CN105977189A - Diode chip baking device - Google Patents
Diode chip baking device Download PDFInfo
- Publication number
- CN105977189A CN105977189A CN201610446525.7A CN201610446525A CN105977189A CN 105977189 A CN105977189 A CN 105977189A CN 201610446525 A CN201610446525 A CN 201610446525A CN 105977189 A CN105977189 A CN 105977189A
- Authority
- CN
- China
- Prior art keywords
- baking
- diode chip
- backlight unit
- support
- casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
Abstract
The invention relates to a diode chip baking device, which comprises a box body, wherein heating pipes are evenly distributed in the box body; a baking rack is arranged in the box body and comprises a bracket and multiple layers of trays; support frames for supporting the trays are arranged in the bracket; bases which are movably connected with the box body are arranged at the bottom part of the bracket; and support seats corresponding to the bases are arranged at the bottom part of the box body. The diode chip baking device has the advantages that to-be-baked diode chips can be put into the trays; and the multiple layers of trays can be put into the bracket, so that the baking number of the diode chips can be increased and efficiency of the diode chips can be improved. The bracket and the box body are carried through the bases and the support seats, so that taking of the bracket is facilitated.
Description
Technical field
The present invention relates to a kind of roasting plant, particularly relate to a kind of diode chip for backlight unit apparatus for baking.
Background technology
Diode is one of the most frequently used electronic component, and the characteristic of its maximum is unilateal conduction, and namely electric current is only
Can flow through from diode direction, the effect of diode has rectification circuit, detecting circuit, mu balanced circuit
And modulation circuit.In the processing technique of existing diode, during to the baking of diode chip for backlight unit after cleaning
Requisite step, and the requirement of diode chip for backlight unit baking is strict, existing roasting mode is all
Toasting manually, baking efficiency is low, and labor intensity is big.
Accordingly, it would be desirable to seek a kind of new technical scheme to solve the problems referred to above
Summary of the invention
It is an object of the invention to: a kind of diode chip for backlight unit apparatus for baking is provided.
For achieving the above object, the technical solution used in the present invention is:
A kind of diode chip for backlight unit apparatus for baking, including casing, box house is evenly distributed with and adds heat pipe, in casing
Being provided with baking rack, baking rack includes support, multiple layer tray, is provided with the bracing frame supporting pallet, support in support
Bottom is provided with the base being flexibly connected with casing, and box bottom is provided with the bearing corresponding with base.
Pulley it is provided with between base and bearing.
Filter paper it is provided with in pallet.
Support is monosymmetric is provided with handle.
Casing top is provided with radiating area.
In technique scheme, with prior art compare reached have the technical effect that pallet in can place need
Diode chip for backlight unit to be toasted, can place multiple layer tray in support, can improve the quantity of diode chip for backlight unit baking
And efficiency;Accepted by base and bearing between support and casing, facilitate taking of support;The setting of pulley,
Facilitate the relative movement of base and bearing;Filter paper can avoid the secondary pollution of diode chip for backlight unit;Radiating area can and
Time carrying out dispel the heat.
Accompanying drawing explanation
Accompanying drawing 1 is the embodiment of the present invention one structural representation.
In the figures above: 1-casing, 2-adds heat pipe, 3-support, 4-pallet, 5-bracing frame, 6-base,
7-bearing, 8-pulley, 9-filter paper, 10-handle, 11-radiating area.
Detailed description of the invention
Below in conjunction with the accompanying drawings and embodiment the invention will be further described.
Embodiment one:
As it is shown in figure 1, a kind of diode chip for backlight unit apparatus for baking of the present invention, including casing 1, casing 1 is internal all
Even being distributed adds heat pipe 2, is provided with baking rack in casing 1, and baking rack includes support 3, multiple layer tray 4, support 3
Inside it is provided with the bracing frame 5 supporting pallet 4, bottom support 3, is provided with the base 6 being flexibly connected with casing 1, casing 1 end
Portion is provided with the bearing 7 corresponding with base 6, is provided with pulley 8, is provided with filter paper 9 in pallet 4 between base 6 and bearing 7,
The monosymmetric handle 10 that is provided with of support 3, casing 1 top is provided with radiating area 11.Can place in pallet 4 and need to dry
Roasting diode chip for backlight unit, can place multiple layer tray 4 in support 3, can improve diode chip for backlight unit baking quantity and
Efficiency;Accepted by base 6 and bearing 7 between support 3 and casing 1, facilitate taking of support 3;Setting of pulley 8
Put, facilitate base 6 and the relative movement of bearing 7;Filter paper 9 can avoid the secondary pollution of diode chip for backlight unit;Dissipate
Can dispel the heat timely in hot-zone 11.
Above-described embodiment only for technology design and the feature of the present invention are described, its object is to allow and is familiar with technique
Personage will appreciate that present disclosure and implement according to this, can not limit the scope of the invention with this.
All according to spirit of the invention made equivalence change or modify, all should contain protection scope of the present invention it
In.
Claims (5)
1. a diode chip for backlight unit apparatus for baking, it is characterised in that: include casing, in described casing
Portion is evenly distributed with and adds heat pipe, is provided with baking rack in described casing, described baking rack include support,
Multiple layer tray, be provided with in described support support pallet bracing frame, described frame bottom be provided with
The base that casing is flexibly connected, described box bottom is provided with the bearing corresponding with base.
A kind of diode chip for backlight unit apparatus for baking the most according to claim 1, it is characterised in that: institute
State and between base and bearing, be provided with pulley.
A kind of diode chip for backlight unit apparatus for baking the most according to claim 1, it is characterised in that: institute
It is provided with filter paper in stating pallet.
A kind of diode chip for backlight unit apparatus for baking the most according to claim 1, it is characterised in that: institute
State that support is monosymmetric is provided with handle.
A kind of diode chip for backlight unit apparatus for baking the most according to claim 1, it is characterised in that: institute
State casing top and be provided with radiating area.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610446525.7A CN105977189A (en) | 2016-06-20 | 2016-06-20 | Diode chip baking device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610446525.7A CN105977189A (en) | 2016-06-20 | 2016-06-20 | Diode chip baking device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN105977189A true CN105977189A (en) | 2016-09-28 |
Family
ID=57022151
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610446525.7A Pending CN105977189A (en) | 2016-06-20 | 2016-06-20 | Diode chip baking device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105977189A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107442373A (en) * | 2017-07-31 | 2017-12-08 | 苏州汉瑞森光电科技股份有限公司 | Apparatus for baking and method for SMD LED glue curings |
CN108050783A (en) * | 2017-12-15 | 2018-05-18 | 芜湖尚唯汽车饰件有限公司 | A kind of inside gadget apparatus for baking |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN203917087U (en) * | 2014-06-18 | 2014-11-05 | 四川蓝彩电子科技有限公司 | Glass-encapsulated diode ink indicia apparatus for baking |
CN104896908A (en) * | 2015-05-11 | 2015-09-09 | 池州华钛半导体有限公司 | Semiconductor oven nitrogen adjusting device |
US20160035601A1 (en) * | 2014-07-31 | 2016-02-04 | Semes Co., Ltd. | Bake unit, substrate treating apparatus including the unit, and substrate treating method |
CN205028887U (en) * | 2015-09-17 | 2016-02-10 | 贵州雅光电子科技股份有限公司 | Diode chip baking equipment |
-
2016
- 2016-06-20 CN CN201610446525.7A patent/CN105977189A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN203917087U (en) * | 2014-06-18 | 2014-11-05 | 四川蓝彩电子科技有限公司 | Glass-encapsulated diode ink indicia apparatus for baking |
US20160035601A1 (en) * | 2014-07-31 | 2016-02-04 | Semes Co., Ltd. | Bake unit, substrate treating apparatus including the unit, and substrate treating method |
CN104896908A (en) * | 2015-05-11 | 2015-09-09 | 池州华钛半导体有限公司 | Semiconductor oven nitrogen adjusting device |
CN205028887U (en) * | 2015-09-17 | 2016-02-10 | 贵州雅光电子科技股份有限公司 | Diode chip baking equipment |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107442373A (en) * | 2017-07-31 | 2017-12-08 | 苏州汉瑞森光电科技股份有限公司 | Apparatus for baking and method for SMD LED glue curings |
CN108050783A (en) * | 2017-12-15 | 2018-05-18 | 芜湖尚唯汽车饰件有限公司 | A kind of inside gadget apparatus for baking |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WD01 | Invention patent application deemed withdrawn after publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160928 |