分的第一区域中。第一辐射体211的特性可与包含在安装模块内的贴片天线的特性类似。
第二辐射体212可布置在包括基板的一个表面的边缘部分的第二区域中。第二辐射体212的特性可与包含在安装模块内的偶极天线或单极天线的特性类似。
第三辐射体213可布置在基板的内部。第三辐射体213的特性可与包含在安装模块内的夹层天线的特性类似。
第四辐射体214可布置在邻近基板侧表面的基板区域。第四辐射体214的特性可与包含在安装模块内的过孔天线的特性类似。
例如,第一辐射体211、第二辐射体212、第三辐射体213和第四辐射体214中至少两个可按预定间隔彼此隔开。因此,辐射体210的辐射模式方向可基于预设间隔而确定。
馈线220可通过基板另一个表面接收RF信号,并向辐射体210发送RF信号。
例如,馈线220可包括至少一个过孔(Via),并且基板的多个夹层通过所述过孔互相电连接。
图6是示出安装模块的插入损耗的示例的示意图。参照图6的曲线图,横坐标表示RF信号的频率,而竖坐标表示馈线的插入损耗。天线装置的插入损耗可等于或者小于1dB。考虑到由于现有的RF电路和外部天线之间的连接而导致可能会发生7dB或更高的插入损耗,可以看出,上述公开的天线的插入损耗已显著地降低。
图7是示出安装模块制造方法的示例的示意图。尽管可以按照图7示出的顺序和方式完成操作步骤,但在不脱离所述说明性示例的精神和范围的情况下,可以改变某些操作步骤的顺序或省略某些操作步骤。图7中的多个操作步骤可并行或者同时进行。图1至图5的上述描述也适用于图7,并通过引用包含在此。因此,在此对上述描述不再重复。
参照图7,安装模块的制造方法可包括安装天线的步骤S10和安装电路的步骤S20。
在S10中,可在包括在安装模块内的基板的一个表面上安装多个天线。所述多个天线可以按照预定的间隔互相隔开,以使所述多个天线的辐射模式方向在预定的方向上。
例如,天线的安装步骤S10可包括下列步骤中的至少两个:S11,在第一区域安装第一天线,所述第一区域包括基板的一个表面的中央部分;S12,在第二区域安装第二天线,所述第二区域包括基板的一个表面的边缘部分;S13,在表面的夹层中形成第三天线;S14,在邻近基板的侧表面的基板区域形成第四天线。
在S20中,可在包含在安装模块内的基板的另一个表面上安装RF电路单元。
如上所述,安装模块可降低由于天线和RF电路之间的连接所造成的信号功率的损失和反射特性恶化的程度。天线装置可在三个维度精确地控制辐射模式。制造安装模块的方法可包括安装使辐射模式在三个维度得以精确地控制的天线矩阵,和在安装模块上安装RF电路。
虽然本公开包括特定示例,但本领域普通技术人员应清楚,在不脱离由权利要求及其等同物的精神和范围的情况下,可对这些实施例进行形式和细节上的各种改变。在此所描述的示例仅被视为描述性意义,而不是出于限制的目的。应该认为各个示例中的特征或方面的描述可适用于其它示例中的类似的特征或方面。如果所述技术以不同的顺序执行,且/或如果所述的系统、结构、设备或电路的部件以不同的方式组合,且/或由其他组件或其等同物替代或补充,则也可实现合适的结果。因此,本公开的范围不是由具体实施方式限定的,而是由权利要求及其等同物限定的,并且权利要求及其等同物的范围内的全部变型将被解释为包括在本公开中。

Claims (13)

1.一种安装模块,包括:
基板;
安装在基板的第一表面上的天线;
安装在基板的第二表面上的RF电路单元;以及
用于通过基板电连接RF电路单元和天线的馈线。
2.根据权利要求1所述的安装模块,其中,所述天线包括偶极天线、单极天线或者贴片天线中的至少一种。
3.根据权利要求2所述的安装模块,其中,所述贴片天线比偶极天线和单极天线中的至少一种更接近第一表面的中央部分。
4.根据权利要求1所述的安装模块,还包括布置在基板内部的夹层天线。
5.根据权利要求1所述的安装模块,还包括邻近基板侧表面布置的过孔天线。
6.根据权利要求5所述的安装模块,其中,所述过孔天线垂直于所述第一表面。
7.根据权利要求5所述的安装模块,其中,所述过孔天线是通过考虑频率、波长、或者印刷电路基板(PCB)的夹层厚度中至少一个因素实现的。
8.根据权利要求1所述的安装模块,还包括布置在基板的第二表面上用于封闭RF电路单元的框架,并且由框架封闭的基板区域填充有环氧树脂模塑料(EMC)树脂。
9.一种天线装置,包括:
辐射体,布置在基板的第一表面以发射或接收RF信号;以及
馈线,被构造成通过基板的第二表面接收RF信号,以及向辐射体发送RF信号。
10.根据权利要求9所述的天线装置,其中,所述辐射体包括下列辐射体中至少两种:
布置在第一表面的中央部分的第一辐射体;
布置在第一表面的边缘部分的第二辐射体;
布置在基板的夹层中的第三辐射体;和
邻近基板的侧表面布置的第四辐射体。
11.根据权利要求10所述的天线装置,其中:
第一辐射体、第二辐射体、第三辐射体和第四辐射体中的至少两个辐射体按预定的间隔互相隔开,以及
所述辐射体的辐射模式方向是基于预定的间隔而确定的。
12.根据权利要求9所述的天线装置,其中,所述馈线包括至少一个使基板的夹层互相电连接的过孔。
13.根据权利要求9所述的天线装置,其中,所述馈线是由导电金属制成的,所述导电金属包括铜(Cu)、镍(Ni)、铝(Al)、银(Ag)或金(Au)中任何一种或者其任意组合。
CN201610082316.9A 2015-03-18 2016-02-05 安装模块和天线装置 Expired - Fee Related CN105990652B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020150037317A KR102117473B1 (ko) 2015-03-18 2015-03-18 실장 기판 모듈, 안테나 장치 및 실장 기판 모듈 제조 방법
KR10-2015-0037317 2015-03-18

Publications (2)

Publication Number Publication Date
CN105990652A true CN105990652A (zh) 2016-10-05
CN105990652B CN105990652B (zh) 2020-01-07

Family

ID=56925633

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610082316.9A Expired - Fee Related CN105990652B (zh) 2015-03-18 2016-02-05 安装模块和天线装置

Country Status (3)

Country Link
US (2) US9923261B2 (zh)
KR (1) KR102117473B1 (zh)
CN (1) CN105990652B (zh)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108365861A (zh) * 2017-01-23 2018-08-03 三星电机株式会社 集成天线的射频模块
CN110729558A (zh) * 2018-07-17 2020-01-24 三星电机株式会社 片式天线模块和电子装置
CN111108649A (zh) * 2017-08-18 2020-05-05 阿莫技术有限公司 天线模块
CN111326848A (zh) * 2018-12-14 2020-06-23 三星电机株式会社 天线模块及包括该天线模块的电子装置
US10707556B2 (en) 2017-01-23 2020-07-07 Samsung Electro-Mechanics Co., Ltd. Antenna-integrated radio frequency module
CN111386692A (zh) * 2017-11-28 2020-07-07 三星电子株式会社 包括天线的电子装置
CN111566876A (zh) * 2018-10-18 2020-08-21 阿莫技术有限公司 具有腔体结构的天线封装组件
CN112243551A (zh) * 2018-06-11 2021-01-19 Lg 伊诺特有限公司 天线
CN112366442A (zh) * 2018-01-18 2021-02-12 三星电机株式会社 天线模块
CN112385090A (zh) * 2018-07-06 2021-02-19 株式会社村田制作所 天线模块和通信装置
CN113196567A (zh) * 2018-12-05 2021-07-30 三星电子株式会社 天线模块以及包括该天线模块的电子装置,该天线模块包括通过印刷电路板的一个面暴露于外部的信号线并且包括电连接到信号线的导电构件
CN113644407A (zh) * 2017-07-28 2021-11-12 三星电机株式会社 包括柔性基板的天线模块

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9825597B2 (en) 2015-12-30 2017-11-21 Skyworks Solutions, Inc. Impedance transformation circuit for amplifier
US11011836B2 (en) 2016-12-20 2021-05-18 The Boeing Company Adjacent antenna interference mitigation
KR20190018812A (ko) 2017-08-16 2019-02-26 삼성전기주식회사 반도체 패키지와 이를 구비하는 전자 기기
US11233337B2 (en) * 2018-03-02 2022-01-25 Samsung Electro-Mechanics Co., Ltd. Antenna apparatus
KR102017159B1 (ko) 2018-03-12 2019-09-02 삼성전자주식회사 안테나 모듈
US10879585B2 (en) * 2018-04-09 2020-12-29 Lg Electronics Inc. Mobile terminal
KR102431462B1 (ko) * 2018-06-14 2022-08-11 삼성전자주식회사 도전성 패턴을 포함하는 안테나 및 그것을 포함하는 전자 장치
WO2019245212A1 (ko) 2018-06-21 2019-12-26 삼성전자 주식회사 캐비티를 포함하는 안테나 모듈
KR102280051B1 (ko) 2018-08-22 2021-07-21 삼성전자주식회사 안테나 모듈 및 이를 포함하는 전자 장치
KR102114138B1 (ko) * 2018-10-04 2020-05-22 삼성전기주식회사 안테나 모듈 및 이를 포함하는 전자기기
US11128030B2 (en) * 2018-10-04 2021-09-21 Samsung Electro-Mechanics Co., Ltd. Antenna module and electronic device including the same
US11056800B2 (en) * 2018-10-16 2021-07-06 Google Llc Antenna arrays integrated into an electromagnetic transparent metallic surface
KR102561724B1 (ko) 2018-12-07 2023-07-31 삼성전자주식회사 안테나 모듈 및 그를 포함하는 전자 장치
US20200212536A1 (en) * 2018-12-31 2020-07-02 Texas Instruments Incorporated Wireless communication device with antenna on package
CN111864390B (zh) * 2019-04-26 2022-03-22 佳邦科技股份有限公司 共构式天线模块
KR102272590B1 (ko) * 2019-06-21 2021-07-05 삼성전기주식회사 안테나 모듈 및 이를 포함하는 전자기기
KR102665787B1 (ko) * 2019-09-06 2024-05-14 삼성전자주식회사 안테나 및 그것을 포함하는 전자 장치
KR102568702B1 (ko) * 2019-10-15 2023-08-21 삼성전자주식회사 안테나 구조 및 이를 포함하는 전자 장치
KR20210147323A (ko) 2020-05-28 2021-12-07 삼성전기주식회사 안테나 기판
KR20220034547A (ko) * 2020-09-11 2022-03-18 삼성전기주식회사 안테나 장치 및 이를 포함하는 전자 장치
KR20220084804A (ko) 2020-12-14 2022-06-21 삼성전기주식회사 안테나 기판

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4218682A (en) * 1979-06-22 1980-08-19 Nasa Multiple band circularly polarized microstrip antenna
US4987424A (en) * 1986-11-07 1991-01-22 Yagi Antenna Co., Ltd. Film antenna apparatus
US20030146872A1 (en) * 2002-02-06 2003-08-07 Kellerman Francis William Multi frequency stacked patch antenna with improved frequency band isolation
US7079079B2 (en) * 2004-06-30 2006-07-18 Skycross, Inc. Low profile compact multi-band meanderline loaded antenna
KR20060095372A (ko) * 2005-02-28 2006-08-31 엘지이노텍 주식회사 전방향 방사 구조를 가지는 안테나
US20080165064A1 (en) * 2007-01-04 2008-07-10 Hill Robert J Broadband antenna for handheld devices
US20090315797A1 (en) * 2008-06-19 2009-12-24 Ahmadreza Rofougaran Method and system for inter-chip communication via integrated circuit package antennas
US20090322619A1 (en) * 2008-06-26 2009-12-31 Jani Petri Juhani Ollikainen Performance improvement of antennas
US20100060526A1 (en) * 2008-09-05 2010-03-11 Smartant Telecom Co., Ltd. Omnidirectional antenna
US20110227793A1 (en) * 2010-03-16 2011-09-22 Johnson Richard S Multi polarization conformal channel monopole antenna

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002271133A (ja) 2001-03-09 2002-09-20 Sharp Corp 高周波アンテナおよび高周波通信装置
JP2003032035A (ja) 2001-07-17 2003-01-31 Alps Electric Co Ltd 送受信ユニット
US9305888B2 (en) * 2012-07-05 2016-04-05 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated antenna structure and array
US9196951B2 (en) * 2012-11-26 2015-11-24 International Business Machines Corporation Millimeter-wave radio frequency integrated circuit packages with integrated antennas
US9806422B2 (en) * 2013-09-11 2017-10-31 International Business Machines Corporation Antenna-in-package structures with broadside and end-fire radiations

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4218682A (en) * 1979-06-22 1980-08-19 Nasa Multiple band circularly polarized microstrip antenna
US4987424A (en) * 1986-11-07 1991-01-22 Yagi Antenna Co., Ltd. Film antenna apparatus
US20030146872A1 (en) * 2002-02-06 2003-08-07 Kellerman Francis William Multi frequency stacked patch antenna with improved frequency band isolation
US7079079B2 (en) * 2004-06-30 2006-07-18 Skycross, Inc. Low profile compact multi-band meanderline loaded antenna
KR20060095372A (ko) * 2005-02-28 2006-08-31 엘지이노텍 주식회사 전방향 방사 구조를 가지는 안테나
US20080165064A1 (en) * 2007-01-04 2008-07-10 Hill Robert J Broadband antenna for handheld devices
US20090315797A1 (en) * 2008-06-19 2009-12-24 Ahmadreza Rofougaran Method and system for inter-chip communication via integrated circuit package antennas
US20090322619A1 (en) * 2008-06-26 2009-12-31 Jani Petri Juhani Ollikainen Performance improvement of antennas
US20100060526A1 (en) * 2008-09-05 2010-03-11 Smartant Telecom Co., Ltd. Omnidirectional antenna
US20110227793A1 (en) * 2010-03-16 2011-09-22 Johnson Richard S Multi polarization conformal channel monopole antenna

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11165137B2 (en) 2017-01-23 2021-11-02 Samsung Electro-Mechanics Co., Ltd. Antenna-integrated radio frequency module
CN112216994B (zh) * 2017-01-23 2024-03-15 三星电机株式会社 集成天线的射频模块
US10707556B2 (en) 2017-01-23 2020-07-07 Samsung Electro-Mechanics Co., Ltd. Antenna-integrated radio frequency module
CN108365861A (zh) * 2017-01-23 2018-08-03 三星电机株式会社 集成天线的射频模块
US10784564B2 (en) 2017-01-23 2020-09-22 Samsung Electro-Mechanics Co., Ltd. Antenna-integrated radio frequency module
CN112216994A (zh) * 2017-01-23 2021-01-12 三星电机株式会社 集成天线的射频模块
CN113644407A (zh) * 2017-07-28 2021-11-12 三星电机株式会社 包括柔性基板的天线模块
CN111108649A (zh) * 2017-08-18 2020-05-05 阿莫技术有限公司 天线模块
CN111108649B (zh) * 2017-08-18 2023-08-25 阿莫技术有限公司 天线模块
CN111386692A (zh) * 2017-11-28 2020-07-07 三星电子株式会社 包括天线的电子装置
US11303032B2 (en) 2017-11-28 2022-04-12 Samsung Electronics Co., Ltd. Electronic device comprising antenna
CN112366442A (zh) * 2018-01-18 2021-02-12 三星电机株式会社 天线模块
CN112243551A (zh) * 2018-06-11 2021-01-19 Lg 伊诺特有限公司 天线
CN112243551B (zh) * 2018-06-11 2024-02-09 Lg 伊诺特有限公司 天线
CN112385090A (zh) * 2018-07-06 2021-02-19 株式会社村田制作所 天线模块和通信装置
CN110729558B (zh) * 2018-07-17 2023-08-25 三星电机株式会社 片式天线模块和电子装置
CN110729558A (zh) * 2018-07-17 2020-01-24 三星电机株式会社 片式天线模块和电子装置
CN111566876B (zh) * 2018-10-18 2021-07-30 阿莫技术有限公司 具有腔体结构的天线封装组件
CN111566876A (zh) * 2018-10-18 2020-08-21 阿莫技术有限公司 具有腔体结构的天线封装组件
CN113196567A (zh) * 2018-12-05 2021-07-30 三星电子株式会社 天线模块以及包括该天线模块的电子装置,该天线模块包括通过印刷电路板的一个面暴露于外部的信号线并且包括电连接到信号线的导电构件
CN111326848A (zh) * 2018-12-14 2020-06-23 三星电机株式会社 天线模块及包括该天线模块的电子装置

Also Published As

Publication number Publication date
US9923261B2 (en) 2018-03-20
USRE49261E1 (en) 2022-10-25
CN105990652B (zh) 2020-01-07
US20160276734A1 (en) 2016-09-22
KR102117473B1 (ko) 2020-06-01
KR20160112154A (ko) 2016-09-28

Similar Documents

Publication Publication Date Title
CN105990652A (zh) 安装模块和天线装置
US10992055B2 (en) Component carrier with integrated antenna arrangement, electronic apparatus, radio communication method
US9715007B2 (en) X-band surface mount microstrip-fed patch antenna
US9620464B2 (en) Wireless communications package with integrated antennas and air cavity
CN104137245B (zh) 薄型、空间高效的电路屏蔽
US7808434B2 (en) Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices
US11133594B2 (en) System and method with multilayer laminated waveguide antenna
US20150311591A1 (en) Printed antenna having non-uniform layers
US8816929B2 (en) Antenna array package and method for building large arrays
US11211689B2 (en) Chip antenna
CN108258424B (zh) 一种移动终端天线及其馈电网络
CN111555020A (zh) 片式天线及包括该片式天线的片式天线模块
KR102669379B1 (ko) 칩 안테나
US20100127376A1 (en) System and method to provide rf shielding for a mems microphone package
CN109962334A (zh) 天线模块及包括该天线模块的电子设备
US20180191064A1 (en) Module arrangement comprising an integrated antenna and embedded components and method for manufacturing a module arrangement
KR101962224B1 (ko) 안테나 장치
US20140055965A1 (en) Circuit module
CN101404277A (zh) 多芯片模块
US20230125676A1 (en) Lga- and bga-based phased-array millimeter-wave antennas
CN212366219U (zh) 指向性天线
KR102500007B1 (ko) 칩 안테나 모듈
US20210013582A1 (en) Radio frequency modules with millimeter-wave air-gap phased-array antenna
KR102459055B1 (ko) 개선 통신 어레이
CN117672877A (zh) 用于制造电子封装的方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20200107

CF01 Termination of patent right due to non-payment of annual fee